downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content
Default Banner Image

Specialty Abrasives for CMP

Comprehensive Analysis of Advanced Particles used in CMP Slurries in the Semiconductor Industry

Specialty Abrasives for CMP report's

Current Edition:

December 2024

Publication Schedule:

Biennial

Principal Analysts:

SEMI & Linx Consulting

Format:

PowerPoint® file

Specialty Abrasives for CMP

The Specialty Abrasives for CMP report examines the key particles and abrasives in the changing field of chemical mechanical planarization, presenting 10 years of data with projections until 2028. As the semiconductor industry adopts novel transistor structures like GAA, HBM and 3D NAND, firms must adapt with advancements in new CMP processes and slurries components. This is especially important as the abrasives industry shifts towards lower abrasive content, focusing on chemical component of CMP.

 

The Specialty Abrasives report employs proprietary research for unparalleled market understanding, leveraging the Linx Materials model for comprehensive abrasive trends and demand, along with in-depth analysis of key CMP processes and materials. These critical insights enable firms to optimize their planning, anticipate supply and operational shifts to capture emerging growth opportunities and stay ahead of competition. 

 

Applicable to: Semiconductor Manufacturing Equipment and Materials suppliers, IDMs, Foundries, Fabless, EDA, Semiconductor IP, Design & Verification Services, other suppliers of goods and services to the semiconductor design and manufacturing ecosystem. 

Market analysts, strategic and technical consulting firms, investors and investment banks. Executives, sales and marketing, business development, supply chain management, engineers, and strategic planning organizations.

Report Methodology 

This report analyzes emerging CMP processes and materials with emphasis on the trends for abrasives. Additionally, we forecast abrasive demand using the Linx Materials Models, access key suppliers, and assess potential business opportunities. 

 

SEMI and Linx adhere to a proven methodology with direct field research with leading CMP users, equipment suppliers, consumable suppliers and technology sources, as well as our proven modeling capabilities to deliver accurate insights to our clients.

  1. Executive Summary
    • CMP Slurry Demand, 2024-2029
    • CMP Abrasive Demand, 2024-2029
    • Abrasives Forecast by Type
    • ASPs
    • Leading Suppliers and Buyers
  2. Methodology
    • Abrasives Allocation by Application and Node
  3. Forecast Drivers
    • Slurry Market
    • Technology Roadmaps
    • Wafer Market Forecast
    • ITRS
  4. CMP Applications to 5 nm, Slurries & Emerging Technologies
    • Copper Bulk
    • Barrier
    • Tungsten
    • Cobalt
    • Ruthenium
    • Oxide and Polysilicon
    • STI and Ceria-based
    • Zirconia
    • Emerging Applications
    • Silicon Wafer Polishing
  5. Abrasives Demand Forecasts 2025-2030 (MT & US$, by node & by application) by Abrasives Type:
    • Colloidal Silica
    • High Purity Colloidal Silica
    • Fumed Silica
    • Ceria
    • Alumina
  6. Abrasive Supplier & Buyer Assessment
    • Key Suppliers
    • Key Supply Chain Relationships
    • Key Buyers
    • New Entrants/Technologies
  7. Business Analysis & Opportunities
    • Market Summary
    • Abrasives by Application
    • Industry Concentration
    • Quality Requirements
    • Conclusions

Product Information

Features

Features

  • Emerging Process Analysis: In-depth examination of novel CMP processes enabled by new transistor structures like GAA, HBM and 3D NAND.
  • Materials & Applications: Insights into key slurry requirements, focusing on selectivity, purity levels, and defectivity. With applications to 5nm on these materials:
    • Copper Bulk
    • Barrier
    • Tungsten
    • Cobalt
    • Ruthenium
    • Oxide and Polysilicon
    • STI and Ceria-based
    • Emerging Applications
    • Silicon Wafer Polishing
  • Trends in Abrasives: Delivers 3 major forecast drivers: Slurry Market, Technology Roadmaps, Wafer Market Forecast.
  • Forecasting Demand: Utilization of Linx Materials Models for projecting abrasive demand and identifying key suppliers.
  • Competitive & Market Breakdown: Access key suppliers' data and potential business opportunities specific to new abrasives market trends.
Benefits

Benefits

  • Demand Forecasting: Leverage accurate 5-year growth forecasts to anticipate supply and material shifts and stay ahead of the field.
  • Strategic Decision Support: Equip companies with the insights necessary for informed planning and investment strategies in a changing industry landscape.
  • Optimize growth and mitigate Risks: Identify and leverage emerging trends to optimize positioning, production and reduce uncertainty in materials and processes.
  • Supplier Benchmarking: Evaluate market position relative to competitors through detailed supplier analysis and insights.

Purchase

Product Member Non-Member  
Specialty Abrasives for CMP Report - One-Time Purchase (enterprise-wide) $16,800 $16,800 Buy Now

* Price is per User License. Multi-user Discounts may be available. Email [email protected] to inquire.
Please review Market Intelligence License Agreement

* Price is per User License. Multi-user Discounts may be available. Email [email protected] to inquire.
Please review Market Intelligence License Agreement