3M
Member Since
Jun 17, 2022
Member ID
11380
Website
Location
Display and Electronics Product Platform
Building 223-3S-23
Saint Paul
MN
55144
United States
Primary Industry
Semiconductor
Primary Product Category
Materials
Primary Product Sub Category
Assembly/Packaging Materials
Company Profile
3M provides a wide variety of products for the semiconductor industry, including heat transfer and cleaning/drying fluids, surfactants, CMP pad conditioners, CMP Fixed Abrasives, CMP pad bonding tapes, temporary wafer bonding systems, IC packaging materials including underfills, static control handling/shielding/testing materials plus electronic component packaging materials, labels, sockets and handling systems.