Arizona & Texas Virtual Fall Outlook 2025

Creating an Ecosystem for Advanced Packaging: How Backend Manufacturing is Leading the Way

As the semiconductor industry pushes the boundaries of performance, efficiency, and miniaturization, advanced packaging has emerged as a critical enabler of next-generation microelectronics. This virtual forum brings together leading voices from across the ecosystem to explore how backend manufacturing is driving innovation and collaboration in advanced packaging technologies.

Topics Include—

• The evolving role of backend manufacturing in enabling heterogeneous integration and chiplet architectures

• Key challenges and opportunities in scaling advanced packaging solutions

• Collaborative models for building a robust ecosystem—from academia to industry

• Workforce development and infrastructure needs to support future growth

• Insights into government and industry initiatives shaping the future of microelectronics manufacturing

Whether you're a technologist, strategist, or policymaker, this forum offers a unique opportunity to gain actionable insights into the future of semiconductor packaging and the collaborative efforts driving it forward.

Participate in a U.S. Time Zone:

• Pacific: 9am–11:00am
• Mountain: 10am–12:00pm
• Central: 11am–1:00pm
• Eastern: 12pm–2:00pm

Register now to be part of this important conversation and contribute to shaping a sustainable future for the semiconductor industry!