Showing 2521-2532 of 2598
Blog
GF Simplifies RF-SOI and FD-SOI Design for 5G with New Partnership Program
GlobalFoundries' new ecosystem partner program, called RFwave™, aims to simplify RF design and help customers reduce time-to-market for a new era of wireless devices and networks (read the full press...
Blog
No Sweat! New Sensor Patch Helps Prevent Dehydration
Worried that you’re underhydrated after a heart-pounding run or bike ride? SEMI’s Nano-Bio Manufacturing Consortium (NBMC) has you covered – with a patch. A few years after the group undertook the...
Event Presentation
European 3D Summit 2018: Heterogeneous Integration – Driving Force and Enabling Technology for 3D-SiP
Bill Bottoms, Ph.D., Chairman at 3MTS discusses 3D integration, heterogeneous integration, CMOS scaling, growth in data generation and global network traffic, OSATs, and plasmonics. Six issues are...
Event Presentation
European 3D Summit 2018: Opportunities and Challenges in 3D Stacked Components
Bob Sankman, Fellow of Assembly Test Technology Development at Intel Corporation, gives a background on 3D packaging, TSV’s advantages, key technology elements required for 3D packaging (in...
Event Presentation
European 3D Summit 2018: Photonic Interconnects for High-Performance Computing and Data Center Applications
Ashkan Seyedi, Photonics Research Scientist at Hewlett Packard Labs, discusses memory-driven compute architecture, network topology, VCSEL photonics, silicon photonics interconnects, LSIP technical...
Event Presentation
European 3D Summit 2018: 3D SoCEnablement Through Hybrid Wafer Bonding – A Foundry Perspective
Luke England, 3D Package Development Manager and Tanya Atanasova, Technology Development Engineer at GlobalFoundries discuss 3D Wafer Bonding Applications, Hybrid Bond Process Flow Scenarios, and...
Event Presentation
European 3D Summit 2018: Fan Out Transformation from WLCSP to 3D
John Hunt, Senior Director of Engineering and Technical Promotion at ASE Inc. discusses WLP evolution, fan out variations (chip first vs. chip last; low density vs. high density), fan out...
Event Presentation
SEMI Oregon Breakfast Forum: China's Impact on the Semiconductor Industry – 2017 Update
Ed Pausa, Director of the Technology Center at PricewaterhouseCoopers discusses current findings on China’s impact on the Semiconductor Industry, including IC and O-S-D market/revenue growth and fab...
Event Presentation
SEMI Oregon Breakfast Forum 2017: How do I Protect Design and Value in the Global IC Manufacturing World?
Michael Chen, Director at Mentor Graphics, Siemens, suggests that only by continuing to innovate at the cutting edge will the United States be able to mitigate the threat posed by Chinese industrial...
Event Presentation
SEMICON Korea 2018: Shaping the Electronic Mobility Experience
Berthold Hellenthal, Manager of Development Electronics at AUDI AG, discusses Audi’s comprehensive semiconductor strategy, or Audi Progressive SemiConductor Program (PSCP), which features three...
Event Presentation
SEMICON Korea 2017: The Next Memory Cycle – When, Why, and How it Will Happen
Jim Handy, General Director at Objective Analysis, begins by showing a chart on semiconductor forecast accuracy, and digs into the memory cycle, what drives commodity cycles, what will drive today’s...
Event Presentation
SEMICON Korea 2017: The Future of Mobility
Klaus Meder, President of Bosch Corporation Japan, share sales figures from 2016 within mobility, industrial tech, energy/building tech, and consumer goods. Specifically a breakdown of total...