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                                   MATERIALS MARKET

Summary

Semiconductor materials play a vital role in the manufacturing of integrated devices (I.C.s). Materials that are used to pattern the wafer are considered "Fab Materials", materials that are used to protect and/or connect the die are called "Packing Materials". The materials segments that SEMI follows include:


Fab Materials

  • Silicon
  • SOI
  • Photomasks
  • Photoresist
  • Photoresist Ancillaries
  • Gases
  • Chemicals
  • Targets
  • CMP


Packaging Materials

  • Leadframes
  • Substrates
  • Bonding Wire
  • Die Attach
  • Mold Compounds
  • Encapsulants
  • Ceramic Packages
  • Other Packaging Materials

Products

SEMI Industry Research and Statistics delivers powerful market data that enables you to:

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Materials

Materials

Materials

Material Market Data Subscription (MMDS)

A quarterly report covering worldwide semiconductor materials, markets and trends
August 30, 2019
Published Quarterly (Feb, May, Aug, Nov)
$2,800 Member | $5,600 Non-member
Multi-user licenses are available
Materials

Photomask Market Characterization Study, 2018 to 2020

A report covering Semiconductor Photomask Market Trends and Forecast
April 17, 2019
$650 Member | $1,050 Non-member
Multi-user licenses are available
Materials

Silicon Wafer Reclaim Market Characterization Summary (Report)

A report covering market trends, pricing, and forecast for the Silicon Wafer Reclaim Market
March 26, 2019
$650 Member | $1,050 Non-member
Multi-user licenses are available
Materials

Global Semiconductor Silicon Report

Historical shipments and forecast of Silicon Materials for semiconductor applications
Coming soon in January 2020
Member | Non-member

Resources

Historical Quarterly Silicon Shipment Data  

Archive Materials-Related Articles/Press Releases

The following material briefs provide a technology overview as well as a market summary for various materials used in the production of semiconductor devices. The data presented in these documents are based on our Materials Market Data Subscription report.

Member Only Content  SEMI Materials Brief: Semiconductor Anti-Reflective Coatings (PDF)
Patterning devices during lithography exposure is difficult due to the highly reflective nature of these films, varying photoresist thickness, and device topography. In order to minimize these effects, materials called anti-reflective coatings (ARC) are applied to wafers either immediately before or after photoresist coating.

Member Only Content  SEMI Materials Brief: Bonding Wire (PDF)
Wire bonding is used throughout the microelectronics industry as a means of interconnecting chips, substrates, and output pins. 

Member Only Content  SEMI Materials Brief: Chemical Mechanical Planarization Materials (PDF)
The manufacture of a semiconductor device is essentially achieved by building alternating layers of metal and insulator materials on a silicon substrate. CMP ensures that these layers be are extremely flat for lithographic processing. 

Member Only Content  Materials Brief: Semiconductor Photomasks (PDF)
A photomask, also called a reticle, is a transparent glass or quartz plate with an array of patterns or images that permit the passage of light in intricate and precise patterns to create the size and shape of a device's elements in a semiconductor circuit.

Member Only Content   SEMI Materials Brief: Semiconductor Photoresists (PDF)
Photoresists allow precise pattern formation upon exposure to light through a template called a photomask and subsequent etching of portions of the photoresist, resulting in the permanent transfer of patterns to the wafer substrate.

Member Only Content  SEMI Materials Brief: Semiconductor Photoresists Developers (PDF)
Aqueous or water-based developers are used in the lithography process to pattern photoresist films immediately after the exposure process. 

Member Only Content  SEMI Materials Brief: Organic Substrates (PDF)
In the past decade, high volume IC packaging has shifted from the era of ceramic packages to organic substrate-based packages, especially the plastic ball grid array (PBGA). 

Member Only Content  SEMI Materials Brief: Die Attach Materials (PDF)
Die attach materials provide the mechanical and thermal connection between the semiconductor device and the package. These materials are used in paste, tape or solder form. This market brief covers paste and tape materials only.

Member Only Content  SEMI Materials Brief: Encapsulant Materials (PDF)
Encapsulant materials are polymeric-based materials used to provide mechanical and environmental protection of a semiconductor device. Mold compounds, underfill, and liquid encapsulants fall into this category. 

Member Only Content  SEMI Materials Brief: Leadframes (PDF)
A leadframe consists of a die mounting paddle and lead fingers. The die paddle serves primarily to mechanically support the die during package manufacture. The lead fingers connect the die to the circuitry external to the package.

Member Only Content = are only available to SEMI members.

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