Taiwan

Back in 2012, China ranked fifth among seven regions worldwide in IC wafer capacity but surged past the Americas and Japan in 2018 and 2019 to claim the number three position (figure 1). That’s a big deal given that ICs account for the largest share of wafer capacity excluding discrete, opto, MEMS and sensors.China’s IC wafer capacity growth accelerated to tune of 14% in 2019 and 21% in 2020 and is expected to grow at least 17% this year, as we report in the latest update of the World Fab Forecast, published December 3rd by SEMI. Of all regions, Taiwan boasts the second strongest growth rate over the same period at 3% to 4%.Figure 1: Total IC installed wafer capacity for top five regions The report shows that from 2019 through the end of 2021 China will have increased wafer capacity for memory by 95%, foundry by 47% and analog by 29%. Foundry will represent the largest portion of those gains, reaching 2 million wpm (200mm equivalents). Memory will follow at about 1.5 million wpm and then analog at over 120,000 wpm.But Chinese companies aren’t pulling off this feat singlehandedly. Many international companies are contributing to the wafer capacity increases in China (figure 2). Figure 2: IC wafer capacity in China by company origin The share of capacity contributed by Chinese-owned companies and international companies has changed little since 2012, though Chinese-owned companies saw a slight dip in their slice of the pie from 60% to 57%From 2019 through 2021, Chinese-owned companies will add almost 60% capacity for foundries, the most of all sectors. Companies including SMIC, Hua Hong Semiconductor, Nexchip, XMC and Hua Li Microelectronics are driving the increases.During the same period, Chinese-owned companies will ramp up memory capacity from basically zero to 300,000 wpm. Companies such as Yangtze Memory Technology and ChangXin Memory Technologies (CXMT), also known as Innotron, are powering the quick rise with aggressive ramps of 3D NAND and DRAM capacity.Among international-owned companies, TSMC and UMC are driving the largest share of foundry growth, while Samsung, SK Hynix and Intel are powering gains in memory capacity.More information is available in the World Fab Forecast report. The report currently collects information for fab equipment and construction investment, capacities, technologies and product types for over 280 fabs and lines in China alone, including 40 facilities that either began operation in 2020 or will from 2021 through 2024.Christian G. Dieseldorff is senior principal analyst in the Industry Research and Analysis group at SEMI in Milpitas, California.

The global economy has started down a gradual path to recovery from COVID-19 in recent months as the world continues to combat the virus. Yet one sector – semiconductors – has shown impressive growth powered by a transformation hastened by the pandemic across industries ranging from education and work-from-home to healthcare.Semiconductor sales increased 12% in September to mark a second consecutive month of double-digit growth, and year-to-date semiconductor receipts as of September jumped 5.5% compared to the same period in 2019, according to SIA/WSTS.While this upward trajectory is encouraging, it pales compared to 2020 semiconductor equipment billings growth, with results from SEMI showing worldwide global chip equipment billings in September soaring to a new high of $7.6 billion this year. During the first nine months of 2020, aggregate equipment billings logged a 23.6% rise compared to the same stretch in 2019, surpassing $51 billion. Better still, the total semiconductor equipment market in 2020 is on track to beat the previous high of $64.5 billion set in 2018.Investments in China, Taiwan and Korea are fueling the chipmaking equipment spending surge. With big domestic and international fab projects in the works, China this year is projected to become the world’s largest capital equipment market for the first time, surpassing Taiwan, which will follow at a close second. Korea will rank third in equipment investments. Taiwan and Korea growth will come on the strength of equipment spending for manufacturing leading-edge semiconductors.Equipment billings in North America and Europe declined year-over-year as the automotive and industrial sectors suffered the heaviest blows from COVID-19. Investment momentum in both regions is expected to pick up in 2021 after automotive production recovers to pre-pandemic levels while factory automation will boost industrial demand.For more information about monthly equipment billing trends by region and equipment segment, please see the SEMI Equipment Market Data Subscription.Clark Tseng is director of Industry Research and Statistics at SEMI.

Over the next five years the Taiwan government plans to invest NT$1.546 billion to build the workforce direly needed for future semiconductor industry research and development. The largesse is a tribute to efforts by SEMI president and CEO Ajit Manocha to enhance the competitiveness of the semiconductor industry by stressing the importance of talent development during his annual visits with the Taiwan president. He has been instrumental in bringing together Taiwan government agencies and local industry representatives – two players in developing the talent pool of the future – to discuss workforce initiatives.As the talent gaps threatens to choke the long-term growth potential of the chip industry, Manocha has emerged as a passionate champion of workforce development. In a letter to more than 2,000 semiconductor companies worldwide, he urged to executives act together to build the workforce vital to industry growth. In 2018, he met with Taiwan President Tsai Ing-wen to discuss ideas for attracting and retaining skilled workers to help ensure Taiwan remains a top investment destination for high-tech multinationals.In early 2019, SEMI Taiwan established its SEMI Taiwan Workforce Development Council to promote talent and career development. Already, the group’s work is resonating in the global semiconductor industry. In September last year, Manocha joined executives from industry heavyweights ASE, MediaTek and TSMC in a visit to President Tsai to urge the government to pursue industry sustainability through talent development. President Tsai responded by instructing her staff to review government resources available for talent development, help drive public-private dialogue and partnerships, and form talent development projects involving the government, industry, academia and research institutes.To carry out comprehensive workforce initiatives, SEMI Taiwan continues to work with the National Security Council and the Executive Yuan (the cabinet). We also launched the Semiconductor Industry Development Council in partnership with leading high-tech companies in Taiwan including ASE, TSMC, MediaTek, PSMC, VIS, MXIC, Nanya, Etron and UMC. Focused on developing semiconductor talent and technology, localizing equipment sourcing, and improving cybersecurity, the council has formed the following seven initiatives: Make existing government talent development programs more flexible to better meet the industry’s workforce needs. Recruit outstanding scholars and leading experts in scientific research, and solicit world-class scientific research teams. Extend age restrictions and other requirements for the Einstein Program (established by the Taiwan MOST, Ministry of Science and Technology) to attract outstanding foreign scholars to Taiwan. Establish a domestic semiconductor research ecosystem and provide sufficient research funding to cultivate R D talent. Strengthen female education in STEM (science, technology, engineering, mathematics) and encourage women to re-join the workforce to help meet the industry’s workforce needs. Continue to promote MOST University-Industry Collaboration Projects (Large Alliance) to connect the upstream academic and research sector with downstream industries. Encourage cooperation between science and technology universities and the chip industry to develop the talent necessary for smart manufacturing to thrive. SEMI’s advocacy efforts with the Taiwan government, the industry and academia are clearly paying off. The Executive Yuan recently announced three major talent development strategies – expanding the talent development capabilities of higher education institutions, promoting industrial-academic cooperation and encouraging businesses to strengthen recruiting efforts and increase funding for semiconductor talent development.The building momentum includes plans by the Taiwan Ministry of Education plans to establish semiconductor technology research centers at several national universities. By passing the sandbox law and loosening regulations organizational personnel, finance and education, the government is freeing up more funding to support semiconductor industry talent development. The ministry also plans to gradually expand the number of students enrolled in STEM curriculum and continues to promote talent training programs and recruiting strategies to help close the workforce gaps and reduce related industry risks. A highly skilled workforce is indispensable to the development of the semiconductor industry and among the most strategic resources in any region. It’s only through long-term partnerships between the government, industry and academia that impactful and sustainable workforce development goals and initiatives can be developed to help the chip industry realize its full potential to innovate and solve some of the world’s greatest challenges. The programs are key to the ability of Taiwan’s semiconductor industry to sharpen its competitive edge. More importantly, they are also the center of gravity in the region’s pursuit of its position as the global semiconductor hub. Jo-Ann Su is senior director and Winnie Chang is marketing and public relations specialist at SEMI Taiwan.

Never before had we expected that SEMICON SEA 2020 would go virtual.The COVID-19 crisis abruptly halted our ability to hold our premier Southeast Asia electronics manufacturing exposition as we typically do – in the physical realm. The pandemic tested our adaptability, challenged our willingness to experiment and, perhaps above all, accelerated not only our own but the world’s digital transformation. We had to change our way of doing business and learn to connect virtually like we had never had before. SEMI continues to believe that virtual interaction is no replacement for face-to-face engagement. But, like the rest of the world, we fast-tracked our digital education and staged the virtual event 20 July to 21 August 2020 to gather supply chain players and help fulfill the tremendous potential of our great industry. For all the suffering the COVID-19 has caused, the pandemic has underscored an important truth – that we need innovation through collaboration now more than ever to help solve the world’s greatest problems. We thank all our event sponsors as we turned what started as a grand experiment into a successful event that drew nearly 3,000 attendees to our webinars, business matching sessions and other online offerings designed to help them uncover new business opportunities. Following are other highlights. Southeast Asia Pavilion at Virtual SEMICON West 2020 In our first collaboration with SEMICON West, our Southeast Asia Pavilion at the event welcomed virtual visitors from around the globe to help them form new connections and grow their businesses. Business Matching Sessions Technical buyers from more than 15 multinational companies along with 141 pre-qualified suppliers attended more than 50 meetings across four online business matching sessions.Technical WebinarsCompany representatives from regions including Malaysia, Singapore, Vietnam, Taiwan, the United States, the UK, Israel, China and Japan shared their expertise and industry insights at SEMICON Southeast Asia 2020 webinars. In addition, experts from leading semiconductor companies such as Micron Semiconductor Asia Operations, ViTrox Corporation Berhad and A*STAR took part in our technical exchange by sharing the latest trends in the rapidly evolving semiconductor industry. Talent Development: Inspirational University Program Talks With building the talent pipeline critical to sustaining growth of Southeast Asia semiconductor manufacturing dynamics, talent champions from Lam Research and GLOBALFOUNDRIES highlighted career opportunities and pathways for young engineers while generating recruiting leads. More than 750 students from Malaysia and Singapore engaged panelists with questions during the sessions. The SEMICON Southeast Asia team extends its tremendous thanks to sponsors and attendees for their support. As we all navigate the pandemic and hope in the near future to awaken to a brighter day, we will continue to connect virtually and, whenever possible, in person as the semiconductor industry evolves and flourishes. The SEMICON SEA 2020 team In the meantime, we will all continue to pull together to support our resilient industry as it outperforms most other manufacturing sectors. Semiconductor capital equipment shipments were up 23% globally in the second quarter of 2020 versus the same period in 2019 and semiconductor chip growth remains in positive territory. Our team has already started planning for SEMICON SEA 2021, scheduled to take place at the Setia Spice Convention Centre in Penang, 18-20 May 2021.We look forward to seeing you again soon as we continue to strengthen the microelectronics ecosystem!Bee Bee Ng is president of SEMI Southeast Asia.

Emerging applications powered by 5G and artificial intelligence (AI) are expected to be a boon to the semiconductor industry, but only once chipmakers overcome a key challenge: Architecting chips that meet the exacting performance, power consumption, size and cost requirements of devices for mid- to high-end applications. One technology – heterogeneous integration – promises to meet these demands and help drive future leaps in semiconductor innovation in the post-Moore era. To help the industry better grasp the technology challenges and business opportunities associated with deploying highly integrated chip and packaging technologies, SEMI and AI on Chip Taiwan Alliance recently gathered industry leaders from organizations including ASE, Unimicron, Dialog Semiconductor, Cadence and AITA to discuss technology trends and the vital importance of building a cross-industry exchange platform to advance next-generation manufacturing processes critical to heterogeneous integration. Following are key takeaways from the forum, Heterogeneous Integration Enables 5G and AI. Overcoming Heterogeneous Integration Technology Challenges Key to Advances in Taiwan High-End Semiconductor Manufacturing The introduction of the Heterogeneous Integration Roadmap (HIR) by the International Technology Roadmap for Semiconductors team in 2016 was an important first step, Dr. C.P. Hung, Vice President of ASE Group, noted in his opening remarks. The HIR is designed to stimulate pre-competitive collaboration to advance heterogeneous integration technology development and accelerate electronics innovation. The roadmap provides a long-term vision for the electronics industry, identifying future technology requirements and potential solutions. Today, the HIR working group focuses on high-performance computing (HPC), 5G and other leading-edge technologies.Dr. Hung predicted that heterogenous integration will reshape traditional collaborations between the semiconductor ecosystem and supply chain in order to clear I/O bottlenecks that hamstring high-performance applications. The retooled industry connections will also need to enable high I/O pin counts, ultra-thin devices, and high-frequency signal shields. In an important step forward, the chip industry today is developing a platform that enhances wafer-level advanced packaging services and deepens cooperation with Oversea Assembly and Testing (OSAT) and substrate supply chain partners. Overcoming the current limits of IC substrates – the connection between IC chips the PCB – is one key for heterogeneous integration technology to flourish, said Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron. He noted that the industry must tackle limits to PCB thickness, substrate density, fine pitch and automation to meet the needs of high-end packaging customers. Another barrier the industry must be surmounted is to make the currently inscrutable confidentiality requirements for patents of foreign materials – key to improving chip yields – easier to access and understand for substrate engineers. Chen said partnerships across the entire industry will be necessary to break through this and other technology breakthroughs. Supply Chain and Cross-Border Ecosystem to Strengthen Partnerships for Further DevelopmentTaiwan has long invested heavily in advancing semiconductor manufacturing and application engineering technologies to become a top global chipmaking hub and, in the process, has been behind significant leaps in optimizing chip functionality, said Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany). With its semiconductor manufacturing prowess, Taiwan can also play a central role in maturing advanced heterogeneous integration packaging technology while managing development costs by partnering with its international supply chain community to overcome technical challenges more effectively, Liu said. The region can also help forge partnerships, even among competitors, to build the ecosystem essential for heterogeneous integration technology to shine.EDA tools will be critical in understanding and resolving heterogeneous integration technical issues since IC substrate, packaging and chip design all pose interdisciplinary engineering challenges, said Julian Sun, Product Marketing Director at Cadence. To help the industry navigate these challenges, Cadence has launched intelligent system design products – solutions that address a wide range of design problems with semiconductor nanometers, micrometers on packaging and testing, and PCB level micro/millimeters to Pin/Pitch, I/O models, and thermals and electricity. By supporting various technical designs, Cadence helps customers shorten the design cycle to strengthen design quality and reduce costs.Sun also pointed to the vital importance of overcoming the significant challenge of designing silicon interposers for heterogeneous integration. Today’s EDA tools are capable of optimizing the design of complex structures including 5GAiP and HBM and are instrumental in aiding Taiwan’s semiconductor ecosystem players to quickly adapt to shifts in the evolving heterogeneous integration market.Heterogeneous Integration Enables 5G and AI speakers (L-R): Julian Sun, Product Marketing Director at Cadence, Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron, Dr. C.P. Hung, Vice President of ASE Group, Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany), Dr. Shih-Chieh Chang, AITA Executive Secretary Designing AI chips is particularly difficult as semiconductor makers struggle with high costs and low yields, said Dr. Shih-Chieh Chang, AITA’s Executive Secretary. That’s why the chip industry now uses FPGAs for small-volume production of AI chips, which makes it easier to improve manufacturing yield through redundant design. For its part, AITA has formed a special interest group (SIG) to help form connections among the chip industry, academia and research institutes. The association’s goal is to build a platform for mass production of AI chips.To get involved in SEMI Taiwan Heterogeneous Integration related events, please contact Ula Huang, outreach senior specialist, at [email protected] Fang is a coordinator and Ashley Huang is a specialist in marketing and public relations at SEMI Taiwan.

Included in this outlook is a discussion of the financial impact of the current pandemic and a forecast for GDP growth by major region for 2020 and 2021.

Linx Consulting and Hilltop Economics continue to monitor how the global economy impacts the electronic materials supply chain. Amidst the recent economic and revenue results releases, we have generated a series of potential scenarios for the next few years. These scenarios are based around sales of silicon wafers expressed in millions of square inches (MSI). Our work develops a multiyear forecast from the historic record of the SEMI-reported MSI demand by developing an econometric relationship with underlying demand drivers. Using this methodology, Linx Consulting and Hilltop Economics have introduced the following three silicon demand forecast scenarios: V-shaped global recession consistent with severe COVID-19 impact followed by a sharp economic rebound. Probability of approximately 40%. V-shaped global recession but with business and consumer behavior differing from the past recession in that there is much more aggressive spending on technology goods that softens the impact for semiconductors in 2020. Probability of approximately 25%. An extended COVID-19 impact developing into a U- or L-shaped global recession with an economic rebound delayed for several years. Probability of approximately 35%. In the few months since coronavirus hit the world, the economic prognosis for all major economies has worsened dramatically, although forecasts remain speculative given the rapid rate of change in the political and economic environment. The forecast changes in GDP since February 2020 of the G7 nations vary from -5.9% for Japan to -10.2% for Italy. These changes are closely linked to unprecedented declines in employment, consumer demand and industrial investment – all key drivers for wafer area demand. This leads us to believe there will be a significant reduction in wafer demand as these economic factors feed through the supply chain.Other leading indicators show dramatic drops in the global and regional economies taking effect at an unprecedented pace. These indicators have a loose predictive relationship for silicon wafer consumption and portend a rapid drop in demand.The demand picture for the semiconductor supply chain (be it wafers, materials, consumables or devices) is thus gloomy, and our models are currently showing Q2 to Q3 2020 reductions in MSI demand of between -11% and -28% depending on the scenario.In marked contrast to this depressing economic picture, the indications from the end-to-end semiconductor supply chain continue to be much more positive. Demand for silicon reported by SEMI increased in Q1 2020 by close to 3% from Q4 2019, while results from materials supply companies vary from slightly negative to record-breaking growth rates through the first three to four months of 2020. Added to this, reported revenues from WSTS for Q1 2020 ticked up 6.2% versus the prior year and the three large foundries in Taiwan and China showed continued growth of Q1 wafer area shipments and a 32.3% growth versus Q1 2019.Revenue and demand reports from leading device manufacturers remain on trend from 2019 with no indication of a precipitous change. Anecdotal reports of strong technology equipment demand to support people working from home and demand for medical devices in response to the pandemic can be substantiated somewhat by demand data although not convincingly.Reports from materials supply companies indicate that factories continue to be fully utilized, having been designated essential businesses, and that safety measures implemented against infection are largely effective.There are some indications of caution, however. The major public silicon wafer suppliers saw a 4% drop in revenues in Q1 over Q4, despite the reported strength in silicon area shipments from SEMI, indicating either ASP declines or some inventory effects.We are advising clients supplying materials into the wafer fabs and packaging supply chains to develop contingency plans for a sharp decline in product demand of as much as 28%, which may bounce back rapidly to 2019 levels or higher in early 2021. However, companies should also be vigilant of a slower than hoped for return to previous activity levels if the effects of the pandemic continue for an extended period.For further information please contact Mark Thirsk at +1 774-245-0959 or on [email protected] in engaging with the electronic materials supply chain? The Electronic Materials Group (EMG) is a SEMI technology community representing SEMI member companies that provide substrates, polymers, metals, organic and inorganic materials, chemicals, and gases developed for electronics manufacturing. Linx Consulting is a longtime member and supporter of the SEMI Electronic Materials Group.Mark Thirsk is managing partner at Linx Consulting. Duncan Meldrum is president of Hilltop Economics.

On Monday, SEMI led a statement from a coalition of industry groups calling on governments worldwide to harmonize their policies to safely allow essential international travel by essential workers. Cross-border mobility in the semiconductor and microelectronics industry is vital to maintaining manufacturing critical to the production of semiconductor devices that are the foundation of our modern economy, countless economic sectors and each nation’s response to the COVID-19 pandemic. Uniform cross-border travel rules impacting essential businesses in the electronics supply chain are crucial for semiconductor business infrastructure and supply chains to maintain effective operations.To that end, SEMI is urging governments around the world to permit international travel by semiconductor supply chain engineers, technicians and executives with minimal disruption to ensure any fast-tracked procedures apply directly to the semiconductor industry and that any agreements negotiated among countries harmonize global travel procedures and processes. Global supply chains require cross-border travel by key technical personnel and business continuity decision-makers to ensure that essential industry manufacturing and business operations remain efficient, effective and uninterrupted. While the industry continues to implement safety protocols and minimize non-essential travel to stem the spread of COVID-19, highly sophisticated equipment sets and materials usage from multiple nations will at times require specialized expertise that is not present in-country.For example, technicians from a semiconductor manufacturing equipment company typically must travel to semiconductor factories in other countries to install or repair specialized tools in situations that are beyond the expertise of the local field office and too complicated to handle by video conference. Similarly, at times semiconductor-based solutions, such as cloud computing, must be implemented or optimized on-site for the equipment to achieve full capacity. After months of remote access to their overseas operations, it also is critical that executives are able to visit their facilities to evaluate and manage their ongoing operations. In the past month, several countries central to the global electronics supply chain have engaged in both formal and informal talks to ease travel restrictions on personnel from essential industries. China, for example, is negotiating fast-track travel protocols with countries throughout Asia and Europe. On May 1, China and South Korea formalized an agreement that has made significant accommodations for semiconductor industry personnel to travel between the two countries. Last week, China and Singapore reached a similar deal – planned to take effect in early June – prioritizing travel for both executives and technicians.Beyond China, several ad-hoc negotiations are underway involving countries as varied as Taiwan, Vietnam, South Korea, Thailand, Canada, Australia and New Zealand. Multilateral discussions are also afoot with the aim of setting up bubble travel zones featuring standard health and travel protocols within the country blocs. As these disparate agreements between individual countries or small blocs of countries take shape, however, they are likely to create divergent standards that may complicate efforts of global businesses to effectively service their operations and customers, even if such travel is and has been deemed essential.In March, when U.S. states and many governments around the world began implementing stay-at-home orders and closing non-essential business operations, SEMI immediately took a lead role advocating to ensure that that the entire microelectronics supply chain was deemed essential and able to continue operations. In the U.S., nearly every state followed SEMI’s recommendation to adhere to the Department of Homeland Security’s Cybersecurity and Infrastructure Security Agency (CISA) guidelines that included semiconductor manufacturing and its supply chain as essential, or specifically highlighted semiconductor supply chains as essential. Overseas, SEMI advocacy worked to ensure the semiconductor supply chain was deemed essential in every key jurisdiction.The mobility of essential workers is critical to essential business operations in the electronics supply chain. Just as SEMI led the effort to ensure that critical electronics supply chain operations were deemed essential as economies were closing down, SEMI will continue to advocate for uniform essential travel guidelines for critical infrastructure workers as economies reopen. Karl Kailing is manager of Public Policy and Advocacy at SEMI.

In an important step toward resuming business as usual in Japan, Prime Minister Shinzo Abe on May 14 lifted the state of emergency originally scheduled to expire at the end of May for 39 of Japan’s 47 prefectures, marking “the real beginning of our efforts toward a new normal in the era of the coronavirus” as new cases continue to decline. But with Tokyo, Osaka and six other prefectures still under the state of emergency, Abe urged citizens to remain cautious as the nation and world continue to confront the COVID-19 threat. Among criteria the remaining prefectures must meet for a state of emergency suspension is a reduction in new infections to no more than 0.5 cases weekly for every 100,000 citizens. The eight prefectures account for nearly half of Japan’s population and GDP, with Tokyo and Osaka the two largest urban areas in the island nation. Japan expects to contain its economic losses to 38 trillion yen, 15 percent less than the 45 trillion yen hit originally projected. The Japan government has planned a May 21 progress review[1] in the eight prefectures, a timeline that Abe said could lead to the lifting of the state of emergency before the original cutoff at the end of the month, a move that would help stem the drain on the domestic economy.Strict Immigration Controls Restricts International Travel to and from Japan by Supplier EngineersAs I reported on April 21, the Japan Foreign Ministry on March 31 raised its travel advisory to level 3 for 49 regions around the world including the U.S., prohibiting travel from Japan for any purpose. SEMI Japan is urging government officials to exempt Japanese supply chain engineers from the travel ban to allow visits to semiconductor manufacturing facilities in those regions in order to install, start up and service equipment.Starting May 14, Japan blocked immigration of foreign nationals and permanent residents from 100 countries and regions worldwide, a ban applying to anyone who spent time in their home region within 14 days of their planned arrival in Japan. The areas include China, Singapore, South Korea, and Taiwan in Asia; Canada and the U.S.; and Germany, France, Italy, Netherlands, Switzerland and the U.K. in Europe. For the complete list, see the Japan Ministry of Justice’s website.Japan’s immigration ban mirrors restrictions now in place in many other regions around the world. The immigration controls are well-intended – to restrict the spread of COVID-19 – but hamstring the global microelectronics supply chain. For example, the curbs bar engineers from international travel to install new tools and software in fabs. SEMI Japan has stressed the potential chip industry impacts of the ban in ongoing talks with the Ministry of Economy, Trade and Industry and is facilitating discussions between government representatives and SEMI members to help clear the way for travel by critical supply chain workers to Japan. SEMI Supports Members with COVID-19 ResourcesSEMI international headquarters and regional offices are here to help you, our members. For more information on our webinars, surveys, best practices and other information designed to help you meet the challenges of the pandemic, please visit the SEMI Coronavirus Updates Resources page.[1] The May 21 review found three prefectures in western area – Hyogo, Kyoto and Osaka – met the criteria to lift the state of the emergency. Four other prefectures – Chiba, Hokkaido, Saitama and Tokyo – remain under the emergency order that will be reviewed again as early as May 25.Jim Hamajima is president of SEMI Japan.

Thanks to developments in science and technology, artificial intelligence (AI), cloud computing, big data and other technologies have been used to establish smart healthcare systems that helps societies respond more effectively to disease outbreaks. The spread of novel coronavirus starting in late 2019 has revealed how not only traditional medicine but also Smart MedTech applications can be instrumental on the anti-epidemic front lines.To give updates on the development of Smart MedTech and how it shines during the fight against COVID-19, SEMI invited Dr. Pei-Yuan Lee, Honorary Superintendent of Show Chwan Memorial Hospital, to share with MSIG (MEMS Sensors Industry Group) and Flex-Tech members how the international community and Taiwan are bringing their best in Smart MedTech to the table and how their collective efforts are helping tackle COVID-19 challenges.Taiwan’s COVID-19 rapid screening reagents and antibody testing help curb coronavirus transmissions Taiwan’s medical community has demonstrated its prowess in responding to the COVID-19 outbreak. Using its nucleic acid extraction reagent, Taiwan Advanced Nanotech Inc. tested 128 specimens from passengers aboard the SuperStar Aquarius cruise ship in only eight hours in early February. Taiwan’s leading research institute Academia Sinica successfully synthesized the first group of monoclonal antibodies capable of recognizing the new coronavirus protein on March 8, enabling testing to be completed in 15 minutes. The College of Medicine of National Taiwan University announced on March 27 that its 30-second screening device had helped identify asymptomatic carriers. The devices detect COVID-19 in people with no symptoms if they have pulmonary infiltration and edema. It took only 14 days for Academia Sinica to successfully synthesized the first group of monoclonal antibodies capable of recognizing the new coronavirus protein. On April 22, three biomedical companies in Taiwan launched a COVID-19 test that produces results from samples of patient mucus in less than 10 minutes to greatly enhance testing speed. Once the test method is approved by the Taiwan government, it will take Taiwan’s medical strategy against COVID-19 to the next level.Artificial Intelligence: the key to upgrading traditional healthcare practicesAI is a key enabler of the transition from traditional medical practice to Smart MedTech. To help fight the COVID-19 outbreak, a National Cheng Kung University medical team developed a 30-minute coronavirus testing procedure that uses AI to read pulmonary X-ray images and automate medical records. Taiwan AI Labs leveraged AI to simulate how drug molecules combine with viruses to reduce research time by three to four years. AI ​​diagnostic technology from the Alibaba DAMO Academy (Academy for Discovery, Adventure, Momentum and Outlook) and Alibaba Cloud interprets CT images of COVID-19 patients with 96 percent accuracy in 20 seconds. AI-powered algorithms improve diagnostic test accuracy, allowing clinicians to quickly analyze scans of pulmonary lesions and quantify the severity of lung damage.Startups have also joined the fight against COVID-19. Taiwan's Internet of Things (IoT) startup iWEECARE invented the world's smallest smart thermometer patch. Heroic-Faith Medical Science launched a device that uses IoT and AI to monitor lung sounds. With Smart MedTech expected to be fertile ground for future venture investments, enterprises must find their niches in establishing new technologies in a much more systemic way. Taiwan startup Health-Faith Medical Science developed a respiratory diagnostics device that uses IoT and AI technology to monitor chest sounds in real time. Anti-epidemic technology to help fulfill smart medtech vision Many AI and big data technologies previously deployed in hospitals and healthcare systems are helping regions around the world speed their pandemic response. The United States and China have started to develop facial mask recognition systems powered by AI, while a team in the Department of Bioinformatics and Medical Engineering at Asia University has devised a facial recognition system combining IoT and AI technology with infrared thermal imaging cameras. At Johns Hopkins University, the Center for Systems Science and Engineering is using AI to create big data models that track global cases, people and traffic flow, and other variables for real-time data analysis that enables epidemiologists to more accurately predict COVID-19 transmission paths. Graphen, Inc., a New York-based provider of next-generation AI platforms, launched the world's first AI COVID-19 genetic evolutionary path analysis systems to gauge the virus’s transmission route and accelerate pandemic response. Both the United States and China are also using robots and drones to improve epidemic research and patient treatment. For the first confirmed case in the United States, robots were used to assist with medical care. In China, robots facilitate deliveries of disinfectants to makeshift hospitals built to expand the nation’s capacity to treat COVID-19 patients. While Taiwan’s robots are traditionally used for hospitality, transportation and disinfection purposes, future robotics research and development will focus more on medical applications that shift more work from medical staff to technology. With abundant technological resources and expertise, Taiwan can join hands with the rest of the world to combat the COVID-19 pandemic. Emerging technologies are pointing the way toward a new paradigm for healthcare community. Biotech, artificial intelligence, and robotics have given rise to new applications that increase virus screening accuracy and efficiency. This growing wave of technological defenses against the pandemic will become a long-term force for stability and strength in healthcare systems across the world.To get involved in SEMI Taiwan Smart MedTech Community, please contact Helen Chen, Outreach Manager, at [email protected] Huang and Winnie Chang are marketing and public relations specialists at SEMI Taiwan.