sustainability

With the rapid proliferation of electronics applications with more powerful embedded intelligence, demand for smarter, more efficient sensors is increasing to help devices connect to the world around them. As the semiconductor industry drives the future of connected technologies and sustainable solutions, it faces challenges in energy consumption, resource management, and ensuring data security.SEMI spoke with Simone Ferri, Vice President and General Manager at STMicroelectronics (ST), about current trends and challenges in the Micro-electromechanical Systems (MEMS) and imaging sensors market and how ST is driving innovation in this rapidly evolving industry. Ferri shared insights ahead of his keynote presentation at the SEMI MEMS Imaging Sensors Summit on November 14, 2024, in Munich. Registration is open.SEMI: Welcome, Simone, and thank you for sharing your perspective on the dynamics and trends for today’s MEMS and imaging sensors. To start, how would you describe the current market dynamics for these technologies, and what key factors are influencing these dynamics? Ferri: Right now, the MEMS and imaging sensors market is primarily driven by applications such as automotive electronics, consumer medical devices, AI-powered devices, and intelligent wake-up systems.According to Omdia, the MEMS market is projected to reach approximately $11 billion by 2027, with a CAGR of 2.8% from 2022 and 2027. Currently, automotive applications account for 50% of this market, with industrial at 15% and consumer at 35%. Notably, the automotive sector is the fastest growing, with a 5.4% CAGR, driven by the increasing use of inertial measurement units (IMUs) and microphones.In addition, Yole Group estimates that the imaging market, including optical sensing, will grow at a 4.7% CAGR between 2023 and 2029. Although mobile phone applications remain the primary driver of Complementary Metal-Oxide-Semiconductor (CMOS) image sensors (CIS) volumes, other sectors, including consumer electronics, automotive, and security imaging, are also contributing to the growth.Long-term forecasts for smartphone sales have been trending downwards, but mobile phones still remain a major driver of applications, innovation, and overall volume in the imaging market. Notably, the automotive imaging sector is one of the fastest growing markets and is expected to drive additional demand for CIS.Factors that influence the current market include global economic conditions, regulatory changes, geopolitical factors, technological innovations, and the emergence of new applications and use cases.SEMI: Can you elaborate on the growth strategies that STMicroelectronics is adopting to stay competitive in the MEMS and imaging sensors market? Ferri: ST has played a pivotal role in both the MEMS and imaging sensors markets for over two decades with its proprietary silicon technologies. We fully leverage our Integrated Device Manufacturer (IDM) business model, which allows us to support our customers through integrated capabilities for both design and manufacturing.To remain competitive, we are exploring new markets for MEMS sensors, particularly in digital healthcare with biosensors, where wearable devices are expected to exceed 500 million units per year by 2027.We’re focusing on the growing demand for automotive sensors such as accelerometers, Inertial Measurement Units (IMU), and pressure sensors, particularly with the rise of electric vehicles. We are enhancing the integration and synergy between automotive and personal devices. For example, we are combining high-g and low-g accelerometers within a single IMU, enabling accurate fall and crash detection, along with precise orientation and wake-up functionality.AI is another one of our priorities. In today's digitalized world, AI enables real-time, contextual understanding and the ability to make decisions that optimize and reduce the power consumption of the final device. Sensors are no longer merely for data collection. Thanks to AI, sensors can interact with their environment and significantly contribute to innovation and sustainability.We are also prioritizing low power consumption. Our MEMS technology operates in low-power mode with almost negligible energy use, activating only when necessary, without waking up the system to understand its environment or to be reconfigured.In addition, we’ve seen optical sensing continue to grow year over year. Optical sensing now offers features such as 3D capture, low-power and low-footprint computer vision, Near InfraRed (NIR) and even Short Wavelength InfraRed (SWIR).We are accelerating and leveraging our IDM model and broadband semiconductor supplier positioning to propose wider system offerings based on the array of sensors and microprocessors that ST develops. As the world shifts toward widespread use of sensors and data collection, the demand for secure sensing technologies is growing, extending beyond mobile and PC applications to spatial computing and AR/VR environments. For example, if we are talking about recognizing specific persons in an AR environment, we don't want the data related to these persons to be sent to the cloud before a decision is made about whether they are supposed to be there or not, as such information can be intercepted. We want all the data to be managed at sensor level and only a warning of rejection or acceptance to be transferred outside our secure sensor. SEMI: What are some of the latest technological innovations in MEMS and imaging sensors that are shaping the industry? Ferri: In MEMS, we're seeing significant advancements in three key areas:- In-sensor AI is integrating technologies in the sensors such as machine learning core (MLC), adaptive self-configuration (ASC), and intelligent sensor processing units (ISPU).- Open sensors are designed to interface seamlessly with other sensors, allowing third parties to benefit from on-sensor processing innovations, while building an ecosystem to create joint value with customers.- Accurate sensors are providing high-precision data, enabling better decision-making and smoother, more natural user interactions. These sensors also reduce factory calibration time and resources, leading to overall lower energy consumption. Because of their accuracy, onboard MLC, and ASC, the sensors can also reconfigure themselves without interaction with the processor, thus guaranteeing the proper accuracy at lower power consumption, at any time, under any condition.In the imaging sensor market, key trends include:- Higher Pixel performance is leading to improved signal-to-noise ratio (SNR), low light performance, better quantum efficiency (QE) and lower noise performance. Despite post processing, pixel performance remains the key factor as SNR performance must remain high while the pixel shrink roadmap advances.- Embedded Intelligence is providing local processing for local decision making, enhanced security, advanced image sensor processing (ISP) for improved image quality, and fusing sensor functions to deliver a better user-experience.- "Always on" capabilities are supporting mass sensorization and deployment of optical sensing solutions everywhere through specific low-power design techniques, process development, and overall system architecture optimization.SEMI: Looking toward the future, what trends do you anticipate will have the most significant impact on the MEMS and imaging sensors market? Ferri: Some macrotrends for sensors include:Electrification: Certain consumer and industrial applications are now being adopted in the automotive sector, especially with the rise of electric vehicles creating new opportunities for innovation and for new players to enter the market. As example, the predictive maintenance that has been developed for industrial electric motors is ported 1:1 to electric vehicles.AI: Regarding data transmission, distributed architecture will push AI towards edge computing, increasingly supported by advancements in 6G and foldable technologies. Additionally, as AI becomes more integrated, the maintenance and security for AI will require more attention.Smart home, buildings, and cities: As cities grow, the demand for smart homes and buildings rises, requiring more sensors to manage energy, security, and urban infrastructure efficiently. Over 55% of the global population and 70% of the EU population reside in cities. Urban areas generate more than 80% of the world’s GDP, and by 2030, it's anticipated that 68% of the global population will be urban dwellers, pointing to the growing need for smart cities.Aging population and digital health: The integration of biosensors with MEMS technology will be crucial for addressing the needs of an aging population.Overall, the use of image sensors for environmental sensing is steadily increasing. This is a major focus for ST, particularly in 3D sensing. New use cases, such as presence detection, are enhancing security and reducing power consumption due to efficient data processing. Additionally, the average number of cameras in smartphones, automobiles, and even in devices like robots and vacuum cleaners, continues to grow.SEMI: What has STMicroelectronics been working on, and what are your plans for the upcoming years? Ferri: To date, we have shipped over 23 billion MEMS sensors. Still, we remain committed to continuously improving our products and enhancing our MEMS technology in terms of affordability, miniaturization, performance, and novelty. We are striving to set the stage for a future defined by innovation and excellence with:Evolution of our current product portfolio by investing in lower power consumption, lower supply voltage, and additional and more sophisticated in-sensor AI for an effective distributed AI conceptNew sensors for presence detection, like infrared (IR) sensors, and health-focused sensors such as biosensors.MEMS sensors are also becoming increasingly accurate, open towards different ecosystems of technologies, and so intelligent that they can self-configure and reduce power consumption thanks to optimal data processing. These attributes allow us to provide meaningful and sustainable solutions across sectors such as automotive, industrial, infrastructure, and personal electronics, enabling us to improve energy efficiency, reduce waste, and support sustainable practices for a greener planet.For the past 10 years, ST has focused on depth sensing across multiple use cases. Today, ST is the number one in the world for time-of-flight solutions through our ST FlightSense product family. More recently, we launched our global shutter image sensors family, ST BrightSense, to address markets like personal electronics, automotive, industrial, communications equipment, and computers and peripherals.More specifically on the automotive side, we have the portfolio, customers, and customer program awards to lead the driver and occupancy monitoring market. We continue to secure design wins from our growing customer base while we expand our product portfolio and broaden our customer and application footprints.SEMI: What are some of the biggest challenges facing the MEMS and imaging sensors industry today, and how is ST addressing them? Ferri: The MEMS and imaging sensors industry faces several challenges, but with strategic planning and innovative solutions, companies can overcome these obstacles by focusing on the following:Integration: With our biosensors, we are doing more with less space. For example, in a standard accelerometer, we integrate an analog front end for electrocardiogram (ECG) analysis, enhancing functionality without increasing the device footprint.Performance enhancement: Ensuring high performance and reliability in various environmental conditions is crucial, especially in automotive and healthcare applications. To meet these demands, we deploy comprehensive testing protocols to ensure our sensors meet performance and reliability standards.Power efficiency: Reducing power consumption is vital, particularly for battery-operated devices like smartphones and IoT devices. We are developing low-power architectures to address this need.Data security: With the growing use of imaging sensors in surveillance and personal devices, data security and privacy have become paramount. Our solutions include encryption for data transmission and storage, as well as robust access control mechanisms to prevent unauthorized access to sensor data.Additionally, supply chain issues remain a significant challenge today. We believe our strategy and capacity as an IDM, combined with our strong innovation capabilities, give us a competitive edge in supply chain management.SEMI: What are you most looking forward to at the MEMS Imaging Sensors Summit, and what does it mean for the European semiconductor industry? Ferri: I look forward to the Summit as a valuable opportunity to connect with industry peers, share insights, and explore new collaborations. I encourage my peers to attend, as it’s a unique platform to collectively shape the future of our industry and sustain Europe’s leadership in semiconductor innovation. About Simone FerriSimone Ferri is Vice President of APMS Group and General Manager for MEMS sub-group at STMicroelectronics. Ferri began his career in STMicroelectronics in 1999 as an R D engineer before becoming a digital designer for the company’s audio division, leading into product management after 5 years. In 2014, ST entrusted Ferri with MEMS consumer sensors followed by global MEMS-sensor related Marketing and Application activities across all markets and segments, leading into his current role. Ferri graduated with a degree in microelectronics from Politecnico di Milano (Polytechnic of Milan), where he also completed his MBA. Sitong He is Marketing and Communications Manager at SEMI Europe.

The drive to scale nodes towards physical limits, known as "More than Moore," and the adoption of 3D architecture in chip integration strategies for advanced logic and memory applications has led to unprecedented demand for high-quality dependable materials solutions. With the aid of digital solutions, the process is expedited with higher quality and efficiency.SEMI spoke with Thorsten vom Stein, Director, Head of Process Design Semiconductor Materials at Merck KGaA, Darmstadt, Germany, about how materials innovations and advanced packaging can contribute to smarter supply chain solutions for a sustainable ecosystem.More insights into key aspects of 3D architecture in chip integration and heterogeneous integration will be shared at the Advanced Packaging Conference (APC) during SEMICON Europa 2024, Nov. 12-15 in Munich, Germany. Registration is open.SEMI: What makes the digitalization of chemical process design for semiconductor materials manufacturing so challenging at a technology level? Vom Stein: The primary challenge in digitalization of process design is achieving data rich experimentation and design flexibility from the start. When we begin the process design for a novel material solution, the freedom of design needs to be very high for optimal outcomes. For example, to identify the best sequence of unit operations to achieve best process intensification, do we need a distillation or extraction after the reaction to meet the purity requirements? At the same time, the samples from these early process trials need to have purity levels and process reliability standards for high-volume manufacturing of routine production in order to meet the requirements of our customers’ leading-edge chip integration strategies. We address this need by executing data rich experimentation starting with first trial, and thereby establish “production ready” data density in the lab.To avoid confining our design space, we therefore need highly “sensorized” and automated modular lab equipment that can give us the data density we need and flexibility at the same time.SEMI: Are data-driven approaches also applied to streamline manufacturing processes? Vom Stein: Yes, data-driven approaches are key to driving cost, quality, process reliability and sustainable excellence. As we scale up from lab experiments to high-volume manufacturing—often times increasing volumes by two or three orders of magnitude—we scale the process model virtually ahead of its physical twin to de-risk these major scale-up steps. An example of this is simulating the effect of reactor geometry on the impurity profile.Establishing this handshake between the physical asset and the process model early in the development has a lot of benefits for sustained cost efficiency of the future manufacturing process. For instance, it allows for optimization of yield and cycle times to the existing asset infrastructure. Furthermore, we can achieve quality reliability critical to our customers by establishing end-to-end correlation models that link the quality of incoming raw materials to finished good impurity profiles.Finally, we can achieve the lowest possible carbon footprint and minimize waste streams and energy intensity via process intensification by matching the unit operation sequence to the specific thermodynamics and kinetics of the process.SEMI: How can advanced packaging contribute to the pursuit of net zero? Vom Stein: Ultimately in a successful process design, we aim to achieve the maximum yield of value-added product with minimal input of resources and raw materials. So, there is an intrinsic synergy between highly intensified processes and their carbon footprint. The digitalization of process design allows us to track the CO 2 footprint during every iteration of the design. Establishing this tracking as a routine design KPI is one of the key initiatives to drive net zero semiconductor material solutions.In addition, advanced process design is a key enabler for circular value streams. We are currently working on multiple projects to recycle waste streams and re-feed them as raw materials in our processes. We are also exploring how our chemical process technology can aid our customers’ recycling efforts such as reusing lithography cleaning solvent waste streams.SEMI: In your previous talks, you emphasized the importance of diversity, equity and inclusion (DE I). How is this related to the digital revolution? Vom Stein: In the not-so-distant past, my team consisted mainly of process chemists and engineers. Now, we are working with data scientists, model developers, automation experts and many more substance matter experts on our projects. This work requires an inclusive culture to maximize the impact of these diverse sets of insights and disciplines.We also must acknowledge that, in many instances, we are exploring unchartered territory that requires a “leap of faith” culture trusting in digital models. Imagine, for example, a production plant director who is used to a stepwise physical scale-up, now being onboard with skipping physical scale-up steps by using predictive process models. It takes time to really establish a trust in the “power of data.” This type of culture is championed at Merck KGaA, Darmstadt, Germany on all levels: from CEO to the production operator. Our DE I Report showcases how we continuously build belonging for over 64,000 employees across the globe.SEMI: Merck KGaA, Darmstadt, Germany is a key contributor to semiconductor innovations. How important is it for Merck KGaA, Darmstadt, Germany to collaborate with other industry leaders to achieve goals in matters such as sustainability and DE I? Vom Stein: Collaboration with our customers and OEM partners is a key piece of achieving the molecular precision necessary to drive technology evolution that serves as the backbone to society. More and more, we need to link our material solution manufacturing process to the process parameters of the tools in the fab, ultimately improving the chip yield of our customers. To transition from the nanometer era to the angstrom era, we must establish these process correlations end to end along the value chain, which is why we are heavily engaged on our Athinia collaboration framework.Besides technology enablement, sustainability is the next avenue where cross value chain collaboration is a must to lower the CO 2 and energy footprint of our industry. To this end, we have started a joint program with Intel on AI-enabled sustainable semiconductor processes.The importance of industry collaboration is why I was so honored to participate at SEMICON Europa together with representatives from leading companies.SEMI: What did enjoy about SEMICON Europa 2023 that you would like to experience again in 2024? Vom Stein: I was really impressed by the SEMICON Europa 20 Under 30 recognition program launched during the show. The program honored the brightest young leaders who have demonstrated success in their careers in the microelectronics supply chain. We were very happy with the acknowledgement of one of our brightest minds at Merck KGaA, Darmstadt, Germany, Balazs Bordas, Digital Twin Implementation Lead. He has been instrumental for many of our pioneering efforts in this space.Such recognition programs are very important for our industry and can make a significant difference in the perception of the semiconductor industry and its ability to motivate and attract more talent. I personally hope to see similar programs in the years to come.Additional resources:Learn more about diversity and inclusion at Merck KGaA, Darmstadt, Germany.Learn more about Merck’s KGaA, Darmstadt, Germany modular lab automation approach.Merck KGaA, Darmstadt, Germany sponsored SEMICON Europa and SEMI Advanced Packaging Conference in 2023. Thorsten vom Stein is Director, Head of Process Design Semiconductor Materials at Merck KGaA, Darmstadt, Germany. Based in Darmstadt, Germany, he holds a PhD in Chemistry from the RWTH Aachen University and has extensive experience in Catalysis, Materials Science, Process Development and Value Chain Innovation.Serena Brischetto is Director of Marketing and Digital Engagement at SEMI Europe.

Silicon carbide (SiC), with its wide band gap and high thermal conductivity, is increasingly favored for semiconductor power applications across several fast-growing industries. Its ability to operate at higher voltages and frequencies enables significant efficiency gains, particularly in e-mobility, where SiC offers key advantages in size, weight, and speed compared to traditional silicon-based power devices.However, as promising as SiC is, the industry still faces critical challenges in scaling to meet growing demand. Key barriers include cost, reliability, and manufacturing capacity, all of which must be addressed for SiC to fully mature.SEMI spoke with Entegris Senior Director - Advanced Technology Engagements, Office of the CTO Mark Puttock, Ph.D., to discuss the challenges of scaling SiC power chip manufacturing from a material supplier’s perspective. Puttock shared insights ahead of his presentation at the Entegris session, Cultivating a Thriving SiC Market: Tackling Key Challenges Across the Value Chain, taking place on November 14, 2024, at SEMICON Europa in Munich, Germany. Don’t miss the opportunity to engage with experts from Entegris and other industry leaders. Registration is now open. SEMI: Global megatrends like environmental crises and AI drive the necessity for SiC power semiconductors. What is the current status? Puttock: The increasing demand for efficient power electronics — fueled by global megatrends such as vehicle electrification, environmental de-carbonization, and the rise of power-hungry AI chips — drives the necessity of wide bandgap semiconductors. SiC offers advantages of weight, size, and speed over traditional silicon (Si) solutions, which are particularly vital in automotive applications 600V and above. However, SiC chip manufacturing has not reached the maturity of silicon-based processing. Greater maturity will help reduce costs, which will accelerate adoption in the market.SEMI: What are the main challenges in scaling SiC?Puttock: Challenges in scaling SiC power chip manufacturing to high volumes are not surprising. That’s because high volume producers have not been operating long enough to resolve early-stage issues. From a material perspective, SiC is more challenging to manage compared to Si. The challenges we identify include:Chemical Mechanical Planarization (CMP): SiC is nearly as hard as diamond and significantly harder than Si, making it challenging to achieve a high removal rate while maintaining both planarity and low defectivity. This step is crucial toward the end of the wafering process and before the epitaxial growth of device layers.Handling: SiC is more brittle than Si, making it more susceptible to damage or breakage.Implantation: SiC is more difficult to implant than Si, requiring higher temperatures and the use of aluminum instead of boron as a P-type implant species. Additionally, it is a significant challenge to achieve a reliable aluminum source with a long and stable lifetime.Thermal Processing for Wafer Growth and Epitaxy Processes: SiC processes run hotter than Si ( 2000° C for wafering, 1500° C for epitaxial growth), demanding resilient chamber parts to achieve good lifetimes.Sustainability: Because SiC is extremely hard, the CMP process requires significant amounts of slurry. Improving slurry recycling and wastewater management continues to be a challenge.On October 29, we will address these issues in our webinar, “Challenges in Scaling SiC Power Chip Manufacturing: A Material Supplier's Perspective” This session will provide valuable insights and considerations for advancing maturity in high-volume SiC power chip manufacturing. SEMI: Can you elaborate on the challenges associated with CMP for SiC wafers? Puttock: SiC wafers are challenging to process, requiring specialized materials and methods compared to traditional silicon. Defects in the SiC wafer crystal during non-optimized CMP processing can propagate into the device epitaxial layers. This leads to yield loss, increased electrical resistance, reduced performance, and wasted power.SiC wafers must be cut, ground, lapped, and polished to create the necessary surface properties before depositing active layers. As the demand for these devices grows, optimizing the CMP process is essential to ensure the desired surface quality and planarity required for device fabrication. For a deeper understanding of these challenges, we recommend downloading our latest white paper, “Solving CMP Challenges in High-Volume SiC Production,” which covers:Achieving maximum smoothness with high removal ratesReducing the total cost of ownership Optimizing CMP slurry and pads for the unique wafer chemistry and topology of SiC wafersSEMI: What do you mean by optimizing slurry for SiC CMP?Puttock: CMP slurry typically consists of abrasive nanoparticle powder dispersed in a chemically reactive solution. The objective is to achieve a smooth, defect-free surface (less than 1 A Ra) with a high removal rate (greater than 7 µm/m).Traditionally, achieving high removal rates and smooth surfaces required two separate slurries. This approach sometimes forced SiC wafer manufacturers to choose a defect-free surface over a faster, more efficient CMP process, depending on their fab capabilities. Today, optimization allows SiC wafer manufacturers to achieve both high polishing capacity and good final surface quality using a single slurry.Additionally, while the slurry is the most critical part of the CMP process, the pad must be compatible with the application. This ensures the desired planarity while also preventing scratches or contamination of the SiC wafer surface. Research shows that optimized thermoplastic polyurethane CMP pads outperform traditional thermoset polyurethane pads. The optimized pads minimize surface damage and enhance removal rates due to their bulk hardness.SEMI: What are the future challenges for SiC devices? Puttock: SiC devices are increasingly favored for their superior energy efficiency and reduced environmental impact. However, the SiC manufacturing process presents challenges due to its high-temperature operations, which consumes significant amounts of energy and shortens the lifespan of chamber components. To address this, improving efficiency in these processes will be crucial in the coming years.Recycling is another important challenge. For example, CMP slurries present an opportunity for water recycling and conservation. At Entegris, we are committed to this issue and are actively collaborating with key industry players to enhance material circularity and prioritize sustainability in our new product development.SEMI: How is Entegris contributing to advancements in SiC technology, and what initiatives or partnerships do you have planned for the near future? Puttock: Entegris is an active member of the SEMI Global Automotive Advisory Council (GAAC) and participates in a working group focused on SiC with key industry leaders such as Volkswagen, BMW, Porsche Consulting, onsemi, Infineon, STMicroelectronics, and others. Our engagement spans the entire semiconductor supply chain, collaborating with integrated device manufacturers and original equipment manufacturers in fabs worldwide. Additionally, we recently announced our latest long-term agreement with onsemi, which underscores our commitment to advancing SiC technology.SEMI: What are your expectations regarding your participation at SEMICON Europa? Puttock: SEMICON Europa is a unique platform to connect with the semiconductor and automotive ecosystems. Last year, we organized a highly successful SiC session in collaboration with SEMI at both SEMICON West and SEMICON Europa, focusing on “Connecting the Automotive Ecosystem Towards More Mature SiC Manufacturing.”This year, we will continue the discussion with industry leaders during our session, “Cultivating a Thriving SiC Market: Tackling Key Challenges Across the Value Chain.” Our goal is to provide insights and propose solutions that will enable SiC power chips to achieve their anticipated role in future technology ecosystems.We will present alongside Porsche Consulting, and the talks will be followed by a panel discussion that will explore the current state and future prospects of SiC technology in power electronics. We invite visitors to join us at the Executive Forum on Thursday, November 14, from 1:40 – 3:00 p.m. and to visit us at Silicon Saxony booth 219 in Hall C1.About Mark PuttockMark Puttock, Ph.D., is the senior director of advanced technology engagements in the office of the CTO at Entegris. He has worked in the semiconductor industry for over 30 years with a background in physics and plasma processing. As a team member of the Entegris CTO office since 2014, Mark has followed technology trends and collaborated with Entegris’ global product development teams to develop timely and differentiated new materials, chemistries, and components for all the world’s semiconductor manufacturers. Maria Daniela Perez is Communications Manager at SEMI Europe.

Semiconductors are the foundation of all electronics and information technology that drive our modern world.

After two days of online pitches Startups for Sustainable Semiconductors semifinalists, the program’s organizing committee has selected nine finalists. These companies will present at the Sustainability Pavilion during the Startups for Sustainable Semiconductor session at SEMICON West.

SEMI and the SEMI PFAS working group members have strengthened their advocacy efforts concerning policies governing the use of per- and polyfluoroalkyl substances (PFAS).

Seeking to spur more green technology innovation for our industry, SEMI Startups for Sustainable Semiconductors launched the third year of the program by inviting startups, academics, and innovators with compelling ideas for advancing semiconductor industry sustainability to apply to participate.

Semiconductor Climate Consortium working groups provided updates on their work to reduce greenhouse gas emissions across the global chip value chain at the first SCC general meeting of 2024. In addition, Alaina Passavant of the Carbon Disclosure Project presented on emission reporting trends.

more than 10 Corporate Venture Capital firms from the semiconductor ecosystem have come together to establish Startups for Sustainable Semiconductors, a program for startup companies with sustainable innovations that can help advance the semiconductor industry in its journey to become greener.

Hosong Hwang, Head of the Environment Team at Samsung Electronics, provides an overview of Samsung’s new environmental strategy and delves into the sustainability journey of a globally renowned electronics company.