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Member Directory v3

FlexTech Member Directory

Featured SEMI Members

Synopsys, Inc.
5 year member
ESDA
http://www.synopsys.com
Synopsys, Inc. is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. As the world’s 15th largest software company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and is also growing its leadership in software security and quality solutions. Whether you’re a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com.
Qualcomm Technologies
10 year member
SOI
http://www.qualcomm.com
Mirasol™ displays from Qualcomm® enable a whole new generation of flat-panel displays for mobile applications. These ultra-low power displays offer consistent viewing quality in almost any environment, including bright sunlight. They are compatible with existing hardware and software architectures, yet allow system designers the ultimate flexibility in their ability to differentiate based on image quality, power consumption and performance.
Entegris, Inc.
20 year member
MSIG
http://www.entegris.com
Entegris, Inc. (NASDAQ: ENTG) is a leading supplier of advanced materials and process solutions for the semiconductor, life sciences, and other high-tech industries. For over 50 years, we have been committed to solving our customers’ most demanding process challenges through a broad solutions portfolio, collaborative and innovative product development, and a focus on science and applications knowledge. Entegris has approximately 8,000 employees throughout its global operations and is ISO 9001 certified. It has manufacturing, customer service and/or research facilities in the United States, Canada, China, Germany, Israel, Japan, Malaysia, Singapore, South Korea, and Taiwan. Our highly skilled team members, facilities, and resources are right where you need them to help you solve your most advanced technology challenges. Additional information can be found at www.entegris.com.
ASMPT Limited
5 year member
MSIG
https://www.asmpt.com/
ASMPT is the Leading Global Supplier of Hardware, Software and Service Solutions for the Intelligent Factories of our Global Customers in the Semiconductor and Electronics Manufacturing Industry, including Advanced Packaging and Mainstream solutions such as ECD/PVD, laser grooving and dicing, die attach and redistribution, TCB, Hybrid bonding, optical and co-packaged optics, wire bond, mold, trim and form, test and inspection for Chip to wafer and chip to substrate; Ranked worldwide #1 since 2002.
ASML Netherlands BV
30 Year Member
SCC
http://www.asml.com
ASML is one of the world's leading providers of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or microchips. Headquartered in Veldhoven, the Netherlands, ASML designs, develops, integrates, markets and services these advanced systems, which continue to help our customers - the major chipmakers - reduce the size and increase the functionality of microchips, and consumer electronic equipment.

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Aalloy Engineering Pte Ltd
http://www.aalloy.com.sg
Aalloy Engineering Pte Ltd is a Singapore-based supplier of cable support systems including cable trays and cable ladders (MPM), and Ultra High Purity (UHP) tubing, valves and fittings (GPI) for semiconductor, pharmaceutical, data center, and high-tech industries. Products and solutions include cable support systems (MPM) for data centers and industrial facilities, covering cable trays, ladders, and accessories for reliable cable management, as well as UHP stainless steel tubing, valves and fittings (GPI) for semiconductor gas and process lines, and cleanroom piping systems for pharmaceutical and life sciences applications. Aalloy supports semiconductor fabs and cleanroom environments requiring reliable cable management, high purity tubing systems, and contamination control, backed by trusted international brands, strong regional sourcing capabilities, ready stock availability, and responsive project support.
Advanced Semiconductor Engineering Inc. (ASE)
http://www.aseglobal.com
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, Automotive, High Performance Computing and more. To learn about our advances in SiP, Fanout, MEMS & Sensor, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @asegroup_global.
AFRL
http://www.afresearchlab.com
The Air Force Research Laboratory is the primary scientific research and development center for the Department of the Air Force. AFRL plays an integral role in leading the discovery, development, and integration of affordable warfighting technologies for our air, space, and cyberspace force. With a workforce of more than 12,500 across nine technology areas and 40 other operations across the globe, AFRL provides a diverse portfolio of science and technology ranging from fundamental to advanced research and technology development. For more information, visit: www.afresearchlab.com.
American Semiconductor, Inc.
http://www.americansemi.com
American Semiconductor (ASI) is the industry leader in thin chip packaging. ASI’s thin-device capability is based on Semiconductor-on-Polymer™ WLCSP packaging that makes the thinnest chips possible. As the leader in thin and ultra-thin device technology, ASI provides a complete range of services for packaging, assembly, test and related electronic system manufacturing services. ASI's extensive thin-device packaging and chip-on-flex assembly enables us to support your program requirements for new product development, prototyping and volume manufacturing.
Applied Nanotech, Inc
http://www.appliednanotech.net
Applied Nanotech develops novel nanomaterials and processes that form the foundation for advances and competitive advantages in a wide variety of fields, including applications in microelectronics, defense, high-energy physics, nuclear energy. Our products and processes include unique printable conductive metallic inks and paste materials, and carbon foils. Examples of conductive metallic inks include copper, nickel, indium and indium/tin alloys, copper/nickel alloys, nickel/chromium alloys and molybdenum, to deliver higher performance in demanding environments.
Arkema Inc.
http://www.arkema.com
Arkema is a global specialist in high-purity advanced materials used in semiconductor equipment and processes. Our expertise includes fluoropolymers, fluorogases, MSA, hydrogen peroxide, amines, polyimide, PEKK and adhesive solutions across the supply chain. Arkema’s Kynar® and Kynar Flex® PVDF resins are chemically resistant to various chemicals including acids, alcohols, oxidants, and aliphatics. Kynar® PVDF systems exhibit very low leachables when in contact with high purity water and acids. A complete line of Kynar® PVDF components can be found including solid and lined pipe, pumps and valves, sheet and rod, vessels and filter housings. Kynar® resin also meets Factory Mutual 4910 smoke and flame criteria. Our Foranext® specialty gases selectively etch material, passivate high aspect ratio features, and modify the properties of substrates. Arkema is a leader in the promotion and commercialization of low global warming potential solutions to reduce emissions.
ASMPT Limited
https://www.asmpt.com/
ASMPT is the Leading Global Supplier of Hardware, Software and Service Solutions for the Intelligent Factories of our Global Customers in the Semiconductor and Electronics Manufacturing Industry, including Advanced Packaging and Mainstream solutions such as ECD/PVD, laser grooving and dicing, die attach and redistribution, TCB, Hybrid bonding, optical and co-packaged optics, wire bond, mold, trim and form, test and inspection for Chip to wafer and chip to substrate; Ranked worldwide #1 since 2002.
AUO Corporation
http://auo.com
An innovative total solutions provider with a commitment to creating sustainable value for its worldwide customers, AU Optronics (AUO) outstands and differentiates itself by corporate sustainability, strategic capability, and environmental commitment. Besides being named to Dow Jones Sustainability World Index since 2010, AUO is the world’s first TFT-LCD manufacturer to have received a LEED Platinum Certification. It is also rated by Bloomberg New Energy Finance as a tier-one PV module maker and by the market research firm EuPD Research as Top Brand PV in the module category. AUO is excited to offer its worldwide customers sustainable solar solutions with technological advantages, all-round service, and an integrated service platform. It has forged a business portfolio comprised of high efficiency and highly integrated solutions from module supply to solar power plant development, operation and maintenance, as well as energy management.
Binghamton University (SUNY)
http://www.binghamton.edu
The Center for Advanced Microelectronics Manufacturing (CAMM) is the nation’s first prototype research and development (R&D) facility in large area flexible electronics. CAMM is a New York State Center of Advanced Technology and home to the New York Node of NextFlex, Manufacturing USA. CAMM has substantial infrastructure for both traditional and additive fabrication and testing of medical and industrial sensors and IOT devices. It is part of Binghamton University’s New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3IP), which serves as an international resource for systems integration and packaging R&D.
BlueHalo
https://bluehalo.com/
AV builds exceptional technologies to support convergence of physical and digital health ecosystems. We provide modernized easy-access care to our nation’s joint forces and public. Our decades of experience with agencies such as the Air Force Research Laboratory (AFRL) and Defense Health Agency (DHA) aims to allow care to meet patients where they are “Anytime, Anywhere, Always”. We develop sensors for human cognitive, physiological and performance monitoring as well as environmental exposure. Combining cross cutting disciplines like biochemistry. We deploy cutting edge innovative smart sensors, connected aps, data analytics and AI/ML research tools to address challenges in operational medicine. Our experts focus on developing solutions in readiness optimization, rehabilitation and return to duty for service members facing challenges after traumatic brain injuries, anomalous health incidents, and musculoskeletal injuries.
Boise State University
https://www.boisestate.edu/
Boise State University is a public, metropolitan research university providing leadership in academics, research, and civic engagement. The university offers an array of undergraduate degrees and experiences that foster student success, lifelong learning, community engagement, innovation, and creativity. Research, creative activity, and graduate programs, including select doctoral degrees, advance new knowledge and benefit the community, the state and the nation. One of Boise State’s areas of research strength is materials science and engineering. A critical mass of faculty expertise exists to make substantive inroads in public–private research partnerships by helping industry partners understand the structure property-processing correlations of additively manufactured systems and their impact on product performance.
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