memory

SEMI spoke with Dr. Mikko Söderlund, sales director for Beneq’s semiconductor business, about trends in Atomic Layer Deposition (ALD) applications. Söderlund shared his views ahead of his presentation at SEMI MEMS Imaging Sensors Summit, 25-27 September, 2019, at the WTC in Grenoble, France. Join us at the event to meet Beneq and other key industry influencers. Registration is open.SEMI: The Backside Illuminated (BSI) CMOS Image Sensors (CIS) market continues to experience steady growth. Which applications are currently driving market growth?Söderlund: BSI CMOS Image Sensor market continues to be driven by mobile, security, automotive and Internet of Things (IoT) applications – so there seems to be plenty of opportunities for BSI CIS market to grow further.SEMI: What is critical for advanced thin-film deposition methods to extract best electrical performance?Söderlund: It is critical to control the material properties of the deposited layer (such as charge density, resistivity or barrier property) and of course, film uniformity and conformality. Furthermore, controlling material interfaces is also important, especially for sensitive III-V materials. {% video_player "embed_player" overrideable=False, type='scriptV4', hide_playlist=True, viral_sharing=False, embed_button=False, width='350', height='197', player_id='12721134435', style='margin: 0px auto; display: block; float: right; margin-left: auto; margin-right: auto; width: 350px;' %} Coatings and material features based on existing standard techniques can be very expensive, or not feasible at all. What does Atomic Layer Deposition (ALD), as a thin film coating method, offer in particular?Söderlund: ALD offers dense, highly conformal and pinhole-free best-in-class functional layers for dielectrics, passivation, encapsulation and much more. As a gentle and precise layer-by-layer method, ALD is extremely well-suited for deposition of such performance critical layers over large surface areas such as a cassette of wafers.SEMI: Please describe the Atomic Layer Deposition (ALD) coating process. Söderlund: ALD is based on a self-limiting surface reaction controlled thin film deposition. During coating, two or more chemical vapors or gaseous precursors react sequentially on the substrate surface, producing a solid thin film (see schematic below). Most ALD coating systems use a flow-through traveling wave setup, where an inert carrier gas flows through the system and precursors are injected as very short pulses into this carrier flow. The carrier gas flow takes the precursor pulses as sequential waves through the reaction chamber, followed by a pumping line, filtering systems and, eventually, a vacuum pump.SEMI: What are the two leading edge ALD applications?Söderlund: Today’s leading-edge ALD applications are in logic (high-k/metal gate, multiple patterning) and memory (DRAM capacitor, 3D NAND). Within the More-than-Moore (MtM) markets, CIS and MEMS (actuators and sensors, RF) have been early adopters of ALD, and we also see ALD being introduced in GaN Power and RF, as well as photonics.SEMI: Give us one prediction about the opportunities offered by advanced imaging applications.Söderlund: The large diversity of imaging applications will continue to drive growth and innovation. For example, machine vision is expected to transform the imaging landscape. We see this as a big opportunity for advanced thin-film deposition methods such as ALD, provided that the tools are versatile enough to address the diverse manufacturing requirements.SEMI: What are your expectations for SEMI MEMS Imaging Sensors Summit and why do you invite your peers to attend? Söderlund: The summit brings together all key RF stakeholders in the MEMS and imaging sensors industry, and we are looking forward to a great event. It’s a special event for us as we are officially launching a new ALD cluster tool product specifically engineered for the MtM applications – so this brings great excitement that we want to share with the attendees.Dr. Mikko Söderlund is Sales Director for Beneq’s semiconductor business. He has more than 20 years of experience in product development, product management, technical sales and business development across the photonics, OLED, and semiconductor industries. Mikko received his Ph.D. in Micro- and Nanotechnology from the Helsinki University of Technology. Serena Brischetto is a marketing and communications manager at SEMI Europe.

The silicon wafer market got off to a rough start in 2019 with major silicon wafer manufacturers’ sales weakening in the first quarter of the year following a sharper memory market downturn than expected. Earnings forecasts for the rest of the year have been revised down.

In the long unfolding arc of technology innovation, artificial intelligence (AI) looms immense. In its quest to mimic human behavior, the technology touches energy, agriculture, manufacturing, logistics, healthcare, construction, transportation and nearly every other imaginable industry – a defining role that promises to fast track the fourth Industrial Revolution. And if the industry oracles have it right, AI growth will be nothing shy of explosive.“The gains these days are not incremental,” said Ajit Manocha, SEMI president and CEO, said to a gathering in July of the Chinese American Semiconductor Professional Association (CASPA) for its Summer Symposium at SEMI’s headquarters in Milpitas. “They are hockey stick – exponential – with AI semiconductors growing in market size from $4 billion this year to $70 billion in 2025.”Manocha left little doubt that AI is remaking the semiconductor industry and, in the process, the world at large. Internet of Things (IoT) and 4G/5G, both key AI enablers, will account for more than 75 percent of device connections by 2025.“Today, 30 billion devices worldwide are connected,” Manocha said, citing an Applied Materials prediction that the number of connected devices globally will grow to between 500 billion and 1 trillion by 2030. Those devices will generate stunning amounts of data collected, interpreted and used to reason, solve problems, learn and plan, leading to the holy grail of autonomous machine behavior.To process this colossal amount of data central to the promise of AI, the industry must break through the limits of a key technology: memory. Memory a Critical AI BottleneckThe challenge for memory starts with performance. Historically, every decade gains in compute performance have outpaced improvements in memory speed by 100 times, and over the past 20 years that gap has grown, said Steven Woo, a fellow and distinguished inventor at Rambus, presenting at the symposium. The upshot is that memory has bottlenecked compute and, in turn, AI performance. The industry has responded with new ways to implement memory systems on AI chips. Each is suited to unique performance requirements and, of course, comes with trade-offs. Among the frontrunners: On-chip memory delivers the highest bandwidth and power efficiency but is limited in capacity. HBM (High Bandwidth Memory) offers both very high memory bandwidth and density. GDDR balances trade-offs among bandwidth, power efficiency, cost and reliability. Since 2012, AI training capability has grown 300,000 times, besting Moore’s law by 25,000 times in doubling every 3.5 months, a blistering pace compared to the 18-month doubling cycle of Moore’s law, Woo said. The staggering improvements have been driven by parallel computing capacity and new application-specific silicon like Google’s Tensor Processing Unit (TPU).These specialized silicon architectures and parallel engines are key to sustaining future gains in compute performance and combatting the slowing of Moore’s Law and the end of power scaling, Woo said. By rethinking the way processors are architected for certain markets, chipmakers can develop dedicated hardware capable of operating with 100 to 1,000 times greater energy efficiency than general purpose processors to overcome another big limiter to scaling compute performance – power.For its part, the memory industry can improve performance by signaling at higher data rates and using stacked architectures like HBM for greater power efficiency and performance, and by bringing compute closer to the data.Memory scaling for AIA key challenge is scaling memory for AI. Demand for better voice, gesture and facial recognition experiences and more immersive virtual reality and augmented reality interactions is tremendous, said Bill En, senior director at AMD, speaking at the symposium. These capabilities require more processing power across both high-performance computing (HPC) for big data analytics and machine learning as it relies on AI and machine intelligence to generate meaningful insights. Emerging machine learning applications include classification and security, medicine, advanced driver assistance, human-aided design, real-time analytics and industrial automation. And with 75 billion IoT-connected devices – all generating data – expected by 2025, there will be no shortage of data to analyze, En said. The wings alone of a new Airbus A380-1000 feature some 10,000 sensors.Mountains of this data are stored in massive data centers on magnetic hard drives, then transferred to DRAM before moving to SRAM within the CPU for the handoff to the compute hardware for analysis.With data growing at an exponential clip, the question is how to make sure all other memory systems can handle the flood of data. AMD’s answer is a chiplet architecture featuring eight smaller chips around the edge that drive the compute and a large chip in the center that doubles the IO interface and memory capability to in turn double chip bandwidth.AMD has also moved from a legacy GDDR5 memory chip configuration to HBM to bring memory bandwidth closer to the GPU for more efficient processing of AI applications. The HBM provides much higher bandwidth while reducing power consumption. Compared to DRAM, AMD’s HBM delivers a much faster data rate and far greater memory density, En said.Over the next decade, look for more performance improvements from multi-chip architectures, innovations in memory technology and integration, aggressive 3D stacking and streamlined system-level interconnects, he said. The industry will also continue to drive performance gains in devices, compute density and power through technology scaling.Michael Hall is a global marketing communications manager at SEMI.

When will the memory market likely show signs of bottoming out? Following is an analysis of the current memory climate using the Memory Inventory Cycle Index introduced in this SEMI two-part article series in October 2018.

This year, SEMI ISS covered it all – from a high-level semiconductor market and global geopolitical overview down to the neuro morphic and quantum level. Here are key takeaways from the Day 1 keynote and Economic Trends and Market Perspectives presentations.In the opening keynote, Anne Kelleher from Intel pointed to the huge growth of data, with fabs collecting more than 5 billion sensor data points each day. The challenge, Kelleher noted, is to turn massive amounts of data into valuable information. Moore’s law is not dead. New models of computing benefit still from Moore’s law and advances in Si/CMOS technologies for conventional, deep learning, neuro morphic and quantum computing.With customers expecting continual improvements in applications, the question is whether the chip industry is moving fast enough to meet these expectations, Kelleher said. A broad supply chain, equipment and materials innovations, and attracting the “best of the best” college graduates to fuel innovation is key, she said.In the economic trends session, Nicholas Burns (ambassador ret.) from Harvard University pointed out that we will see a major shift in power. The U.S. will remain the major world power over the next 10 years, but we will see a major shift in power in the next coming decades as the gap with countries like China, Russia and India continues to narrow.Duncan Meldrum from Hilltop Economics said that we are passing the peak growth of economic cycle. He warns that a more likely outlook is that a global growth recession is developing. Although semiconductor MSI growth will see a noticeable slowdown in 2019 and 2020, the semiconductor industry is still healthy over the longer term.Bob Johnson from Gartner sees demand shifting from consumer to commercial applications with higher ROIs and budgets. AI, IoT and 5D are the major enablers. He sees structural changes in the semiconductor industry especially for memory but also for Moore’s law with increasing costs and fewer players.The DRAM markets shows volatility and NAND market may be negative in 2019 but non-memory are expected to accelerate mainly because of increasing content and some price hikes.Overall Gartner expects good long-term growth with a CAGR (2017 to 2022) of 5.1%, outpacing 2011 to 2016 CAGR of 2.6%. After a strong 2018 with 13.4% revenue, he forecasts a slower 2019 with 2.6% growth followed by a 8% growth in 2020 and negative growth rate in 2021.Andrea Lati of VLSI went “Back to fundamentals” in his presentation about the industry. VLSI sees a downside bias due to slowing global economy, tariffs, and trade wars. Future drivers are data economy, cloud, AI and automotive.As memory leads the 2019 slowdown, analog, power, logic and other sectors remain in positive territory. VLSI lowered its semiconductor equipment forecast for 2018 from 20% (Jan. 2018) to 14% (Dec. 2018) but increased its sales outlook from 8% to 15% in 2018. VLSI expects revenue to slow into the first half of 2019 but increase to over 4% in the second half of the year, resulting in total 2019 drop of 2.7%. Semiconductor equipment sales are expected to drop from 14% in 2018 to -10% in 2019.Michael Corbett of Linz Consulting, covering wafer fab materials in the years of 3D scaling, sees these as good times for the industry. His outlook for wafer fab materials is bullish based on strong MSI and because wafer fab materials suppliers are getting bigger because of M As.In the Market Perspective session, Sujeet Chand of Rockwell Automation pointed out that as more and more data is generated, the problem is how to get value of all the data collected. There is a need to create the right architecture for machine learning and AI and big data is increasingly being replaced by contextual/structured data. He expects Industry 4.0 to drive foundries to become smaller, more flexible and more productive.In the Technology and Manufacturing session, Aki Sekiguchi of TEL addressed process challenges in the age of co-optimization. The semiconductor industry continues to expand, driven by massive growth of interconnected devices, with heavy demand for processing power and storage. He expects an exponential increase of data from about 40ZB in 2018 to 50ZB in 2020 to 163 ZB in 2026.Major technologies such as DRAM, 3D NAND and logic are dealing with scaling challenges. The density of DRAM (Mb/chip) is plateauing according to 2015 to 2020 trend data, with DRAM is in need of EUV. Memory capacity demand is leading to increasing layers and higher aspect ratios that is concern for 3D NAND and mainly for plasma etch. With Logic already implementing 3D structures, it appears to be in a solid position. Buddy Nicoson of Micron talked about his 50 years in the industry and looked ahead to the next 50. The anchors – quality, cost, scale and speed – won’t change. It has been a great journey so far with unprecedented opportunities and challenges ahead of us. We are getting into a convergence (specialization, integration) and solution-based phase. We will see some inflection points in the coming years, with the best yet to come.Christian G. Dieseldorff is senior principal analyst in the Industry Research and Analysis group at SEMI in Milpitas, California.

We are living in a digital world where semiconductors are taken for granted, AI is bringing semiconductors back into the deserved spotlight, and now we are witnessing the dawn of the Cognitive Era enabled by semiconductors,” SEMI president and CEO Ajit Manocha said to an audience of more than 500 during his presentation – Rebirth of the Semiconductor Industry – at the First Global IC Entrepreneur Conference.Speaking at the Shanghai event in mid-December, Manocha recalled how, when he first entered the semiconductor industry in the 1980s, semiconductors revenue topped out at about $10 billion. Now, with sales having swelled to a staggering $450 billion, the industry is on a much faster growth track. Revenue could reach $500 billion by the end of 2020 and trillions of dollars by 2030. Over the past two decades, chips have given rise to social media and e-commerce powerhouses such as Google, Facebook, and Alibaba. All rely on heavily on chips, the engines of data centers across all industries. Wave after wave of technology innovation have been powered by semiconductors – from mainframe computers in the 1970s, personal computers in the 1980s, the Internet in the 1990s, and mobile and social networking in the early 20th century, to the current shining stars of technology such as IoT, big data, new memory, virtual reality, autonomous driving and artificial intelligence, Manocha said. New applications across areas such as smart manufacturing and digital healthcare are stoking the latest round of semiconductor growth.The rise of AI, like all the technologies before it, has renewed the semiconductor industry once again with its promise to drive growth of all industries worldwide, Manocha said. Five years ago, IoT was but a gleam in a technologist’s eye, more hype than reality with doubt about its viability running deep. Today, with about 60 percent of people in the world connected to the Internet, the enormous promise and potential of IoT is flowering. Industry growth will explode as the melding of AI and IoT birth countless applications and innovations in SMART transportation (0 emissions; 0 fatalities; 0 congestion), smart sensors (agriculture, infrastructure, healthcare) and SMART “Everything” (people, devices, homes, cities, industries, and the list goes on). Indeed, AI is now widely recognized as a chief growth driver of the semiconductor industry well into the future, with semiconductor technology at the core of AI innovation, he said. Semiconductors are thrusting the fifth industrial revolution into the fast lane. China’s much-anticipated rise as an industry powerhouse over the next few years will only accelerate industry growth, turning current disruptions into future opportunities as SEMI China continues to cultivate connection, collaboration and innovation in China’s fast-growing semiconductor sector.Cherry Sun is a marketing manager at SEMI China.

Part 1 of this article discussed the Memory Inventory Cycle Index and compared it with memory device sales and memory fab equipment investments. This article, the second of the two-part series, illustrates how the Memory Inventory Cycle Index starts to weaken before memory sales of the top three memory suppliers decline. It also shows how the Memory Inventory Cycle Index peaked in the fourth quarter of last year along with YoY growth rates for both memory sales and memory fab equipment investments.In addition to the weakening signaled by the Memory Inventory Cycle Index, memory suppliers are facing headwinds in the form of tariffs as mentioned in Micron’s most recent earnings call. The U.S.-China trade dispute could reduce Micron’s profitability; China granted a preliminary injunction to prevent Micron’s Chinese subsidiary from manufacturing and selling in China this July. However, it is very difficult to quantify the risk the tariffs pose to the future of the memory market.On the other hand, the YoY growth rate of semiconductor sales according to the World Semiconductor Trade Statistics is closely tied to China’s manufacturing sector as shown by the Purchasing Managers Index (PMI) New export orders and Orders in hand sub-indexes. Figure 3 shows that as the growth rate of new exports and order backlog slows, the YoY growth rate of semiconductor sales will be adversely impacted. As the largest consumer of semiconductors in the world, China will bear the brunt of the slowing market. Figure 3. Memory Inventory Cycle Index China manufacturing sector PMI’s sub-indices * RemarksChina PMI’s sub-indices are on the basis of the data published by NBS (National Bureau of Satistics of China). Also those data were calculated based on 12MMA (12-month moving average) to minimize seasonal fluctuation. The YoY growth rate of the 3-month moving average of semiconductor sales in China alone, China and Asia Pacific, and all regions showed additional declines in July (Figure 4). Monitoring the Orders in hand and New export orders sub-indices for China and China’s semiconductor consumption and WSTS sales revenue in China can help track the risk of trade disputes. Figure 4. YoY growth rate of semiconductor sales revenue in China and Asia Pacific * Remarks1) Regions as defined by WSTS’ Bluebook.2) Sales revenue were calculated based on 3MMA (3-month moving average value). A review of the relationship between the Memory Inventory Cycle Index, semiconductor sales, and memory fab equipment investment growth rates suggests we have passed the peak in the current cycle. However, bear in mind that the Work In Process (WIP) to Finished-goods inventory ratio has sharply increased since 2017 as shown in Figure 5. The increase in WIP inventory could be attributed to the increasing technical challenges associated with 3D NAND stacking and DRAM scaling. As a result, the proportion of finished-goods inventory in total inventory remained low until the second quarter of 2018, possibly implying that memory demand remained healthy in spite of the contraction modeled by the Memory Inventory Cycle Index. Figure 5. The proportion of finished-goods inventory in the total inventories * Remarks 1) All inventories data from 3 companies’ financial reports were calculated based on 4-quarter moving average.2) Total Inventory accounts for the sum of Finished-Goods, WIP, and Raw materials inventory.3) Company data complied by SEMI. The Memory Inventory Cycle Index has entered a period of contraction, which is supported by Micron’s weak guidance for its fiscal first quarter of 2019 (September to November). The outlook for memory sales and memory fab equipment investments reported by WSTS and SEMI, respectively, also suggests that a market correction is underway. While the low proportion of finished-goods inventory does not threaten the market yet, it should remind industry observers to view high WIP inventories with caution. Unlike past inventory cycles, the high inventory levels could burden the memory market in the absence of sustainable demand.Sungho Yoon is a senior market research analyst in Industry Research and Statistics at SEMI. SEMI China IC Ecosystem ReportLearn more about 30 new fab construction projects underway or planned in China in the newly released SEMI China IC Ecosystem Report. The research report is a comprehensive update and analysis of China's IC manufacturing ecosystem with charts, graphs, tables and maps.

Micron, one of the top three memory semiconductor companies, reported solid results for the fourth quarter of fiscal 2018 (June to August) to extend a multi-quarter string of strong growth. However, the company’s mediocre guidance for the current quarter has raised concerns that memory demand will start to slow.To shed light on this super memory cycle, which began in the second half of 2016, this article examines correlations among the top three memory suppliers’ sales revenue, quarterly inventory levels, World Semiconductor Trade Statistics (WSTS) market data, and memory fab equipment investments reported by SEMI.The Memory Inventory Cycle Index, which is based on financial data reported by Samsung, SK Hynix and Micron, is the difference between the year-over-year growth rates of sales (or shipments) and inventories. The index explains business cycle fluctuations such as expansions and contractions, trending up in expansions and declining in contractions. Figure 1 shows both historical Micron sales (blue dotted line) and the quarterly Memory Inventory Cycle Index (black solid line). To minimize seasonal fluctuations, both were calculated based on a four-quarter moving average of sales and inventories. Figure 1. Memory Inventory Cycle Index Compared to Memory Sales* Remarks1) Memory Inventory Cycle Index = YoY growth rate of memory sales revenues - YoY growth rate of memory total inventoris value on a four quarters moving average.2) Calculated memory sales and inventoris are based on Samsung, SK Hynix, and Micron public announcements.3) South Korea Won were converted to US$ based on the quaterly average value released by FRED.4) Companies’ sales data were calculated based on 4-quarter moving average.5) Company data complied by SEMI. As shown in Figure 1, the Memory Inventory Cycle Index has been declining since peaking in the fourth quarter of 2017, mirroring the previous two contractions – in 2010 and 2014 – in which memory sales slowed or stagnated after four quarters of the index decline. Accordingly, if this relationship holds between the Memory Inventory Cycle Index and sales, Micron’s sales will slow in the coming quarters and is consistent with Micron’s guidance for the current quarter. Moreover, the index suggests that the sum of three companies’ sales (the solid red line) will exhibit a similar trend of decreased growth in the coming quarters, which will impact the annual growth rate of global memory sales.WSTS recently increased its 2018 forecast for memory sales to 30.5%, up from 26.5% projected in June of this year. However, the 3-month moving average of memory sales shows that memory sales already increased by 48% YoY in the first half of the year, which means growth is expected to be lower in the second half of the year. Other signs pointing to a weaker end to the year include front-end equipment investments by the top three memory suppliers. SEMI is modeling an annual increase of only one percent for the year for these suppliers, with spending down 23% in the second half relative to the first half of the year.Figure 2 shows the historical trend of the Memory Inventory Cycle Index, the YoY growth rate of memory sales, and YoY memory fab equipment investments. The Memory Inventory Cycle Index increased faster than memory sales and fab equipment investments in the past two cycles. In the most recent memory cycle, these three indexes are moving in tandem, each peaking in the fourth quarter of 2017. Figure 2. Memory Inventory Cycle Index, Memory Sales and Memory Fab Equipment Investments* Remarks1) Both sales and memory fab equipment investments data were calculated based on 4-quarter moving average to minimize seasonal fluctuation.2) All data are from SEMI, except memory sales (WSTS) While overall memory sales continue to be strong this year, memory ASPs have shown signs of weakening right after the inventory index peak. NAND flash ASPs have been trending downward since the first quarter of 2018. With the recent inventory correction and short-term CPU shortage, DRAM ASPs are expected to soften in the fourth quarter of 2018. The looming memory market slowdown has memory makers adjusting their capacity expansion plans for the rest of this year. Some new capacity additions, especially for DRAM, have been pushed out to 2019. The memory inventory cycle index has to some extent foretold the slowdown of the memory market. In the second and final part of this article, we will discuss the correlation between the Memory Inventory Cycle Index and China’s semiconductor sales and Purchasing Managers Index. We will also look at the increasing level of memory inventory in the past few quarters and its composition including Work-in-Progress and Finished goods. Clark Tseng is director and Sungho Yoon is senior market research analyst in Industry Research and Statistics at SEMI. SEMI World Fab ForecastFor the latest worldwide memory fabs forecast including company details, please see the SEMI World Fab Forecast. The report includes quarter-to-quarter fab data from planning to production for both DRAM and NAND Flash companies.

Process power and reactive gas subsystems for semiconductor manufacturing equipment have grown at a CAGR of 21% since 2013. The segment growth is considerably above the critical subsystems industry average of 9.5% and is attributable to higher demand for vacuum processing equipment over the period.Process power and reactive gas subsystems now account for approximately 12% of all expenditures on critical subsystems used on semiconductor manufacturing equipment, up from 7% in 2013. The main driver of this exceptional growth has been the rise in vacuum processing steps (deposition and etch) during the manufacturing processes of both logic and memory devices. Most deposition and etch processes require an RF generator to provide a plasma energy source in the chamber, increasing demand for tools with power subsystems such as RF power supplies and matching networks.Multiple patterning and the advent of 3D NAND in high-volume manufacturing have significantly increased the number of deposition and etch processing steps and, in the case of 3D NAND, longer and more difficult etch processes are requiring a wider range of power solutions. Further analysis shows that 3D NAND has been the principle growth catalyst, with the total share of power subsystems going to memory applications increasing 8 percentage points since 2013. Memory applications now account for almost half of all power subsystems demand in 2018. Interestingly, investigation of power subsystems by tool type reveals that a clear majority of power subsystems (60%) find their way on to etch tools with only 40% on deposition tools. This can be explained by the fact that more delicate etch processes can require multiple RF power solutions per tool, whereas deposition does always use plasma energy sources, for example in thermal deposition processes.Despite the staggering growth performance of the power subsystems segment over the past five years, we expect the growth rate to moderate significantly in the run-up to 2023. Now that 3D NAND has been adopted in high-volume manufacturing, we expect the rate of increase in vacuum/plasma processing steps to slow down. The introduction of EUV also has the potential to taper demand for vacuum processing equipment. However, it is not expected the reverse the trend as multiple patterning techniques will still be needed in conjunction with EUV to achieve the desired improvements in device density and performance. The future growth trend for power and reactive gas subsystems is forecast to be in line with the critical subsystems industry average at approximately 2.0% CAGR until 2023.For more information about Critical Subsystems and VLSI Research, please visit www.vlsiresearch.com/public/csubsJulian West is a technical and market analyst at VLSI Research Europe.

Korea is on track to top all other regions in fab investment, spending $63 billion between 2017 and 2020, with powerhouses Samsung Electronics Co. and SK Hynix leading the way, according to latest World Fab Forecast Report by SEMI. Samsung Electronics increased fab investments $770 million to $12 billion this year, and SK Hynix upped its spending a significant $2.8 billion to $7.25 billion in 2018.Korea's investment companies anticipate continued growth for both companies in the second half of 2018.Under this halo of extraordinary investment, nearly 380 SEMI Korea members and industry analysts gathered for 2018 SEMI Korea Members Day on September 13 to share insights on semiconductor market trends and new technologies that could help members bolster their competitiveness. Following are key takeaways from the event. Korea semiconductor market to grow 16% in 2018That’s according to IDC Korea VP Kim Soo-kyung, who noted that data center, memory and Internet of Things (IoT) are becoming key growth drivers for the semiconductor industry. He encouraged semiconductor companies to closely track development of automotive technology and the industry semiconductor market, both key growth areas. SEMI Korea president H.D. Cho opens SEMI Korea Members Day 2018 Continuing fab investment will lead to oversupply, but display will shineMarket entry by Chinese companies will also spur the oversupply, said Jeong Won-Seok, an analyst at HI Investment Corp. He noted that the oversupply will force Korea into stiffer competition with other regions. However, with OLED used for a wide variety of devices and the display industry seeing rapid growth, the sector will remain ripe for growth among Korean companies.Interconnecting various applications is a big semiconductor industry trendThe need for these interconnections will stand out in the mobility and high-performance computing (HPC) markets, said Park Sung-Soon, principal research fellow at Amkor Technology Korea, who addressed trends in packaging technology. He also emphasized interconnection cost efficiency as key to maximizing competitiveness.Smart Manufacturing is driving mass customizationAs semiconductor industry growth continues, production methods are shifting from ‘mass production’ to ‘mass customization,’ increasing the importance of Smart Manufacturing in driving greater production efficiency, noted BISTel VP Jeon Kyeong-Sik. Building a Smart Manufacturing platform to support large-scale production of specialized database and artificial intelligence (AI) chips will boost production efficiency, reduce costs and improve risk management. Virtual simulation will be a key enabling technology. SEMI analyst Clark Tseng presenting at SEMI Korea Members Day 2018 Surge in data volume and technology advances to drive long-term semiconductor industry growthThese key industry drivers will continue to power fab investment growth, with spending focused on 3D NAND, DRAM, and foundry, said Clark Tseng, director of Industry Research and Statistics at SEMI. China alone will see eye-watering growth with the region’s investments in domestic companies surging 46% from 2018 to 2019 and fab investment by Chinese domestic companies outpacing spending by foreign companies in China, Tseng predicted. SEMI membership rises with industry growthCulminating the event, SEMI Korea president H.D. Cho said, "With the growth of the semiconductor market, the number of SEMI members is gradually increasing, and we will help member companies grow with various activities such as Korea Members Day.”Jaegwan Shim is a marketing specialist at SEMI Korea.