Showing 3217 - 3228 of 8234
SEMI Press Release
ASTC 2023 Opens Tomorrow With Focus on MEMS and Sensors Growth Applications
SINGAPORE – 16 January 2023 – Cutting-edge innovations across an explosion of MEMS and sensors applications will take center stage at Advanced Semiconductor Technology Conference (ASTC) starting...
Page
ITPC Speaker Bio - Jaihyuk Song
BIOGRAPHYDr. Jaihyuk Song is the Corporate President and CTO of Samsung Electronics’ Device Solutions Business leading the Semiconductor R&D Center and Mechatronics Research Center....
Page
ITPC Speaker Bio - Thomas Sonderman
BIOGRAPHYThomas Sonderman serves as president & CEO for SkyWater and is a member of the company’s board of directors, with comprehensive responsibility for all business functions and operations....
Page
Northeast Forum Spring 2020 Bio - Debbie Gustafson
Debbie Gustafson is the Chief Executive Officer of Energetiq Technology, Inc. and a member of its board of directors. Ms. Gustafson joined the company in 2005 as the VP of Sales, when the high...
Blog
From Static Compliance to Operational Proof: The Next Phase of Semiconductor Manufacturing Cybersecurity
For years, cybersecurity in manufacturing was often treated as a mere compliance issue. Suppliers filled out questionnaires. A scan report was produced before shipment. A checklist was reviewed...
Page
Global Executive Summit on Energy, Emissions and Efficiency - The Okura Tokyo, December 15–16, 2025
SEMI’s Global Executive Summit (GES) on Energy, Emissions and Efficiency, held on December 15th and 16th, 2025 took place at The Okura Tokyo. The Summit was co-organized by SEMI and Google,...
Blog
Securing Chip Access – Models for a Dedicated Supply Chain
In 1992, speaking in front of several fabless CEOs, AMD’s CEO, Jerry Sanders, notoriously remarked: “Now hear me and hear me well; real men have fabs!” However, by 2008, AMD had divested its...
SEMI Press Release
UCLA and SEMI Win NIST Funding to Produce Heterogeneous Integration Roadmap
MILPITAS, Calif. — May 17, 2022 — SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, and the UCLA Center for Heterogeneous Integration and...
Member Press Release
First ScN Deposition Using PEALD
Press Release: Kurt J. Lesker Company Announces Groundbreaking Report in an ALD first!Jefferson Hills, PA – January 8th, 2024 – Kurt J. Lesker Company is proud to announce the successful publication...
Page
Pacific Northwest - Bruce J. Tufts
Bruce J. Tufts is vice president and director of the Fab Materials Organization in the Global Supply Chain group at Intel Corporation. Bruce is responsible for Intel’s...
Page
Virtual ASMC 2021 Bio - Joel Hartman
Joël Hartmann is Executive Vice President of STMicroelectronics, Digital & Smart Power Technology, and Digital Front-End Manufacturing, and has held this position since February 2012. He...
Page
Oral History Interview: Ken Rygler
SEMI Oral History Interview
Ken Rygler
Interviewed by Craig Addison, SEMI
Ken Rygler joined DuPont in 1964 and during most of his career with the company has been...