Showing 121 - 132 of 230
SEMI Press Release
SEMI Launches Industry 4.0 Readiness Assessment Model to Advance Semiconductor Smart Manufacturing Maturity
MILPITAS, Calif. — November 2, 2023 — SEMI today announced availability of the new Industry 4.0 Readiness Assessment Model (IRAM) to help organizations across the semiconductor...
Page
Korea Translations
Korean Translations of SEMI International Standards for Environment and Safety Underway
By Natalie Shim, SEMI Korea
As SEMI safety standards are very actively applied in the Korean semiconductor...
Page
FlexTech PR Programs
Page
300 mm Tape Frame FOUP Related Standards Published
300 mm Tape Frame FOUP Related Standards Published
By Hayato Iwamoto, SEMI Japan Region PI&C (Physical Interfaces & Carriers) Technical Committee, 300 mm Tape Frame PI&C Task Force...
SEMI Press Release
SEMI Europe Publishes Recommendations for the REACH Revision
Advancing Sustainability and Innovation in the Semiconductor Industry BRUSSELS, Belgium – June 30, 2025 – SEMI, the industry association serving the global electronics design and...
Page
Discover Our Most Popular Standards
Top 10 SEMI Standards Driving Microelectronics Innovation
Determined to take your semiconductor operations beyond conventional limits? SEMI, leading the charge in fostering innovation and...
Page
Smart Manufacturing Solutions
At SEMI, we are committed to meeting the manufacturing grand challenge by providing valuable tools and services. Through the Smart Manufacturing Initiative, members are collaborating and exploring...
Blog
China Now World’s Largest Consumer of Packaging Equipment and Materials
Fueled by heavy government investment, IC packaging and testing in China generated $29 billion in revenue in 2017, making China the world’s largest consumer of packaging equipment and materials,...
Event
Industry 5.0
Industry 5.0 is the next step in the evolution of industrial advancements, emphasizing a more human-centric approach to technology integration. While Industry 4.0 focuses on automation, smart...