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This collection contains presentations by Dirk Drescher, GM at XFAB, Florian Hilpert, Group Leader of Aviation Electronics at Fraunhofer, Florin Udrea, Ph.D., Professor of Semiconductor Engineering at Cambridge University, and Klaus Hege, Global Key Account Manager at Linde Electronics, which were given during SEMICON Europa 2017 in November in Munich, Germany.

“From PPM to PPB – How Device Manufacturers Meet Increasing Challenges in Automotive Quality and Reliability” gives a company overview for X-FAB. Semiconductor content in cars is growing, with increasing complexity and precision requirements. Reliability is a selling point; the closer to zero defects, the better. Reducing failure rate in all three time frames (“infant” mortality, wear-out, and useful life) is key. Suggestions for moving from PPM to PPB are given in all production phases– design, prototyping characterization, qualification, volume manufacturing, wafer sort/reliability test, and assembly/final test. Collaborating with complete supply chain (upstream and downstream) is also recommended.

“Power Electronics of Highest Power Density for Automotive Applications” suggests miniaturization and mechatronic integration is the key to new applications. Potentials in Power Electronics include: semiconductor technology development, reduced switching losses, innovative module design, faster SiC modules, and advanced system architecture. Diversification in highly integrated driver inverters, such as the COSIVU, for use in electric commercial vehicles is discussed. Product offerings HoskA and EMiLE are introduced. Eventually, power electronic systems could be applied to aviation.

“Silicon and Wide Bandgap Devices in Power Electronics” introduces 5 spin-off companies from the HVMS Group. Applications suitable for WBGs, properties of silicon/4H SiC/GaN/Diamond are shown. The safe operating area for silicon/WBGs, and what breaks the silicon limit is analyzed graphically. SiC MOSFETs, doping concentration, GaN HEMT, and MiP Diamond diodes are all compared with pros and cons. Future technologies for silicon superjunction/IGBT/SiC/GaN/Diamond are postulated.

“The Technologically Transformational Automotive Electronics Market and the Implications for Material Supply” discusses the how electronics have become ubiquitous on cars, driven by innovation and growing regulation– some are safety negligible, but others benefit from safety enhancement, and others still are safety critical. Cameras, radar, sonar, GPS, and LiDAR can all be utilized, and redundancy is better. Automobile applications will grow all areas of semiconductor design and fabrication. Mass market safety is only achievable with quality across the full supply chain, from raw materials to distribution; Linde takes a holistic, collaborative approach as a liason between raw materials and customers.

 

Keywords: Automotive, Transportation, Defects, Reliability, Characterization, Optimization, Big Data, SiC, GaN, CMOS, MEMS, Sensors, MOSFET, Doping, Radar, LiDAR, Fabrication, Materials, Supply Chain, Assembly, Miniaturization