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May 6, 2025
May 6, 2025

SEMI Standards Update: MEMS Manufacturing Readiness and Cybersecurity Initiatives Take Center Stage in Q1 2025

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With microelectronics manufacturing increasing in complexity and facing more cybersecurity threats, the SEMI International Standards Program has made crucial progress on efforts to address these challenges and others, in the first quarter of 2025. MEMS manufacturing readiness and cybersecurity came into sharp focus with the introduction of SEMI Standard MS15 - Guide to MEMS Manufacturing Readiness Levels. In addition, this quarter saw the opening of the public commentary period for a SEMI-led semiconductor manufacturing cybersecurity profile, developed for the National Institute of Standards and Technology’s (NIST) Cybersecurity Framework (CSF) 2.0

Through collaborative efforts, we held a successful North America Standards Winter Meeting in February, co-hosted a MEMS webinar, and published over 15 new and revised standards in areas such as equipment automation software, facilities, materials, and more.

With exciting developments still to come, we’re looking forward to a wonderful year ahead.

MEMS Manufacturing Readiness 

This March, SEMI unveiled its new standard, SEMI MS15 – Guide to MEMS Manufacturing Readiness Levels. This standard offers readiness level definitions, processes, and practices for creating MEMS products that meet targeted specification performance, quality, cost, and time-to-market. This standard is broken into eight distinct levels that cover basic research, all the way through high-volume production. 

Prior to the official release of SEMI MS15, we held a webinar that previewed how MEMS Manufacturing Readiness Levels will facilitate efficient MEMS development. Led by co-chair, Michelle Bourke of Lam Research, the SEMI MEMS & Sensors Industry Group (MSIG) hosted a webinar featuring MEMS experts from SoftMEMS, HP, Teledyne MEMS, and Polar Semiconductor. Speakers shared insight into creating a structured and balanced MEMS manufacturing approach to drive successful products to commercialization. 

Cybersecurity Resilience 

Like 2024, cybersecurity remains pertinent in 2025. Last October, SEMI introduced SEMI Standard E191 and its subordinate standard, SEMI E191.1 to help define cybersecurity status information reporting. SEMI E191 and E191.1 join SEMI’s existing cybersecurity standards, SEMI E187 and E188

Last year also saw the development of the NIST CSF 2.0 Semiconductor Manufacturing Profile under SEMI’s Semiconductor Manufacturing Cybersecurity Consortium (SMCC). In partnership with NIST, SMCC advanced a community profile for CSF 2.0 that will serve as a cybersecurity framework specific to semiconductor manufacturing. The profile opened for public commentary between February 27 and May 30, with the final version slated for official release in Q3 of this year.

As the semiconductor industry becomes increasingly reliant on digital technologies, we will continue to prioritize cybersecurity standards and initiatives essential for safeguarding the global supply chain.

North America SEMI Standards Winter Meetings

From February 24 to 27 at SEMI’s headquarters, leaders from 11 committees and over 40 task forces collaborated on new and revised standards and safety guidelines for environmental, health, and safety, equipment automation and software, liquid chemicals, traceability, and more.  

Three SEMI Standard draft documents that were reviewed at the North America SEMI Standards Fall Meetings last November have also been approved and published. In addition to SEMI MS15, SEMI F122 – Guide for Facilities Data Package for Manufacturing Equipment Installation and Building Information Modeling, and SEMI E193 – Specification for 300 mm Film Frame FOUP (FFF), have also been approved and published. SEMI F122 suggests formats for reporting facilities data required to plan, prepare, model, and optimize a facility for the installation of manufacturing equipment by fab owners and manufacturing equipment customers. SEMI E193 drives consistent implementation of interfaces for film frame carriers that are compact and work with existing 300 mm FOUP standards and BOLTS interfaces. These standards are now available for purchase. 

The North America SEMI Standards Summer Meetings will take place from June 2-5 at SEMI’s Milpitas, California headquarters. Some technical committees and task forces may meet virtually outside of this meeting set – check the SEMI Standards calendar of events for updates!

Standards Introduced in Q1 2025

New and revised standards released in Q1. 

January 2025 standards: https://store-us.semi.org/collections/standards/lang-english+stdpbc-0125

February 2025 standards: https://store-us.semi.org/collections/standards/lang-english+stdpbc-0225

March 2025 standards: https://store-us.semi.org/collections/standards/lang-english+stdpbc-0325

Testimonials

Hear from Doug Suerich, Director of Marketing at PEER Group, how his work is helping shape smart manufacturing standards and global cybersecurity policies through our powerful collaborative platform. 

Get Involved

SEMI Standards development activities take place throughout the year in all major manufacturing regions. To participate, join the SEMI International Standards Program.

SEMI Standards are available through Individual Download purchases or online via SEMIViews. Sign up for a 30-day SEMIViews trial.

For more information, please visit the Standards website and events page. For any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff

Paul Trio is Director of Standards at SEMI.