IoT

SEMICON Europa, SEMICON West, SEMICON Japan, & SEMICON Taiwan welcome back exhibitors and visitors to show floors starting in mid-November as four of SEMI’s seven flagship events gather visionaries and industry leaders to explore the latest semiconductor trends and innovations by the end of 2021.

In the early 1990s, engineers of varying degrees of skill with a powerful PC set up shop designing and selling blocks or libraries of reusable components with a defined interface and behavior. These blocks, known as intellectual property, or IP, were then (and still are) integrated into a larger design. While the new market segment created excitement and new opportunities, it also was untested and created uncertainty. Many fledgling companies failed. It’s a different story today. Arm, as well as Cadence and Synopsys, are silicon IP suppliers and the segment’s yearly revenue tops $4 billion, a long way from those early garage startup days. ESD Alliance member CAST, a silicon IP provider since 1993, participated in the remarkable growth and impact on the semiconductor industry. Nikos Zervas, CAST’s CEO, and I discuss those early days of the IP business and what’s ahead. Smith: What were the early days of silicon IP like? Zervas: In those early Wild West days of IP, vendors and customers both wanted to benefit from IP, but nothing was standardized, and people just tried things to see if they worked. The perceived barrier to entry was low: hundreds of IP companies sprang up thinking they only needed RTL coding skills and tools, an FPGA to prototype, and a few thousand dollars to invest. IP deliverables, quality standards, and business practices varied from vendor to vendor and over time. Risk was high, and there are many horror stories of re-spins or market failures due to faulty IP cores. Smith: How has the silicon IP market changed from its early days? Zervas: Firms delivering high-quality IP and providing outstanding customer support survived. Others disappeared. Eventually the industry centered around a reasonably common sense of IP requirements and quality and a consistent set of business practices. IP product complexity has driven upwards as SoCs have grown. The largest ASICs used to approach a few million gates; today they’re hundreds of millions, and the granularity of IP has evolved from small functions to pre-integrated subsystems. Early on, a designer doing image processing might license individual functions like a Finite Impulse Response (FIR) filter or a Discrete Cosine Transfer (DCT) block. Today, instead they would license a complete JPEG compression core containing those functions and more, or even a complete black box subsystem streaming processed, stabilized, compressed video over Ethernet. IP selection criteria have also changed. Early IP was handcrafted to eliminate every extra gate, as being a few thousand gates smaller was a killer advantage in the era of 180nm ASIC processes. Today, at 7nm or 5nm process, tens of thousands gate differences are just noise, and it’s usually the reliability, functionality, and performance of an IP core that matter most. Smith: When did the silicon IP market start to take off? What was the driving force? Zervas: By the early to mid 2000s, uncertainty about what IP was and how best to use it – and the early wave of less-than-great providers – were being replaced by increasing acceptance and emerging best practices. The introduction of smartphones, the wild growth of Internet of Things applications, growing automotive system sophistication, and other advances fueled the explosion of the IP market in the late 2000s. In fact, according to the ESD Alliance Electronic Design Market Data Report, revenue from IP licensing today has surpassed the license revenue from front-end EDA tools. This would have been unimaginable in the late 1990s. Smith: How has silicon IP changed chip design? Zervas: Designers today must develop massive, complex systems with an even tighter time to market. Only the higher level of design abstraction and the distributed expertise that silicon IP provides make this possible. But IP also increases the challenge of differentiation: With the same IP available to everyone, how do you design a product that stands out in its market? The answer to differentiation today lies mainly in clever SoC architecture. Delivering better features with superior performance, lower power consumption, or other winning characteristics now depends not so much on perfecting each separate IP block but rather from selecting the best IP for the system’s requirements, integrating those IP cores for clean communication and efficient resource sharing, and other smart system-level decisions. It’s similar to modern building design: Every firm has access to the same materials and tools – concrete, glass, etc. – but only a few produce exceptional buildings. Smith: It seems that are several different business models for IP licensing, such as up-front license fees, subscriptions, royalties, or a combination of these. Do you think the IP market will gradually align around one basic model, or will it continue as is with a variety? Zervas: Different models serve different needs. For example, commodity IP like a SPI interface can’t demand royalties, but unique, leading-edge IP – like a 112Gbps SERDES – still can. I believe the market will continue with different business models, though the number of different models may shrink and their terms begin to align. About Nikos Zervas Dr. Nikos Zervas is the chief executive officer of CAST, Inc. He co-founded image and video compression IP developer Alma Technologies in 2001, and led the bootstrapped firm as chairman and CEO for nine years before joining CAST. He was a founding member of the Hellenic Semiconductor Industry Association and served on its board for several years with responsibility for strategic planning. He is a senior IEEE member and member of the Technical Chambers of Greece, had contributed to the GSIA's IP Working Group, and has published multiple technical papers on data compression design and related topics. Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community.

China’s semiconductor sector has exploded to become one of the largest in the world and match the region’s prominence as the biggest consumer of chips. From 2015 to 2020 alone, revenue of China’s integrated circuit (IC) industry expanded at a rapid clip of 20% CAGR (RMB) to $128 billion.

Spend any time with Ansys’ John Lee, Rich Goldman or Marc Swinnen and you’ll hear plenty of optimism about the semiconductor industry even though they tick off a long list of looming design challenges. The need for reliable and effective electronic systems, they emphasize, is great and runs through high tech, aerospace and defense, automotive, IoT and 5G with communications being a common denominator. The three are especially bullish these days on changing market dynamics brought on by systems companies building company-specific bespoke, or custom, silicon. These systems companies are building chips with a different perspective and a fresh look at silicon design, a move away from the more traditional segment-specific silicon due to much more complexity. Ansys, a member of the ESD Alliance, a SEMI Technology Community, is a 4,100-employee company with a comprehensive portfolio of multiphysics engineering simulation software for product design, testing and operation products and services. John, Rich, Marc and I focused on Ansys’ semiconductor and electronics segment for our conversation. Smith: When did you notice the move by systems companies to build their own chips? What drives this trend? Lee: The inflection point was about three years ago when hyperscale data center and system companies recognized they needed an enterprise system design platform. They are designing bespoke silicon, driven to do this for cost efficiencies and to avoid relying on outside suppliers. They also want differentiation based on their specific platform needs so they can optimize compute power to their specific needs. Smith: What is driving the trend for multiphysics experience to ensure effective and reliable electronic systems? Lee: The increasing need for multiphysics analysis is acute. The physics of 3D IC, for example, brings in mechanical engineering with the convergence of mechanical and electrical as 3D emerges at the intersection of IC and System. As a result, physics becomes a necessity to analyze the stability of the chip in the package. Goldman: As well, the move to stacked chips, 3D IC and wafer-on-wafer requires thermal, electromagnetic and mechanical analysis in addition to the traditional analysis for function, performance and power. They all need to be analyzed together, not serially. It becomes multiphysics, not multiple physics. Smith: Two distinctly different disciplines – multiple physics and multiphysics – are needed for semiconductor design. How are they different? Why the need now? Swinnen: Multiple physics refers to the sheer breadth of physics that is now needed to analyze from the IC up to the largest system whereas multiphysics refers to the capability to analyze several physical effects concurrently, accounting for their impact on the design and interactions between various physics. Multiphysics are necessary to analyze the full context of the system environment – from nanometers to kilometers – for multi-chip packaging, chip-to-package-to-silicon and systems with multi-domain guidance. Goldman: A self-driving car, as an illustration, includes AI systems-on-chip, solid-state sensors, infotainment systems and radar/lidar detectors that must all work in the rain, the heat and the bitter cold. Smith: Why are design groups being reorganized to include expertise in mechanical and electromagnetic issues? Swinnen: Complexity has exploded, driven by a long list of technical requirements and, perhaps, mischaracterization. Goldman: Just consider the system on chip, mischaracterized by the semiconductor industry. The chip is never a system by itself. Rather, it is a complex component in a larger system and must be analyzed in that context. 3D IC is where this comes together and forces a recognition of physics outside the traditional scope of SoC design. 3D IC chips are much closer together on the board and it takes multiphysics embedded into the workflow of semiconductor design, packaging, system design and 3D IC to ensure they work reliably and efficiently. Smith: What is the solution? Goldman: It’s clear a specialized digital thread is necessary to move disparate groups with expertise in systems, physics and silicon together. Today, these groups or disciplines might not exist in the same company, whether it be a foundry, fabless or outsourced semiconductor assembly and test (OSAT) company. Lee: In order to unify the entire system design environment, a cloud-based, open and extensible heterogenous enterprise compute platform is required. It is similar to the SaaS-based business model and known as Simulation-as-a-Service (also SaaS). While vertical integration of design groups is already taking place at leading system design houses, there have also been advances in electronic design tools. These are starting to offer more comprehensive multiphysics capabilities including thermal, fluid dynamics (CFD), mechanical stress and reliability analysis in a single analysis cockpit. Today’s system designers face two platform challenges: First, they need an environment that is open enough to accept analysis results from multiple sources so that they can be overlapped and cross-analyzed. Second, the design platform must have the capacity to handle the enormous amounts of data generated by the latest 3-nanometer chips and 3D IC systems, and this implies an intimate coupling to elastic cloud computing. The days of an engineer writing Perl scripts and handing it off to someone else are gone. We believe that the industry is responding to this challenge with a new generation of design platforms that a cloud-native, open and extensible to allow heterogenous enterprise design. We are definitely at an inflection point in electronic design today, but the electronic industry has faced these before an we are confident it will master these challenges as well. About Rich Goldman Rich Goldman is director of marketing for the Electronics and Semiconductor Business Unit of Ansys. He holds a Bachelor of Science degree from Syracuse University and an MBA and Master of Science degree in Engineering Management. Moscow Institute of Electronic Technology (MIET)’s first honorary professor, he is also the recipient of honorary PhD degrees from Russian-Armenian (Slavnoic) University and State Engineering University of Armenia for contributions to the advancement of Armenia’s high-tech education and economic ecosystem. Rich served on EDAC’s board of directors. About John Lee John Lee is general manager and vice president of the Ansys Electronics and Semiconductor Business Unit. Lee co-founded and served as CEO of Gear Design Solutions (now Ansys), developer of the first purpose-built big data platform for integrated circuit design. He cofounded two other startups (Mojave Design and Performance Signal Integrity), which successfully exited into companies now part of Synopsys. He holds undergraduate and graduate degrees from Carnegie Mellon University. About Marc Swinnen Marc Swinnen is director of product marketing for the Electronics and Semiconductor Division of Ansys. He holds Master degrees in Electronic Engineering and Industrial Management from KU Leuven, Belgium, as well as an MBA from San Jose State University. About Bob Smith Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community. He is responsible for the management and operations of the ESD Alliance, an international association of companies providing goods and services throughout the semiconductor design ecosystem.

U.S. consumers are flush with cash, the American economy is hurtling back from the depths of the COVID-19 pandemic, and the semiconductor industry is flying high on skyrocketing chip demand, with chip equities soaring since the initial outbreak in early 2020 as virus outbreaks worldwide supercharged demand for the digitization of everything from factories to home offices. “Wow, what a difference a year makes,” said Jennie Raubacher, Global Head of Semiconductor Electronics Investment Banking at Wells Fargo, speaking at a recent SEMI webinar. The two rounds of government stimulus payments in 2020 and 2021 gave many U.S. households the safety net to withstand the heaviest blows dealt by the COVID-19 pandemic and stoked consumer spending that has helped lift a hobbled economy. Durable goods spending in the U.S. has also seen a sharp rebound, surging more than 60% from its April 2020 trough, Raubacher said. The twin forces have driven a blistering U.S. economic recovery after GDP shrunk about 10% by the second quarter of 2020 only to bounce back in the first quarter of this year to roughly $19 trillion, regaining the lost ground to match the GDP charted at the end of 2019. With the U.S. economy continuing to gain steam, inflation has, as expected, edged higher, with price increases particularly acute in used vehicle and lumber markets. Despite surging prices, Wells Fargo sees inflation moderating as durable goods demand slows, easing pressure on interest rates, Raubacher said. Equity Valuations at Record Highs Heady semiconductor stock prices are not new. Over the past 15 years, equity prices of chip companies in the S P 500 have grown more than 460%, outpacing the 230% jump in value of the S P 500 index overall, Raubacher said. And chip stocks continue to shine. Since early 2020, when the spread of COVID-19 hit its rapid clip, the recognition of the growing importance of chips to economies around the world has exploded. That dynamic joined secular technology trends including autonomous driving development, industrial and factory automation, 5G infrastructure buildouts, data center expansions, and smart city and smart home innovation fueled by the Internet of Things (IoT) as key drivers of semiconductor stock valuations. With its price/earnings (PE) ratio now at more than 21x, the S P 500 is well above its historical average of 15x PE. “The S P 500 valuation is at record high any way you look at it, and valuation multiples across the board, currently at 3x Next Twelve Months revenue, have increased dramatically from historical averages,” Raubacher said. Semiconductor stock valuations are on similar trajectory, with the SOXX index now at 15x Next Twelve Months EBITDA (earnings before interest, taxes, depreciation and amortization). “While semiconductor stocks may seem highly valued compared to historical levels, the chip industry has grown faster and expanded profitability by a wider margin than S P 500 companies,” Raubacher said. With that differential, “semiconductor equities are not as expensive as they may seem at first glance.” Earnings expansion and valuation multiple increases for the chip industry over the past 15 years have translated into a more than 500% jump in market capitalization, compared to a 300% increase for the S P 500 excluding chip companies, she said. Chip company revenue growth in the first quarter of 2021 was predictably low due to seasonality, dipping 2.4%, though dropped less than the historical average, Raubacher said. Second-quarter revenue growth for the industry is expected to hew to the historical average of 6%. Semiconductor growth forecasts by market analysts for 2021 range widely from 6% to 17% year-over-year, she added. Chip Companies Raise Capital at Record Pace In 2020 and 2021, semiconductor companies have raised an unprecedented $82 billion in capital to finance maturing debt and acquisitions, a wave that will “likely catalyze further consolidation in the sector,” Raubacher said. None of the financing has stemmed from liquidity crunches. Since Raubacher joined Wells Fargo 10 years ago to lead its semiconductor practice, the group has executed more than 175 transactions including $40 billion in mergers and acquisitions and $360 billion of financing for its semiconductor industry clients. “With a strong macroeconomic backdrop and demand environment, relatively low interest rates, semiconductor companies showing strong business fundamentals and robust valuations, we expect a pickup in M A activity,” she said. Growth Forecast Across Most Semiconductor Applications The next four years will see the chip industry grow across most applications including wireless communications, consumer electronics, transportation and medical. Automotive and industrial/aerospace will lead the way, expanding at an expected compounded annual growth rate of 14% and 10%, respectively, from 2020 to 2025 to “drive a significant portion of the TAM expansion during that period,” Raubacher said. Across all applications, the semiconductor industry is expected to grow at a 6.8% CAGR from 2020 through 2025, adding $183 billion in revenue by the end of the forecast period, she said. ESG Rises in Importance For their part, investors now focus on more than pure business performance when valuing individual companies. The ability of businesses to reduce their carbon footprint, promote workplace diversity and take other steps to serve the greater good as part of Environmental, Social and Governance (ESG) programs are carrying more weight in valuation models. “Investors are paying more and more attention to ESG initiatives and targets,” Raubacher said. “On the debt side, we’re seeing things like green bonds and interest rate reductions tied to ESG targets. Only a few semiconductor companies have incorporated ESG measures into their financing, so it’s still early days. It really comes down to the metrics you can track in your companies and the goals and targets you can commit to. It will be a very company-specific approach rather than an industry standard.” In the chip industry, Raubacher noted that ESG targets are geared not only to manufacturing equipment and processes in fabs and other semiconductor facilities throughout the supply chain, but increasingly also to chips themselves. As technology innovation continues to spur the development of chips to power more electronics for consumers and businesses, their proliferation comes at a cost: greater energy consumption. The upshot is that semiconductor makers are becoming more focused than ever on power-efficient designs to bolster their ESG initiatives, Raubacher said. Many semiconductor players across the supply chain are reducing their carbon footprint by switching to energy-saving equipment and reducing water waste, Raubacher said. At the same time, more semiconductor executives are recognizing the rising importance of highlighting corporate achievements across all aspects of ESG. More Governments See Vital Importance of Semiconductors As shelter-in-place orders took hold in countries worldwide after the initial COVID-19 outbreak, work-from-home offices, online shopping, virtual classes and remote doctor’s visits became the norm. The electronics at the heart of this connectivity – born of both necessity and convenience – and the chips that power them took on outsized importance around the world. Geopolitical skirmishes intensified and supply chains across the semiconductor industry were reimagined and redrawn. Governments jockeyed for advantage in the race to build new semiconductor manufacturing facilities and upped their chip investments. An acute chip shortage that started in the automotive industry and quickly spread to other sectors magnified just how pervasive and vital semiconductors had become in making the world go round. “There’s no question that the semiconductor industry is vitally important to global and national economies as governments around the world now recognize its strategic importance,” Raubacher said. That puts the industry in an even stronger position to help lay the regulatory groundwork for its own future. “There’s a unique opportunity for semiconductor industry executives to shape the public policies that could impact the direction of the industry for the next 30 years,” she said. More than 750 people attended the June 2nd webinar, Surging Chip Demand, Digital Transformation, and the Pandemic – What’s Next?, sponsored by SEMI members Brooks Automation, Hitachi, JECT, KLA and TEL. Sven Smit of McKinsey Company also delivered his talk Leading in COVID-19 Exit at the event.

Dr. Mousumi Bhat, senior director of External Manufacturing at Micron Technology and first female member of the SEMI Southeast Asia Regional Advisory Board, discusses her passion for sustainable business practices and her work driving the transformation of Micron’s manufacturing plant in Singapore.

For the first time in its 20-year history, the FLEX Conference dedicated an entire session to the important and timely twin topics of environmental sustainability and power consumption of electronic devices. The event planning committee recognized the urgent need to increase the awareness of how technology and electronics devices can help reduce greenhouse gas emissions (GGE) overall and meet aggressive targets to curb the impacts of climate change. Dr. Christine Ho, CEO of Imprint Energy, delivered the keynote for the session, focusing on the need for powering billions of sensors that will be deployed annually, and their role in reducing fossil fuel emissions through becoming aware of issues, monitoring our resources over time, and intervening early and often to combat waste in multiple sectors and industry. Quoting extensively from the organization Exponential Roadmap Initiative (ERI), Ho noted that “the digital sector has the potential to directly reduce fossil fuel emissions 15% by 2030 and indirectly support a further reduction of 35% by influencing consumer and business decisions and systems transformation.” The initiative’s playbook for reaching net zero carbon emissions by 2050 and limiting global warming to 1.5° Celsius outlines how the digital sector can help remove 13 of the 27 gigatons (GT) of CO2 needed to reach this goal. Ho stated that the rapidly emerging Internet of Things (IoT), devices, software systems, and data insights are the backbone of this digital transformation. The IoT's vast network of sensors can transform multiple sectors, such as the logistics industry, which on an annual basis moves and ships more than 10 billion tons of products worldwide by ships, airplanes, long haul trucks, and train - contributing 17% of GGE and more than 4 gigatons of CO2 annually. Always-connected IoT sensors used by the logistics industry can reduce waste and damage in the supply chain, which is especially problematic for temperature-sensitive and damage prone pharmaceutical and food products, mitigating the need for producing high volumes of buffer inventory to replace damaged goods Noting that the attendees of 20 Years of FLEX Conferences were a big part of the current advancements of low-cost printed, active, shipping tags, Ho said that Imprint Energy’s flexible and thin, Zinc based batteries are ideal for IoT devices, since they boast a significantly smaller carbon footprint than Lithium-Ion (Li-ion) batteries. Imprint Energy is working with systems designers and integrators to design the battery as an integral part of the device package and use low-power strategies to extend device lifetimes. Imprint recommends co-locating battery printing alongside the device integration to further minimize shipping and logistics. When manufactured separately, Imprint’s small footprint, low-operating temperature process line (less than 80°C) provides significant carbon footprint advantages over other technologies. Ho challenged the attendees, saying “we all need to participate in protecting our earth. We need to eliminate waste and contribute to reducing half of our current greenhouse gas emissions by 2030, and we can do that by deploying a global digital skin with more than 100 billion IoT devices in 2030 and up to 1 trillion by 2050. We can minimize the device carbon footprint and maximize its longevity by considering the power capability, as well as design for re-use and re-cycling of the critical materials.” Following Dr. Ho’s presentation, FLEX kicked off a spirited panel discussion with experts from PowerRox, ITN Energy Systems, Birla Carbon, and Auburn University and chaired by Bob Praino and Eric Forsythe, from Chasm Advanced Materials and the Army Research Labs, respectively. The speakers summarized their on-demand presentations and looked at what is being done today to recycle Lithium-Ion batteries, how IoT devices are currently being powered, and drew comparisons between the early days of the Internet and development of the IoT. The speakers generally agreed that the power requirements of wireless cellular and Blue-tooth devices were still too high and run times too short. FLEX 2021 was a virtual event in the 2021 SEMI Technology Series. It was organized by SEMI FlexTech, SEMI NBMC, and NextFlex. Major sponsors included E Ink and Novacentrix. The event covered technical developments in flexible, printed and hybrid electronics, featuring more than 100 presentations and networking opportunities. Technical proceedings are available until March 26 at http://flex.semi.org. Heidi Hoffman is senior director in Corporate Marketing at SEMI.

SEMI spoke with Eyal Shekel, senior vice president of Service Strategy and Excellence at Tokyo Electron Limited, about the impact of artificial intelligence (AI) on smart manufacturing and how other fab solutions for smarter process tools are advancing semiconductor manufacturing.Eyal shared his views ahead of his presentation at the SEMI Fab Management Forum, 17 February, as part of the SEMI Technology Unites Global Summit, 15-19 February 2021, an online event. Join us to meet experts from Tokyo Electron and other key industry influencers. Registration is open. SEMI: AI technology is considered a key enabler for smart manufacturing. What are the latest trends? Shekel: The advent of advanced nodes and extreme complex 3D semiconductor geometry has lengthened time to market and increased costs in areas ranging from equipment development and large-scale metrology usage to monitoring yield inhibitors.AI is becoming a critical tool in the area of material informatics to determine suitable materials and processing techniques in order to meet the needs of future devices. Together with new materials and processes, the development and implementation of virtual metrology will enable accurate and almost absolute real-time monitoring of our customers’ device wafers at each stage of the manufacturing process.SEMI: What are the benefits of data analysis in the process from R D and Ramp-Up to High-Volume Manufacturing? Shekel: The new research field of materials informatics enabled by AI provides tools to guide the highly efficient discovery and optimization of production processes. For example, TEL has developed methodologies for co-optimizing processes and materials for etch rates.To monitor and manage the yield of semiconductor fabrication processes, direct metrology measurements are important. However, it is difficult to monitor all production wafers due to the time and cost involved. With deep learning AI, it is now becoming possible to predict every wafer’s metrology measurements based on production equipment data and previously processed wafer metrology variables. This enables total quality management and run-to-run control, while simultaneously reducing production costs and cycle time.SEMI: Can you tell us more about TEL Service Advantage?Shekel: TEL Service Advantage is a TEL global support organization that allows customers to select a service plan that fits their needs. Through TEL Service Advantage, we can quickly respond to customer requests and technical advancements. TEL Service Advantage provides various plans to maximize equipment maintenance efficiency for customers and productivity from equipment manufactured by TEL. TEL Service Advantage plans can be combined to meet customer needs and achieve maximum results.A key enabling element of TEL Service Advantage is TELeMetrics™. TEL analyzes equipment data from various sensors using a remote connection and, based on that analysis, provides solutions to customer-specific problems around equipment throughput and predictive maintenance.SEMI: How is AI helping during the pandemic? Can you share a success story? Shekel: The pandemic forced severe travel restrictions worldwide, making it very difficult or even impossible in many cases to visit our customers, as it is still the case today. Standard communication devices like smartphones and email helped at the beginning when TEL intensified the remote support by our Total Support Centre (TSC).TEL continued to develop its Service Advantage program quickly, and started using additional advanced tools and methodologies such as the following: Deployed AR (Augmented Reality) to remotely assist our customer and TEL engineers Secured remote connections into TEL tools to investigate parameters and logs, or to change set-up Used remote training courses that connects trainers via video conferencing systems and training tools in the factories to skill up engineers located in a different parts of the world Used AR glasses for tool start-up and troubleshooting Expanded TEL database global technology with multi-tool on languages search capabilities A key project at a customer site in Europe offers an excellent success story. Using all the approaches above, we collaborated with the local team to put a tool into production with no major delays. This was highly appreciated by the customer and very important for us.SEMI: What do you predict for the future? Shekel: Global technology infrastructure continues to develop and expand rapidly. Elements like 5G networks, IoT and advanced sensing capabilities will lead to what we call General AI, which will be based on neuro-like infrastructure. The auto learning will spread across domains and rely on internal logic and reasoning to automate many tasks that are manual today. In our industry in particular, General AI will enable workers to focus more on data analytics and future advanced R D rather than ongoing operations.SEMI: How can technology unite us? What do you expect from your participation at SEMI Technology Unites Global Summit?Shekel: Technology united us in the last 150 years. The connectivity started with telegraph and telephone and was used to exchange information over wider distances. Nowadays, video conference capabilities, AR and improving communications technology makes it much easier to unite people who are geographically dispersed. This becomes obvious and valuable especially during this pandemic period. As a fact, we are able to continue to perform all our key activities – our tool support, training and customer relationships – even if we cannot be present in person.The SEMI Technology Unites Global Summit is a great chance to stay connected to people and customers that I would normally meet at the SEMICON exhibitions.It also offers the opportunity to network with many more people who I would not be able to meet otherwise. Moreover, I can watch speeches and presentations at any time! Normally I would miss some programs since exhibitions and events took place at the same time.Eyal Shekel, senior vice president of Service Strategy and Excellence at Tokyo Electron Europe Limited, is a 27-year semiconductor industry veteran. Upon his graduation as a Mechanical Engineer from the Technion (Israel leading technical institute), he joined Applied Materials. In 1997 he moved on to Tokyo Electron (TEL) in Europe, served as the Regional Service Manager of Israel and, soon after, was appointed the company’s General Manager. Since 2005 Eyal has been part of TEL Europe senior management. He oversaw the Service and Support Operations for TEL Europe as a senior vice president until 2019. In his current role, he co-leads TEL’s Global Service Committee in Japan.The SEMI SMART Manufacturing Initiative is a global effort to promote awareness of and interest in smart manufacturing with a focus on delivering industry-recognized best-in-class programs and services to enable members to maximize product quality and productivity while reducing costs. Activities are focused on building out core capabilities to enable smart manufacturing across the microelectronics supply chain. MADEin4 is a consortium of 47 partners from 10 countries connecting the full range of supply chain – from semiconductor equipment manufacturers and system-integrating metrology companies to RTOS and key applications such as the automotive industry. The MADEin4 Project develops next generation metrology tools, machine learning methods and applications in support of Industry 4.0 high-volume manufacturing in the semiconductor manufacturing industry. Serena Brischetto is senior manager of Marketing and Communications at SEMI Europe.

Electric mobility, renewable energy and other technology innovations like IoT, 5G, smart manufacturing and robotics all require reliability, efficiency, and compact power systems, fueling the adoption of Silicon Carbide (SiC) and Gallium Nitride (GaN) to support lower voltages in significantly smaller devices. But chip designers must overcome the technological and economical challenges of integrating the two semiconductor materials into power systems.SEMI spoke with Elisabeth Brandl, Business Development Manager at EV Group about trends and new developments within the power electronics industry and the devices' application in smart mobility. Brandl shared her views ahead of her presentation at the SEMI SMART Mobility Forum, 18 February, as part of the SEMI Technology Unites Global Summit, 15-19 February 2021, online event. Join us to meet experts from EV Group and other key industry influencers. Registration is open. SEMI: What is driving new developments in power electronics?Brandl: Globally there are significant changes in infrastructure requirements for communication, automotive and power conversion. We need to look no further than the rising adoption of 5G, electric and hybrid vehicles, and renewable energy as examples of drivers of these changes. The device level, particularly in the field of power electronics, figures prominently in these shifts.The power electronics industry faces a growing number of scenarios where conventional silicon power devices are no longer suitable and are easily outperformed by new architectures mainly based on wide bandgap semiconductor materials like Silicon Carbide (SiC) and Gallium Nitride (GaN).SEMI: What industry challenges is power electronics innovation aiming to solve? Brandl: Power conversion efficiency is very important and needs further improvement as the related losses significantly contribute to the overall power consumption. For green power and a better environmental footprint, renewable energy is crucial, but so is overall power-consumption efficiency, yet the role of power devices is often underestimated. High-frequency and high-power applications, such as data center applications and inverters for renewable energy, where silicon power electronics are reaching their limits, are also important areas in power electronics.SEMI: How will the transition from silicon to compound semiconductor materials help?Brandl: The superior material properties of several compound semiconductors can tackle the need for lower losses in power conversion or better high-frequency behavior. Today, we mainly talk about GaN and SiC power devices as they are materials well-suited to address these needs. However, other materials like diamond and gallium oxide are in development for these applications. Material properties of SiC that enable thinner materials with lower power losses and better thermal behavior address power conversion efficiency as well as form factor challenges. GaN, especially in a high electron mobility transistor (HEMT), can be used for high-frequency applications.SEMI: What enables a better and more cost-effective manufacturability of SiC and GaN power devices?Brandl: For the end customer, a typical figure of merit regarding the cost effectiveness is $ per Ampere or Watt. While this seems simple, the reality is of course more complex. It is important to understand the main cost contributors within the manufacturing area. For SiC, this is clearly the substrate cost. In my presentation, I will show a way to reduce this cost via wafer bonding. For GaN, epitaxy – a method for growing or depositing mono crystalline films on a substrate – is the critical parameter. And of course, yield has a very big impact on cost effectiveness too, which means that good process control including metrology is very important.SEMI: Many semiconductor companies are already transitioning to silicon carbide and gallium nitride. Can you give us an example of a success story?Brandl: All the big power device manufacturers have either acquired or developed their SiC and/or GaN power device technology, so they also see a bright future for these wide bandgap semiconductors in the power device market. The most prominent success story is STMicroelectronics with its SiC MOSFET power devices, which have been implemented by Tesla in its Model 3 vehicles since 2018.SEMI: What is coming next?Brandl: New materials for power devices are being explored, such as diamond and gallium oxide. For SiC, the trend is moving toward 8-inch substrates, which is the focus of the funded EU project REACTION under the coordination of STMicroelectronics. Cost reduction and substrate availability also play a big role. All major power device manufacturers have contracts to secure the supply chain for SiC substrates because material availability is the main uncertainty at this time. Finally, collaborations along the supply chain are crucial and generally beneficial for all parties, as development requirements are better communicated and prioritized.Elisabeth Brandl is Business Development Manager at EV Group. She received her master in technical physics from the Johannes Kepler University Linz, Austria in Semiconductor and Solid State Physics. Since 2014, she has been responsible for Product Marketing Management for temporary bonding and compound semiconductors at EVG. The SMART Mobility Forum is the digital platform of SEMI Europe’s Global Automotive Advisory Council (GAAC) for industry stakeholders along the automotive and electronics value chains, from Design, Semiconductor Equipment and Materials Suppliers to Automotive OEMs.Smart Mobility is one of four SEMI initiatives focused on building communities, content, and activities around critical and emerging electronics markets. Read more about our Regional Chapters.Serena Brischetto is senior manager of Marketing and Communications at SEMI Europe.

SEMI spoke with Tom Doyle, founder and CEO of Aspinity, about the challenges of packing more localized intelligence into portable Internet of Things (IoT) devices without draining their batteries. Doyle shared his views on Aspinity’s system-level approach – solve the power problems by performing machine learning in analog – ahead of his presentation at the SEMI MEMS Imaging Sensors Technology Showcase, 18 February, as part of the SEMI Technology Unites Global Summit, 15-19 February 2021, online event. Join us to meet experts from Aspinity and other key industry influencers. Registration is open. SEMI: Why is power efficiency so important for IoT devices? Doyle: Hundreds of millions of IoT devices are improving our lives at home and at work. Always on and always sensing the environment for data, these smart devices have traditionally been wall-powered and have relied on the cloud for their data processing needs, but clogged networks, as well as privacy and performance issues, have necessitated the migration to edge processing.Spanning consumer, medical and industrial, these IoT devices are becoming smaller and more portable. And a portion of them is operating remotely in hard-to-access locations. So now we are packing more functionality into the device and we are moving to battery power and the batteries need to last a long time. That is a big challenge before us, and to answer it, we need to find the most power-efficient ways to integrate always-on sensing capability into IoT devices because we cannot afford to have short battery life limit market adoption.SEMI: Why is it so challenging to deliver low-power, always-on solutions and how can sensors suppliers achieve improvements in system power? Doyle: In today’s always-on IoT devices, all sensor data – which are naturally analog – is immediately digitized at high resolution, and then it’s analyzed to determine whether a wake word has been spoken, a specific motion has been made, or some other anomaly has occurred. But since most of the data collected will not contain the information for which the device is waiting, this digitize-first approach wastes significant battery life by continuously running irrelevant data through the ADC and the digital processor.Sensors suppliers have some options to consider for reducing power. If they are satisfied achieving incremental improvements in battery life, both sensors and digital processor suppliers can continue to drive down the power of each individual component in the system. But to achieve revolutionary power savings, we must look at a more holistic system solution.The fundamental problem is that moving data through a system costs power. That is why the most efficient way to save power is to reduce the amount of data down to what’s actually important as early as possible, right at the start of the signal chain, where the physical world becomes data. If we can minimize the amount of data that require downstream processing, then we can maximize battery life.SEMI: Aspinity aims to solve the battery-life problem in IoT devices by introducing a new system architecture. Could you explain how your approach differs from digitize-first?Doyle: Aspinity’s solution, called the Reconfigurable Analog Modular Processor (RAMP), is an analog processing technology that combines analog machine learning (analogML™) and analog compression to enable accurate, ultra-low-power analog event detection and system wake-up. RAMP technology enables a new system architecture, which we call analyze-first, that allows an always-on system to spend just a little bit of analog power up front at the sensor to determine whether sensed data are relevant to the task at hand before waking the digital system for further processing. The analyze-first architecture can extend battery life by months or years over digitize-first architectures because it keeps the higher-power digital components asleep unless important data require digitization and analysis, which in some applications – such as voice-first or acoustic event detection – may occur very rarely. Aspinity RAMP voice activity detection with preroll from Aspinity on Vimeo. SEMI: Can you give us an example?Doyle: Here is a practical example of how this works: For most voice-enabled systems, such as smart speakers, voice-activated TV remotes and hearables, voice is only present 10%-20% of the time – but the digitize-first architecture on which these devices are traditionally based is digitizing 100% of the sound data captured by the microphone, even when most of that data are irrelevant and could not possibly contain a wake word.In contrast, the RAMP-based analyze-first architecture is highly efficient since it uses feature extraction and a neural network to analyze the sound at the microphone, right where it enters the device, to determine if the sound contains voice before waking the digital wake word engine. Additionally, the accuracy of most wake word engines relies not just on waking up and analyzing the wake word, but also on analyzing the 500ms of sound prior to the wake word (preroll). To support wake word engine performance, the RAMP also continuously compresses 500ms of preroll that can be stored in just 2k of memory and delivered to the wake word engine along with the voice data. So, this new analyze-first approach using RAMP technology can extend battery life by 10 times over older digitize-first designs, without sacrificing performance and accuracy.SEMI: What solutions can Aspinity bring to address the current market needs? Doyle: Aspinity offers the only analogML chip for always-on IoT devices that run on battery: the RAMP chip.The RAMP is trainable and programmable to detect many different types of sensor events directly from the raw analog sensor data. One application that benefits from a RAMP chip are devices that are always-listening for voice, for glass break or alarms, or for some other type of sound. Other examples include vibration sensors that monitor industrial equipment for predictive and preventative maintenance, and heartrate sensors that are used to detect anomalies in wearables and other biomedical applications.Aspinity just recently introduced our voice-first evaluation kit – which we will be demonstrating during the Technology Showcase at Technology Unites – to enable our customers to get first-hand experience with our RAMP-based analog voice wake-up solution. With this complete hardware and software kit, customers can experience all of the benefits of analogML and analog data compression – 10x power savings without a reduction in wake word detection accuracy –for their next generation of voice-enabled devices.SEMI: How can technology unite us? What do you expect from your participation at SEMI Technology Unites Global Summit?Doyle: I think this past year has shown us that when time gets tough – and for many of us, the COVID-19 pandemic has been one of the most difficult challenges we have faced – that innovation is critical to solving major problems. The microelectronics industry has played an important role in providing critical components for COVID-19 testing, ventilators, air-purification systems, and other equipment used in healthcare settings. COVID-19 has also accelerated the move to voice as a preferred interface to many devices in an effort to stem the spread of germs on surfaces.The biotech industry is gearing up to provide the vaccines that we hope will restore more normalcy to our daily lives. We can thank the successful collaborations between R D innovators and established companies in many different markets for the new devices and drugs now going into production.With traditional in-person conferences still on hold until the pandemic eases up, attending industry conferences with exceptional speakers presenting interesting content is more important than ever. SEMI Technology Unites Global Summit provides that opportunity, and I’m genuinely looking forward to participating.Tom Doyle, Founder and CEO of Aspinity, brings over 30 years of experience in operational excellence and executive leadership in analog and mixed-signal semiconductor technology to Aspinity. Prior to Aspinity, Tom was group director of Cadence Design Systems’ analog and mixed-signal IC business unit, where he managed the deployment of the company’s technology to the world’s foremost semiconductor companies. Previously, Tom was founder and president of the analog/mixed-signal software firm, Paragon IC solutions, where he was responsible for all operational facets of the company including sales and marketing, global partners/distributors, and engineering teams in the US and Asia. Tom holds a B.S. in Electrical Engineering from West Virginia University and an MBA from California State University, Long Beach.Serena Brischetto is senior manager of Marketing and Communications at SEMI Europe.