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Member Press Release
DuPont Joins SEMI Foundation’s Semiconductor PRIDE Initiative as a Founding Member
WILMINGTON, Del., Dec. 18, 2024 – DuPont (NYSE: DD) today announced it has joined the SEMI Foundation’s Semiconductor PRIDE (Semiconductor Professionals for Respect, Inclusion, Diversity, and Equity)...
Member Company
SiSTEM Technology Ltd
Sistem Technology is a full service distributor of capital equipment and consumables serving the semiconductor and other high technology industries in Europe
Blog
III-V: A New Era of Technological Advances
Integrated photonics offers the semiconductor industry a new way to increase the speed and capability of classical compute functions, as well as enabling quantum computing. The III-V Summit,...
Blog
Affordable, Accessible, and Quality Childcare: A Critical Workforce Development Strategy for the Semiconductor Industry
“Every working family in America knows how hard it is today to find affordable childcare or early childhood education.” – U.S. Senator Bernie Sanders“Finding solutions to improve affordability of...
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ISS 2025 Speaker Abstract & Bio - Guttorm Aase, McKinsey & Company
Building a Resilient, Thriving US Semi Supply ChainABSTRACTThe CHIPS Act was passed with bi-partisan support in 2022 with the main objective of securing semiconductor supplies for the US. A wave of...
SEMI Press Release
SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era
SEOUL, South Korea ─ December 17, 2024 ─ SEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge...
Member Company
EN2CORE technology Inc.
EN2CORE technology is a Korean company which has its own plasma technology.
EN2CORE technology has Semiconductor business and Energy & Environment business.
<Semiconductor...
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ISS 2025 Speaker Abstract & Bio - Greet Storms, ASML
AFFORDABLE EUV LITHOGRAPHY SUPPORTING LOGIC AND DRAM ROADMAPS INTO THE NEXT DECADEABSTRACTSemiconductor industry continues to pursue Moore`s law by printing all complex layers on a chip in the most...
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ISS 2025 Speaker Abstract & Bio - Rahul Manepalli, Intel
ADVANCED PACKAGING SUBSTRATE TECHNOLOGIES FOR HETEROGENOUS INTEGRATIONABSTRACTAdvanced packaging is enabling unprecedented levels of integration, enabling dense interconnection of logic, memory and...
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ISS 2025 Speaker Abstract & Bio - Ke Xu, Purdue University
In-situ Study on Thermal Compression Bonding of Nanotwinned Cu Pillars ABSTRACTCu-Cu pillars thermal compression bonding (TCB) technique has emerged as a promising solution for ultrafine pitch...
Event
Information & Control Japan TC Chapter Meeting
Information & Control Japan TC Chapter Meeting Date: Friday, December 13, 2024Time: 1:30 pm - 4:30 pm JSTVenue: Room 702, International Conference Tower 7F, Tokyo Big Sight, Tokyo, Japan in...
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ISS 2025 Bulls & Bears Panel Abstract
ABOUTThe Bulls & Bears equity analyst panel offers an engaging debate on the state of the semiconductor and capital equipment cyclical fundamentals through 2024 and expectations for 2025 in the...