With the rapid rise of AI, high-performance computing (HPC), and memory expansion, 3DIC and advanced packaging technologies have become key drivers of semiconductor innovation. The integration of 3DIC advanced packaging technologies, bringing together industry leaders, academic institutions, and suppliers, is essential for strengthening ecosystem collaboration, promoting global partnerships, and addressing manufacturing challenges. Building a seamless and sustainable supply chain will be vital to sustaining innovation, advancing standards, and driving the next wave of semiconductor growth.
The SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) plays a pivotal role in connecting the ecosystem. By leveraging SEMI’s global platform and cross-domain resources, the Alliance aims to enhance manufacturing efficiency and yield, enabling the semiconductor industry to meet increasing demands for performance, miniaturization, and energy efficiency while continuing to push beyond the limits of Moore’s Law.
The SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) was initiated by SEMI, TSMC, and ASE to establish a comprehensive and resilient global advanced packaging ecosystem. The Alliance is expected to open for general membership applications in 2026.
For those interested in learning more or joining, please contact: Jamie Lee [email protected]
3DICAMA’s core mission is to strengthen ecosystem collaboration across the semiconductor value chain by linking manufacturers, suppliers, and academia to build a robust and synergistic innovation network. The Alliance also aims to reinforce global supply chain connectivity and local support capabilities, enhancing industry resilience and regional service capacity.
Through SEMI’s global platform, 3DICAMA promotes standardization across materials, processes, and design to improve manufacturing quality and consistency. It also accelerates advancements in 3DIC and advanced packaging technologies, as well as measurement and testing capabilities, to enable the next generation of high-performance, miniaturized, and energy-efficient semiconductor solutions.