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CMP Technologies and Markets

A comprehensive review of the applications, technology, global markets and suppliers

2025 CMP TOC

Current Edition:

February 2026

Publication Schedule:

Annually

Principal Analysts:

Mike Corbett

Format:

Microsoft® Excel® file (.xls), PowerPoint® file
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Overview
Methodology
Overview

The 15th edition of the CMP (Chemical Mechanical Planarization) Technologies and Markets report delivers a comprehensive forecast of global CMP consumables demand through 2030, with deep insights into the market’s evolving growth drivers and emerging applications.

Following a strong rebound in 2025, the CMP market is experiencing renewed growth across 200mm and 300mm platforms. The expansion of advanced logic and memory technologies including 3D NAND and multi-gate structures like FinFET is accelerating demand for slurries and pads.

This edition also explores how the introduction of novel materials (such as cobalt liners, bulk cobalt fills, molybdenum and new barrier materials) is reshaping planarization requirements, creating new opportunities across both planar and non-planar device architectures.

Whether you're seeking to understand competitive dynamics, forecast demand, or identify materials innovation opportunities, this report is your go-to resource for strategic decision-making in the CMP ecosystem.

Applicable to: Semiconductor Manufacturing Equipment and Materials suppliers, IDMs, Foundries, Fabless, EDA, Semiconductor IP, Design & Verification Services, other suppliers of goods and services to the semiconductor design and manufacturing ecosystem. 

Market analysts, strategic and technical consulting firms, investors and investment banks. Executives, sales and marketing, business development, supply chain management, engineers, and strategic planning organizations.

Methodology

Report Methodology

Linx Consulting utilizes a proven approach to these studies in order to gather, analyze, and confirm the informational outputs required in the final reports. Key methodologies include the following:

Comprehensive Primary and Secondary Research

Linx conducts field interviews with key end users, equipment makers, materials suppliers, and knowledgeable experts. 

Market Modeling 

Wafer start forecasts by device type and technology node are combined with detailed device architecture models to develop unique forecast models for manufacturing unit operations, material demand and market trends.

Product Information

主な特徴

Features

  • 5-year detailed data: CMP materials consumption analysis from 2025 to 2030, with growth rates by technology.
  • Market overview: Overview of top suppliers and market shares by relevant segments.
  • Technology review of major applications: By CMP materials (Copper, Tungsten, Barrier, Cobalt, Moly, Ru, etc.) and by layer (STI, Oxide, and Polysilicon).
  • FEOL, Logic, and Emerging Memory Technology Coverage:
    Insights on FinFET, GAA, 3D NAND, MRAM, CrossPoint, and others.
  • Growth drivers: Segmentation by device type, technology roadmaps, and map unit operations by device type to inform market trajectory.
  • Delivered in PowerPoint format with embedded Excel charts
  • Proven methodology backed by 14 editions
メリット

Benefits

  • Strategic planning: Use accurate consumption analysis and growth trends to inform business and investment decisions.

  • Stay Ahead of Market Shifts: Access forward-looking insights to anticipate changes and align with industry direction.

  • Accelerate Growth Potential: Leverages insights from a rebounding CMP market, particularly in 200mm and 300mm, to capitalize on drivers.

  • Mitigate Risk: Navigate supply chain shifts, technology disruptions, and emerging materials adoption with greater clarity.

  • Benchmark Against Competitors: Understand your position in the market and how key players are evolving. 

  • Easily extract, customize, and adapt charts for presentations, scenario planning, and internal use.

  • Gain confidence in your planning with trusted, time-tested analysis used by industry leaders.

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Please review Market Intelligence License Agreement

* Price is per User License. Multi-user Discounts may be available. Email [email protected] to inquire.
Please review Market Intelligence License Agreement