Semiconductor materials play a vital role in the manufacturing of integrated devices (I.C.s). Materials that are used to pattern the wafer are considered "Fab Materials", materials that are used to protect and/or connect the die are called "Packing Materials". The materials segments that SEMI follows include:
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The following material briefs provide a technology overview as well as a market summary for various materials used in the production of semiconductor devices. The data presented in these documents are based on our Materials Market Data Subscription report.
SEMI Materials Brief: Semiconductor Anti-Reflective Coatings (PDF)
Patterning devices during lithography exposure is difficult due to the highly reflective nature of these films, varying photoresist thickness, and device topography. In order to minimize these effects, materials called anti-reflective coatings (ARC) are applied to wafers either immediately before or after photoresist coating.
SEMI Materials Brief: Bonding Wire (PDF)
Wire bonding is used throughout the microelectronics industry as a means of interconnecting chips, substrates, and output pins.
SEMI Materials Brief: Chemical Mechanical Planarization Materials (PDF)
The manufacture of a semiconductor device is essentially achieved by building alternating layers of metal and insulator materials on a silicon substrate. CMP ensures that these layers be are extremely flat for lithographic processing.
Materials Brief: Semiconductor Photomasks (PDF)
A photomask, also called a reticle, is a transparent glass or quartz plate with an array of patterns or images that permit the passage of light in intricate and precise patterns to create the size and shape of a device's elements in a semiconductor circuit.
SEMI Materials Brief: Semiconductor Photoresists (PDF)
Photoresists allow precise pattern formation upon exposure to light through a template called a photomask and subsequent etching of portions of the photoresist, resulting in the permanent transfer of patterns to the wafer substrate.
SEMI Materials Brief: Semiconductor Photoresists Developers (PDF)
Aqueous or water-based developers are used in the lithography process to pattern photoresist films immediately after the exposure process.
SEMI Materials Brief: Organic Substrates (PDF)
In the past decade, high volume IC packaging has shifted from the era of ceramic packages to organic substrate-based packages, especially the plastic ball grid array (PBGA).
SEMI Materials Brief: Die Attach Materials (PDF)
Die attach materials provide the mechanical and thermal connection between the semiconductor device and the package. These materials are used in paste, tape or solder form. This market brief covers paste and tape materials only.
SEMI Materials Brief: Encapsulant Materials (PDF)
Encapsulant materials are polymeric-based materials used to provide mechanical and environmental protection of a semiconductor device. Mold compounds, underfill, and liquid encapsulants fall into this category.
SEMI Materials Brief: Leadframes (PDF)
A leadframe consists of a die mounting paddle and lead fingers. The die paddle serves primarily to mechanically support the die during package manufacture. The lead fingers connect the die to the circuitry external to the package.
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