MSIG

Semiconductor process development is no easy task, with each generation of devices more difficult and expensive to create. Traditional cycles of build-and-test development are becoming obsolete, since they are too expensive and time-consuming for the most advanced processes.The High Cost of Process DevelopmentMost chip designers developing new products rely on existing manufacturing processes, but someone had to create those processes to make the designs possible. The goal of process development is to create new semiconductor manufacturing processes that provide high yield while achieving the required device performance. In contrast to new chip design, however, it requires an entirely different set of engineers and skills.The traditional approach to process development involves building multiple test wafers to determine the ideal process for a given device. After one set of wafers is fabricated and analyzed, insights from the previous round help to refine process steps for another round of fabrication. Due to smaller feature sizes, each new process generation is more sensitive to variation. This adds even more complexity because smaller feature sizes and parasitic effects require more measurements and testing as well as additional fabrication. The cycle is repeated many times before the entire process flow can be finalized, making it time- and cost-intensive, especially for the most advanced technology nodes.Testing Virtual Wafers Instead of Real WafersToday, there is an alternative to this slow, expensive way of doing things. Virtual fabrication lets computers simulate all of the processing that occurs when real wafers are built. These virtual models allow semiconductor process engineers to test manufacturing equipment settings with far greater variation than is possible in a physical fab. Designers can simulate the entire process flow, running the equivalent of thousands of wafers in days instead of months. Designers can quickly see graphical animations to visualize process steps, modify process recipes and device geometries, and measure how these changes affect electrical behavior.Improving Yield Using Statistics in Virtual Wafer FabricationBecause of the high volume of data generated, designers are turning to statistical analysis to provide greater confidence in their choice of process settings. Defects and random variations can be modeled in a virtual fab in a way that’s not possible in a real fab, letting developers test the sensitivity of the device structures against the unpredictable aspects of processing.There’s more than one approach to optimizing the process settings used in a new memory or logic fabrication sequence. The simplest one involves taking a single variable and exploring its effects. Critical dimensions (CDs), for example, establish those feature sizes of a device that ensure desired electrical performance. A particular dimension can be swept from low to high values – developers can then measure the effects of that range on device behaviors such as threshold voltage. This allows developers to ensure that the electrical behavior of their device design addresses the range of expected feature sizes and variability. The interactions with intersecting process steps can also be tested for further validation, since these interactions can lead to unanticipated device performance.But, in reality, this approach isn’t sufficient for studying the complex web of interactions between process steps and the resulting structures.A second approach leverages Monte Carlo analysis, randomly varying a wide range of process and device parameters and calculating the resulting device geometry and performance. This data can be used to automatically identify the process and design settings needed to achieve yield and performance goals. It’s an area where simulation shines, providing a useful way to test the interactions between many different processes.Statistical experiments using virtual fabrication illustrate step-by-step methodology to optimize process and design settingsVirtual Fabrication PlatformSEMulator3D is a virtual fabrication platform created by Coventor, a Lam Research company. It allows the definition of all process steps, the modeling of devices, the collection of metrics, electrical and device analysis, the statistical analysis of results, and the visualization of process steps through graphical animation. Today, semiconductor companies use it for both optimizing and scaling leading process nodes and for developing advanced new technologies like GAA (Gate-All-Around) transistors.The ability to do this work virtually is the future of semiconductor process development. Virtual fabrication accelerates new process time-to-market by months, opening up market opportunities worth hundreds of millions of dollars for semiconductor companies.Visualization of process steps of a Gate-All-Around transistor shows 3D construction in SEMulator3D. To learn more about virtual fabrication and how it’s changing the future of semiconductor technology development, download our whitepaper Speeding Up Process Optimization with Virtual Fabrication.Lam Research is a longtime member of MEMS Sensors Industry Group®, (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enabling members to grow and prosper. Visit us today.David M. Fried, Ph.D., is vice president of Computational Products at Lam Research, where he is responsible for the company’s strategic direction and implementation of virtual process solutions, including the Coventor SEMulator3D virtual fabrication 3D process modeling solution. Fried leads the execution of technology strategy for technology platforms, partnerships, and external relationships. His expertise touches upon such areas as Silicon-on-Insulator (SOI), FinFETs, memory scaling, strained silicon, and process variability.Fried is a well-respected technologist in the semiconductor industry, with 60 patents to his credit and a notable 14-year career with IBM, where he was involved in successive process generations from 65-nanometer and lower. His most recent position was 22nm chief technologist for IBM’s Systems and Technology Group. He holds bachelor’s, master’s and doctoral degrees in Electrical Engineering from Cornell University.Republished with permission from Lam Research.

Call it a wild guess, but I suspect I am not the only follower of the automotive industry who is tired of reading articles that lament the impact of Covid-19 and speculate, to varying degrees of accuracy, what kind of recovery is in store for major automotive markets around the world.I’m much more interested in what solutions and creative approaches people, companies, and countries have come up with to make cars smarter and safer despite the pandemic or even because of it.A friend of mine who works at a major European vehicle OEM told me that “innovation cannot, must not stop – despite current difficulties.” This sentiment echoes through the automotive supply chain, particularly in the resilience of the semiconductor industry during these challenging times.The recent publication of the AspenCore Guide to Sensors in Automotive – Making Cars See and Think Ahead is a refreshingly positive and inspiring collection of articles, interviews, technology deep dives and business news, all carefully curated and edited by AspenCore Global Editor-in-Chief Junko Yoshida.One article I particularly enjoyed was her “6 Trends on ‘Perception’ for ADAS/AV.” The insights she was able to gather from experts attending the AutoSens show in Brussels are fascinating, even if consensus on what, exactly, will be the winning “robust perception” solution appears to be far off. This is only fitting with so many companies elbowing for that prime spot!Another feature article that stood out was Nitin Dahad’s “Level 5 AVs Unlikely Before 2035” article. It wasn’t so much the longer ramp to full autonomy that caught my eye but the daunting challenge the automotive industry and AVs have to tackle: “…all possible unusual driving situations under all driving conditions and in all environments.” This is truly a mind-boggling undertaking. The author argues that the road to Level 5 “is likely to be paved gradually, as more advanced driver-assistance features come to market.” Sounds reasonable.Both these articles point to the need for collaboration across the automotive electronics supply chain in order to not only sustain the pace of innovation, but accelerate it, as we face our current challenges. This made me think about the SEMI Smart Mobility initiative and how the great minds supporting it might be able to help. The initiative is designed to bring together automotive OEMs, Tier 1s, device makers, design houses, equipment and materials companies as well as R D institutes to address shared challenges and opportunities.SEMI used to stand for Semiconductor Equipment and Materials International, but over the past several years – and driven by the advent of IoT, AI, and everything “smart” – we now represent the entire electronics manufacturing and design ecosystem, with more than 2,400 member companies on our global roster. We created the Smart Mobility initiative in late 2017 with the initial goal of connecting a substantial number of members to new business opportunities involving rapidly rising silicon content in automotive. IHS Markit projects automotive semiconductor revenue to continue to grow at a 6% CAGR to 2026.Over the past 2 ½ years, the initiative has quickly evolved into a global platform connecting the semiconductor, sensor and automotive electronics ecosystem under one roof – the Global Automotive Advisory Council or GAAC. While “silicon content” is still the operative word for many of our core members, the Council’s mission is to address opportunities and challenges that impact more than one segment of the value chain. For example, the challenge of getting to zero defects involves just about every stakeholder – from contamination control in wafer carriers to ensuring device reliability and robustness to packaging and, ultimately, system integration in the car.SEMI also encompasses a number of Technology Communities that provide deep technical expertise in support of the GAAC’s mission. Member companies in our MEMS Sensors Industry Group (MSIG) are directly engaged in and contributing to the GAAC work. GAAC Europe Chapter - Participating Companies“Sensorizing” – making things smarter through the application of sensors – has created solutions for the automotive and mobility space that bring innovation, safety, security and comfort to driver and passenger and that benefit the environment around the car.This makes the AspenCore Guide to Sensors in Automotive a great resource for our members and SEMI staff as we collaborate to accelerate the drive toward Level 5 autonomy.If you are interested in learning more about SEMI’s Smart Mobility and the GAAC, please contact Bettina Weiss, Chief of Staff and Global Smart Mobility Lead at [email protected] with permission from EE Times.

Connectivity. Electrification. Shared Mobility. Autonomous Driving. McKinsey Company cites these four disruptive trends behind future mobility — dynamics that could help to transform quality of life for hundreds of millions of people.McKinsey Company predicts that by 2030, mobility innovation could dynamically alter everything from safety in human locomotion to air quality, public spaces and power systems. Much the same way that tiny plankton in our oceans sustain aquatic animals, MEMS and sensors, while small, are crucial building blocks of integrated mobility.As partner at McKinsey Company, Andreas Breiter will explore this connection during his MSEC 2020 presentation, Future Mobility Enabled by Sensorization. SEMI recently caught up with Breiter to preview his October 7 talk at SEMI’s first virtual MEMS Sensors Executive Congress, October 6-8 and 13-15, 2020.Register now for MSEC 2020 and explore this topic with Breiter during the live Q A portion of his presentation.SEMI: You play a dual role at McKinsey Company, advising clients in advanced industries on capital investments and serving on the leadership team of the McKinsey Center for Future Mobility (MCFM). What is the relationship between them?Breiter: Mobility has become so much more than the auto sector. Today when we say future mobility, we’re talking about the convergence of many exciting developments influencing the ways that people and goods move around. Cars have become computers, and we now have to contemplate new frontiers, such as air taxis and electric vehicle infrastructure.Mobility is changing so quickly that it’s inspiring decision-makers from other market sectors to explore what implications it will have for them. We’re helping mining companies think about their haulers, retailers think about their footprints, and insurance companies plan for autonomous vehicles. The MCFM exists as a global think tank to focus on these frontier topics, helping to ensure we are ready for the future. During my MSEC presentation, I’ll explore how those future topics are influencing automotive mobility in the short- and long-term. The MCFM is even more forward-looking, so we’re just starting to build scenarios for what might come in 2040 and beyond.SEMI: How are changes in the mobility ecosystem affecting the automotive value chain?Breiter: In the past, the automotive value chain was clearly structured. We had sensor companies selling to Tier 1 suppliers, who would in turn sell to OEMs, who would sell directly to end customers.The value chain has grown more complex, however. In the future, we might see fleets of robotaxis, which will be owned by companies instead of by individual consumers. Already today, rideshare companies are game-changers because consumers can travel by car without owning one.Plus we see companies offer parts of the user experience such as user interfaces for automotive infotainment. In the past, everything in the car was branded by the OEM, but now we have third-party platforms that let us control some of our automotive infotainment options.SEMI: How are MEMS and sensors suppliers participating in this new value chain?Breiter: The pervasive use of sensors in cars has driven automotive OEMs and Tier 1 suppliers to work directly with suppliers, whose close involvement eases the complexity of integration. Just think about the sensors used in autonomous driving. Getting that right is safety-critical.We’re also seeing suppliers go beyond the individual component level to provide complete systems-level solutions. Advanced driver-assistance systems (ADAS) are a good example.SEMI: Automotive applications tends to have some of the longest design-to-delivery cycles in industry. Will this ever change?Breiter: The automotive product lifecycle was typically five-plus years, with a few years of development before that and continued service after the end of the lifecycle. That gives MEMS and sensors suppliers a 10+ year timeline on one model.With so much innovation taking place, this slow cycle won’t work forever. Over-the-air (OTA) updates, for example, enable new features when they become ready for deployment. I expect we’ll see OTA updates from many end manufacturers in coming years. SEMI: What changes do you foresee in ADAS and autonomous driving?Breiter: ADAS and autonomous features will become much more common. We’ve already witnessed this progression, with introductions first in premier models and later rolling out in more affordable vehicles. Lane-change assist and rear camera followed this path and are now pretty standard. Collision avoidance, as a safety-critical feature, is likely next in line for more widespread adoption.As for fully autonomous driving, consumers will accept that only when it becomes safer than a human driving a car.SEMI: Where is the greatest opportunity in the next five years?Breiter: Electrification of vehicles is number one. When it comes to engines, we’re moving from internal combustion to hybrid and then to electric. Since OEMs are adding sensors for the battery system, for battery management, and for electric motors, this progression represents growth opportunity for sensors suppliers – in particular for hybrid vehicles that contain both powertrain technologies.But that’s not all when it comes to sensors. Outside of powertrains, new sensors are added to enable a variety of functions, including, for example, ADAS and autonomy, as well as increased interior content, such as mood lighting.SEMI: Is there anything surprising coming, sensor-wise, in mobility?Breiter: To enable intelligent traffic systems, you need to make infrastructure smarter — which brings us to sensors. We’re going to see roads and other assets in infrastructure sense the state of traffic, sense what traffic participants are doing, and support connectivity between, for example, the infrastructure, vehicles on the ground, pedestrians on walkways and drones in the air.SEMI: What would you like MSEC attendees to take away from your presentation?Breiter: We’re living in a transformative era for the mobility industry. During the last 100 years of mobility, the ecosystem barely changed. In recent years, however, we’ve seen massive technological gains, largely enabled by semiconductors, MEMS and sensors. Instead of serving as just one of many suppliers, I’d encourage MSEC attendees to anticipate future mobility challenges so they can offer solutions to OEMs and Tier 1 suppliers accordingly.For more information, visit McKinsey Center for Future Mobility. MEMS Sensors Industry Group® (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enables members to grow and prosper. Visit us today.Andreas Breiter leads McKinsey’s capital-investment work for advanced industries in North America as well as its Center for Future Mobility on the West Coast. In his advisory work, Breiter serves a broad range of companies in the automotive sector, including car and truck manufacturers and their suppliers, as well as companies in the utilities and renewables space. He helps executives make strategic choices around product development and helps companies stay ahead of emerging trends, such as autonomous driving, connectivity, electric vehicles, and shared mobility.Andreas holds a Ph.D. in Operations Management and studied in Germany, France, the U.S. and Canada.Nishita Rao is product marketing manager at SEMI.

At the 1964 New York World’s Fair, Walt Disney and his team of Imagineers debuted Audio-Animatronics® in four attractions, Great Moments with Mr. Lincoln, General Electric Carousel of Progress, Ford Magic Skyway, and it’s a small world. As “a new type of animation” that Walt said was “so lifelike that you might find it hard to believe,” Audio-Animatronics captivated audiences, setting the stage for the technological innovation that would transform theme-park attractions for decades to come. While the Audio-Animatronics in classic Disney® attractions such as Enchanted Tiki Room and Pirates of the Caribbean® continue to delight park-goers, more modern attractions take full advantage of the miniaturized, sensitive enabling hardware components, software algorithms, and connectivity technologies that are available to today’s engineers.When Michael Tschanz, director of engineering technology and analysis, a segment within Disney Parks, Experiences and Products’ Global Engineering and Technology department, gives the opening keynote at MSEC 2020, SEMI’s first virtual MEMS Sensors Executive Congress (October 6-8 and 13-15, 2020), attendees will get a rare look inside the magic of select Walt Disney World attractions. Join MEMS Sensors Industry Group and SEMI on October 6 for Tschanz’s keynote presentation, Model-Based Design and Scientific Data Analytics of Disney Attractions — and experience video footage that you won’t see anywhere else. Register now for MSEC 2020.MEMS Sensors Industry Group® (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enables members to grow and prosper. Visit us today.In his role at Disney, Michael Tschanz leads a multidiscipline team which develops detailed mathematical and physics models for transportation, ride and animatronic systems, custom software and network applications, and robotics. The responsibilities for this team also include the development of optimization algorithms, servo controllers, interactive/immersive experiences, data analytics, and material process solutions. Michael’s rich and diverse background includes designs of numerous attractions at various Disney theme parks including: Test Track® Attraction; Mission: SPACE® Attraction; Toy Story Mania!® Attraction and the Expedition Everest® Attraction. Michael also designed all the velocity profiles at the worldwide locations of The Twilight Zone Tower of Terror™.Nishita Rao is product marketing manager at SEMI.

MEMS sensors have come a long way over the past few decades. The late 1990’s brought us the mass production of both MEMS accelerometers for automotive air bag crash sensors and MEMS gyros for rollover detection and anti-locking braking systems (ABS). In the early 2000’s, MEMS sensors made the jump from automotive to mobile and consumer electronics, first with a MEMS microphone in the wildly successful Motorola RAZR phone and then with a MEMS accelerometer in the first Nintendo Wii remote.Following this initial period of MEMS’ commercialization, the timetable for the mass proliferation of both MEMS and non-MEMS sensors accelerated dramatically. Just take Apple iPhone. Released in 2007, the first iPhone had one MEMS accelerometer and one proximity sensor. Released 10 years later, iPhone X included four MEMS microphones, a barometer, three-axis gyro, MEMS accelerometer and proximity sensor, an ambient light sensor and an infrared (IR) sensor, a magnetometer, and multiple image sensors. For perspective’s sake, well over two billion iPhones have been sold since 2007, making iPhone a major growth-driver in MEMS. According to Yole Développement[i] (Yole), MEMS will generate $10.9 billion in revenue in 2020 alone (non-MEMS sensor revenue will be even higher), spanning automotive, consumer and mobile, Internet of Things (IoT), medical and healthcare, aerospace, industrial and other markets.With so much growth behind us, what’s ahead? Jens Fabrowsky, executive vice president of Automotive Electronics at Robert Bosch GmbH, will share his insights on the future of MEMS during his MSEC 2020 keynote, The Next 10 Years of MEMS: An Outlook on Opportunities and Challenges. I recently spoke with Fabrowsky to preview his October 15 presentation at SEMI’s first virtual MEMS Sensors Executive Congress, October 6-8 and 13-15, 2020. Register now for MSEC 2020 and explore this topic with Fabrowsky by participating in the Q A segment of his presentation.SEMI: What are some of the primary challenges facing the MEMS industry?Fabrowsky: Development costs for new generations of MEMS sensors are increasing, leading to several major shifts. To compensate for rising development costs and reduce risk, MEMS sensors suppliers are pursuing wider, diverse markets instead of just targeting high-volume applications. At the same time, end-device manufacturers are demanding greater product differentiation, but they don’t want to pay a premium for it or wait for new hardware iterations. To stay competitive, sensor suppliers are providing software solutions that support new features and functionality. That approach is more cost-effective and speeds design-to-production cycles. SEMI: What factors are increasing development costs for new MEMS sensors, and what can companies do to mitigate their R D risk? Fabrowsky: As with most electronic components, MEMS’ costs are driven by development and capital expenditures. The increasing complexity of the content, especially in interface ASICs and software, makes MEMS development a multidisciplinary feat, requiring several competencies across multiple design centers to meet ever-demanding timelines.Manufacturing also plays a role. We often see dedicated manufacturing lines built for new MEMS products, which stresses both investments and capacity planning. Working together as an industry, we can reduce risk and costs by applying the same manufacturing process to more than one generation of product, which will speed time to market, increase volumes and improve ROI. SEMI: To what degree will the COVID-19 pandemic continue to affect sensors suppliers?Fabrowsky: MEMS manufacturing flows have been affected by disruptions in the supply chain. While the benefits of multiple sourcing and more direct ownership of the flow itself (on-shoring, vertical integration) have helped us, no one in the industry can claim they are out of danger, especially if a new wave of contagion occurs. Our industry relies heavily on just-in-time manufacturing and logistics, and we are all watching for influences that could alter flow. The pandemic has reminded us all that an important competitive advantage is a predictable, secure supply — which also comes at a cost that the end customer must value. SEMI: Why and how are traditional hardware companies like Robert Bosch differentiating their platforms for end-device manufacturers? Fabrowsky: On-shoring was already a trend before the pandemic. We’ve always believed in and are still investing in our own manufacturing facilities. That includes the 12-inch ASIC fab in Dresden, Germany, where we expect to manufacture future generations of power and control electronics to satisfy the growing appetite for silicon that vehicle electrification demands.We think that one of our biggest differentiators is that our portfolio includes more than just components: Close collaboration with our internal partner divisions gives us comprehensive system know-how across the automotive supply chain. On the consumer-electronics side, we have extensive partnerships with makers of application processors, wireless systems, and sensor processing software. With this expertise behind us, we can provide flexible system-integration options to our end customers — who also benefit from a mature supply chain that supports high volumes and field-tested quality.SEMI: What does customer demand for software solutions mean for sensor suppliers and how will suppliers evolve to meet this need? Fabrowsky: In some silicon product business units, the R D effort to develop software is higher than the effort to design the hardware! Software is not only what’s needed on the application layer. It also runs the interface to the processors – the drivers. In addition, increasingly complex testing software ensures high yield and minimizes defects. On the application layer, we are increasingly using and promoting open-source platforms to encourage better collaboration throughout the ecosystem. In contrast, companies that charge fees to access their own proprietary software environments are missing the opportunity to remain competitive in the long run. SEMI: Why are end-device manufacturers looking for plug-and-play solutions instead of standalone devices? Fabrowsky: Consumers of electronic devices always want products with more features and lower prices. Their requirements produce a trickle-down effect that reaches all the way to component suppliers such as ourselves. This requires us to manage a healthy innovation pipeline, and to choose products and technologies that promise growth and high volumes. This isn’t always simple, however, and many times the component itself is not enough. Think of our Light Drive projector for Bosch Smartglasses. The only way we can hope to win designs in this market is by realizing a fully integrated module, with our own scanning mirrors and driver chips, as well as our integration of laser modules and the display system. This lets us offer an individually tested and calibrated end product ready for assembly.SEMI: What would you like MSEC 2020 attendees to take away from your presentation?Fabrowsky: We’ll be looking at what’s driving the next decade of MEMS applications. For example, the embedded computing inside the sensors, together with enhancements in integration, materials and packaging, will increase the pervasiveness of MEMS sensors and actuators as touchpoints between electronics and the physical world. This will create a new form of intimacy between us and the machines, which we call Artificial Empathy.To learn more about Bosch Smartglasses Light Drive and other MEMS advancements, register now for MSEC 2020.Robert Bosch GmbH is a longtime member of MEMS Sensors Industry Group® (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enabling members to grow and prosper. Visit us today.Jens Fabrowsky began his more than 20-year career at Bosch Group as department head responsible for hydraulic units in the Blaichach plant, Germany Chassis Systems division, in 1999. He soon moved onto technical plant manager and later to plant manager within the company’s Germany Gasoline systems division. He has held the role of executive vice president, Automotive Electronics at Robert Bosch GmbH, since April 2012. Fabrowsky studied mechanical engineering and industrial engineering at the University of Stuttgart (Germany) and the Technical University of Munich (Germany). [i] Status of the MEMS Industry report, Yole Développement, 2020.Nishita Rao is product marketing manager at SEMI.

Jack McCauley understands the interplay between video game hardware and human interaction like few others in the industry. He designed the guitar and drums for Red Octane’s (later Activision’s) Guitar Hero video game series. As co-founder and chief engineer of Oculus VR, he designed the Oculus DK1 and DK2 virtual reality (VR) headsets and helped guide the company through its acquisition by Facebook in 2014. Now active in automotive technology, he builds cars at Black Lab, his private R D facility and hardware incubator in Livermore, California. And, in no small feat, he thinks he’s solved the head-tracking problems in augmented reality (AR)/VR headsets – which he’ll demonstrate during his keynote presentation, MEMS Applications in Augmented Reality, October 6 at MSEC 2020. SEMI’s first virtual MEMS Sensors Executive Congress. The event is October 6-8 and 13-15, 2020, and registration is open. I interviewed McCauley to preview his presentation. Register now for MSEC 2020.SEMI: What inspired you to become the first person to use a MEMS sensor in a gaming device?McCauley: When I started designing the Guitar Hero peripherals, I had intermittent problems with the motion tracking. I switched to a Freescale single-axis accelerometer, developed some IP around it, and that fixed the problem. That’s how I became an early customer of MEMS. SEMI: When you pioneered immersive VR gaming experiences at Oculus VR, tech industry analysts predicted widespread adoption of VR for gaming. What do you think happened?McCauley: There are a lot of reasons why VR hasn’t become the standard bearer for gaming. Gaming used to be a solitary activity, but as companies like Microsoft and Sony got behind multiplayer gaming, we realized many gamers found the social aspect more important than the visual aspect. Many gamers are content to play on a 2D screen or on multiple monitors because they’re playing against many people. The proliferation of internet connections worldwide has also promoted the kinship and social aspect of gaming.SEMI: Do you think VR has a place in other applications?McCauley: I think it has a lot of potential in real estate, VR movies, and engineering and design, among other areas. The automotive designer Henrik Fisker, for example, created whole vehicles in a game-engine model. If you wanted to buy one of his cars, let’s say, you could change the color and upholstery, for example, and then view it in a VR environment. SEMI: One of the biggest obstacles to VR adoption is the motion sickness some people experience during game play. What would you do to fix that?McCauley: The vestibular system in the brain, which uses the inner ear, is crucial to helping you balance. If there’s a mismatch between what your eyes see and your brain is perceiving, you’re likely to feel dizzy. I’ve built a VR headset that uses a MEMS pico projector with micromirrors and a small laser for position tracking as well as for facial tracking and modeling. But the platform’s not for sale.Still, many of the technical advances that we’ve made in VR are helping us with AR development. The increasing power of mobile chipsets and GPUs, the decreasing geometry for individual transistors and the way specific chips are processed, screen interfaces that will drive a 4K panel at a high frame rate, plus MEMS devices inside the eyewear for rotations and tracking are all helpful innovations.SEMI: When designing cars in your own lab, you’re doing a lot of work with AR. What do you think of AR’s commercial viability?McCauley: I know there are well-funded AR programs in place at major companies. That’s because mobile-device companies want an omnipresent phone in front of your face. I thought Google Glass, for example, was brilliant, but it was way too early for that product, and there was too much hype behind it.McCauley's latest R D project is a vehicle that incorporates augmented features and a computerized display. The vehicle is a custom built, environmentally friendly super-car with enhanced driver safety and high vehicle performance. AR is appealing because it lets people see through a screen – and have objects appear on that screen – while they are moving through space. My son actually came up with one of the ideas I’m implementing in a car I’m designing. We were driving in Spain, and he suggested that instead of using Google Maps to show me driving directions – which would force me to look down at an infotainment display – a sign could appear on AR glasses that would instruct me how to drive to Italy. That’s just an example of how we’ll use AR. SEMI: After you sold Oculus VR to Facebook, you began investing time and resources into engineering education. Why did you make that choice?McCauley: I’m originally from a blue-collar family, and then I got an education at Berkeley. That made a major difference in my life. When I sold Oculus, I donated to education-focused charities primarily, because an education can lift an entire family out of poverty. Let’s say your family are farm workers, but you get a degree in engineering and land a job at Apple. That could produce a ripple effect. As other members of your family and people in your community see the benefits of your education, they’re more likely to get an education, too. SEMI: What would you like MSEC attendees to take away from your presentation?McCauley: I appreciate what the MEMS industry has done for VR because if Oculus didn’t have a nine degrees of freedom (9DoF) IMU, no one would have bought our company. A new application will come along sooner or later that will require a different type of MEMS technology, and I have total confidence that the MEMS industry will deliver what’s needed. For more information on McCauley’s R D projects or on his position as Innovator in Residence at UC Berkeley’s Jacobs Institute for Design Innovation, visit his website. MEMS Sensors Industry Group® (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enables members to grow and prosper. Visit us today.Jack McCauley is an Innovator in Residence at the Jacobs Institute for Design Innovation, where he mentors students, lectures in courses focused on product design and design for manufacturing, and leads research and development projects focused on applications of augmented, virtual, and mixed reality for design professionals and students.McCauley graduated from Berkeley Engineering with a B.S. in Electrical Engineering and Computer Science in 1986, and credits the time he spent at Berkeley as an undergraduate with helping to ignite his career. Maria Vetrano is a public relations consultant at SEMI.

Earlier this year when the novel coronavirus, SARS-CoV-2, began sprinting around the world, public health officials told us that social distancing was the most effective way to slow its spread. We’re now many months into the pandemic, and social distancing, combined with mask-wearing, is still the best way to prevent new cases of the disease.On March 20, 2020, governors on opposite coasts, Gavin Newsom in California and Andrew Cuomo in New York, shut down their states, and other states soon followed. Only essential businesses, such as select retailers – grocery and hardware stores as well as pharmacies, for example – were allowed to remain open. Depending on location, however, it was days or weeks before strict social distancing measures were in place. Tape stuck six feet apart on store floors has helped shoppers keep their distance. But shouldn’t there be a more exact and reliable way to gauge social distances in retail stores, gyms, workplaces and other settings?David Horsley, founder and CTO of Chirp Microsystems, a TDK Group company, believes so, and the company is developing technology that does just that. Horsley will share the details in his keynote A Wearable Social Distancing Solution Based on Ultrasonic Time-of-Flight Sensors October 14 at MSEC 2020, SEMI’s first virtual MEMS Sensors Executive. The event is October 6-8 and 13-15, 2020. Register now for MSEC 2020.I spoke with Horsley to learn more about the sensors.SEMI: What was the inspiration for providing Chirp’s ultrasonic Time-of-Flight (ToF) sensors for social distancing?Horsley: Companies actually started contacting Chirp about six months ago to inquire about social distance tags to measure distance between people. They already knew about us because we’ve been supplying MEMS ultrasonic ToF sensors for virtual reality and robotics for several years, so they knew we could provide the same kind of low-power range-finding accuracy for resource-constrained devices. SEMI: How are your customers using Chirp-based social distance tags?Horsley: They’re designing Chirp’s ultrasonic ToF sensors into wearable tags worn by workers in distribution centers, in factories, and in oil and gas production, to name a few areas. The tags alert workers when they’re closer than two meters from another worker to ensure social distancing. Chirp’s ToF sensors also support contact tracing without recording any personal information, which is a major advantage over contact-tracing applications from companies like Google and Apple. Because those apps use Bluetooth Low Energy (BLE), which is already in your smartphone, the user has to enable location services. This records your GPS location, a privacy concern.BLE is problematic on some other levels as well. It only provides one-meter accuracy while Chirp’s ToF solution for social distancing delivers one-centimeter accuracy. Because BLE is only accurate within one meter, it can’t alert you in real-time that you’ve crossed that two-meter boundary to another person. Imagine you’re in the checkout line at the supermarket. BLE can tell you that other people are in your general vicinity, but it doesn’t have enough resolution to tell you whether the next shopper is two meters away from you or only one-and-a-half meters away. And because it doesn’t use the air as a medium, it registers a lot of false positives. If, for example, you’re separated from a person by a partition or a wall, and you’re within two or three meters of each other, your phone’s social-distance app will register a false positive.SEMI: Are you talking with customers in other environments, such as college campuses and theme parks?Horsley: There’s great deal of potential in those markets. For example, Professor Prabal Dutta’s group at UC Berkeley is working on a system that uses our sensors. His work also made us aware of some of the privacy concerns around contact tracing because universities are much more uneasy about student privacy than some private-sector companies are today. SEMI: What would you like MSEC attendees to take away from your presentation?Horsley: From the beginning, we believed that MEMS ultrasound was very versatile. We expected it to find a home in different types of applications because of its low power, small size and ease of use, particularly since we provide the enabling software that makes it all work. With design wins in four to five vertical markets, we’re experiencing significant marketplace validation. We’re all hoping that COVID-19 will wind down in the first half of 2021. As the focus on social distancing begins to fade, we’re looking forward to building out our customer base in the markets we’re in today as well as gearing up to explore new markets.Chirp Microsystems and TDK InvenSense are longtime members of MEMS Sensors Industry Group® (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enabling members to grow and prosper. Visit us today to learn how MSIG membership can make a difference in your business.David A. Horsley, Ph.D., is co-founder and CTO of Chirp Microsystems Inc., a TDK Group company. Horsley is also a professor of Mechanical and Aerospace Engineering at the University of California, Davis, and is adjunct professor of Mechanical Engineering at the University of California, Berkeley. Since 2004, he has been co-director of the Berkeley Sensor and Actuator Center (BSAC), the National Science Foundation’s Industrial/University Collaborative Research Center (I/UCRC) focused on MEMS research. Horsley is also a recipient of the National Science Foundation’s CAREER Award, and has authored or co-authored over 150 scientific papers and holds over 20 patents.Maria Vetrano is a public relations consultant for MSIG, a SEMI technology community.

While the world awaits a working vaccine to protect us from COVID-19, we need to employ all available tools to help curb the spread of this novel virus. On the one hand, it’s remarkable that we’re relying on the same low-tech tools that our forebears used to moderate the pandemic of 1918 — social isolation, mask-wearing and hand-washing. On the other, we have access to numerous technologies that hadn’t even been invented a century ago. Among the most important is molecular diagnostics for advanced testing.While we continue to face a scarcity of test kits in the U.S., the majority of commercially available genetic tests for COVID-19 are reliable, so accuracy is rarely the problem. We’re hampered instead by the timeliness of getting the results and by the level of detail the tests provide.To save more lives and reduce the burden on our healthcare system, we need point-of-care genetic tests that deliver accurate results rapidly, telling us right away who’s positive and who’s negative. We also need pertinent test data shared as quickly as possible via secure networks to improve our ability to track surges in infections. These are two of the challenges that emerging biotech companies are pivoting to embrace. RT-PCR: The Gold Standard in Accuracy, Not SpeedWhen I read about some of the high-quality COVID-19 tests on the market – such as Abbott’s, which detects positive results in as little as five minutes — I am awed by how far we’ve come since the last global pandemic. The core enabling technology in test platforms such as Abbott’s uses the molecular genetics technique real-time reverse polymerase chain reaction (RT-PCR). The vast majority of rapid tests administered today in hospitals and other clinical settings use RT-PCR.While accuracy is high for RT-PCR tests, getting tests results to patients is slow because test samples are sent to the lab for analysis. That lab could be located in a hospital, in a doctor’s office, or in an urgent care facility run by a large company such as Quest Diagnostics. Regardless of location, each lab must have an RT-PCR machine to read the test results. Plus each RT-PCR machine costs thousands of dollars, and requires a technician to read the results, , factors that have limited the proliferation of these machines.New COVID-19 cases are still surging in parts of the U.S., India and Brazil, and in some areas, we’re seeing instances of inundated labs, with test results coming back in one to two weeks. That’s not fast enough for a virus this contagious. We need to get accurate tests results to healthcare providers, public officials, and patients as close to real-time as possible. To meet this goal, we need to apply molecular-diagnostic techniques to new types of biosensors that deliver test results at the point of care in minutes through platforms that send that data in near real-time to the cloud. This essential information will allow public health institutions, states, cities and other key stakeholders to identify and mitigate emerging hot spots of disease.Over the past seven months, we’ve had the privilege of working with a handful of biotech companies that have pivoted to develop rapid point-of-care molecular diagnostics that target COVID-19. One of these, HEMEMICS, is developing a handheld molecular diagnostic test platform that could be administered by healthcare workers in triage settings such as ambulances, emergency rooms, community clinics and makeshift hospitals. As a true point-of-care test platform, it would deliver results onsite, without requiring the transfer of test samples to a lab. “We’re aiming to redefine point-of-care testing for COVID-19,” said John Lehman Warden, Jr., CEO and co-founder, HEMEMICS. “Unlike the most common type of on-site test — the lateral flow monitor — our test isn’t waiting for osmotic reactions to occur. We place the sample from a quick nasal swab or a drop of blood right on-chip, and binding takes place within a standing drop of fluid. That makes our platform fast, delivering results in about 60 seconds. Plus it simplifies sharing test results with other communities of interest, such as public health departments and municipalities, because it’s Bluetooth-enabled and supports cloud-based management networks.”As its foundry partner, we’re collaborating with HEMEMICS as it continues to refine its biochip’s sensitivity for both antibody and antigen testing of SARS-CoV-2. Once HEMEMICS is satisfied, it will move forward with the U.S. Food and Drug Administration’s (FDA’s) emergency use authorization (EUA), which it hopes will bring the HEMEMICS platform into the hands of the millions of people who stand to benefit.As we head into the fall and winter months, we’ll need both rapid, connected point-of-care biosensor test platforms such as HEMEMICS’ and high-accuracy RT-PCR tests to fight COVID-19 effectively. And at their root, we’ll have MEMS and biosensors to thank. For more information on Rogue Valley Microdevices’ biosensor solutions, please contact the company at [email protected] or visit its website. As founder and CEO of Rogue Valley Microdevices, Jessica Gomez has created a world-class precision MEMS foundry in the heart of Southern Oregon. Integral to her role as CEO, Gomez practices a business philosophy of offering best-in-class process technology and R D expertise to customers to help them achieve the highest quality and reliability in their products. Gomez plays an active leadership role within and beyond the technology industry. She is a board member of the prestigious SEMI Board of Industry Leaders, she was the first executive selected for Spotlight on SEMI Women, and she is chairman of the Oregon Institute of Technology Board of Trustees.Rogue Valley Microdevices is a longtime member of MEMS Sensors Industry Group (MSIG), a SEMI technology community that enables the MEMS and sensor industry to address common challenges, innovate and accelerate business results.

About 70% of the U.S. Gross Domestic Product (GDP) is driven by consumer demand. What consumers are looking for is influenced by, for example, fashion trends, product innovations, environmental forces, and personal interests. Regarding personal interests: Sales of electronic components at Fry’s are poor. Radio Shack stores even vanished completely. Today’s consumers do not like to tinker; they want to buy software-enabled, user-friendly systems with over-the-air updating that serves their current and future requirements well – e.g. smartphones. System vendors followed the same transition, and so did semiconductor vendors. Instead of offering (low margin) components, they develop and manufacture big portions of, if not complete, (high value) hardware and software solutions for electronic systems, targeted at specific markets.Mid-August, two SEMI webinars outlined the Smart Mobility market and what it expects from system and semiconductor vendors.SEMI's Smart Initiative“None of us knows as much as all of us,” “Connect – Collaborate – Innovate,” and other strategic considerations have motivated SEMI to become the gateway for the $2 Trillion (= 2,000 Billion) global electronic design and manufacturing supply chain. Figure 1 shows how many companies and organizations have joined this large industry organization, to work together efficiently and serve customer demands cost-effectively. Especially in four high-growth markets/application areas – Smart Data, Smart Mobility, Smart MedTech, and Smart Manufacturing – SEMI enables highly rewarding cooperation. Figure 1: Overview of SEMI members, technology communities, and areas of focus. (Courtesy: SEMI) MEMS and Sensors for Smart Mobility Tim Brosnihan, executive director of MEMS Sensor Industry Group (MSIG), moderated the webinar on MEMS and sensors for Smart Mobility. Bettina Weiss, Chief of Staff and Global Smart Mobility Lead at SEMI, presented the overview. In addition to Figure 1 above, she showed how many companies are now supporting SEMI’s Smart Mobility efforts and have joined the Global Automotive Advisory Council (GAAC). The European GAAC was founded in 2018, based on requests from VW and Audi. Regional chapters have also been formed in the U.S., China, Taiwan, and Japan. Figure 2 shows the current members of the American GAAC – new members are welcomed in all five regions. Figure 2: Current GAAC members in the Americas. (Courtesy: SEMI) Market Trends and Technology Innovations in MEMS Sensors Andreas Breiter, Partner at McKinsey Company, addressed markets, and Armen Mkrtchyan, Associate Partner at McKinsey Company, spoke about technology. Breiter addressed both vehicle and infrastructure changes required, as well as many ongoing and planned activities to enable Smart Mobility. He outlined autonomy, connectivity, electrification, and shared mobility of vehicles as the major opportunities for MEMS sensors. Mkrtchyan showed which technologies enable Smart Mobility and which regions will invest how much in software, hardware, and services by 2030, to capture data and process it in partially/fully autonomous vehicles’ Domain Control Units (DCUs) – see Figure 3. Figure 3: Pre-COVID market estimates. (Courtesy: McKinsey Company) MEMS-based sensors are used in vehicles to monitor pressures and perform as accelerometers or gyroscopes. Non-MEMS-based sensors capture light (e.g. for time-of-flight distance measurements) or magnetic fields (e.g. for RPM measurements). Regarding the many infrastructure upgrades needed for enabling autonomous vehicles on the roads, in Figure 4, Breiter gives road planners a lot of food for thought and planning work. City planners face much more complex challenges. That’s why electronic systems will also be needed to make these large infrastructure investments earn returns. Figure 4: Smart roads are essential for autonomous driving. (Courtesy: McKinsey Company) EDA and Smart Mobility The second Smart Mobility webinar focused on how Electronic Design Automation (EDA) tool vendors, Intellectual Property (IP, System Building Blocks) vendors, and system/IC Design Services can contribute to the success of Smart Mobility. Bob Smith, executive director of Electronic System Design Alliance (ESDA), moderated the webinar, highlighting where the relatively small but essential ESDA and its members fit in the semiconductor ecosystem – see Figure 5. Figure 5: EDA, IP, and design services enable the entire electronics ecosystem. (Courtesy: ESDA) Bettina Weiss explained how SEMI and the Smart Mobility Team are working to bring together stakeholders in the semiconductor ecosystem in general and the Smart Mobility segment specifically, to jointly address topics of common interest, work on solutions and agree upon standards where and when needed. Market Trends and Technology Innovations in EDA, IP and Design Services Andreas Breiter and Armen Mkrtchyan presented McKinsey’s perspectives regarding these topics. In addition to the above-mentioned market data, Breiter emphasized that DCUs are playing an increasingly important role in capturing the data provided by smart sensors, are processing it, and initiating appropriate actions. Together with application-specific software, these DCUs perform tasks like sensor fusion, manage creature comfort, assure safe operation of the vehicle, and secure communication with the outside world (Figure 6). Figure 6: High growth for DCU; likely shift in business models. (Courtesy: McKinsey Company) Mkrtchyan addressed EDA, IP, and services for Smart Mobility from 10 different technical perspectives. Here are the highlights. Component failures can and will have severe consequences in Smart Mobility. Therefore screening, testing, and exhaustive verification are extremely important. Software content is likely to increase at 10% CAGR during this decade. To increase the productivity of software and middleware developers, he emphasized that standards need to be agreed upon. Over-the-air (OTA) updating capabilities are needed. That’s why cybersecurity is important to keep vehicles current and safe. Power train electronics need to function at up to 150°C. New materials will be needed to increase reliability, reduce cooling efforts, and lower unit costs. Last, but not least, Mkrtchyan emphasized that every city needs to design its own infrastructure, not only to enable Smart Mobility but also to monetize the large investments needed; EDA, IP and design support will help to achieve both. In summary, he stated that Design and IP as well as packaging and test will be the most impacted areas in the transition to Smart Mobility. Personal Comments After having attended several MSIG events, I am impressed by how MEMS, NEMS (Nano…), and sensors can lend machines in many ways sight, smell, taste, touch, and hearing. They can replicate these human senses, often better than found in us. If you, like me, celebrated when your first modem enabled your PC to communicate with the entire world, you’ll appreciate the value MEMS and sensors can and will add to machines’ “communication skills.” Also, I can assure you that innovative engineers in this field will find many new ways to capture data in the physical, chemical, and biological domains and enable machines to keep humans safe. (I look forward to a handheld Covid-19 sensor that provides results within a few seconds!) Having worked for a small, then a large EDA vendor, many years ago, and for the ESD Alliance several years ago, I know how difficult it is to motivate innovative software developers to work together or agree upon standards. I am glad that the ESD Alliance is now working closely with SEMI. Most SEMI member companies, and their innovative employees, have learned over the years how important standards are to reduce development cost, processing, and test time, as well as time to profit. I wish Bob Smith and the ESDA members all the best for cooperating closely to define design standards, bi-directional hand-off points up and down the entire supply chain, primarily at the interface between design and manufacturing. I want to encourage EDA and IP experts to work closely with the experienced and knowledgeable people in materials, equipment, manufacturing, and test. 5G mm-wave communication, artificial intelligence/machine learning (AI/ML), reliable solutions for Smart Mobility, and development/characterization of new materials offer great opportunities and challenges for design AND manufacturing. Together, these two big camps can monetize required solutions much better and faster, than on their own. Your contact at SEMI can tell you how and where you can watch the webinar recordings and/or download all the slides. P.S.: Having two eCars and one eBike in our garage encourages me to appreciate SEMI’s efforts in advance Smart Mobility! Republished with permission from 3D InCites.

Inertial sensors have continued to underpin the success of wearables in increasingly important ways. Propelled by evolutionary advancements in inertial sensors, wearables have strayed from their humble beginnings in simple activity and wellness, which defined the user experience over the past decade. What started with the simple act of telling people their daily step count has morphed to provide deeper insights into swim stroke and run cadence, all the way to mapping out a person’s off-piste ski route. Layered on top of this foundation of inertial sensors, we’ve fused optical, temperature and other sensor technology to provide clinical-grade healthcare snapshots available previously only by visiting the doctor’s office.Inertial sensors today are again leading the way in improving health and wellness. Instead of humans, however, this time the patients are machines. In fact, the health of critical assets – whether factory-based equipment, windmills, train bogies or aircraft – has been assessed through sophisticated analysis of their vibration signatures for many years. The sensors used for these applications have depended on piezoelectric technology because their vibration amplitude signals are very small and difficult to detect and because of the importance of understanding their spectral content over a wide bandwidth. When it comes to noise and bandwidth, bulk piezoceramics have had a major advantage over electrostatic MEMS technology – until recently.Using bulky expensive piezoelectric sensors for condition-based monitoring has been akin to going to the doctor’s office to have an MRI. The equipment required (sensors, receivers) is expensive and requires highly trained specialists to operate the machine and to interpret the information. For this reason, only mission-critical assets are instrumented. For nearly all other equipment, we tend to use inefficient schedule-based maintenance approaches to cover the gap of not having continuous data. Condition-based monitoring leverages real-time sensing of critical machine parameters to reduce system downtime and improve efficiency. Evolving machine healthMEMS started to democratize machine health several years ago, when suppliers began switching from piezoelectrics to capacitive MEMS. While the performance was still not on par with piezoelectric sensors, MEMS technology could already capture a wide array of faults. One example, the ADXL001, started making its way into Integrated Electronics Piezo-Electric (IEPE) and 4-20 mA sensors, which form the backbone of the vibration monitoring market. Although the bandwidth and noise of the sensor did not allow for very early detection and prescriptive monitoring, it did allow the tracking of faults as they progressed and became more imminent.Other digital accelerometers started finding their way into new wireless prototype systems with the goal to simplify and increase deployment to a greater population of assets. The thinking was that self-contained digital wireless sensor nodes could be deployed more economically and quickly, and that these digital sensors would bring the power of computing to the edge node.Unfortunately, even the lowest-noise MEMS products did not have the bandwidth needed to diagnose and predict faults early enough to influence how and when machines are maintained most economically. Instead, such devices were used to detect imminent failure to prevent irreparable harm. As we all know, however, the earlier the doctor spots a problem, the better the probable outcome. That’s because early detection increases the likelihood that the doctor will have access to the full spectrum of treatment options available to fix the problem.Inertial MEMS is blazing a new frontier with the introduction of next-generation capacitive MEMS such as the ADXL100x portfolio. Offering ultra-low noise density and high-frequency response, these newer capacitive MEMS devices fit the bill. With 3dB bandwidths up to 25 kHz and flat response curves within 0.4dB all the way to 10kHz, these accelerometers demonstrate compelling enabling characteristics such as better DC performance, improved robustness, lifetime stability, linearity, and of course, cost, making capacitive MEMS a better choice than piezoelectrics.With high-bandwidth capacitive MEMS much easier to use and deploy – as well as more affordable – the market is starting to respond. Condition monitoring equipment and instrumentation is becoming more accessible to a larger base of manufacturers. In turn, a wealth of data is being created and mined to develop better and timelier predictive and prescriptive maintenance approaches that rely heavily on machine learning and artificial intelligence (AI).It’s worth paying attention to the sizable condition-based monitoring market. Estimated at $3.5 billion and growing, condition-based monitoring reduces downtime and increases equipment utilization in quantifiable ways. And it’s not just manufacturers who stand to benefit. More sustainable and efficient industrial processes, safer trains that crisscross continents at ever increasing speeds, autonomous cars and trucks that know what’s happening under the hood as well as on the road, and modern infrastructure to support our evolving lives show us that condition-based monitoring has something for everyone.Learn more about Analog Devices’ condition-based monitoring signal-chain options that help customers on the journey from sensor to solution. View ADI’s whole portfolio of condition-based monitoring solutions online or download Next-Generation Condition-Based Monitoring brochure.Tzeno Galchev is product marketing manager in the Inertial Sensor Technology Group at Analog Devices Inc. He oversees the strategic marketing and product definition of the inertial sensor component portfolio. He received B.S. degrees in both Electrical and Computer Engineering in 2004, and M.S. and Ph.D. degrees in Electrical Engineering in 2006 and 2010 respectively from the University of Michigan, Ann Arbor. He has over 30 publications in the area of MEMS, holds multiple patents, and is a frequent lecturer and speaker on topics related to MEMS, energy harvesting and sensors.Analog Devices is a longtime member of MEMS Sensors Industry Group (MSIG), a SEMI technology community that enables the MEMS and sensor industry to address common challenges, innovate and accelerate business results.