Showing 2545-2556 of 2576
Event Presentation
SEMICON Europa 2017: 3DIC Assembly at Room Temperature Employing Binary Alloying
Eric Schulte, CTO of SETNA Corporation discusses current bonding methods of 3D assembly and proposes a solution via Indium Silver Binary, going over the methodology, characterization, and evaluation...
Event Presentation
SEMICON Europa 2017: Meeting the Increased Demand for 200 mm Capacity by Enhancing Capital Efficiency and Fab Productivity for IoT Applications
David Haynes, Ph.D., Senior Business Development Director of Lam Research Corporation addresses IoT challenges from a capital equipment perspective and offers strategies for reducing defectivity,...
Event Presentation
SEMICON Europa 2017: Providing Key Process Enabling Vacuum Capability Through Integrated Sub-Fab Data Management
Erik Collart, Global Product Manager at EdCentra of EDWARDS, discusses the importance of vacuum and ambient quality in the chip manufacturing process, and the enablement of manufacturing through...
Event Presentation
SEMICON Europa 2017: Flexible Displays – Dramatic New Capabilities Enabling New Applications by Expanding Form, Fit and Function
Michael McCreary, Ph.D, CTO of E Ink Corporation, discusses Electrophoretic Display Technology and its role in creating flexible, foldable, and curved displays for use in an increasing number of...
Event Presentation
SEMICON Europa 2017: Transparent and Flexible Moisture Barriers
Luca Gautero, Senior Process Development Engineer at Meyer Burger discusses moisture barrier applications/challenges, stacked encapsultation layers with PECVD and inkjet printing, and barrier foil...
Event Presentation
SEMICON Europa 2017: Henkel – Enabling Materials for Semiconductor and Sensor Assembly
HENKEL presents Innovative Semiconductor and Sensor Assembly Solutions via package level EMI shielding solutions, advanced semiconductor packaging materials, high conductivity semi sintering die...
Event Presentation
SEMICON Europa 2017: How Sensor Frameworks Enable Efficient Development
Shubhadip Paul, Software Engineer at NXP Semiconductors, discusses remote sensors in an IoT ecosystem, from smart sensor nodes to sensor frameworks. Two demonstrations of NXP’s technology are...
Event Presentation
SEMICON Europa 2017: Measurement of Airborne Nanoscale Particles Using Condensation Particle Counters
Richard Remiarz, Business Director of Controlled Environments at TSI Incorporated, discusses market needs, limits in light-scattering instruments, CPC technology and its history, water-based CPCs,...
Event Presentation
SEMICON Europa 2018: Power Semiconductor Wafer Thinning Process Control for Automotive Application
Yann Guillou, Global Marketing Manager of UnitySC, discusses power semiconductor ICs and their reliability. Power semi wafer backside processing and inspection techniques are discussed, as well as...
Event Presentation
SEMICON Europa 2017: The Digital Twin in the Cloud – Smart Equipment Life Cycle Managemetn by OEMs
Frank Geissler, Sales Director at AIS Automation Software Systems, defines “digital twin” as a dynamic digital representation of an industrial asset, that enables companies to better understand and...
Event Presentation
SEMICON Europa 2017: farao Company Pitch
This presentation, given by staff at farao, discusses the mobility/transportation market, acknowledging that private/commercial ownership dominates the total miles driven today, despite other...
Event Presentation
Chemical & Gas Manufacturers Group Webinar 2017: Advanced Patterning Challenges at 5nm
Darron Jurajda, Business Unit Leader at Brewer Science leads a presentation featuring three key speakers, including Greg MacIntyre, Advanced Patterning Department at IMEC, with “EUV Patterning...