sustainability

The SEMI Startups for Sustainable Semiconductors (S3) program announced 15 startups chosen as finalists for pitching to the industry at SEMICON West 2025 in Phoenix, Arizona. The finalists were chosen from a field of 35 semifinalists after a virtual pitch event over 2 days. Startups were evaluated by the organizing committee on five factors: the sustainability impact on our industry, commercial viability of product, company value proposition, the quality of the pitch and the startup team.The committee, made up of experienced Corporate Venture Capitalists (CVCs) from the global semiconductor industry, initially received 145 submissions in all three categories identified for 2025:Sustainable Semiconductor ManufacturingSustainable Data CenterGen AI for Sustainable DesignNow in its 4th year, the program features strong exposure to semiconductor industry CVCs, through the personal mentoring each startup receives. Mentoring topics are tailored to align with the needs and strategic positioning of the startup business plan, and can range from basic introduction to semiconductor manufacturing, to connections to new funding sources. A full analysis of the program over the past 3 years is available here.The SEMI Startups for Sustainability Semiconductor pitch event will take place at the Sustainability Pavilion Stage on Wednesday, October 8 starting at 1:00 p.m. Program lead John Wei of Applied Ventures will open the session and introduce a fireside chat featuring Dr. Om Nalamasu, CTO of Applied Materials and Chair of Applied Ventures and Dr. Melissa Grupen-Shemansky, CTO of SEMI, and moderated by Saifi Usmani, SEMI Vice President of Sustainability. These executives will discuss the role of startups in semiconductor sustainability, along with a variety of related topics. The finalist pitches are scheduled from 2:00 to 4:40 p.m., with each presenter given a 10-minute time slot.Investors are welcome to attend the session at SEMICON West and to register their interest here to learn more about the 2026 program.2025 S3 FinalistsActasys Inc.Brooklyn, NY, USA Actasys has developed a precision cooling solution designed for thermal bottlenecks in semiconductor-driven systems such as networking cards (NICs), DPUs, switches, and optical transceivers. Instead of cooling entire racks or server rooms ActaJet™ targets localized hotspots at the device level, delivering scalable, high-efficiency airflow through a compact, adaptive, and electronically controlled actuator system. AlixLabs ABLund, Sweden AlixLabs AB is developing a disruptive semiconductor manufacturing technology based on Atomic Layer Pitch Splitting (APS). It enables cost-effective and environmentally sustainable scaling of transistor architectures by doubling pattern density without requiring advanced lithography. The core product includes both the APS process and customized etching equipment that integrates into existing semiconductor fab workflows, reducing complexity, cost, and environmental impact.AllonniaBoston, MA, USA Allonnia delivers on-site PFAS treatment with SAFF® (Surface Active Foam Fractionation), a modular system that uses air to naturally separate long- and short-chain PFAS from water. SAFF concentrates PFAS up to 100,000x, minimizing waste and enabling cost-effective, closed-loop management alongside any destruction technology. This plug-and-play solution helps fabs meet strict regulations while advancing sustainability goals with low OPEX and seamless integration into existing operations.AlsemySeoul, South Korea Alsemy is building an AI-powered platform that bridges Manufacturing Execution Systems (MES) and EDA domains enabling fabless engineers to reflect manufacturing data characteristics in their chip designs, while process engineers can make data-driven decisions to optimize manufacturing processes for maximum chip performance. By connecting these traditionally siloed areas, a feedback loop is created to drive efficiency and innovation across the semiconductor value chain.Arieca IncPittsburgh, PA, USA Arieca's adaptable Liquid Metal Embedded Elastomer (LMEE) technology, which blends liquid metal and polymer, delivers both thermal performance and mechanical reliability. LMEEs are a cost-effective, dispensable emulsion that is compatible with existing high volume manufacturing tools and allows for low pressure spreading and excellent wetting. CuspAICambridge, UK CuspAI is building an engine that combines Gen AI models, virtual twins, and active learning pipelines for simulation to develop sustainable materials solutions that address critical environmental challenges, including, environmentally-friendly etching reagents, specialized sorbents for emissions capture, and novel catalysts for manufacturing waste remediation. The engine has already proven successful in designing metal-organic frameworks (MOFs) for carbon capture and PFAS removal from water.FlexiramicsEnshede, The Netherlands Flexiramics® is a breakthrough flexible, 100% ceramic fiber material designed as a drop-in replacement for glass fiber in PCBs. By enhancing thermal conductivity and reducing signal loss, it enables semiconductor manufacturers to build faster, cooler, and more reliable devices. This translates into higher performance, longer lifetimes, and greater efficiency for next-generation chips and advanced electronic systems.icspiKitchener, ON, Canada icspi has developed the microAFM, a scalable atomic force microscope (AFM) on a 1 mm^2 MEMS scan head, 1,000,000x smaller than conventional AFMs. MicroAFM technology enables parallel arrays of thousands of devices for sub-nanometer metrology and inspection with unprecedented throughput, accelerating time-to-yield and reducing scrap.Mixx Technologies, Inc.San Jose, CA, USA Mixx Technologies is a deep-tech startup building next-generation optical interconnect solutions to deliver non-blocking, energy-efficient data movement. The advanced 3DS platform enables petabit level end-to-end connectivity for AI workloads resulting in sustainable, efficient, and cost-effective scaling. The 3DS platform comprised of the engine, package and system, enables seamless deployment of the optical IO chiplet.Point2 TechnologySan Jose, CA, USA Point2 designs and manufactures mixed-signal interconnect SoCs for terabit data transmission, to overcome the barriers of copper and optical cabling to accelerate AI interconnect in GPU cluster scale-up. e-Tube technology uses an RF Transmitter SoC to convert data from the electrical to the RF domain for transmission over plastic waveguides, with the RF Receiver SoC converting the data from the RF domain back to the electrical domain.PROUDLausanne, Switzerland PROUD's patented diamond-layer technology with the highest heat dissipation capacity ( 1000 W/m.K) of any existing material, deposited on chips, allows a direct upgrade in heat extraction, power output and efficiency.SKYRE, Inc.East Hartford, MA, USA SKYRE, Inc. is a pioneer in hydrogen technology, developing innovative solutions to support a clean energy future. From hydrogen recycling, purification and compression, to sustainable energy systems, we deliver environmentally responsible innovations in high-efficiency, zero-waste hydrogen and carbon transformation technologies—cutting costs, boosting industrial productivity, and reducing environmental impact.SyentaSydney, Australia Syenta has developed LEM - Localized Electrochemical Modelling - a process for depositing metal patterns using a local electrochemical process. The pattern is created on a stamp, which then prints the pattern on the substrate in an additive process.Vionano Innovations IncSt. Paul, MN, USA VioNano Innovations is building a patterning platform to enable advanced feature scaling using self-assembling polymer brush materials. The system enables polymers over 193 nm DUV lithography patterns to double feature density without requiring ALD/CVD or etch steps. The result is a low-energy, high-resolution process for sub-20 nm features using existing infrastructure.XLYNX MaterialsVictoria, BC, Canada XLYNX designs and manufactures a revolutionary family of polymer crosslinkers. These reagents are uniquely able to cure virtually ANY aliphatic polymer, by harnessing high-yielding insertions to carbon-hydrogen bonds. Curing can be triggered thermally (at temperatures as low as 80°C) or photochemically (using either UV or blue light). Heidi Hoffman is Senior Director, Marketing Sustainability at SEMI. Saifi Usmani is VP, Global Industry Sustainability Programs at SEMI.

Under the Greenhouse Gas Protocol (GHGP), all companies are required to calculate and report their emissions, including those of all members of their downstream and upstream supply chains. These are called Scope 3 emissions, and are divided into 15 Categories, including Category 11 - Use of Sold Products, a heavy lift for many small (and often large) companies. Measurement and improvements in vendor Scope 3 emissions are already influencing vendor selection and sourcing decisions, and experts agree that this will continue to increase. Upstream suppliers have typically relied on broad GHGP guidance to follow in making their calculations. For the semiconductor sector, and its well-documented, incredibly complex supply chain, there was no guidance accounting for the nuances within the industry to standardize calculations. Work began a year-and-a-half ago to change that.The Semiconductor Climate Consortium (SCC)’s Scope 3 Working Group compiled, verified and published a guidance document for calculating Scope 3, Category 11 emissions. The guidance document helps standardize emissions reporting and calculation methods and accounts for the unique requirements and circumstances of the semiconductor value chain.The SCC 3.11 guidance explicitly highlights where it maintains consistency with the existing guidance (e.g., GHG, SBTi, US EPA) and where it expands on that guidance to close a gap relevant to one or more of the semiconductor industry segments. The document was developed with the help of the Sustainability Consulting Group ERM, as well as excellent participation from the Scope 3 Working Group members, including representation from every segment of the semiconductor value chain from IDMs to foundries, fabless companies, chemical gas and materials companies, OSATS, and equipment manufacturers.Some of the significant areas considered while compiling the guidance included:Boundaries, especially around products and direct use-phase emissionsProduct lifespan, especially across the different sectors of the value chainMarket based emissions guidanceIncorporating grid decarbonization into the inventory and calculationsThe document includes several useful calculation examples, including direct use phase emissions and direct and indirect energy consumption. The examples help to make the guidance more tangible and practical in real world application.We were pleased to collaborate with our industry colleagues on developing this guidance as we work to align with others in the industry and minimize our reporting via efforts by the SCC. Download the Guidance Document.For further insights into the Guidance, the authors, including experts from ERM recently hosted a webinar. Register to watch the recording. Sara Turner is Climate Program Manager at Lam Research, and Mike Halblander is Product Marketing Manager at Teradyne. Both Turner and Halblander lead the SCC’s Scope 3 Working Group.

The SEMI Startups for Sustainable Semiconductors (S3) program, now in its 4th year of inviting startups to apply, is pleased to announce the 35 startups chosen to move to the semi-finalist virtual pitch event happening July 31 and August 1. From this pool, 10-12 finalists will be chosen and invited to pitch to a live audience at SEMICON West 2025 in Phoenix, AZ, October 7-9, 2025. The committee, made up of experienced Corporate Venture Capitalists (CVCs) from the global semiconductor industry, received impressive submissions in all three categories identified for 2025:Sustainable Semiconductor ManufacturingSustainable Data CenterGen AI for Sustainable DesignLed by Applied Materials this year, the program’s strongest feature is the exposure to the CVCs, as well as the personal mentoring each semi-finalist receives. The mentoring topics are tailor made to align with the greatest need of the startup and can range from basic introduction to semiconductor manufacturing, to connecting them to funding sources. A full analysis of the program kicked off this year’s efforts. The program saw a 100% increase in applications to 145 this year and thus the pool of semifinalists expanded from 30 to 35. While geographically diverse, the semi-finalists all share their solutions for the building and use of more sustainable electronics. Are you an investor and would like to receive notice of the virtual and live pitch events around S3? Register your interest here.2025 S3 Semifinalists3D Architech, Inc.Boston, MA, USA 3D Architech develops and commercializes advanced cooling devices for AI chips using a proprietary gel-based metal 3D printing technology. Unlike conventional methods limited to 100-micron structures, our technology enables highly complex microstructures at 10-micron precision, achieving up to 60% improvement in cooling efficiency. Actasys Inc.Brooklyn, NY, USAActasys has developed a precision cooling solution designed for thermal bottlenecks in semiconductor-driven systems such as networking cards (NICs), DPUs, switches, and optical transceivers. Instead of cooling entire racks or server rooms ActaJet™ targets localized hotspots at the device level, delivering scalable, high-efficiency airflow through a compact, adaptive, and electronically controlled actuator system. AlixLabs ABLund, SwedenAlixLabs AB is developing a disruptive semiconductor manufacturing technology based on Atomic Layer Pitch Splitting (APS). It enables cost-effective and environmentally sustainable scaling of transistor architectures by doubling pattern density without requiring advanced lithography. The core product includes both the APS process and customized etching equipment that integrates into existing semiconductor fab workflows, reducing complexity, cost, and environmental impact.AllonniaBoston, MA, USAAllonnia™ Surface Active Foam Fractionation (SAFF) unit is a turnkey PFAS remediation system engineered for on-site deployment. The system employs foam fractionation to physically separate PFAS from contaminated water streams, including both long- and short-chain compounds. SAFF arrives in a standard container and requires only electrical power, influent, and effluent hookups, and is telemetry-enabled for remote monitoring and control.Alloy EnterprisesBurlington, VT, USAAlloy Enterprises develops and manufactures cold plates, manifolds, and integrated thermal solutions for liquid cooling GPUs, CPUs, and other high-performance components in data centers and semiconductor equipment. Alloy utilizes a patented Stack Forging® process to enable direct-to-chip cooling to improve thermal performance and reduce pressure drop by up to 40 times, enabling data centers to run 44°C water and reduce pumping power.AlsemySeoul, South KoreaAlsemy is building an AI-powered platform that bridges Manufacturing Execution Systems (MES) and EDA domains enabling fabless engineers to reflect manufacturing data characteristics in their chip designs, while process engineers can make data-driven decisions to optimize manufacturing processes for maximum chip performance. By connecting these traditionally siloed areas, a feedback loop is created to drive efficiency and innovation across the semiconductor value chain.Arieca IncPittsburgh, PA, USAArieca's adaptable Liquid Metal Embedded Elastomer (LMEE) technology, which blends liquid metal and polymer, delivers both thermal performance and mechanical reliability. LMEEs are a cost-effective, dispensable emulsion that is compatible with existing high volume manufacturing tools and allows for low pressure spreading and excellent wetting. Atomos 3DWest Lafayette, IN, USAAtomos 3D offers low temperature transistor technology for monolithic 3D chip integrationCoflux Purification, IncHouston, TX, USACoflux Purification is developing a modular, point-of-use reactor system that both captures and destroys PFAS in semiconductor wastewater using our patent-pending Covalent Organic Frameworks (COFs). These materials serve as photocatalytic adsorbents, combining high surface area, tunable porosity, and chemical stability to enable efficient PFAS adsorption and UV-driven degradation within a compact, modular system ensuring smooth operational deployment. CoolSem TechnologiesEindhoven, The NetherlandsCoolSem is developing a breakthrough thermal management technology for semiconductor devices. The Wafer Level Thermal Interface Stack (WLTIS) enables 1) up to 15x better thermal management; 2) 25-55°C lower chip temperatures; 3) 2-4° increase in device performance, reliability, and lifespan; and 4) up to 30-50% reduction in cooling energy needs. CoolSem help handle the exploding demand for AI training and inference without proportional increases in power usage or carbon footprint.CuspAICambridge, UKCuspAI is building an engine that combines Gen AI models, virtual twins, and active learning pipelines for simulation to develop sustainable materials solutions that address critical environmental challenges, including, environmentally-friendly etching reagents, specialized sorbents for emissions capture, and novel catalysts for manufacturing waste remediation. The engine has already proven successful in designing metal-organic frameworks (MOFs) for carbon capture and PFAS removal from water.FlexiramicsEnshede, The NetherlandsFlexiramics® is a flexible, 100% ceramic fiber material engineered as a drop-in replacement for PCB substrates. It dramatically improves heat dissipation and signal integrity in high-performance electronics, enabling faster, cooler, and more reliable semiconductor systems.FluorityxWatertown, MA, USAFluorityx is commercializing a portable low-cost polymer sensor for PFAS. This fast and efficient system will be able to measure low concentrations of PFAS and replace expensive equipment and does not require highly trained staff to operate and maintain the equipment.Forever AnalyticalSouth Bend, IN, USAForever Analytical is developing a field-deployable sensor capable of providing real-time total fluorine (TF) mass-balance information. The company is also developing a mass-spectroscopy based solution that can be coupled with the sensor to provide information on the specific PFAS molecules present in the waste stream and can be adapted to measure other contamination of interest, such as heavy metals, lead, and copper.Gallox Semiconductors Inc.Ithaca, NY, USAGallox Semiconductors is dedicated to commercializing beta-gallium oxide (Ga2O3)-based transistors and diodes. Our patented device topologies take advantage of Ga2O3's large bandgap (~4.8 eV), which enables lower conduction losses and higher voltage handling compared to SiC. Higher voltage operation means greater power densities and system-level efficiency, effectively generating less waste heat and reducing both energy loss and cooling burdens.IC Recovery, a Division of Greene Lyon Group, Inc.Beverly, MA, USAIC Recovery's multi-patented CHIP-RENEW® technology uses a proprietary process to apply a unique thermal fluid to the surface of PCBs until the solder alloy attaching chips and other components to the board substrate reaches temperature liquidus. At that point, we can selectively recover functionally valuable chips for renewal and reuse, and/or harvest all other chips and components on the board in order to concentrate their content for subsequent, sustainable refining.icspiKitchener, ON, CanadaIcspi has created a complete atomic force microscope (AFM) scan head on a 1 mm x 1 mm chip - 1 million times smaller than traditional AFMs and the future of nanoscale semiconductor metrology and inspection powered by arrays of thousands of micro-AFM devices. The technology boosts wafer coverage and speeds time-to-yield and reduces scrap. Kelvin Cooling Inc.Berkeley, CA, USAKelvin Cooling introduces high-efficiency nano-film evaporation cooling technology - enhancing thermal management by increasing heat transfer efficiency while reducing power consumption. This thin-film evaporation system enables direct-to-chip cooling, in a compact, scalable, and energy-efficient platform.LinqueMunich, GermanyLinque provides an integrated photonic switch (IPS) enabling AI-capable network nodes with reconfigurable all-optical routing for high data-rate channels with ultra-low latencies suitable for scale-out and scale-up layers of data center networks.Makr MicrosystemsBangalore, IndiaMakr Microsystems has developed a novel approach to AcousticAtomic Force Microscope (AFM) that uses common AFM instrumentation and simplifies interpretation, with a modified probe geometry that enables both acoustic transduction and sensing. We have demonstrated nanometer scale imaging from samples with shallow and deep subsurface structures.MatnexLondon, UKMatnex platform uses AI to rapidly scan the periodic table, allows input of objectives (functional electronic, optical, or mechanical properties) and constraints (element exclusions, intrinsic price, emission limits, etc.), and then searches a proprietary database to identify suitable stable candidates and their production methods. This provides fit-for-purpose materials that reduce environmental impact, improve the bottom line, and open new markets with technological breakthroughs.Mixx Technologies, Inc.San Jose, CA, USAMixx Technologies is a deep-tech startup building next-generation optical interconnect solutions to deliver non-blocking, energy-efficient data movement. The advanced 3DS platform enables petabit level end-to-end connectivity for AI workloads resulting in sustainable, efficient, and cost-effective scaling. The 3DS platform comprised of the engine, package and system, enables seamless deployment of the optical IO chiplet.Nano Performance Technologies Ltd.Coquitlam, BC, CanadaNano Performance Technologies (NPT) is developing next-generation nanomaterials, specifically, Tellurene and Bismuthene (2D materials) and ultra-pure gold nanoparticle, for use in semiconductors, quantum computing, and advanced biosensing. The innovation is the scalable production and commercialization of these materials. The platform combines IP from Purdue University with in-house lab capabilities, enabling a supply of application-ready nanomaterials to R D and manufacturing partners.NextGO EpiBerlin, GermanyNextGo Epi delivers high-quality and large-scale Gallium Oxide epiwafer for high-voltage (up to 10kV-level) applications that are durable in high-temperature operations and environments with high radiation levels.NextoarBangalore, IndiaNextoar is a deeptech AI startup, focused on using AI to train the frontline fab technicians, equipment engineers, maintenance engineers, test engineers, service engineers, etc., and others closest to the action. The system will make them part of the innovation engine by, augmenting frontline workers, amplifying their business impact and creating continuously innovating organizations.PhysicsXNew York, NY, USAThe PhysicsX platform is an AI-driven simulation software stack designed to speed up traditional numerical simulations, optimizes components within defined constraints, and generate innovative geometries using generative Large Geometry Models (LGMs). The technology seamlessly integrates into enterprise engineering workflows, driving tangible improvements in product design, manufacturing, and operations and has several successful implementations in the electronics ecosystem.Point2 TechnologySan Jose, CA, USAPoint2 designs and manufactures mixed-signal interconnect SoCs for terabit data transmission, to overcome the barriers of copper and optical cabling to accelerate AI interconnect in GPU cluster scale-up. e-Tube technology uses an RF Transmitter SoC to convert data from the electrical to the RF domain for transmission over plastic waveguides, with the RF Receiver SoC converting the data from the RF domain back to the electrical domain.PROUDLausanne, SwitzerlandPROUD's patented diamond-layer technology with the highest heat dissipation capacity ( 1000 W/m.K) of any existing material, deposited on chips, allows a direct upgrade in heat extraction, power output and efficiency.Scrona AGZurich, AustriaScrona has developed a scalable multi-nozzle electrohydrodynamic (EHD) inkjet printhead for additive microfabrication in semiconductor and electronics manufacturing. This MEMS-based 128-nozzle printhead enables sub-10 nm resolution, ultra-low material use, and wide material compatibility, including metals, dielectrics, and polymers. It replaces wasteful lithography and etching with direct-write precision printing, significantly reducing energy, water, and chemical consumption in an automation-ready format.SKYRE, Inc.East Hartford, MA, USASKYRE develops and manufactures products for on-site purification and pressurization of process hydrogen and makes it available for reuse at the fab facility. The hardware is highly reliable with low maintenance costs with equal or better quality and lower cost than merchant hydrogen or onsite hydrogen generation.SyentaSydney, AustraliaSyenta has developed LEM - Localized Electrochemical Modelling - a process for depositing metal patterns using a local electrochemical process. The pattern is created on a stamp, which then prints the pattern on the substrate in an additive process.Terecircuits CorporationMountain View, CA, USATerecircuits develops advanced material solutions for heterogeneous assembly of small, fragile, and thinned components, Chiplets, sensors, power devices, and passives. The process is ideal for achieving scale with reduced waste; while meeting critical assembly challenges such as 3D assembly, silicon carbide die attach, flexible circuits, and optics. Vertical HorizonsCambridge, MA, USAVertical Horizons is a fabless semiconductor company commercializing vertical gallium nitride (GaN) power transistors to revolutionize energy efficiency. Vertical GaN reduces energy losses by up to 30% and doubles power density, enabling a 50% reduction in system footprint. This innovation tackles the urgent need for a new generation of power infrastructure designed to scale AI, and high-density and high-power applications.Vionano Innovations IncSt. Paul, MN, USAVioNano Innovations is building a patterning platform to enable advanced feature scaling using self-assembling polymer brush materials. The system enables polymers over 193 nm DUV lithography patterns to double feature density without requiring ALD/CVD or etch steps. The result is a low-energy, high-resolution process for sub-20 nm features using existing infrastructure.XLYNX MaterialsVictoria, BC, CanadaXLYNX designs and manufactures a revolutionary family of polymer crosslinkers. These reagents are uniquely able to cure virtually ANY aliphatic polymer, by harnessing high-yielding insertions to carbon-hydrogen bonds. Curing can be triggered thermally (at temperatures as low as 80°C) or photochemically (using either UV or blue light). Heidi Hoffman is Senior Director, Marketing Sustainability at SEMI.

As artificial intelligence (AI) proliferates rapidly, AI models and datasets are also growing rapidly in size. This growth far outpaces performance improvement in hardware systems, and is increasing AI’s energy consumption unsustainably. To address these challenges and explore collaborative solutions, SEMI’s Smart Data-AI Initiative - as part of its Future of Computing focus - recently hosted a day-long workshop on Sustainable AI Systems that brought together domain experts from the entire AI ecosystem. Speakers included industry leaders Applied Materials, AMD, Arm, ASE, Google DeepMind, IBM, Intel, Lam Research, McKinsey, Micron, NVIDIA, Qualcomm, SK hynix; exciting start-ups Cerebras, LightMatter, Mentium Technologies and Mueon; and leading-edge academic institutions, Stanford University and University of California, Davis Irvine. The keynotes, panels and spirited audience discussions covered novel devices, materials, advanced packaging, chiplets, photonics and architectures algorithms for data centers, cloud edge. This article synthesizes high-level insights from the workshop.The AI ImperativeThe day started with a basic question – why is AI essential to continued progress and prosperity? The answer lies partly in shifting global demographics, with the population aging in most developed economies. At the turn of the century, there were ~6 people in the workforce supporting each retiree, but projections indicate there will be only 2 active workers per retiree by 2050. In parallel, productivity growth rates have fallen to half of what is required. AI can help bridge this gap, if we can ensure continued progress of AI in a responsible and sustainable manner.The Energy WallA formidable roadblock to continued progress of AI is its rising energy demands. For example, the energy used by some large language models (LLMs) to run just one training cycle could be used to power thousands of homes. The switch to transformer models has increased AI-driven computing demand by a factor of 50 million over 5 years, and by some projections, this demand will consume half the world's generation capacity by 2050. This is clearly not sustainable! All players in the ecosystem are deeply committed to reducing AI’s energy consumption, and the industry has already decreased the energy used per token of computing by a factor of 100K in the past 10 years. However, the rapid growth of AI outpaces this, highlighting the huge challenge ahead.The System StackThis workshop was developed with the hypothesis that innovation is required across all segments, and an important first step is to initiate a dialog. Our highly distinguished speakers covered the entire solution stack, and while it is impossible to capture the ocean of insights that they shared, the following provides a flavor.Materials DevicesMaterials and devices used to build semiconductor chips form the foundation of the stack for all computing systems. Silicon substrates with copper interconnects remain industry’s mainstay, but are being augmented by innovative ideas. As device dimensions continue to shrink, novel 2D materials such as MoSe2, WSe2, ZrSe2 and NbP are being researched. While Si mobility degrades with decreasing film thickness, 2D materials maintain high electron mobility in thin-film substrates. These can be stacked to build 3D systems with lower power consumption than traditional planar structures. In parallel, novel device technologies such as gate-all-around (GAA) can provide power savings up to 25%.These novel materials and devices are complex, and require almost magical wizardry to build. For example, they may require depositing a stack of multiple defect-free films that are only a single (or few) atomic layer(s) thick, or etching a steep well that is one hundred times as deep as it is wide. It is an incredible accomplishment of the semiconductor industry to build these devices and chips successfully, but it is getting harder and more expensive. Consequently, AI is now being used as a tool to help with this ever-growing fabrication complexity of semiconductor R D and manufacturing. This is a synergistic virtuous cycle, where AI algorithms enabled by chips are used in turn to help with chip fabrication.System IntegrationThe next layer of the stack is the integration of individual devices into a system. Advanced packaging techniques, such as silicon or glass interposers (2.5D) for interconnecting chips, can reduce the communication distance and power consumption. These are often deployed for high-performance computing systems running AI algorithms. Beyond this, the industry is actively exploring 3D systems that are even more compact, both as multi-die 3D packages and as monolithic 3D chips.The concept of chiplets – smaller chips with specialized functions that can be assembled flexibly to optimize system performance – holds much promise. Industry consortia are developing protocols such as Universal Chiplet Interconnect ExpressTM (UCIeTM) to enable seamless integration of chiplets both in the planar and vertical dimensions. These advanced techniques pack more functional elements into increasingly compact form factors, but this proximity makes power delivery challenging and often generates intense heat. Much work is needed to ensure optimal power delivery and adequate thermal dissipation.Looking beyond traditional electronics, photonics represents an exciting opportunity. Most long-distance data communication is on fiber-optic cables and thus already photonic – bringing this to shorter distances can save energy while increasing bandwidth and performance. This requires efficient photonic-electronic integration at the packaging or even chip level, which is a major challenge requiring cross-disciplinary collaboration.Architectures and AlgorithmsAI algorithms need enormous amounts of data processing compared to traditional computing workloads. This requirement stretches (or breaks) the limits of traditional Von Neumann architecture, which requires frequent data movement between memory and processor elements for each computation cycle. Much of current architecture innovation focuses on bringing processor and memory elements closer to each other. System integration is already driving “compute-near-memory” architectures like high bandwidth memory (HBM). Other forward-looking implementations combine them into a single chip, known as compute-in-memory (CIM). Memory elements being explored for this purpose include resistive RAM (RRAM), phase-change memory (PCM), ferroelectric RAM (FeRAM) and magnetic RAM (MRAM). However, there is no one “perfect” memory – each has pros and cons in terms of latency, capacity, bandwidth, power consumed per operation, manufacturability, etc. Other researchers are also exploring devices like memristors for analog computing, which can improve energy efficiency for certain workloads.Finally, hardware-software co-optimization is crucial. Algorithms mismatched with the underlying system are energy expensive; conversely, co-optimized systems are highly efficient. While conceptually obvious, this is difficult in practice because development cycles are quite different – software algorithms can transform in a few months, while new hardware often takes years to develop. While some strategies can be used for mitigation – such as designing in redundancy/flexibility or making the hardware application-specific – much work remains to solve this conundrum.Pre-competitive Collaboration to Find SolutionsAll speakers emphasized that pre-competitive collaboration across the entire stack is critical, as these challenges are formidable and cannot be solved by one entity or in isolated silos. SEMI is a global and neutral organization with over 3,000 member companies, and is well-positioned to provide a pre-competitive collaboration platform to connect the dots across silos. In fact, SEMI’s mantra is “Connect, Collaborate, Innovate” – reinforcing its commitment to advancing the entire industry. For this purpose, SEMI’s Smart Data-AI Initiative continues to drive robust discussions on this topic – next there will be a roundtable discussion during SEMICON Southeast Asia, May 20-22 in Singapore, followed by a focused technology session at SEMICON West 2025, October 7-9 in Phoenix, Arizona. The overall objective is to move from “talking-the-talk” to “walking-the-walk,” towards creating system-level solutions for energy-efficient AI computing. Specifically, we want to identify the pre-competitive actions that could synergize individual innovations and make the whole greater than the sum of parts. Some ideas include collaborative proof-of-concept projects, industry standards and independent benchmarking. Come join us on this journey and connect with us at [email protected]. Dr. Pushkar P. Apte is the Strategic Technology Advisor and leads the Smart Data-AI Initiative at SEMI.

Industry growth has consequences.Rapid growth for semiconductor companies has meant increasing amounts of spent materials and chemicals. As expected, these have enlarged environmental impacts, disposal costs, and liability. Semiconductor companies confront challenges that not every sector faces: larger company size, higher value added per unit of production, and higher technological capacity are not always related to lower quantities of waste per unit of production.Collective action is needed to turn this challenge into business resilience. SEMI, imec, and our SEMI Circularity Working Group community are sharpening our cooperation to meet the need.MOVING FROM LINEAR TO CIRCULARSemiconductor value chain companies are making strides to pivot from a linear economy (take, make, waste) to a circular economy (maintain, reuse, refurbish, remanufacture, recycle). Early strategies were anchored primarily to waste management, waste-to-energy, waste diversion, and recycling programs. Lately companies are expanding to novel raw materials strategies, waste repurposing methods, and improvement of remanufacturing through resale at new-product-like performance and quality. This is a real opportunity for companies because using spent chemicals as a feedstock can cut costs, bolster supply chain management, reduce greenhouse gas emissions, create opportunities for brands, and bolster social license to operate. Yet most breakthroughs in circular practices are happening in relative isolation across the value chain. Until now, there is no widely recognized system for identifying and ranking materials used in manufacturing to prioritize where conversion from linear to circular use would provide the most gains. A FRAMEWORK FOR PRIORITIZATIONA 2025 report – produced through collaboration between SEMI and imec – presents an inventory of 69 distinct materials prioritized for circularity along with the framework for ranking. It also shares the method to support calibration to fit specific use cases. The outputs will be immediately useful for decision-makers across functions in the semiconductor value chain, including, but not limited to:ProcurementSustainabilityEHS (environment, health, and safety), andRisk management. These professionals now have a cross-industry reference for driving impactful circular initiatives at their firms.Download the reportCATALYZING RESEARCH DEVELOPMENT, VALIDATION, AND ADOPTIONIn conjunction with the publication, SEMI and imec are launching the Circular Semiconductors Research Network, a platform to connect research teams with industry adopters to accelerate validation and deployment of circular technologies and methods. Ideal collaborators can substantiate Technology Readiness Level (TRL) 4 or greater and seek industry validation, adoption, and acceleration of circularity solution deployment aimed to purify, reuse, and/or resell spent materials and by-products – either onsite or offsite at a permitted facility under the conditions set out in our invitation.Research teams with relevant subject matter expertise are welcome to submit proposals for research in exploratory phases (lower TRLs) for review by SEMI members. Preference will be given to research teams that address practical hurdles faced by semiconductor value chain companies as they navigate regulatory frameworks for onsite vs. offsite treatments.The call for collaboration seeks to amplify research and development of technologies that comply with applicable regulations and meet one of the following conditions: (1) the owner/operator does not need to obtain a waste permit, or (2) the technology needs to be put offsite at a permitted waste facility. View the Invitation – Applications due May 30, 2025THE BIGGER PICTUREThe publication and launch of the Circular Semiconductors Research Network is a response to growing attention from business leaders and policymakers on critical materials in semiconductor manufacturing. Supply chain security for these materials has become a strategic issue for governments and the private sector, not only because it could affect the pace of the energy transition but also because materials sourcing has become contested among geopolitical rivalries and alliances. The network will provide momentum for industry and research to prioritize the development and adoption of circular methods for materials that would generate the most strategic, economic, and environmental gain in the semiconductor value chain. It will do so in dialogue with the SEMI Circularity Working Group, a venue for collective action among SEMI members that works closely with other trade association initiatives such as the SEMI Supply Chain Management Initiative, which is focused on resilience, agility, and responsibility, and the SEMI Accelerating Sustainability with Smart Manufacturing Task Force, which develops an industry technology roadmap. For more information, write to the Circular Semiconductors Research Network at [email protected]. SEMI members are invited to join the Circularity Working Group meeting monthly. If interested, contact Jordan Famularo at [email protected]. Jordan Famularo, PhD, is Program Manager – Sustainability at SEMI.

The world is abuzz with the new opportunities being created by artificial intelligence (AI), enabled by availability of unprecedented amounts of data. AI runs on the semiconductor engine, and in turn, creates a rising demand for semiconductor chips. The semiconductor industry is predicted to reach $1 trillion in revenue by 2030 by McKinsey Co., in large part due to the market demand for AI and data. There are, however, formidable challenges to overcome for this virtuous cycle to continue. The SEMI Smart Data-AI Initiative, together with the SEMI Future of Computing Think Tank, is working to help the industry address these challenges. This article paints the big picture and lays the groundwork for an in-person workshop on March 19, 2025, in Silicon Valley, where pre-competitive and collaborative solutions will be explored.“To unlock the full potential of AI, innovation is required across the technology stack – from the models and software to datacenter architecture, chip design and how those chips are made. Advancements in foundational semiconductor technologies will have a dramatic impact on system-level energy and cost reduction in the AI datacenter.” – Gary Dickerson, President and CEO of Applied MaterialsThe Performance ChallengeInvestment in AI system infrastructure is rising at a dizzying pace, with hundreds of billions of dollars being committed by individual companies as well as public-private partnerships around the world. AI models built on larger data sets generally deliver better results, so model sizes are growing exponentially each year, with leading-edge models requiring billions and even trillions of parameters. This is especially true with the rapid growth of the Large Language Models (LLMs) used for Generative AI. Can the foundational semiconductor technology keep up? Even if semiconductor chips were following the famous Moore’s Law, performance would only double every 2 years. The real pace of performance improvement is even slower, as leading-edge technologies are reaching physical limits of materials – with the tiniest patterned dimensions on chips now approaching the fundamental atomic separation distance. While semiconductor designers and process technologists continue to innovate with new materials, devices, 3-dimensional stacking and so forth, there remains a formidable challenge for silicon chips and hardware systems to keep up with the growth rate of AI models and data sets. The Energy ChallengeProcessing ever-larger data sets and AI models also requires increasing energy. A recent report by the US Department of Energy indicates that data center energy consumption tripled over the past decade and may triple again in just 5 years! Other analyses show that a single data center powered by 20,000 GPUs can consume almost 40,000 KW, which is enough to power 31,000 homes in the US! Consequently, it is challenging for data centers to meet their power needs through public utilities, and several hyper scalers are investing in nuclear power. This acceleration in AI energy demand is further exacerbated because silicon technology evolution no longer follows power scaling with “Dennard’s Law,” which states that power density remains constant as technology scales to tinier dimensions. In fact, energy consumption of silicon devices has been increasing with technology scaling for the last decade. These combined factors give rise to the second formidable challenge – energy consumption is rising unsustainably for AI systems.Exploring SolutionsAddressing these challenges requires innovation from algorithms and architecture to foundational silicon technologies. The following are illustrative examples (not comprehensive) spanning the entire AI system stack.At the software and algorithm level, innovators are finding ways to reduce model size and to use hardware more efficiently. For example, IBM’s Granite models are smaller in size, with less than a billion parameters. Similarly, Google's Gemma platform offers small language models (SLMs). The recent market disruption from the publication of the DeepSeek reasoning model suggests that relatively smaller domain-specific reasoning models may offer significant efficiencies. At the architectural level, multiple paths are being explored. Special-purpose (or domain-specific) processing elements can deliver improved performance at equal or lower power for specific tasks. Examples include Cerebras’ wafer-scale designs with optimized AI accelerators and Mueon’s system-scale integration solutions. Another innovation path focuses on bringing computing closer to the memory elements, where the data resides. This addresses the major bottleneck between processors and memory in the traditional Von Neumann architecture, which has been the mainstay of the industry since inception. In-memory or near-memory computing, such as memory-focused architectures from Micron or processor-in-memory (PIM) solutions from SK hynix, offer higher performance with lower energy consumption for certain workloads. In parallel, leading CPU and GPU makers like AMD, Intel, and NVIDIA continue to innovate with power-efficient solutions. And “Edge Intelligence” innovations – for example, internet-of-things (IoT) solutions from Arm and Qualcomm – help reduce the processing and power load on data centers by executing more operations on edge devices.Critical enabling technologies also contribute significantly. Advanced packaging, for example ASE’s heterogeneous integration solutions, enable efficient, high-performance computing by integrating multiple diverse components optimally. Another emerging development is the advent of “chiplets,” which split the chip into smaller parts, and enable special-purpose accelerator building blocks to be assembled with more general processor, memory, and interconnect elements. A well-developed chiplet ecosystem could provide silicon designers with more degrees of freedom to design optimized systems. Looking beyond electronics, the integration of photonics can enable low-power, high-bandwidth connectivity – for example, LightMatter’s silicon photonics interconnects and Ciena’s data center interconnects.Materials and devices form the foundation of the technology stack. Example technology innovations include Stanford University-led N3XT, a 3D solution that integrates multiple novel devices and materials including resistive and spin-torque transfer RAMs, carbon nanotubes and 2D materials. Similarly, a University of California-led effort synthesizes low-dimensional nanostructures, sensors, detectors and photonics in an integrated solution. Finally, advanced and innovative processes and equipment are being developed – for example, by Applied Materials and Lam Research – to fabricate these novel materials and devices.All these individual innovations are amazing and necessary, but are they sufficient? What if we could collaborate across the entire system and co-optimize hardware and software innovations synergistically? Could the integrated whole be greater than the sum of parts? What efficiencies could we unleash? And what business opportunities would this unlock?The SEMI Future of Computing workshop on March 19, 2025, seeks to answer these questions by uniting AI innovation leaders from industry, academia and start-ups, including most of the companies and universities mentioned in this article. We will begin building pre-competitive collaboration that breaks through silos and explores system-level solutions – with the ultimate objective of radically improving the energy-efficiency of computing for AI.Pushkar Apte is the Strategic Technology Advisor and leads the Smart Data-AI Initiative at SEMI.Jim Sexton is a Fellow at IBM.Melissa Grupen-Shemansky is CTO and VP of Technology Communities at SEMI.

The SEMI Startups for Sustainable Semiconductors Program – or S3 – connects promising climate technology startups with many of the industry’s largest Corporate Venture Capital (CVC) firms. For startups interested in applying their solutions to improving sustainable practices within the semiconductor industry, the call for applications is open until May 1. After applications have been submitted, finalists will pitch their solutions to an audience at this year’s SEMICON West, taking place from October 7-9 in Phoenix, Arizona. Solutions of Interest – 2025 S3 Categories Each year, sponsors choose priority categories for sustainability-related solutions. This year’s categories include: Sustainable and efficient solutions for data centers, including thermal management, power management, and systems and componentsGenerative AI, software, and other AI solutions for alternative materials discovery, device and physics simulation, energy-efficient chip design, and end-to-end sustainable product designMore sustainable solutions for energy and materials, including new process designs for lower energy intensity, energy tracking and management software, emissions control and abatement, water solutions, PFAS destruction, and recycling solutionsAll startups that address any of these areas are encouraged to apply. Why Apply for S3?Startups that apply for S3 can benefit from the following. Mentorship from industry experts on how to break into the semiconductor industry, even if your startup had never previously considered the semiconductor market for its products or servicesProof of concept (POC) and pilot partnership opportunitiesExposure to major semiconductor industry leadersPotential investments from both CVCs and venture capitalists (VCs) throughout the program and final pitch eventAdditional public relations opportunities as a result of the programS3 Performance ReportTo help prepare for the 2025 competition, the S3 team conducted a review of the application process to develop a report card of key performance indicators. After assessing three years’ worth of data from over 150 startup teams, notable takeaways from the report are as follows. The S3 program provides startups with a 4.1% chance of securing a scaled customer. To date, S3 has enabled eight direct VC investments, 34 first-of-their-kind proof of concepts, and seven sustainability innovations that have scaled into initial production.One in three startups reviewed by internal subject matter experts moves into a POCOne in five startups that secure a POC move into a scaled deploymentOne in two startups that move into scaled deployment receive direct investment from the CVC arm of the companyApproximately one in 30 startups are successful at a first-scaled deployment with a semiconductor customerBy providing footholds into the semiconductor ecosystem through mentoring and customer introductions, S3 offers the opportunity for startups to strategically solve pressing, real-world technological challenges. Forward Statements To achieve a more sustainable semiconductor industry, we must move faster. The longer humanity takes to resolve unsustainable practices, the more expensive solutions will become. Through collaboration and competition, we can advance development on a larger, more efficient scale. To learn more, download the full report. John Wei joined Applied Ventures in 2020. He focuses on a range of deep tech areas and industry verticals, including advanced materials, display, and Industry 4.0 technologies. He also manages Applied Ventures’ investment activities in the Greater China region.Prior to joining Applied Ventures, Wei was a key member of the SABIC Ventures investment team, where he led multiple investments in advanced materials, display, energy sustainability, and manufacturing space in North America, Europe, and China. Earlier in his career, Wei held various commercial and technical roles at The Linde Group and General Electric with domain expertise in the petrochemical, power generation, alternative energy and oil gas industries.

The sensor revolution is shaping the future of connectivity, with innovation in MEMS and imaging technologies paving the way for a smarter and more integrated world.As the world becomes increasingly interconnected, MEMS and imaging sensor technologies are driving transformative changes across industries, shaping the future of connectivity, intelligence, and sustainability. Powered by advances in miniaturization, AI integration, and sustainable design, MEMS and imaging technologies are enabling groundbreaking applications—from autonomous vehicles to wearable health devices—while addressing urgent global challenges like climate change and energy efficiency. At the MEMS Imaging Sensors Summit 2024, Laith Altimime, President of SEMI Europe, emphasized the pivotal role of MEMS and imaging technologies. Setting the stage for discussions on technological breakthroughs and market trends, Altimime remarked, “Sensors are at the heart of the next wave of innovation, enabling unprecedented levels of intelligence that are transforming industries and fostering a smarter, more sustainable, and seamlessly connected future.”Laith Altimime, President, SEMI EuropeStefan Finkbeiner, CEO of Bosch Sensortec, underscored in his opening keynote how advanced sensor technologies are enabling life-changing use cases. “Sensors are all around us, though we don’t always notice them,” emphasizing sensors’ ubiquitous role in smartphones, wearables, and hearables. Finkbeiner highlighted miniaturization as a key challenge, noting that even as sensors continue to shrink, they are increasingly integrated with edge AI to enable efficient, local decision-making.Stefan Finkbeiner, CEO, Bosch SensortecSimone Ferri, APMS Group Vice-President and MEMS Sub-Group General Manager at STMicroelectronics, highlighted the pivotal role of sensors as a bridge between the physical and digital world, noting “the most sophisticated machine is the human – so it is best to emulate human capabilities to enable the next generation of devices to accurately measure the parameters of your body.” Ferri stressed the importance of sustainability, advocating for smart, transformative, and precise sensors that provide meaningful data with optimal efficiency. By aligning technological innovation with environmental responsibility, Simone Ferri demonstrated how sensorization can enhance lives while enabling a net-zero transition across industries.Simone Ferri, APMS Group Vice-President and MEMS Sub-Group General Manager, STMicroelectronicsMEMS Growth Fueled by Piezo Materials and ElectrificationJean-Christophe Eloy, CEO and President of Yole Group, grounded the discussion in market data, forecasting a 5% CAGR for the MEMS market, which is set to exceed $20 billion by 2029. He highlighted key trends such as the increasing sophistication of automotive sensors—more cameras, higher resolution—and the impact of electrification. On the technology front, Eloy noted a “strong shift towards piezoelectric (piezo) MEMS,” driven by advancement in new materials like Lead Zirconate Titanate (PZT), Aluminum Nitride (AIN), and Scandium-doped Aluminum Nitride (ScAIN).Jean-Christophe Eloy, CEO and President, Yole GroupAlissa Fitzgerald, CEO of A.M. Fitzgerald Associates explored the expanding roles of MEMS technology in new domains, such as fiber optics for data centers. “Photonics is in the news,” she remarked, highlighting its potential to deliver 40% power savings compared to copper technologies. “MEMS manufacturing is set to evolve by 2030 and beyond,” said Fitzgerald, emphasizing the continued innovation in traditional wafer-based processes through the adoption of advanced thin-film materials like piezoelectrics and GaN. Furthermore, Fitzgerald discussed emerging manufacturing techniques such as 3D-printed MEMS and biodegradable materials to enable low-cost, sustainable sensors.Alissa Fitzgerald, CEO of A.M. Fitzgerald AssociatesAdding to the conversation on manufacturing, Jessica Gomez, CEO of Rogue Valley Microdevices, shared her perspective on how 300mm-capable MEMS foundries could “change the game,” improving production efficiency and lowering costs. Gomez also outlined the unique challenges of MEMS manufacturing, including the need for custom processes and the high-mix, low-volume nature of production.Advancing Smart Mobility Through Interoperable NetworksSmart mobility gained significant traction as Patrice Ancel, In-Vehicle Technologies Leader at BMW, tackled the intricacies of in-vehicle networking. Ancel shed light on the complexities of today’s vehicles, which contain 20,000 components and over 100 electronic control units (ECUs) from multiple suppliers. His message was clear: “Interoperability is key for us; without interoperability, none of this will happen.” Ancel’s call for collaboration resonated throughout the summit, highlighting the critical role of teamwork in driving innovation and progress within the automotive industry.Patrice Ancel, In-Vehicle Technologies Leader, BMWA Vision for the Future: Sustainability, Collaboration, and InnovationThe MEMS Imaging Sensors Summit demonstrated how collaboration, sustainability, and innovation are driving the sensor industry forward. From addressing market trends to tackling manufacturing challenges, the discussions revealed a shared commitment to creating a smarter, more connected world.On behalf of SEMI, the SEMI Europe team would like to thank the industry leaders whose expertise and enthusiasm made this summit a resounding success. SEMI ContactAna Bernardo, Manager of Technology ProgramsEmail: [email protected] Mobile: +49 175 4129 764Sitong He, Communications Manager Email: [email protected]: +49 151 5546 2638

With increasing demand for personalized smart devices, the MEMS and sensor market is undergoing rapid transformation. MEMS sensors are the backbone of smart wearable devices, seamlessly integrating multiple functions to monitor and simplify our day-to-day activities. As applications in healthcare, environmental tracking, and AR/VR expand, the need for ultra-compact, energy-efficient, and intelligent sensors is more critical than ever.In an exclusive conversation with SEMI, Stefan Finkbeiner, CEO of Bosch Sensortec, shared his perspective on the dynamic landscape of MEMS sensor technology. From Bosch’s evolution to a solutions provider with a focus on sustainability and market-driven innovations, Finkbeiner offered a deep dive into how Bosch Sensortec is positioning itself at the forefront of the industry. “We have to think in terms of the end application and determine what the right hardware and software configuration should be in order to provide solutions with the greatest benefit and flexibility.”Further insights into the future of MEMS and sensor technology will be shared by Finkbeiner during his keynote at the SEMI MEMS Imaging Sensors Summit on November 14, 2024, in Munich, Germany. Registration is still open.SEMI: Welcome, Stefan, and thank you for sharing your insights on advanced sensor technologies. Let’s start with a personal question: What motivates and inspires you about working in sensor technology?Finkbeiner: Sensor technology is very diverse and has significant impacts on consumers. We take pride in prioritizing consumers’ needs and benefits. True to the Bosch motto, “Invented for life,” we are committed to making life better, easier and healthier. This is demonstrated in our sensing solutions, which provide valuable data for fitness tracking in smartwatches, enhance the audio experience in hearables, and enable real-time monitoring of air quality to help individuals make informed decisions for a healthier environment. I am fascinated by technology advancements that are enabling the scaling of sensors—and the processing power and intelligence packed into these increasingly compact devices. For instance, our latest acceleration sensors for hearables are the smallest in the world and are nearly invisible at just 1.2 x 0.8 x 0.55 mm³.We leverage innovative wafer level chip scale packaging (WLCSP) to achieve this reduced form factor. These compact, feature-rich, high-performance accelerometers are easier to integrate in the latest generation consumer products where size and functionality are critical requirements.SEMI: How has Bosch Sensortec’s approach evolved over the years and what is the company’s primary focus today? Finkbeiner: We began our success story a few years ago as a hardware supplier, with one of our first applications being the 'Portrait-Landscape' function in smartphones. Over time, we’ve evolved into one of the leading providers of MEMS sensors.Today, we no longer see ourselves purely as a sensor manufacturer, but as a technology solutions provider. Our focus has shifted to think in terms of the end application and determine what the right hardware and software configuration should be to provide solutions with the greatest benefit and flexibility.Achieving this requires significant software and artificial intelligence (AI) development. In essence, we are optimizing software through self-learning models. Hardware remains essential for optimizing power consumption, with most sensors integrating a controller alongside the ASIC to enable seamless software integration.This unique software and hardware configuration unlocks exciting possibilities and broadens our market reach. We see significant growth in head-mounted devices, and we are actively working on related acoustics solutions.SEMI: Looking ahead, what trends do you anticipate will have the most significant impact on the MEMS sensors market?Finkbeiner: We see several trends that will significantly impact the MEMS sensor market. First, there is growing demand for personal health monitoring in consumer and mobile electronics. Wearable devices, in particular, are becoming essential tools for individuals to track their health and fitness status. This trend requires MEMS sensors to become even more accurate, with solutions that include sophisticated software algorithms to ensure reliability, accuracy, and reproducibility. As a result, AI and machine learning (ML) technologies will play a crucial role in enhancing sensor performance.A second important trend is the continued miniaturization of MEMS sensors. To meet customer demands, sensors must integrate more functionality, including edge-processing capabilities. For example, what once may have been a simple accelerometer with a step-counting algorithm is now evolving into a 6-axis Inertial Measurement Unit (IMU) with an integrated microcontroller and advanced AI/ML software. A great example of this is in True Wireless Stereo (TWS) earphones, where the IMU not only tracks steps but also enables complex tasks like dead reckoning and supports 3D audio—all within the tight constraints of a small TWS earbud housing. Low power consumption, as always, is a critical factor for these mobile devices to meet CE (Conformité Européenne) standards.Finally, we believe that smart glasses, augmented reality (AR) and virtual reality (VR) devices are poised to become the “next big thing.” These devices require advanced image projection optics that offer excellent optical quality, low weight, and ease of use to ensure consumer adoption. We believe our MEMS-based LBS (Laser Beam Scanning) solution is ideal for these applications. Additionally, the successful adoption of smart glasses hinges on high-performance MEMS sensors that are compact, accurate, and power-efficient—critical requirements for all-day wearability and functionality.These trends underscore the need for MEMS technology to evolve, integrating greater functionality, precision, and efficiency to meet the demands of next-generation consumer devices.SEMI: What are some of the biggest challenges facing the MEMS sensors industry today, and how can companies overcome them?Finkbeiner: One key challenge is that the smartphone market—arguably the most attractive market for a variety of MEMS and MOEMS sensors—has become more or less saturated. To stay competitive, MEMS companies must innovate existing products while also developing new, differentiated sensors and actuators for next-generation mobile products.SEMI: How is Bosch Sensortec supporting sustainability initiatives?Finkbeiner: We are helping to mitigate climate change with our low carbon footprint solutions.Up to 20% of annual global carbon emissions are caused by forest fires. This is equivalent to carbon dioxide emitted by all the vehicles driven worldwide. Our sensors can detect forest fires before they develop into wildfires by measuring various gases such as carbon monoxide and hydrogen. In parallel, we are working with our production partners to reduce our carbon footprint over the coming years, while also replacing or minimizing the use of environmentally hazardous chemicals, such as PFAS.SEMI: What are you most excited about for the MEMS Imaging Sensors Summit, and how do you think it will impact the European semiconductor industry?Finkbeiner: The European semiconductor industry has deep expertise in MEMS and sensor technologies, positioning it to make a significant impact in markets such as consumer health, optical sensing, and AR displays. By continuing to focus on sustainable solutions, we can drive even greater impact for the broader industry and secure Europe’s leadership in these growth sectors.I look forward to collaborating with industry peers at the Summit to define next steps needed to advance Europe’s leadership. The MEMS Summit is an invaluable opportunity to collaborate and drive progress, and I warmly invite my colleagues to join us in shaping the future of the European semiconductor industry.Dr. Stefan Finkbeiner Dr. Stefan Finkbeiner has been CEO and General Manager at Bosch Sensortec GmbH since 2012. He was born in 1966 in Freudenstadt, Germany. Stefan Finkbeiner held various senior positions at Bosch including Director of Sensor Marketing, Director of Corporate Research in microsystems technology, and Vice President of Sensor Engineering. He looks back on almost 30 years in semiconductor industry working in different positions related to sensor research, development, manufacturing, and marketing. Due to his wide experience in semiconductor and sensor industry, Stefan Finkbeiner is a recognized guest in panel discussions and as keynote speaker. SEMI ContactSitong He / Communications Manager, SEMI EuropeEmail: [email protected]: +49 151 5546 2638

In today’s rapidly evolving semiconductor industry, ensuring both precision and efficiency in manufacturing has become an increasing challenge, particularly as advanced technologies like MEMS and AI chips push the boundaries of design and production. Inspection methods that were once sufficient are now falling short, making room for cutting-edge solutions powered by artificial intelligence (AI). The introduction of AI-driven 3D X-ray inspection technologies is transforming the landscape, offering manufacturers a sophisticated tool to ensure quality control, while driving sustainable production strategies.SEMI spoke with, Joscha Malin, Product Manager, and Daniel Stickler, R D Expert for X-ray Imaging at Comet AG, Industrial X-Ray System Division, to explore how AI-powered 3D X-ray inspection technologies are shaping manufacturing. They delve into how these technologies address critical challenges during inspections and defect analysis, using tools such as Dragonfly 3D World software for user-friendly, AI-driven insights that facilitate effective decision-making.Further insights into the application of AI-powered 3D X-ray inspection technologies and their role in advancing MEMS manufacturing will be presented by Stickler at the SEMI MEMS Imaging Sensors Summit on November 14, 2024, in Munich, Germany. Registration is now open.SEMI: Thank you both for agreeing to share your insights. To start, can you explain the importance of inspection strategies in the context of MEMS manufacturing?Malin: As MEMS devices become increasingly miniaturized and complex, effective inspection strategies are crucial. These strategies not only accelerate the wrap-up of production processes, but also significantly enhance product yield. With tighter tolerances and various materials involved, ensuring the integrity and functionality of each component is more critical than ever. A robust inspection strategy allows us to catch potential defects early, which can save time and costs associated with rework or scrap.Stickler: The evolution of MEMS technology, particularly in AI chips, demands a higher level of inspection sophistication. Traditional methods may fall short in providing the necessary detail and speed, which is why we’re focusing on advanced solutions like our AI-powered 3D X-ray inspection.SEMI: Could you elaborate on how the 3D X-ray technology differs from conventional inspection methods? Stickler: The 3D X-ray technology we utilize acts as a bridge between traditional optical methods and standard 2D X-ray inspection. It offers high-resolution, three-dimensional images without damaging the samples. 3D X-ray technology emphasizes three main benefits: clarity, efficiency, and actionable insights. This means we can obtain detailed images that help us analyze components more effectively, allowing for real-time decision-making.Malin: Moreover, the clarity and detail provided by the 3D X-ray images are critical when it comes to defect analysis in MEMS devices. They allow us to assess mechanical, electrical, and assembly errors in ways that conventional methods simply cannot. This leads to a more reliable production process.SEMI: What specific MEMS defects can be effectively analyzed using this technology?Stickler: There are several types of defects we can analyze. For instance, we can detect mechanical defects such as stiction or fractures, as well as electrical failures like short circuits. The 3D X-ray inspection allows us to visualize these defects in detail. Additionally, we can monitor assembly errors, which are particularly important in complex MEMS devices where misalignments can lead to significant issues.Malin: I’d like to add that early detection of these defects is paramount. The faster we identify issues, the quicker we can implement corrective actions, thereby improving overall yield and reducing production costs.SEMI: You mentioned yield improvement earlier. Can you explain how your technology contributes to that?Malin: Our approach supports process optimization by providing information on product characteristics and, for example, allows us to identify trends early on that may lead to yield issues later. We also aim to accelerate new product introduction in the early phase by rapid feedback, saving time and cost. This is crucial because many defects may not be apparent until later stages of production. With our technology, we can monitor samples in real-time, allowing us to react promptly to emerging challenges.Stickler: By integrating this feedback loop, we can significantly shorten the time to market for new products. This is particularly beneficial in industries where speed and efficiency are essential.SEMI: Can you tell us about Dragonfly 3D World software and its role in this process?Malin: Dragonfly 3D World is a user-friendly software that leverages AI and, specifically, deep learning for image processing. It enables users to efficiently perform bump metrology and defect identification, for example, without needing extensive expertise in the field. The software makes complex processes manageable, even for operators who may not be specialists in image processing.Stickler: Beside MEMS and advanced packaging in GPU production, this software is indeed an “AI-for-AI” application. By utilizing deep learning, users can train models that adapt to various imaging tasks, making the entire inspection process more efficient. The insights generated from the 3D X-ray images are automated, enhancing usability and streamlining workflows.SEMI: In conclusion, what are the key takeaways you’d like to share?Malin: The key takeaways are that AI-driven 3D X-ray inspection is transformative for the MEMS manufacturing process, enhancing inspection strategies and defect detection significantly. By integrating advanced technologies, we can ensure higher product quality and efficiency.Stickler: Yes, and I would emphasize the importance of powerful monitoring and non-destructive test tools. Our innovative solutions not only improve yield, but also pave the way for sustainable practices in manufacturing, ultimately benefiting the industry. Dr. Daniel SticklerDirector X-ray Technology Components at Comet AG, Industrial X-Ray System Division. Based in Hamburg, Germany, he holds a PhD in Physics from the University of Hamburg and has extensive experience in X-ray imaging, semiconductor X-ray applications and product innovations. Joscha MalinDirector Product Marketing Software Products at Comet AG, Industrial X-Ray System Division. Based in Hamburg, Germany, he holds a degree in Electrical Engineering with specialization in Semiconductors and profound experience in the industry. For over a decade, he has focused on developing X-ray inspection and metrology solutions, especially for the Semiconductor industry. SEMI ContactSitong He / Communications Manager, SEMI EuropeEmail: [email protected]: +49 151 5546 2638