MILPITAS, Calif. — August 7, 2023 — SEMI today announced the election of Eric Johnson, Representative Director and CEO of JSR Corporation, as a new member of the SEMI International Board. In addition, SEMI confirmed the re-election of seven current members to the SEMI International Board of Directors in accordance with the association's by-laws.

The following seven Board members were re-elected for three-year terms:

• Mike Allison, CEO, VAT Group
• Chun Hyuk Lee, CEO and Vice Chairman, Dongjin Semichem
• Bertrand Loy, President, CEO and Board Member, Entegris
• Daisuke Murata, President and CEO, Murata Machinery
• Kyu Dong Sung, CEO, EO Technics
• Kazuo Ushida, Chairman and Representative Director, Nikon
• Li Zheng, CEO, JCET Group

The elected board members’ revised tenure took effect at the annual SEMI membership meeting on July 12 during SEMICON West 2023.

“We congratulate the newly elected and re-elected members to the SEMI Board of Directors and thank these industry leaders for their commitment to serving on behalf of the global electronics manufacturing and design supply chain,” said SEMI President and CEO Ajit Manocha. “Our International Board represents a mix of industry segments and regions, helping us to ensure that SEMI programs advance industry growth and deliver exceptional member value.”

SEMI’s 18 voting directors and 11 emeritus directors represent companies from Europe, China, Japan, Korea, North America, and Taiwan, reflecting the global scope of the association’s activities. SEMI directors are elected by the general membership as voting members of the Board and can serve a total of five three-year terms.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Announces Election and Re-Election of International Board Members

MILPITAS, Calif. – August 8, 2023 – With advanced materials a critical enabler of semiconductor growth applications, Strategic Materials Conference (SMC 2023) will gather top executives and leaders from every segment of semiconductor manufacturing for insights into the latest developments in advanced materials October 2-4, 2023 at the Holiday Inn in San Jose, Calif. Executives from Dupont, Micron and TSMC will keynote as the premier event focuses on drivers of advanced materials, highlighting opportunities for materials innovation across the electronics supply chain. Registration is open.

Themed Materials Readiness for the Next Semiconductor Super Cycle, SMC 2023 will feature the following key sessions:

• Market & Geopolitical Trends
• Future Technology
• Materials Driving Performance
• More Than Moore
• Sustainability: Special update on SEMI EHS Regulatory and PFAS Initiative
• Executive Panel:What We Learned from a Downturn and How to Prepare for an Upcoming Upturn

SMC 2023 Keynotes

	Randy King CTO, Electronics & Industrial Business DuPont
	John Whitman Corporate Vice President, Front End Operations Central Teams & Procurement Micron
	Iuliana Radu, Ph.D. Deputy Director TSMC

SMC 2023 presentation titles also include:

• Opportunities and Challenges for Semiconductor Materials: the Key to a More Resilient and Sustainable Future
• The Cyclical and the Structural: Macro Outlook for 2024 and Beyond
• Semiconductor Market Overview: From Good to Bad to…?
• Semiconductor Materials Outlook
• New Materials for Advanced BEOL for Classical and Quantum Devices
• Driving Innovation in Patterning with Novel Materials
• Impact of Materials on Equipment Design and Unit Process Development
• Materials Innovation Advancing the Angstrom Era
• Global Materials for Semiconductors – Why the Future Requires Investment and Regionalization with a Focus on Environmental Sustainability and AI
• Heterogeneous Integration Simplified
• The Growth of Heterogeneous Integration and Advanced Interconnect Technologies
• Overcoming Challenges of More-than-Moore Device Manufacturing
• Leading Sustainability in a Dynamic Environment
• Technologies Enabling Mature-Node Semiconductor Factories to Become Among Greenest in the World
• Materials-Driven Scaling Fueling the Next Era of Semiconductor Innovation 
• Delivering a New Era of More From a Foundry Perspective

Register for SMC 2023.
 

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SMC 2023 Keynotes and Sessions – Paving the Way to the Next Semiconductor Industry Super Cycle

HSINCHU, Taiwan – August 1, 2023 – With Taiwan forecast to remain a top buyer of chipmaking equipment, the stage is set for SEMICON Taiwan 2023 as companies from across the electronics design and manufacturing supply chain gather for insights into the latest trends, developments and innovations driving industry growth. Registration is open for the exhibition and conferences, September 6-8, 2023, at TaiNEX 1 and 2 in Taipei.

The largest SEMICON Taiwan ever, the event is expected to draw more than 50,000 attendees while featuring 3,000 booths and 850 exhibitors. Themed Inspire Innovation. Empower Sustainability, SEMICON Taiwan 2023 will offer more than 20 forums spotlighting critical semiconductor industry topics including:

• Advanced Manufacturing
• Heterogeneous Integration
• Compound Semiconductors
• Automotive Chips
• Smart Manufacturing
• Sustainable Manufacturing
• Semiconductor Cybersecurity
• Talent

Taiwan is projected to maintain a top position in purchases of chipmaking equipment in 2023 and 2024, according to the recent Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective announced by SEMI.

“The semiconductor industry is the main driving force for technology development and critical to innovations that promise to help overcome some of the world’s greatest challenges,” said Terry Tsao, Global Chief Marketing Officer at SEMI and President of SEMI Taiwan. “SEMICON Taiwan 2023 will bring together representatives from the global microelectronics industry, governments, academia and research to set a path to a more prosperous, sustainable future.”

SEMICON Taiwan 2023 Highlights

CEO Summit
Top semiconductor industry executives will gather at the CEO Summit to examine vital innovation trends and keys to the industry’s success over the next 20 years. Featured speakers will include:

• Tien Wu, CEO of Advanced Semiconductor Engineering (ASE)
• Mark Liu, Chairman of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC)
• Anirudh Devgan, President and CEO of Cadence Design Systems
• Tim Archer, President and CEO of Lam Research
• Toshiki Kawai, President and CEO of Tokyo Electron (TEL)

Market and Industry Trend Forum
Top industry analysts will explore market trends, present industry forecasts and provide insights into how companies across the semiconductor ecosystems can navigate the unpredictable market environment. Speakers will include analysts from Gartner, McKinsey & Company, Morgan Stanley, Mizuho Bank, the SEMI Market Intelligent Team (MIT), and TechInsights. 

8 Country Pavilions
With Taiwan a vital and reliable partner in the global economy, many regions have sought cooperation with the region in order to better adapt to a rapidly changing industry. Toward that end, SEMICON Taiwan 2023 will feature eight country pavilions including Australia, the Czech Republic, the UK, Italy, Japan, Poland and Singapore. In addition, the Silicon Europe Pavilion will feature Dutch and German exhibitors.

12 Theme Pavilions and Multiple International Forums
SEMICON Taiwan 2023 will feature 12 theme pavilions to showcase areas key to semiconductor industry growth including Heterogeneous Integration, Compound Semiconductor, Materials, Green Manufacturing, and Workforce Development.

The event will also host Smart Manufacturing Journey, themed AI-Driven Innovation of Future Automation. The interactive exhibition of virtual and real integration technology will showcase powerful, innovative artificial intelligence (AI) technologies and the latest developments in robotics and automation.

SEMICON 2023 will also include:

• Smart Manufacturing Expo Taiwan
• Heterogeneous Integration Global Summit
• Strategic Materials Conference Taiwan
• FLEX Taiwan 2023

Register for SEMICON Taiwan 2023 before August 15 for a 25% early-bird discount. Groups of more than three people receive a 50% early-bird discount.

Register for International Forums by August 15 for an early-bird discount of up to 50%.
 

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Monica Hung/SEMI Taiwan
Phone: +886.3.560.1777 ext. 207
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON Taiwan 2023 to Highlight Auto Chips, Advanced Manufacturing, Sustainability, Cybersecurity, Talent

India Semiconductor Mission (ISM) Provides Key Endorsement of Event

AHMEDABAD, India and MILPITAS, Calif. – July 29, 2023 – SEMI today announced its intent to support the India Semiconductor Mission (ISM) in creating a vibrant semiconductor manufacturing and design ecosystem in India. The collaboration would build on the successful execution of ISM’s two editions of SemiconIndia and continue SEMI’s tradition of bringing together stakeholders in the global end-to-end semiconductor ecosystem. A Memorandum of Understanding (MOU) is under development.

SEMI is in discussions with Electronic Industries Association of India (ELCINA) and Messe München India (MMI) as key partners to stage its flagship event.

The ISM has noted that SEMICON India would be highly complementary to efforts by the government of India to advance the domestic semiconductor ecosystem and connect to the global industry.

“For more than 50 years, the SEMICON platform has connected companies from across the global semiconductor industry to uncover new business opportunities, gain insights into market and technology trends, and collaborate to drive innovation and address top electronics industry challenges,” said Ajit Manocha, SEMI President and CEO. “With SEMI recognized worldwide as a key enabler of industry growth, the establishment of SEMICON India marks a significant step forward for the region.”

The partnership will give Indian semiconductor and electronics companies access to more than 2,500 SEMI member companies across the global semiconductor and electronics manufacturing and design supply chain. Additionally, SEMICON India will provide a platform for stakeholder participation in critical SEMI initiatives across areas including Workforce Development, Sustainability and Supply Chain Management to advance industry growth.

“India is all set as the next destination on the global map for semiconductor manufacturing,” said Bhupinder Singh, CEO of Messe München India. “We applaud initiatives by the India Semiconductor Mission to establish semiconductor design, manufacturing, packaging, capacity building as well as R&D in the region. Messe München India looks forward to work with SEMI to organize SEMICON India in collaboration with ELCINA, a partnership that is a natural extension of the longstanding work between Messe München and SEMI to stage events in Europe and China. Staying true to our purpose of enabling meaningful handshakes and unlocking business opportunities. This platform will integrate upstream and downstream value chains for wafer fabs and OSATs and help the India semiconductor and electronics industry become more self-reliant.”

"The semiconductor industry has taken centre stage in the electronic systems design and manufacturing ecosystem,” said Sanjay Agarwal, President of ELCINA and Managing Director at Globe Capacitors Ltd. “The industry is a strategic, vital enabler of economic growth in India. Coming together with SEMI as our partner is of great value as together we can strengthen the semiconductor industry in India and become a trusted partner to chip companies worldwide. We look forward to working with SEMI and leveraging our existing partnership with Messe München to make SEMICON India a grand success.”
 

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

About ELCINA
Electronic Industries Association of India (ELCINA) was established in 1967 as the first industry association supporting electronic components and hardware, when India's Electronics industry was still in its infancy. Since then, ELCINA has established itself as an interactive forum for electronics manufacturers.

ELCINA’s key objective is to promote value added manufacturing, R&D and business expansion in the Electronic System Design & Manufacturing (ESDM) sector. ELCINA delivers this through knowledge sharing, industry research, policy support and enabling creation of an efficient eco-system in the country. We engage with all stakeholders, technical institutes and industry associations to promote business expansion through B2B and B2G industry programs.

ELCINA actively advises the government on policy and business environment issues. With greater liberalization, ELCINA's focus has shifted to professional and value-added services to the Electronics Community. Visit www.elcina.com to learn more.

About Messe München India
Founded in 2007 as a wholly owned subsidiary of Messe München GmbH, Messe München India Pvt. Ltd. is one of the leading organizers of trade fairs in India with an extensive portfolio of B2B trade fairs covering various sectors: air cargo India, analytica Anacon India/India Lab Expo, bauma CONEXPO India, drink technology India, electronica India, IFAT India, Indian Ceramics Asia, Intersolar India/The smarter E India, LASER World of PHOTONICS INDIA, MatDispens, Pack Mach Asia Expo, Pharma Pro Pack, productronica India, SmartTech Asia, VRTECH India, and World Tea & Coffee Expo. Messe München India works closely with industry stakeholders to develop well-researched trade fairs encapsulating the latest trends and innovations dominating the industry. Headquartered in Mumbai with offices in New Delhi and Bengaluru, Messe München India connects global competence by bringing professionals together for business, learning and networking. Visit Messe München India to learn more.
 

SEMI Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Electronics Industries Association of India (ELCINA) Contact

Rajesh Rawat
Phone: +91 9911445890
Email: [email protected]

Messe München India Contact

Annabel Dsouza
Phone: +91 22 4255 4723
Email: [email protected]

• Read more about SEMI Announces Intent to Host SEMICON India in Partnership With India Semiconductor Mission

MILPITAS, Calif. — July 25, 2023 — Worldwide silicon wafer shipments increased 2.0% quarter-over-quarter to 3,331 million square inches in the second quarter of 2023, down 10.1% from the 3,704 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.

“The semiconductor industry continues to work through excess inventory in various market segments, necessitating that fabs operate below full capacity,” said Anna-Riikka Vuorikari-Antikainen, Chairman of SEMI SMG and Chief Commercial Officer at Okmetic. “As a result, silicon wafer shipments are lagging their 2022 peak. Second-quarter wafer shipments held steady quarter-on-quarter with 300mm showing quarterly growth among all wafer sizes.”

Silicon Area Shipment Trends – Semiconductor Applications Only

Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks are produced in diameters of up to 12 inches and serve as the substrate material on which most semiconductors are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The SMG facilitates collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information, visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Worldwide Silicon Wafer Shipments Rise in Q2 2023, SEMI Reports

GRENOBLE, France – July 18, 2023 – More than 300 industry experts will gather 19-21 September at the SEMI MEMS & Imaging Sensors Summit for insights into the latest MEMS and sensors technology developments and trends key to global sustainability. Themed Ubiquitous Sensing for a Sustainable World, the event will be held at the World Trade Center (WTC) in Grenoble, France. Registration is open.

Hosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community, the summit will open with insightful executive keynotes and feature sessions on the following critical semiconductor industry topics.

Program Sessions

Session 1: Growth Drivers and Megatrends
Industry leaders will explore megatrends including the increasing electrification of vehicles, advanced driver assistance systems (ADAS), and increasing demand for augmented and virtual reality technologies (AR and VR) in consumer electronics. Experts will examine market growth drivers and the latest technological advances while offering perspectives on how to capitalize on future trends to drive growth and innovation.

Session 2: Smart and Green Manufacturing Solutions
Experts will discuss approaches to achieving industry sustainability goals and paving the way to net zero greenhouse gas emissions.

Session 3.1: Future of MEMS Technology
Thought leaders will share their visions for emerging MEMS applications and present technology roadmaps and market forecasts while discussing the latest trends in audio, biosensing, and manufacturing.

Session 3.2: Future of Imaging Technology
Discussions will highlight new image sensors developments and applications in areas such as medical, autonomous vehicles and the environment. Thought leaders will explore leading-edge design, novel materials, and manufacturing methods.

Session 4: Fusion Challenges
Experts will discuss the critical role of sensors in interpreting the most relevant data in order to optimize manufacturing sustainability.

Session 5: Smart Agriculture
This session will explore state-of-the-art technologies for the agriculture industry to track, monitor, automate, and analyze operations in order to driver greater predictability and efficiency.

Session 6: Disruptive Technologies
Industry leaders will discuss the critical role of disruptive semiconductor technologies that fuel innovations in semiconductor materials, processes, and equipment for a sustainable future.

Session 7: Integrated Photonics
Experts will offer insights into how photonics is enabling new sensing and vision applications and ways photonics innovations must be integrated across the value chain to enable faster, more energy-efficient chips.

More MEMS & Imaging Sensors Summit Highlights

• Networking opportunities at the exhibition and a gala dinner for attendees of both MEMS and imaging sensor tracks.
• Exhibition showcasing leading companies driving the future of MEMS, imaging and sensors design and manufacturing including:

• Adeia
• AEMtec
• Besi
• Comet Yxlon
• Eurofins | MASER
• EV Group (EVG)
• FormFactor
• OPTIM Wafer Services
• Philips MEMS & Micro Devices
• Polyteknik AS
• ProSys
• Pyxalis
• SET Corporation
• Siconnex
• Siemens EDA (represented by EDA Solutions Limited)
• Sumitomo Precision Products
• SUSS Microtec
• L. Gore & Associates
• WIN SOURCE

Premier sponsors

• Platinum Sponsors: Adeia, Infineon, KLA and Siconnex
• Gold Sponsors: Comet Yxlon and SUSS MicroTec
• Event sponsors: Evatec, EV Group (EVG), Okmetic and Teledyne MEMS

For more information, please visit theMEMS & Sensors Imaging Summit website.

Stay in touch on Twitter @SEMIEurope: #SensorsSummit #MEMS #Imaging #SEMIEurope
 

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about MEMS & Imaging Sensors Summit to Spotlight Ubiquitous Sensing for a Sustainable World

MILPITAS, Calif. – July 24, 2023 – With advanced materials a critical enabler of semiconductor growth applications, Strategic Materials Conference (SMC 2023) will gather top executives and leaders from every segment of semiconductor manufacturing for insights into the latest developments in advanced materials October 2-4, 2023 at the Holiday Inn in San Jose, Calif., a change in venue from the DoubleTree by Hilton in San Jose. Registration is open.

SMC is the premier event focused on drivers of advanced materials, highlighting opportunities for key materials across the electronics supply chain in growth markets including computing and data storage, wireless communication, automotive, consumer and industrial electronics.

Themed Materials Readiness for the Next Semiconductor Super Cycle, SMC 2023 will feature the following sessions:

• Session 1: Market and Geopolitical Trends
• Session 2: Future Technology
• Session 3: Materials Driving Performance Session
• Session 4: More than Moore
• Session 5: Sustainability Session 
• Session 6: Executive Panel: Outlook from Semiconductor Industry Executives

SMC 2023 Keynotes

	Randy King CTO, Electronics & Industrial Business DuPont
	John Whitman Corporate Vice President, Front End Operations Central Teams & Procurement Micron
	Iuliana Radu, Ph.D., Deputy Director TSMC

Industry leaders presenting at SMC 2023 include:

• Amkor Technology
• Analog Devices
• Applied Materials
• AT&S
• CEA
• DuPont
• Eastman Chemical Company
• Entegris
• GlobalFoundries
• Intel Corporation
• JSR Corporation
• Lam Research
• Macquarie
• Micron
• Omdia
• Prismark Partners
• Purdue University
• SCREEN SPE US
• SEMI
• Tokyo Electron (TEL)
• TSMC
   

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Strategic Materials Conference 2023 to Spotlight Innovations Paving the Way to the Next Semiconductor Industry Super Cycle

MILPITAS, Calif. – July 19, 2023 – SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, today announced that SEMICON West 2024 at the Moscone Center in San Francisco will be held July 9-11.

SEMICON West is moving to Phoenix for a five-year annual rotation and shifting from its longstanding July event dates to October beginning in 2025. The exhibition and conference will be held again in Arizona in 2027 and 2029, with all three appearances at the Phoenix Convention Center.

Phoenix will first host SEMICON West Oct. 7-9, 2025. The event will continue to be held at the Moscone Center in San Francisco on the alternating years and over the long term.

“We look forward to bringing the remarkable excitement pervasive at SEMICON West 2023 to next year’s exhibition and conference,” said Joe Stockunas, President of SEMI Americas. “Semiconductor industry growth, sustainability and talent will remain major themes at SEMICON West 2024 as we again provide a stage for critical insights and conversations key for the industry to flourish in the years to come.”
 

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Announces SEMICON West 2024 Dates – July 9-11

SAN FRANCISCO, Calif. — July 13, 2023 — SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, today honored industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries. The SEMI Standards awards were announced July 11 at the SEMI International Standards reception at SEMICON West 2023 at the Moscone Center in San Francisco.

SEMI International Standards Excellence Award

Presented since 1992, the Excellence Award this year honored the leadership teams of the Taiwan Fab & Equipment Information Security Task Force and the North America Fab & Equipment Computer and Device Security (CDS) Task Force developed SEMI E187 - Specification for Cybersecurity of Fab Equipment and SEMI E188 - Specification for Malware Free Equipment Integration, respectively. These complementary standards address major fab and semiconductor manufacturing equipment security issues. 

SEMI honored the following award recipients:

• Richard Howard of Cimetrix by PDF Solutions
• Ryan Bond of Intel
• Ares Cho of ITRI
• Leon Chang of TSMC

SEMI E187 significantly improves information security across the supply chain including semiconductor manufacturers, customers, and suppliers. SEMI E188 mitigates the spread of malware to manufacturing facilities during capital equipment delivery and helps both device manufacturers and equipment suppliers improve equipment reliability and uptime.

Corporate Device Manufacture Award

The North American SEMI International Standards Corporate Device Member Award recognizes a representative from a device manufacturer for outstanding contributions to the development of SEMI Standards.

• Emily Liew of X-FAB Silicon Foundries SE was instrumental in revising wafer marking standards SEMI M12 and M13. Liew worked with key members of the Silicon Wafer Global Technical Committee to create additional specifications for laser marking on the back surface of 200mm wafers while clarifying the scope of both standards. She oversees the Traceability 5-Year Review Task Force and is an active participant in many other SEMI Global Technical Committees.

Merit Award

The North American SEMI International Standards Merit Award recognizes major contributions to the SEMI International Standards Program in solving complex problems at the task-force level and driving projects to completion.

• Alexander Tregub of ATCP Consulting Services formed and leads the Chemical Mechanical Planarization Consumables (CMP-C) Task Force under the SEMI Liquid Chemicals North America Global Technical Committee. Tregub helped drive the publication of four new CMP-C standards for pads hardness, density and porosity, disks, and windows (SEMI C100, C102, C103, C104) with two more in development (rings and PSA). Together, Tregub and the CMP-C Task Force, demonstrates tremendous effort, dedication, and support to advance the technology and fulfill the needs of semiconductor manufacturers.

Leadership Award

The North American SEMI International Standards Leadership Award recognizes individuals who have strengthened the SEMI Standards Program through member training, mentoring, and new member recruitment. Leaders play a critical role in preparing new volunteers to become productive committee contributors, efficiently guiding them through the standardization process.

• Andrew Petraszak of Tokyo Electron guided the S1 (Safety Labels) Revision Task Force through consensus building to improve its industry relevance of SEMI S1 and alignment with best practices. He rallied his peers as well as his competitors to complete the revision of SEMI S1. Petraszak not only leads the S2 Mechanical Design Task Force, working to improve lifting equipment (§ 18.6) and hinged loads (§ 18.7) of the prominent SEMI S2, Safety Guideline for Manufacturing Equipment, he is also spearheading the improvements to SEMI S3 (heating systems).

Honor Award

The North American SEMI International Standards Honor Award recognizes individuals with a longstanding dedication to advancing SEMI Standards. 

• Mohamed Saleem of Brooks Instrument/ITW has been an active participant in the SEMI Standards Program as a volunteer industry expert for more than 25 years. Saleem’s extensive experience in the SEMI Standards Program is critical in driving results to completion and he remains a key force in pushing topics through the SEMI Standards process. Saleem is a member of the North America Regional Standards Committee and chairs the Gases North America Global Technical Committee. He also leads three other Gases task forces and has authored many widely used standards such as SEMI F20 (316 SS distribution systems), F58 (test method for moisture dry-down in gas delivery systems), F70 (particle contribution), F105 (guide for metallic material compatibility), andSEMI E186 (EtherCAT ports in MFCs).

• Koh Murai of KESG/MEGA has been an active participant in the SEMI Standards Program as a volunteer industry expert for over 12 years and is a member of the North America Regional Standards Committee. Murai chairs the Liquid Chemicals North America Global Technical Committee, leads the High Purity Task Force and provides support in many other Liquid Chemicals task forces. Murai has been instrumental in authoring and revising many known standards such as SEMI F31 (bulk chemical distribution systems), F39 (chemical blending systems), F41 (qualification of a bulk chemical distribution system), the E49 series (E49.2, E49.4, E49.5, E49.7 – Guide for High Purity and Ultrahigh Purity Piping Performance, Subassemblies, and Final Assemblies), other various chemical standards, and several new slurry standards.

For more information, visit the SEMI International Standards webpage.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Standards Leaders Honored at SEMICON West 2023

SAN FRANCISCO — July 13, 2023 — Recognizing innovations and other outstanding accomplishments in flexible hybrid electronics (FHE), SEMI FlexTech, a SEMI Technology Community, yesterday presented the 2023 FLEXI Awards at the FLEX Conference and Exhibition, co-located with SEMICON West 2023 in San Francisco.

The FLEXI Awards spotlight FHE contributions in five categories: R&D Achievement, Product Innovation and Commercialization, Environmental Sustainability, Workforce Development and Industry Leadership.

2023 FLEXI Award Winners

R&D Achievement – Pradeep Lall, MacFarlane Endowed Distinguished Professor and Director at Auburn University, was recognized for his landmark contributions in developing additive manufacturing processes and reliability testing for additive printed flexible electronics. His research has been instrumental in achieving surface-mount assembled additively printed circuits. He has regularly presented papers at the FLEX Conference focusing on process, material, and reliability advancements for additively printed FHE and is the academic co-lead of the SEMI Task Force on FHE Reliability Standard Development.

Product Innovation and Commercialization – Dr. Azar Alizadeh, Principal Scientist, and her team at GE Research won a FLEXI for developing low-cost wireless, flexible, and wearable medical devices for both military and clinical use. The wireless vital sign monitoring system has significantly advanced low-power, wearable, wireless multi-parameter devices and analytics capable of monitoring heart rate, respiration rate, blood oxygenation, continuous changes in blood pressure and skin temperature for ambulatory patient monitoring and decision making.

Environmental Sustainability – Robert Praino, co-founder and COO of CHASM, received a FLEXI for leading a project with U.S. Department of Energy to advance the decarbonization of cement through the CHASM NTeC-C additive that reduces the amount of cement in concrete, eliminating 0.7 metric tons of CO² per ton of concrete. For new semiconductor fabs between 8 million and 15 million square feet, the additive could reduce CO² from the floor construction alone by 18,000 to 36,000 metric tons.

Workforce Development – Dr. Peter Doerschuk of Cornell University was recognized as a key advocate and intellectual partner in applying AI/ML approaches to optimize cleanroom processes. He has been instrumental in training master’s degree students in image processing and deep learning, many hired by top develop AI tool developers. His work has led to a deep neural net that will be used by several Cornell engineering students in the coming years. A key focus of Dr. Doerschuk is to help grow the workforce needed to develop next-generation micro- and nano-scale manufacturing strategies for both FHE and traditional chip manufacturing.

Industry Leadership – Dr. Nancy Stoffel, Platform Leader for Flexible Hybrid Electronics at GE Research, won a FLEXI for her outstanding leadership in advancing FHE manufacturing. She has led roadmapping and gap analysis workshops critical to identifying future project topics and building out a robust FHE infrastructure. Dr. Stoffel is also addressing the need for more STEM workers and advocates tirelessly for diversity in science and engineering by supporting and speaking on the topic at workshops, panels, programs and other forums.

About the FLEXI Awards Committee

The FLEXI Awards committee consists of representatives from Applied Materials, Eli Lilly, STMicroelectronics and UES.
 

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI FlexTech Announces 2023 FLEXI Award Winners for Outstanding Achievements in Flexible Electronics