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Every day it seems like a new portable voice-first device is coming to market. From smart speakers small enough to fit in your pocket to tiny wireless earbuds and voice-activated TV remote controls, we are using voice increasingly to play music, select TV shows, turn on the lights or interact with our smart thermostat. While the popularity of voice-first interfaces has spawned massive diversity in device type, as long as these devices are portable, they have one thing in common: They’re battery-powered, and that could be a problem for consumers who are tired of frequently recharging or replacing batteries. Change the Architecture, Reduce the PowerThe issue lies in the traditional hardware architectures of today’s voice-first devices, which are notoriously inefficient when it comes to power consumption. Such devices rely on a “digitize-first” model of processing voice data in which the heaviest power-consumers, like the analog-to-digital converter (ADC) and the digital signal processor (DSP), do all the heavy lifting up front, right at the start of the audio signal chain. They continuously digitize and analyze 100% of the ambient sound data as they search for a wake word, even if speech is not present and the only sound is noise. Because voice is spoken randomly and sporadically, that continuous digitization of sound wastes up to 90% of battery power.To tackle the battery drain in portable voice-first devices, we need look no further than the human brain. Our brain processes sound very efficiently. Imagine that you are outside your house having a conversation with your neighbor. You are able to focus on what your neighbor is saying because your brain can differentiate between sounds that it should send to the deeper brain for speech processing and sounds that it shouldn’t bother processing further (e.g., dog barks, sirens or car traffic). The brain spends minimal energy up front to decide whether it should spend additional energy on processing down the line. In other words, it saves the most power-intensive processing only for the important sounds.We can mimic the brain’s approach to signal processing by enabling a new “analyze-first” architecture for voice-first devices. This analyze-first approach requires ultra-low-power analog processing technology that can differentiate voice from noise before the sound data is digitized. This keeps the higher-power capabilities in a voice-first system, such as the wake-word engine, in a low-power mode when just noise is present. This approach only wakes up the higher-power chips in the system, e.g., the DSP or ADC, when it detects speech. Like our brain, a voice-first system uses an analyze-first architecture to conserve energy most of the time, saving the heavy lifting, i.e., the wake-word listening, for times when speech is present. The analyze-first architectural approach to always-on listening analyzes the analog microphone prior to digitization, saving considerable power in portable voice-first devices that run on battery. This architectural shift to analyze-first is well worth the investment because it reduces the system’s power consumption in a battery-powered voice-first device by up to 10x. That’s the difference between a portable smart speaker that runs for a month on battery instead of a week or smart earbuds that last for a whole day instead of a few hours on a single charge. Longer battery life in portable voice-first devices generates more good will among consumers, creating another key differentiator for manufacturers engaged in the ultra-competitive race for more users.For more information on the analyze-first architectural approach to voice-first devices, please view our video.Tom Doyle is CEO and founder of Aspinity. He brings over 30 years of experience in operational excellence and executive leadership in analog and mixed-signal semiconductor technology to Aspinity. Prior to Aspinity, Tom was group director of Cadence Design Systems’ analog and mixed-signal IC business unit, where he managed the deployment of the company’s technology to the world’s foremost semiconductor companies. Previously, Tom was founder and president of the analog/mixed-signal software firm, Paragon IC solutions, where he was responsible for all operational facets of the company including sales and marketing, global partners/distributors, and engineering teams in the US and Asia. Tom holds a B.S. in Electrical Engineering from West Virginia University and an MBA from California State University, Long Beach. For more information, visit www.aspinity.com. Aspinity is a member of SEMI-MEMS Sensors Industry Group, which connects the MEMS and sensors supply network, allowing members to address common industry challenges and explore new markets.
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SEMI spoke with Thomas Fries, founder and CEO of FRT GmbH, about how hybrid metrology is shaping multi-sensor metrology tools to enhance measurement precision as the industry moves away from a single-sensor approach.Fries offered his views ahead of the SEMI MEMS Imaging Sensors Summit, 25 to 27 September 2019 in Grenoble, France. Join us at the event to meet experts from FRT Metrology and many other MEMS, imaging and sensors companies. Registration is open. SEMI: Metrology in front-end used to be straightforward. But then, as the number of tasks to be implemented increased, we moved to a multi-sensors approach. What drove this transition?Fries: I believe it´s more about software than about sensors. But of course the basis is the hardware. So, most metrology tools were designed around a specific sensor, e.g. a white light interferometer.A rigid frame, wafer fixtures, scanning tables etc. were then added to develop a complete system. In manufacturing more machinery was added, like handling systems, cleanroom equipment and more sensors, mainly for additive functions such as reading IDs or measuring temperature. The center was still the one and only sensor, being pimped more and more by some hardware features and a lot of software.SEMI: How are sensors and software shaping the way metrology is applied today?Fries: Today a huge number of optical sensors are available to provide various measurement options. But sometimes there are only very slight differences from one sensor to the other. A tiny variation may determine whether we solve a problem or end up fishing in troubled waters.And of course using different machines with those sensors requires high budgets for capital investment, used floor space, measuring time, etc. A multi-sensor platform solves all these problems. But again, it is the software that makes the real difference.SEMI: What lead to those advancements in metrology? What problems did they set out to solve?Fries: Metrology has been evolving ever since the measurement standards were established. The first challenge was to create a flexible mechanical platform that was also reliable and stable. All components were designed to be integrated into one system, mechanically, electrically and of course in the software.This level of integration requires not only an appropriate user interface, but also data formats and evaluation algorithms that leverage multi-sensor hardware. Today every metrology tool in the fab is justified by the application, not by specific sensors or specs. Of course the application leads to a set of specs, but the solution for the metrology task is realized within the software.New developments in metrology combine expertise in system design, physical knowledge in metrology and materials, mechanical engineering and also mathematical and software skills.The last step was the implementation of hybrid metrology functionality into a multi-sensor system that opens totally new doors in metrology. Before multi-sensors development, quite a few hitches could not be properly solved. SEMI: This is especially true when we consider applications in advanced packaging and MEMS manufacturing. What is in your opinion the main challenge?Fries: Specifically, in MEMS and advanced packaging we face multiple metrology challenges, as various processes run in one step and conditions on the wafer may vary quite often. In this case, a high degree of flexibility, up to the option to upgrade the metrology tool at any time or place, is a priceless advantage. Besides, cost effects for footprint, throughput and investment play a key role.A central task for nearly every customer application is to combine global measurements (complete wafer) and local measurements (per die) within one recipe. This is a perfect case for a multi-sensor platform. Measuring step heights and film thickness in one take is also an everyday routine. Combining those characteristics to measure hidden structures (hybrid metrology) is unique.SEMI: How will hybrid metrology enhance measurement precision and where do you expect the multi-sensor approach to be more applicable?Fries: The first advantage is the ability to measure properties that you cannot access directly. On top of that, all the previously mentioned features such as facing multiple metrology tasks, the combination of complete wafer and per die measurement are playing key roles. The precision of specific measuring tasks can be optimized by calibrating sensors against each other or combining results to get rid of noise or artefacts.MEMS and advanced packaging are natural playgrounds for hybrid metrology. But already today we see applications in high volume manufacturing in the 300mm fabs. As structures on wafers shrink, wafers are getting thinner and the whole process is becoming more and more complex. The classic one-sensor metrology tool is running out of gas. SEMI: What are your expectations regarding the summit in Grenoble, and for the future of the MEMS Sensors technology?Fries: FRT has always been very strong in MEMS and sensors and we have attended and exhibited at the SEMI MEMS Imaging Sensors Summit from the very beginning. The summit is always a very good meeting point for the community, and a perfect training session that gives participants extended updates in all fields. And of course, it grows our network and gives us the opportunity to show our latest products and applications.If you really want to know how the future of MEMS and sensors will look like, join the summit and don´t miss the chance to pass by the exhibition to meet FRT and many other industry leaders.Dr. Thomas Fries lives with his family close to Cologne. He is engaged in a variety of activities: as technical advisor to various ministries, supervisory board of PlanOptik AG, board and advisory board of IVAM, board member of COPT.NRW e. V., just to name a few. FRT supports many social projects as well as kindergartens and schools. Motorcycles and cars are still a great passion alongside his family.Serena Brischetto is senior marketing and communications manager at SEMI Europe.
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According to market research and strategy consulting firm Yole Développement (Yole), the total market size of MEMS, sensors and actuators will double from $48 billion in 2018 to $93 billion in 2024.[i] The consumer market will continue to drive volume, with applications such as smartphones making up for in volume what they lack in average selling price (ASP). Stronger demand in automotive, biomedical/health, industrial, and voice-first applications (such as smart speakers) will support this upward trajectory. With so much growth ahead of us, how will the design and manufacture of MEMS keep pace with industry demand for higher levels of innovation and integration, lower cost and lower power, smaller footprints, and faster design cycles — all while meeting acceptable price points?We turned to a handful of MEMS manufacturing experts from SEMI-MSIG who will join us at SEMICON West 2019, July 9-11 at the Moscone Center in San Francisco, to explore the complexities of keeping pace with market demand for MEMS over the next decade.Address the Design GapMentor GM, ICDS Division Greg Lebsack and SoftMEMS President Mary Ann Maher see tremendous progress in the manufacturing supply chain for MEMS. At the same time, they acknowledge the significant gap that still exists in design capability for creating the billions of interconnected sensors required for future applications. Greg and Mary Ann will dive into the standards, ecosystem requirements and collaborative design solutions that will allow the micro-sensors industry to meet demand for next-generation wearables, Internet of Things (IoT) products and medical devices.Get Collaborative with Greg and Mary Ann: Addressing the Design Gap to Enable Next Generation Sensor-Based Products, SEMICON West, TechTALKS South, Thursday, July 11, 2019, 10:35-11:00 a.m. Register today.Get to a Really Big NumberFrom thousands of sensors and actuators in a single airplane to hundreds in a single car or a piece of factory equipment to the twenty-plus that ship in each of the hundreds of millions of the world’s smartphones, we aren’t even close to reaching the saturation point for these intelligent devices. SPTS Technologies EVP GM David Butler isn’t living on the Spaceship Enterprise (or the Millenium Falcon, come to think of it) when he says that we are going to get to a trillion sensors. It is going to happen. The questions are: how and when?Connect with David: Enabling the Age of a Trillion Sensors, SEMICON West, TechTALKS South, Thursday, July 11, 2019, 11:00-11:25 a.m. Register today.Shift to Automotive-GradeDemand for optical sensing technologies such as LIDAR is shifting sensor manufacturing requirements from consumer- to automotive-grade, with its enhanced lifetimes, temperature cycling and higher performance specifications. To meet demand, manufacturers are turning to wafer-level processing, since it complies with the hermetic sealing and dew-point control required for the more rigorous automotive-grade applications. EV Group Business Development Director Thomas Uhrmann, Ph.D., will provide an overview of the steps for manufacturing optical elements, including integration with CMOS circuitry, as he offers a window into the future of automotive packaging for sensors.Tune in with Thomas: Future Manufacturing Requirements for Automotive and Photonics Sensing, SEMICON West, TechTALKS South, Thursday, July 11, 2019, 11:25-11:50 a.m. Register today. Measure Twice, Cut OnceFaster time-to-market, improved device yield, and greater productivity in high-volume manufacturing are increasingly critical requirements for MEMS manufacturers. When a single manufacturing error can cost hundreds of thousands if not a million or more dollars — as well as months of development time — designers can save both time and cost by employing an integrated approach to MEMS design. Lam Research Sr. Director of Strategic Marketing David Haynes will explain how simulation, verification and process modeling can address MEMS-specific engineering challenges such as multi-physics interactions, process variations, MEMS + IC integration, and MEMS + package interaction. Using the right tools before committing to actual fabrication can make or break a project.Get Conceptual (and Practical) with David: Enabling Better MEMS from Concept to High-Volume Production, SEMICON West, TechTALKS South, Thursday, July 11, 2019, 11:50 a.m.-12:15 p.m. Register today.Navigate a Dynamic Foundry LandscapeWe’re still living in a one product-one process world when it comes to MEMS manufacturing. This makes bringing a new device to market both time-consuming and expensive. These challenges aside, the functional capabilities of MEMS, combined with small-footprint and low-power options, have made MEMS increasingly popular. How are market dynamics in MEMS manufacturing evolving to accommodate both demand for high-volume, lower-cost products such as MEMS microphones as well as high-value, lower-volume products such as biomedical devices, IoT products and industrial sensors? Rogue Valley Microdevices Founder CEO Jessica Gomez will explain how foundry consolidation through acquisition, collaboration with other ecosystem players, and specialization in vertical markets such as biomedical or optical are some of the approaches that are transforming the MEMS foundry landscape.Join the Evolution with Jessica: Consolidation, Collaboration, Specialization: How Will MEMS Fabs Manage Changing Dynamics, TechTALKS Stage South, Thursday, July 11, 2019, 12:15-12:40 p.m. Register today.i“Status of the MEMS Industry report,” Yole Développement (Yole), 2019 Edition.Maria Vetrano is a public relations consultant at SEMI.
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Tracking and localization technologies typically integrate with Wi-Fi and Bluetooth signals to pinpoint the location of people and objects. But what if a venue can’t install beacons or routers, or afford to deploy Wi-Fi or Bluetooth networks? Thanks to a combination of proprietary algorithms, advanced sensor fusion and the natural geomagnetic field, GipStech, a spin-off of Università della Calabria, built an indoor localization and navigation technology platform for accurate localization in the absence of an adequate GPS signal.Ahead of the SEMI MEMS Imaging Sensors Summit, 25 to 27 September 2019 in Grenoble France, Serena Brischetto of SEMI spoke with Gaetano D'Aquila, co-founder and CEO of GiPStech, about sensor fusion, augmented GPS applications and the future of indoor localization. Join us in Grenoble to learn more about GiPStech and meet other MEMS, imaging and sensors experts. Registration is open online.SEMI: Early this year GiPStech completed a test deployment of the first high-precision, infrastructure-free navigation system at Tokyo Shinjuku metro station in Japan. This is the busiest transportation hub globally! What were the main challenges you faced and how did your technology enable such a highly complex indoor localization?D'Aquila: As you mentioned, Shinjuku station in Tokyo has been registered in Guinness World Records as the busiest transportation hub globally. With 36 platforms, 200 exits and countless corridors and connections, it is easy to get lost there, especially for foreigners and tourists. On the other hand, this scale and complexity makes it unfeasible and expensive to install Bluetooth or similar infrastructure for standard indoor localization.For this reason, we needed to provide a cost-effective indoor localization technology without installing any kind of artificial supporting infrastructure. Thanks to our GiPStech patented multi-sensor-fusion localization stack and the high density of public Wi-FI networks, it’s possible to determine when passengers are inside the station. The public Wi-Fi networks signals were fused as an additional source in GiPStech's sensor-fusion platform to complement the inertial and geomagnetic engine and deliver very accurate results across the entire station. The tests performed in the station also demonstrated that the localization system can even detect the floors where travelers are walking. Now we are ready to roll out the same setup in other stations and environments.SEMI: You are not the first to pursue infrastructure-free indoor localization, but your technology platform seems to be very accurate in bringing precision, stability and consistency to the user experience. What lead to those advancements and incredible results?D'Aquila: Our key differentiating factors are built in the approach we created after years of research and development. One differentiation, of course, is related to our expertise and know-how about how the geomagnetic field can be used as a driving signal for the localization process.During R D we constructed and patented a modular multi-sensor-fusion software stack to solve any kind of localization problem, mainly in indoor environments. We started from a single-signal approach based on the employment of the geomagnetic field as a localization signal. But, mainly due to the very inaccurate devices chosen to measure the geomagnetic field, such as the smartphones that everyone carries in their pockets, we noticed that this single-signal approach is accurate but not reliable because it is strongly affected by a key weakness – the quality of sensor in the device.SEMI: How long did it take for you to solve this issue?D'Aquila: We started to integrate other signals within a few months after the first field tests related to the employment of the geomagnetic field alone. We also began to develop a software platform that could fuse any signal source (natural or artificial) available in the environment to preserve the reliability and accuracy of the localization system when some of these signals are temporarily affected by poor measurement quality. This is our differentiating factor today. We can re-configure our software platform to provide the best reliability and accuracy with the lowest artificial infrastructure in almost any context – from outdoor in a seamless way to indoor and vice versa.SEMI: GiPStech’s inertial engine is one of your cutting-edge technologies that completes your advanced indoor navigation and localization software stack. How do you see the technology evolving?D'Aquila: The inertial engine was one of our first technology modules mainly developed to enhance reliability, smooth the signals and reduce the computational power requirement of our geomagnetic localization approach.After a while, together with a third party that evaluated the performances of our module, we noticed that this module not only can be used as a self-standing localization technique, but it can also deliver high accuracy mainly in PDR (pedestrian dead reckoning) applications.Today our PDR is itself a black box with embedded subsystems. Besides some filtering modules, it includes a state-of-the-art step detector that detect steps even when the person changes the smartphone position and location (not only in the hands but also in backpacks or pockets) and an advanced step validation module that identifies and rejects fake steps.If you’ve ever used a commercial fitness tracker attached to your wrist, you know that in most cases if you move your arm the device will counts some steps that, of course, are not real. Our step validator solves this problem by detecting only real steps – a very important capability that allows our PDR to be employed as a self-standing inertial navigation system. We developed the PDR with strong attention to maintaining low requirements for the computational power and memory footprint. These additional characteristics makes the PDR very interesting even for a direct integration of the software at the silicon level in modern MEMS sensors.In a nutshell, the ability of MEMS sensors to run directly an embedded software module will drive technology enhancements that will allow some of the functionalities now available through an external application processor, such as those in smartphones, to move to a lower level (in the silicon). This, of course, reduces power consumption while even increasing the number of value-added services, including localization services, that could be built directly on top of the MEMS without requiring external software and/or application processor.SEMI: Do you think indoor localization will be more applicable in the next 10 years in areas such as Smart manufacturing, travel, healthcare, entertainment and retail?D'Aquila: Several market reports and our business development experience lead us to assess which sectors are of greatest interest for the application of indoor positioning technologies. They include the following. Industry (manufacturing logistics) Healthcare (tracking of assets, patients and doctors) Big installations (visit experience for museums, fairs) Airports stations (both for travelers and for resource and operation management) Large distribution (user profiling and influencing of the purchasing behavior) Indoor localization is a key enabling technology. Adoption, mainly in these sectors, was limited by the unfavorable tradeoff between cost and benefits. Our indoor localization technology aims to overcome those tradeoffs to make its adoption much more cost-effective while providing the best possible reliability and accuracy.SEMI: What are your expectations regarding the summit in Grenoble, and for the future of the sensors technology ahead? Where are we heading?D'Aquila: Many sectors would benefit from indoor localization technologies. MEMS, imaging and sensors are driving innovation and explosive demand for transportation, medical, mobile, industrial and other IoT applications. But these devices also constitute the basic building blocks for the development of reliable and affordable localization technologies.In outdoor environments we are pretty covered by the GPS. Indoors, where we spend more than of 80 percent of our time, similar types of services are coming to the market now and becoming more reliable over time.This Summit facilitates the direct interaction between different stakeholders to act at different points in the MEMS sensors value chain. Indoor localization was an emerging technology unrelated to the sensors ecosystem until now. Today, indoor localization must leverage MEMS sensors to be effective and reliable. In the future, localization technologies will be embedded directly in silicon to deliver the best performance at a lower cost to increase their adoption for more applications.Gaetano D'Aquila served as research fellow from 2002 to 2004 at the CNR and as an assistant teacher at the University of Calabria. From 2003 to 2014, he worked in the industry first as a security consultant for Telcos and Banking in Value Team S.p.A. and then as project manager at Infomobility S.p.A., where he coordinated research and development and strategic activities in the automotive and auto insurance industries. In 2014 he co-founded GiPStech and is its current CEO. He has published several papers in scientific journals and has filed for seven patents, three of which have been granted in the U.S. and Europe. Gaetano has a MSc in Computer Engineering and a Ph.D. in Science and Engineering of the Environment, Buildings and Energy from the University of Calabria, Italy.Serena Brischetto is a marketing and communications manager at SEMI Europe.
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Why Is Smart Parking a Hot Topic? Poorly managed parking resources have a substantial negative impact on cities — one that has been well-documented. According to industry studies, poorly managed parking: Increases Traffic Congestion: 30% of traffic is caused by ongoing circling for parking. Increases Pollution: In Westwood, California, cruising for parking burned 47,000 gallons of gas and generated 730 tons of carbon dioxide in one year. Frustrates Drivers: Urban drivers spend an average of 20 minutes per trip looking for parking. Stifles Economic Opportunities: Traffic congestion cost Americans $124 billion in 2013, and this is predicted to rise to $186 billion by 2030. These problems are getting worse. As a result of growing urban populations, cities account for more than 80% of carbon emissions globally. Unplanned or inadequately managed urban expansion leads to rapid sprawl, pollution and environmental degradation. Due to the lack of parking-space availability, for example, Japan is ranked among the most expensive countries for paid parking. If left unaddressed, poor parking management will continue to plague cities, both large and small. Fortunately, Smart City Internet of Things (IoT) initiatives are helping cities to address their parking issues. IoT to the RescueThere are three key drivers of Smart City IoT initiatives. Cities want to: Improve the overall quality of life and mobility in urban environments Leverage technology to augment and improve existing infrastructure and services that citizens rely on every day Foster both economic and environmental improvements The availability of high-accuracy vehicle detection sensors coupled with affordable, low-power connectivity has enabled a new generation of Smart Parking technology. However, choosing the right Smart Parking solution is essential.High-accuracy vehicle detection sensors can provide valuable data to city planners and parking managers. This information includes: Parking availability Traffic flow Parking occupancy rate and historical data Turnover For parking management to effect change, city traffic managers, parking managers and urban planners need a holistic view of parking availability and usage patterns, and users need real-time information about available parking spaces.Sensors, cameras and communication networks form the basic infrastructure for Smart Parking. To deliver on the promise of IoT and to help cities improve the overall quality of life for residents and visitors, cities need a complete smart parking solution that provides: Accurate real-time vehicle detection and location of available parking spaces – significantly reduces the amount of time spent cruising for parking spaces, giving drivers the precise location of available spaces Connectivity from the sensor to the cloud – facilitates real-time parking data that city planners, parking enforcement and traffic managers can use to reduce traffic congestion Parking applications for cities, parking-lot owners and drivers — enables navigation to available parking and supports mobile payment, streamlining the parking process. Parking applications can also direct traffic enforcement personnel to parking violations as they occur, helping to alleviate traffic bottlenecks, such as double parking in loading zones. Such applications also improve the efficiency of other city services such as public transportation and garbage collection. Complete Smart Parking Solution – Sensor to Cloud (Source: PNI Sensor) To learn how cities are using Smart Parking sensors to improve the services they offer to residents and visitors, come see PNI at SEMI’s 2019 FLEX Japan MEMS Sensors Forum (May 22-23, Toyko, Japan). PNI President and CEO Becky Oh and PNI’s partner, Macnica Networks, will share Smart Parking use cases from innovative cities, corporate campuses and universities (Smart Parking presentation, May 22 from 16:55-17:25). Register for the conference today. For more information about PNI Sensor, visit the PNI Sensor website. Becky Oh is the president and CEO of PNI Sensor. Throughout her 20 years with the company, Ms. Oh has held a range of senior-level positions, from operations to technical business development. She received an M.S. degree in Electrical Engineering from Cornell University and a B.S. in Electrical Engineering and Computer Science from MIT. Ms. Oh holds multiple patents in the area of devices with multi-sensing and reporting capabilities.
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Air pollution is one of the grand challenges facing the entire planet — from the wealthiest nations to the least developed. The World Health Organization reports that nine out of 10 people breathe air containing high levels of pollutants, and that polluted air takes over seven million lives annually through stroke, heart disease and respiratory ailments.As a result, the world is thirsty for reliable, high-performing chemical and environmental sensors that can provide previously unavailable real-time awareness of environmental conditions. On one level, this seems like a relatively simple step, given that smartphones are already equipped with miniaturized sensing technologies that can monitor our living environment and activities.While highly desirable, embedding air pollution sensors in common mobile and wearable devices has not been feasible previously because the necessary trade-offs between high performance and miniaturization have made it impossible.This situation drove a CEA-Leti team to develop a novel generation of fully integrated optical chemical sensors that leverage MEMS technologies. The team successfully merged multiple functionalities on the same chip, using integrated optics and photonics, fluidics, acoustics and electromechanical transduction. How did the team overcome significant technical obstacles to design a proof-of-concept device that senses multiple environmental pollutants — housed in a minimal hardware footprint?Advancing Chemical Sensor Capabilities with Silicon Featuring high selectivity, real-time performance, and fully reversible capabilities, optical chemical sensors are perfect candidates for industrial, environmental and biomedical applications. Consequently, in recent years, worldwide R D initiatives have invested substantial effort to improve them.R D programs have focused particularly on the mid-infrared (Mid-IR) wavelength range (2.5 - 12 µm) — also known as the molecule fingerprint region, which provides a unique combination of fundamental absorption order-of-magnitude bands and unambiguous identification of specific chemicals. A multitude of molecules generate strong and distinct absorption lines in the Mid-IR, providing a foundation for accurate spectroscopic detection. Traditionally, however, these sensors have required large and expensive lenses for infrared (IR) light, making them too big and costly for resource-constrained wearables and mobile devices.Fortunately, recent advances in integrated silicon photonics and quantum cascade laser (QCL) technologies have spurred investigation of new chemical sensor architectures. Richard Soref, a research professor at the University of Massachusetts Boston’s department of engineering, introduced the extension of Near-IR technology into the longer-wave Mid-IR infrared region in 2006. Soref’s concept showed that highly sensitive and selective gas sensors could be fabricated on planar substrates at low cost by co-integrating silicon MEMS, group IV photonics, and specifically designed III-V hetero-structures.While this approach showed promise, it preceded the widespread availability of most mobile devices and wearables. Foreseeing today’s proliferation of those devices, CEA-Leti developed the different building blocks required to implement these concepts in real devices.A New Concept of Integrated OpticsLeveraging these interesting findings, the institute developed a new combination of integrated optics and multiple sensor functions on a single chip: QCL sources, a photo-acoustic (PA) cell, and a mid-IR photonic integrated circuit (PIC) combiner. Their integration on a planar substrate (Figure 1) helped to achieve higher performance, new capabilities, and higher reliability at lower cost, all in a smaller package (less than a 1 cm3 or smaller than a 1-cent coin) with reduced weight and power consumption (less than 100 mJ per measurement). Figure 1: Fully integrated optical sensor (Courtesy: CEA Leti) This configuration represents a multi-gas-detection enabler. The PIC replaces costly, fragile discrete optics while the PA detector uses a MEMS microphone to replace bulky multi-pass cells.PA spectroscopy is among the most sensitive techniques available for monitoring chemical emissions or detecting gas traces. It relies on excitation of the chemical with a pulsed light source emitting at the absorption wavelengths of such molecules. The relaxation process creates local periodic variations of the temperature, resulting in stationary pressure waves, which high-performance microphones can detect.This new generation of devices, fully fabricated on silicon, shows performance comparable with state-of-the-art systems, with the huge bonus of small size and power efficiency that work well for mobile and wearable electronics. By supporting integration onto common technological platforms, such as on-chip photoacoustic sensors, researchers have successfully realized these miniaturized and cost-effective Mid-IR photonic devices in silicon. Mobile device and wearables manufacturers can now take advantage of manufacturable integrated devices for applications that are highly sensitive to size, performance and cost. Adding gas sensing to mobile devices and wearables is now very feasible.For more information on chemical sensing at CEA-Leti, please visit or contact: http://www.leti-cea.com/cea-tech/leti/englishCEA-Leti is an active member of SEMI-MEMS Sensors Industry Group. The technology research institute, along with Fraunhofer and imec, recently joined SEMI’s family as a Strategic Association Partner under a memorandum of understanding (MOU). Under this agreement, CEA-Leti will work with SEMI to advance technology roadmaps, industry standards and cutting-edge technologies including Internet of Things (IoT), artificial intelligence (AI) and machine learning that enable new capabilities across healthcare, automotive and other electronics manufacturing ecosystems. Sergio Nicoletti has more than 20 years of experience in micro and nanofabrication, including magnetic, superconducting and chemical sensing devices and technologies. Having joined CEA-Leti in 2006 as project manager for optical sensing devices used in chemical detection, Nicoletti is currently business development manager at the institute.Previous positions include research and project management at CNR-IMM (Bologna, Italy) and at Hitachi Global Storage Technologies. Nicoletti was also a visiting scientist at HGST (San Jose, Calif.), where he worked on magnetic recording-head devices.Nicoletti holds more than 20 patents and has more than 70 publications in peer-reviewed journals. In 2016, he was appointed coordinator of the European H2020 project MIRPHAB and is director of the project’s pilot line.Nicoletti received his Ph.D. in physics, with a focus on HTc superconducting devices, from Université Joseph Fourier (Grenoble, France). References“Photoacoustic cell on silicon for mid-infrared QCL-based spectroscopic analysis,” JG Coutard, A Glière, JM Fedeli, O Lartigue, J Skubich, G Aoust, A Teulle, T Strahl, S Nicoletti, M Carras, L Duraffourg. Proceedings Volume 10931, MOEMS and Miniaturized Systems XVIII; 109310V (2019) https://doi.org/10.1117/12.2506514“Miniaturization of mid-IR sensors on Si: challenges and perspectives,” S Nicoletti, JM Fédéli, M Fournier, P Labeye, P Barritault, A Marchant, A Glière, A Teulle, J Coutard, L Duraffourg - Silicon Proceedings Volume 10923, Silicon Photonics XIV; 109230H (2019) https://doi.org/10.1117/12.2506759
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New MEMS-based products are constantly emerging, fueled by the Internet of Things (IoT), autonomous driving, smart manufacturing and healthcare applications. The MEMS pressure sensor market is no exception to this trend1. Its growth has been driven mainly by automotive applications such as tire pressure management system (TPMS) regulations in China, fuel and ignition systems, thermal systems, oil-pressure monitoring, and indoor and outdoor navigation systems. Easy to customize and integrate, miniature, sensitive, accurate and low-power MEMS devices are especially well-suited to the accuracy, power consumption, sensitivity and miniaturization that pressure sensors require.Yet MEMS design also presents some specialized challenges, such as a strong coupling between fabrication technology and design. Complex physical structures that exhibit non-linear behavior, custom packaging requirements, and a final product that requires integration with surrounding CMOS circuitry are just a few examples. What’s more, there is a lack of standardized processes and process validation in MEMS design ecosystems. Pressure Sensor (Courtesy: X-FAB) As with other products based on MEMS technology, designers must increasingly customize pressure sensors for higher performance – sensitivity and linearity, in this case – while decreasing their package size. Designers can accomplish the task by studying sensor performance and manufacturability using computer models prior to fabrication. This can ensure that the sensor meets its required specifications while simultaneously reducing manufacturing cycles and cost.The Power of CollaborationThis is where strong collaboration among EDA providers, MEMS technologists and designers delivers tangible benefits. EDA providers and MEMS foundries can collectively help MEMS designers to incorporate foundry process constraints into their designs.In the semiconductor industry, first-pass successful silicon relies on standardized manufacturing processes, thorough technology characterization, accurate model generation, established simulation and verification, and extensive reuse of proven design blocks. In the MEMS world, where processes and products are developed concurrently, and processes change with every product, is it possible to adopt standardized processes, design methodologies, and tools that enable efficient reuse of existing technology and design knowledge? The challenge lies in maintaining the flexibility to optimize products for a diverse array of requirements. The ideal design platform should ease sharing of technology and design data between the foundry and its customers, enabling two-way collaborative development and allowing foundry technologists to easily perform a feasibility assessment of a customer’s project. This approach offers important benefits, allowing designers to explore and evaluate the suitability of a foundry’s process technology in their unique application. It also supports accurate prediction of device performance prior to fabrication and reduces costly build-and-test cycles. Combining standardized manufacturing processes, MEMS process design kits (PDKs), and a proven design flow are the starting point for development of manufacturing-ready designs.A Real-Life Example using Pressure SensorsAn EDA company, Coventor (a Lam Research company), along with MEMS foundry partner X-FAB, collaborated to develop a PDK that would ensure that manufacturing constraints are automatically considered early in their design process. The design flow is based upon an X-FAB fabrication platform that supports multiple process options for the manufacturing of absolute and relative MEMS pressure sensors. The PDK is a “golden container” for all the process and material characteristics of the silicon membrane and substrate, glass, passivation layers, and piezoresistive components. It enforces material properties and guarantees their correct implementation during the simulation. It also includes a component library containing ready-to-use, 3D parameterized devices (such as membranes and resistors), all pre-designed with foundry-supported materials to support their respective design rules. The components are readily partitioned for optimized meshing and simulation, saving design and simulation time. Figure 1: The elements and design flow of the PDK designed by Coventor and X-FAB. (Courtesy: Coventor)Designers can use components from the library to create a custom design — which might include different membrane shapes and sizes, and resistors of varying shape, size and position — to simulate the impact of different technology variants (such as resistor doping profiles, membrane and substrate thickness, glass material properties, and passivation schemes). This allows them to anticipate the effect of these design changes on sensor sensitivity for varying pressure and temperature regimes.Extensive validation of the pressure sensor design platform is currently underway. So far, the simulations have exhibited very good correlation to actual device measurements across a range of pressure and temperature conditions, including predictions of non-linear behavior for various pressure sensor designs. At the same time, the simulation accounts for mechanical membrane properties and piezoresistivity. With this type of design platform, a foundry can provide guidelines to help customers select both the fab technology and design features that lead to an optimal design solution. Figure 2: Simulation results depicting mechanical displacement in a pressure sensor design (Courtesy: X-FAB) Let’s Face the Next Challenges…A complete design platform for MEMS must eventually include not only MEMS device design, but system integration functions, such as the application-specific integrated circuit (ASIC) design and packaging/assembly of the product. In addition to the design verification that the PDK provides, additional partnerships among foundries, integrated device manufacturers (IDMs), research centers, equipment suppliers, and EDA vendors will help to define requirements and solutions that address every level of design and production. These might include tasks such as describing standardized material properties and process specifications, creating accurate foundry-proven design models, and defining requirements for system-level simulation. In the future, PDK simulations might even include up to tape-out and physical verification. To learn more about this collaborative PDK development work, please click here for the whitepaper.Christine Dufour, MEMS PDK Program Manager, CoventorChristine Dufour is the MEMS PDK program manager at Coventor. She has more than 20 years of experience in the semiconductor industry, leading process design kit development for BiCMOS and CMOS processes at several major semiconductor companies. Ms. Dufour has also worked as a product manager in the RF design environment area. In addition to her extensive experience in MEMS PDK development, she is an expert in all aspects of MEMS design flow and design tool development. Ms. Dufour received an engineering degree at Technological University of Compiegne.For more information on Coventor, a Lam Research Company, visit: https://www.coventor.com/ Viraja Sharma, Development Engineer, MEMS Simulation Design, X-FABViraja Sharma is a development engineer for MEMS Simulation Design at X-FAB. Her work involves the design and simulation of MEMS inertial and pressure sensors. Prior to her tenure at X-FAB, Ms. Sharma performed similar duties for other semiconductor companies. She received her Master of Science degree in Micro and Nano Systems from TU Chemnitz, where she studied MEMS and micro technologies.For more information on X-FAB, visit: https://www.xfab.comCoventor and X-FAB are members of SEMI-MEMS Sensors Industry Group that connects the MEMS and sensors supply network, enabling members to address common industry challenges and explore new markets. 1 Market research firm Yole Développement predicts that MEMS pressure sensors alone will become a $2 billion market by 2023. See: https://yole-i-micronews-com.osu.eu-west 2.outscale.com/uploads/2019/01/YD18018_MEMS_Pressure_Sensor_Market_Yole_Developpement_2018_Sample.pdf
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Creating a custom Internet of Things (IoT) IC is challenging because it involves multiple design domains (digital, analog and RF). Creating a sensor-based IC that combines electronics that use the traditional CMOS IC design flow with a MEMS sensor on the same silicon die, however, can seem impossible. Couple the co-design and verification challenges with a lack of traditional process design kit (PDK) support for MEMS, and you have a tough road to travel to get your IoT designs to market.What can we do to make the sensor-based IoT design community successful?Understanding the ChallengesThe sensor-based IoT IC typically features a MEMS sensor (and optional actuator) that interact with the real world. Analog and digital circuitry processes the signals and sends them to a CPU. The CPU provides the “smarts” to process the data from the sensor and then sends processed data via a radio to the Internet; alternatively, the CPU could activate the actuator. A typical sensor-based IoT IC (Source: Mentor: A Siemens Business) Based on the complexity of the system, designers face many co-design challenges: Analog design requirements imposed by MEMS: MEMS devices often require high voltages and multiple power supplies; they emit small signals that need amplification and conditioning; and they are sensitive to the environment and require calibration. Design flow interactions: Parasitics from MEMS devices might affect circuits and vice versa. Circuit designers need MEMS models for impedance and timing. Integration: MEMS devices operate at different timescales than circuits, which adds a layer of complexity. Compounding the problem is a lack of MEMS PDKs and methods to tie together ICs and MEMS PDKs for integration and cross-verification. After conquering the co-design challenges, the design team has to address mixed-domain simulation challenges that include: Simulating the system: This requires verification of MEMS, digital, analog and RF circuitry with embedded software that runs on the CPU. Timescales: These vary widely, from a single deflection of the MEMS transducer in femtoseconds to a seconds-long simulation of the embedded software performing a measurement and transmitting data. Simulation time: Simulation of a behavioral digital design is extremely fast. However, the system simulation requires stand-in models that incorporate the behavior of the analog and MEMS block to simulate in an acceptable amount of time. The challenge of timescales for co-simulation. (Source: Mentor: A Siemens Business) MEMS is the KeyThe reality is that it’s the MEMS device that adds extra complexity to the sensor-based IC design and verification flow. To amplify the problem, the MEMS manufacturing process is not nearly as mature as the standardized IC process. For example, the standardized IC process includes ready-made PDKs that include everything designers need to move through design and verification flows. Foundries often provide soft and hard IP to quickly build-out design, and EDA tools provide high levels of automation enabled by abstraction and a standardized IC flow. How will MEMS-based design evolve?MEMS-based design must catch up to the standardized IC process. The first step is providing MEMS PDKs that include: Multi-physics domain design rules and material properties Packaging information Wafer and bonding information Fabrication information We must also tackle issues associated with these PDKs, including: Ownership, distribution and maintenance of the PDKs Consensus on the contents of the PDKs Merging of CMOS and MEMS PDKs The industry needs to move toward standardized MEMS manufacturing processes with available PDKs. Companies must provide IP and recommend structured design methods for co-design and verification of ICs that incorporate MEMS. How can EDA help with these flows?The EDA ContributionEDA companies must work with teams in the MEMS IC co-design space, collaborating with MEMS fabricators to help enable PDKs. By incorporating PDK support within their own tools, EDA companies can provide an integrated custom IC flow that allows teams to design and verify MEMS-based ICs. For details about this flow, click here to download the Mentor whitepaper: Fusing CMOS IC and MEMS Design for IoT Edge Devices.Greg Lebsack brings 25 years of executive and technical management experience — along with a proven track record of building strong teams and delivering predictable results — to his role as general manager of the ICDS division of Mentor, a Siemens Business. Lebsack joined Mentor in 2015 after that company acquired Tanner EDA, where he was president. Prior to Tanner EDA, he held management and technical positions in a number of different industries and companies, including Sprint, General Electric and McKinsey Co. Greg holds a bachelor’s degree in business administration from Northern Arizona University.Greg Lebsack recently presented on the topic of Integrated Co-design of MEMS/IC at the MEMS Sensors Technical congress, a technical conference organized by the MEMS Sensors Industry Group.
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Have you ever wondered if you could “feel” what it’s like to revisit your favorite vacation spot while sitting on a couch in your living room? How about walk through a restaurant overlooking the water’s edge as you enjoy a savory dish, while still sitting on that couch?If you follow trends in consumer electronics, you probably imagined a virtual reality (VR) headset that uses a visual interface to simulate the ambiance of the restaurant as you use a voice interface to scroll through the restaurant’s menu. While the tech world has made great progress in evolving the visual and voice interfaces of VR, immersive virtual food-tasting also requires a digital interface that supports a sense of smell and taste. In fact, the National University of Singapore is conducting research on the topic (see the video), and Project Nourished claims to enable “eating and drinking in a whole new way – by hacking vision, gustation, olfaction, audition and touch – with or without caloric intake” – through VR.We’ve already come a long way in our quest to replicate human senses such as touch, vision (via biometric authentication) and voice to build user interfaces to interact with the digital devices around us. In fact, every invention that permanently changed the consumer electronics landscape in the last few decades has in turn brought to life one of these user interfaces (UI). For example, smartphones proliferated touch, video games such as Nintendo Wii and Sony Xbox brought gesture, and most recently, smart speakers and VR headsets have increased the adaptation of voice and vision.Complexities of UI DesignUI design is a complicated task that builds upon years of research in neuroscience, cognitive thinking and engineering. It must also account for individuality because users interact differently with their digital devices. Some, like me, use their left hand predominantly when interacting with a gaming console. Some have a heavy accent, which can make speech recognition difficult, while those with a hearing disability may prefer touch over voice as a user interface. Application, context and proximity of the device to the user also affect UI. For example, a user interacting with a smartphone at home has the option to touch or speak to the device whereas voice is the safest means to communicate with a car’s infotainment system while driving.Consumers often bring their digital devices wherever they go, but still expect a consistent user experience. Therefore, a natural user experience is the key to UI adoption. A multi-sensory approach combining voice, vision and/or touch could prove the most practical solution. For example, if I were to access my account at a bank ATM, I would prefer visual- or touch-interface authentication for security reasons, but I would still want to use a hands-free voice interaction to switch between the different menus on the machine. In this case, a combination of UIs could provide a more natural multi-sensory experience, albeit one that needs a careful design.UI technology development and adoption are largely influenced by the top four players in the consumer electronics industry – Apple, Amazon, Google and Samsung. Apple pioneered the touch interface with the invention of keyboard-less smartphones, and the rest of the industry followed suit. The introduction of Google Glass kickstarted the VR/augmented reality (AR) segment and opened new applications in the gaming and multimedia entertainment segments. While VR headsets work for gaming – and more recently for selling products and experiences – they are large and cumbersome devices that are uncomfortable to wear for extended periods. These are major hurdles for designers to solve. Voice, on the other hand, offers a hands-free user interface that is a more natural and frictionless compared to alternative UIs.A voice UI needs nothing but a voice command to interact with digital devices. However, it comes with its own complexity of varying user speech characteristics such as accent or volume. More importantly, the need to suppress various background noises for efficient use of voice UIs is critical. While edge computing and/or cloud-based artificial intelligence (AI) are critical technologies to enable battery life and performance of smart home devices, the overarching goal of conversational AI is still far from reality.From a business standpoint, the winner of the race for voice UIs must improve AI capabilities while supporting a strong ecosystem of partners. Amazon, for example, is king of this strategy. The e-commerce giant is building an Alexa Voice Service (AVS) ecosystem by way of its Alexa Fund companies and third-party integrations (partners) to realize its goal of proliferating voice everywhere. These partnerships enable the ecosystem to build end-to-end speech systems that can literally take voice interface products everywhere and promote, among other things, hardware startups that are disrupting the MEMS market with products such as environmentally robust piezoelectric microphones.Energy harvesting near-zero-power always-listening microphones, used in partnership with the AVS ecosystem, are enabling voice UI products to expand into battery-operated applications such as hands-free TV remotes, smart garbage cans, Bluetooth speakers, headsets, hardware appliances and automobiles. A good example of a unique voice UI launched at CES 2019: Housewares designer simplehuman’s voice-activated smart garbage can uses Vesper microphones and AVS. Watch the video.While the future might bring additional digital interfaces, along with multisensory experiences using vision, gesture and touch, voice UI is at the forefront of current technological innovation. Soon, Alexa might help cook dinner without intervention, even turning off the stove when food is burning through the use of a scent-detection sensor integrated with a microphone array. Voice UI continues to astound us with its possibilities, and we’re excited for the journey ahead.With more than 12 years of experience working in speech and voice applications for wireless devices, Udaynag Pisipati is a senior field applications engineer at Vesper. He holds a master’s degree in electrical engineering from University of Missouri and an MBA from Santa Clara University. A firm believer in speech as a natural user interface for human-machine interaction, Pisipati’s areas of interest include everything related to speech processing, including microphones/speakers, signal processing and machine learning.Vesper is a member of MEMS Sensors Industry Group (MSIG), SEMI technology community.
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The 3D optical sensing market is once again surging – and it’s all thanks to Apple. What will we see in the next wave of end products enhanced by this technology, how will other market segments approach – and eventually use – 3D optical sensing, and which suppliers stand to gain the most from this very vital technology?Although 3D sensing, facial recognition and optical authentication systems have become only recently hot topics in the consumer electronics market, these mechanisms first made their appearance nearly a decade ago in November 2010. Following that debut, Microsoft soon launched the Kinect system in its Xbox 360 gaming console, marking a milestone as significant as Nintendo’s launch of its Nintendo Wii remote controller in 2010, which catapulted MEMS motion sensors into the high-volume consumer market.The Kinect system used a triangulation-based camera that Israeli developer PrimeSense Ltd. created and then licensed to Microsoft; Apple liked the technology so much that it acquired PrimeSense in 2013. The first version of Kinect applied the Structured Light (SL) method, a depth-sensing principle featuring an infrared (IR) laser projecting dots onto the scene, with a monochrome CMOS sensor measuring the differences in the acquired pattern. The second version of Kinect used the Time-of-Flight (ToF) principle.Kinect for Xbox360 was not only a successful consumer product; it also sparked a new market, thanks to the relatively low cost of the 3D sensing solution. By using the same hardware for Xbox 360 as in its first version of Kinect, Microsoft allowed developers to design their pet projects in the Kinect environment. Adding hand gestures controls to a PC, creating a user-controlled virtual dynamic light (see Kimchi and Chips’ demo), and developing an inexpensive hologram generator (see “Princess Leia” video from the MIT Media Lab) are just a few examples of ecosystem developers and DIYers applying their creativity to Kinect.Apple Goes 3D with Face ID3D optical sensing has expanded from gaming consoles to the smartphone. In 2017 Apple presented its Face ID camera system for the iPhone X, which they launched to celebrate the 10-year anniversary of the iPhone. Face ID is the result of a longer term strategy for Apple, the byproduct of several company acquisitions to expand know-how in 3D sensing and augmented reality (AR)/virtual reality (VR). Between 2015 and 2018, Apple acquired the camera-module maker LinX (2015), the AR startup Vrvana and the imaging sensor firm InVisage Tech (both in 2017), and AR glasses’ designer Akonia Holographics (2018).For a company that has always innovated on its own terms, Apple’s idiosyncratic approach called for deployment of the Structured Light method combined with a ToF device. The result is an amalgamation that utilizes the best features of the two mechanisms, even if the combination is one that is expensive. Apple’s addition of a near-infrared illuminator to its ToF device enhances the system’s effectiveness under most light conditions while also improving the reliability of Face ID; the overall outcome is a more satisfying user experience. The ToF component, which STMicrolectronics supplies, makes use of so-called single-photon avalanche diode (SPAD) receivers that can work with any target material and color, although a higher target illumination is required to obtain good accuracy.The other core components of the Face ID system are the Vertical Cavity Surface Emitting Laser (VCSEL, from Lumentum) and a dot projector (from ams/Heptagon), assembled together in an optical package. Apple’s expensive but reliable approach explains the company’s inclusion of the Face ID system in its latest smartphone and tablet offerings – across the iPhone Xs, Xs Pro and Xr as well as in the latest iPad Pro models. Apple’s Face ID uses facial recognition for authentication on a range of iPhone and iPad Pro models. Image courtesy of Apple. Chinese Phone Makers Get into the GameMeanwhile, other mobile handset manufacturers are rumored to be working on Face ID-like systems or have already presented similar solutions, albeit through a variety of approaches. Some have chosen to use standard ToF devices while others have adopted an SL tactic. In many of these designs, which happen to target Android systems, OEMs generally include a fingerprint sensor as a fallback biometric option to their own nascent 3D facial recognition systems. The fingerprint sensor operates in either standalone mode or integrates into the display.Chinese handset maker Oppo, for instance, uses the SL method on its Find X model with algorithms coming from Megvii. Oppo claims its equivalent of Apple Face ID is faster. I have heard that Vivo has been working on a ToF camera since mid-2018, which it claims provides greater accuracy and security in end-applications such as secure payments and unlocking the phone.Chinese technology giant Huawei’s first 3D facial sensor appeared in its Mate 20 Pro flagship mobile phone. Aside from providing facial biometrics, the front-facing 3D sensor doubles as a 3D scanner, enabling users to digitize live objects that they can then manipulate in 3D AR applications. While still a novelty, the application highlights the use of 3D light sensors beyond that of biometrics. Xiaomi’s Mi Explorer Edition smartphone features a complex SL 3D module to enable 3D facial scanning although it looks like a clone of the Apple solution.Overall, the importance of facial recognition is no longer a matter of dispute, given that Apple’s rivals are now developing counterpart offerings of their own. Leaked code from the next revision of the Android operating system (revision Q), now under development by Google, has confirmed as much. Big and Getting BiggerIHS Markit forecasts that global revenue for ToF sensors in the 3D optical sensing market will surpass $500 million in 2019, up from $370 million last year. We also predict that the ToF market will grow in the coming years, spurred by combo solutions integrated with other light sensors in the same package. This will lead to a cheaper bill of materials (BOM) compared to the BOM for the SL method.At the same time, IHS Markit forecasts that the total market potential for light sensors will be worth much more, reaching $1.5 billion by year 2022. That’s because after a solid start with gaming consoles, 3D sensing has matured and consolidated in the massive smartphone arena.A segment of 3D Sensing’s future growth will come from other use cases and applications that are emerging outside consumer electronics and mobile. These include people-counting and -tracking in consumer and industrial applications, landing-aid and obstacle-avoidance functions in drones, and car-trunk (boot) opening with foot gestures, as well as gesture recognition and passenger detection in automotive. IHS Markit predicts steady growth for ToF and other light sensors. All told, the ToF approach appears to have a greater chance than the SL method in gaining a larger market share, leading to a cheaper and smaller BOM along with reduced integration costs in system assembly and calibration.Sometime this year, Apple and other handset OEMs may include a ToF-based 3D camera on the back of the iPhone to support more immersive gaming experiences and new AR/VR applications. This will further boost the 3D sensing market.To be sure, other mature technologies are available as valid alternatives to optical 3D sensing, including ultrasonic, mmWave and radar. These alternative technologies may gain part of the total market now commanded by 3D sensing, in use cases such as obstacle-avoidance or in-cabin presence detection.To learn about 3D Optical Sensing and Light Sensors from IHS Markit, go to: https://technology.ihs.com/606483/light-sensors-for-consumer-mobile-report-2018Manuel Tagliavini, a principal research analyst at IHS Markit, covers MEMS and sensors technology.Manuel Tagliavini joined IHS Markit in 2017. His key areas of focus are MEMS and sensors for mobile and consumer technologies. He is responsible for the tracking of sensors in handsets, tablets, laptops, and sports and fitness products.Prior to IHS Markit, he spent over 10 years with STMicroelectronics, working in various roles including product engineering, program management, and marketing and business development in the company's MEMS division.Tagliavini earned an Executive Master of Business Administration at SDA Bocconi School of Management and a Master of Science in Electronic Engineering from the University of Parma, both in Italy.Stay tuned with the technological advances and market trends in the MEMS Sensors ecosystem. Join MEMS Sensors Industry Group (MSIG), the SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, allowing members to grow and prosper.
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