MILPITAS, Calif. — January 2, 2024 — Global semiconductor capacity is expected to increase 6.4% in 2024 to top the 30 million *wafers per month (wpm) mark for the first time after rising 5.5% to 29.6 wpm in 2023, SEMI announced today in its latest quarterly World Fab Forecast report.

The 2024 growth will be driven by capacity increases in leading-edge logic and foundry, applications including generative AI and high-performance computing (HPC), and the recovery in end-demand for chips. The capacity expansion slowed in 2023 due to softening semiconductor market demand and the resulting inventory correction.

“Resurgent market demand and increased government incentives worldwide are powering an upsurge in fab investments in key chipmaking regions and the projected 6.4% rise in global capacity for 2024,” said Ajit Manocha, SEMI President and CEO. “The heightened global attention on the strategic importance of semiconductor manufacturing to national and economic security is a key catalyst of these trends.”

Covering 2022 to 2024, the World Fab Forecast report shows that the global semiconductor industry plans to begin operation of 82 new volume fabs, including 11 projects in 2023 and 42 projects in 2024 spanning wafer sizes ranging from 300mm to 100mm.

China Leads Semiconductor Industry Expansion

Boosted by government funding and other incentives, China is expected to increase its share of global semiconductor production. Chinese chip manufacturers are forecast to start operations of 18 projects in 2024, with 12% YoY capacity growth to 7.6 million wpm in 2023 and 13% YoY capacity growth to 8.6 million wpm in 2024.

Taiwan is projected to remain the second-largest region in semiconductor capacity, increasing capacity 5.6% to 5.4 million wpm in 2023 and posting 4.2% growth to 5.7 million wpm in 2024. The region is poised to begin operations of five fabs in 2024.

Korea ranks third in chip capacity at 4.9 million wpm in 2023 and 5.1 million wpm in 2024, a 5.4% increase as one fab comes online. Japan is expected to place fourth at 4.6 million wpm in 2023 and 4.7 million wpm in 2024, a capacity increase of 2% as it starts operations of four fabs in 2024.

The World Fab Forecast shows the Americas increasing chip capacity by 6% YoY to 3.1 million wpm with six new fabs in 2024. Europe & Mideast is projected to up capacity 3.6% to 2.7 million wpm in 2024 as it launches operations of four new fabs. Southeast Asia is poised to increase capacity 4% to 1.7 million wpm in 2024 with the start of four new fab projects.

Foundry Segment Continues Strong Capacity Growth

Foundry suppliers are forecast to rank as the top semiconductor equipment buyers, increasing capacity to 9.3 million wpm in 2023 and a record 10.2 million wpm in 2024.

The memory segment slowed expansion of capacity in 2023 due to weak demand in consumer electronics including PCs and smartphones. The DRAM segment is expected to increase capacity 2% to 3.8 million wpm in 2023 and 5% to 4 million wpm in 2024. Installed capacity for 3D NAND is projected to remain flat at 3.6 million in 2023 and rise 2% to 3.7 million wpm next year.

In the discrete and analog segments, vehicle electrification remains the key driver of capacity expansion. Discrete capacity is forecast to grow 10% to 4.1 million wpm in 2023 and 7% to 4.4 million wpm in 2024, while Analog capacity is projected to grow 11% to 2.1 million wpm in 2023 and 10% to 2.4 million wpm in 2024.

The latest update of the SEMI World Fab Forecast report, published in December, lists 1,500 facilities and lines globally, including 177 volume facilities and lines with various probabilities expected to start operation in 2023 or later. 

Download a sample of the SEMI World Fab Forecast report.

For details about SEMI reports on other semiconductor sectors, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at [email protected].

*200mm equivalent

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contacts

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]

Chih-Wen Liu/SEMI Taiwan
Phone: 886.3.560.1777
Email: [email protected]

• Read more about Global Semiconductor Capacity Projected to Reach Record High 30 Million Wafers Per Month in 2024, SEMI Reports

MILPITAS, Calif. — December 13, 2023 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today announced the election of two new members to the SEMI International Board: Kai Beckmann, Member of the Executive Board and CEO of the Electronics business sector of Merck KGaA, Darmstadt, Germany, and Benjamin Loh, Chair of the Management Board and President and CEO of ASM. The tenure of the new board members begins immediately.

“We congratulate the newly elected International Board members, Kai Beckmann and Benjamin Loh, and thank them for their commitment to guide SEMI in representing the global electronics manufacturing and design supply chain,” said SEMI President and CEO Ajit Manocha. “Kai and Benjamin add to the breadth and depth of knowledge on our Board of Directors and will help us to ensure that SEMI programs continue to advance semiconductor industry growth, address top concerns, and deliver exceptional member value.”

SEMI’s 18 independent voting directors and 11 emeritus directors represent companies from Europe, China, Japan, Korea, North America, and Taiwan, reflecting the global scope of the association’s activities. SEMI directors are elected by the general membership as voting members of the Board and can serve a total of five three-year terms.

Kai Beckmann joined the Executive Board of Merck KGaA, Darmstadt, Germany in April 2011. He has served as CEO of the Electronics business sector since September 2017. Under his leadership the business successfully transformed into a leading player in the global electronics materials market. Beyond Merck KGaA, Darmstadt, Germany, he has several external mandates such as President of the German Federation of Chemical Employers' Associations and Chairman of the Advisory Board of Fraunhofer Institute for Computer Graphics Research.

Benjamin Loh was appointed Chair of the Management Board and President and CEO of ASM in May 2020. He is a non-executive director of ASMPT and in the past held positions as non-executive director at Schneeberger, Schweiter Technologies AG, and Liteq BV. Loh was a SEMI China regional advisory board member while employed with Unaxis Corporation and living in China from 2002 to 2005.

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Announces Election of Two New International Board Members

MILPITAS, Calif. — December 12, 2023 — SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced recipients of the 2023 SEMI Sustainability Excellence Award. SEMI President and CEO Ajit Manocha selected the award recipients based on their inspirational leadership and innovative approaches to expanding sustainability practices at their companies and in the semiconductor industry in order to meet aggressive net zero emission goals.

The leaders were also recognized for their contributions to the Path to Net Zero session during the SEMICON West 2023 CEO Summit keynote program. The honorees will be commemorated on the SEMI Wall of Fame at the association’s headquarters in Milpitas.

2023 SEMI Sustainability Excellence Award honorees:

• Gary Dickerson, President and CEO, Applied Materials
• Keyvan Esfarjani, Executive VP, Chief Global Operations Officer, GM of Manufacturing, Supply Chain and Operations, Intel Corporation
• Mukesh Khare, General Manager of IBM Semiconductors and VP of Hybrid Cloud Research, IBM
• Aamir Paul, President, North America, Schneider Electric

“The drive toward net zero is a challenge that requires intense collaboration across international borders and supply chains,” said Manocha. “SEMI is pleased to honor Gary, Keyvan, Mukesh and Aamir for their tremendous inspiration as the semiconductor industry works to achieve its emissions goals. Their leadership and passion are strong drivers for their companies adopting leading-edge sustainability practices, and their actions are a powerful motivator for the entire industry supply chain to follow suit.”

The recipients were selected based on their alignment with principles of the SEMI Sustainability Initiative and its focus on Environment, Social and Governance (ESG) issues.

Recipient Accomplishments

Gary Dickerson is a longtime sustainability leader and a major contributor to the semiconductor industry's net zero pathway. His passion for making a positive impact is reflected in Applied Materials’ vision to Make Possible a Better Future. Dickerson champions Applied’s ESG leadership initiatives, including the company’s “3x30” program, which is aimed at reducing the environmental impact of its products, and Applied’s Net Zero 2040 Playbook, a bold framework for reducing the industry’s carbon emissions through close collaboration with Applied’s customers and suppliers.

Keyvan Esfarjani leads Intel’s ambitious sustainability efforts, which include achieving 100% renewable energy, net positive water and zero waste to landfill by 2030, reaching net zero Scope 1 and 2 GHG emissions by 2040, and collaborating with suppliers to meaningfully reduce Scope 3 emissions and achieve net-zero upstream GHG emissions by 2050. He is a consistent force in reducing Intel’s environmental footprint while driving global capacity expansion plans and calling for the semiconductor industry to accelerate its timeline in meeting climate goals.

Dr. Mukesh Khare leads a global IBM team that is redefining the future of computing for products such as generative artificial intelligence (AI) and high-performance computing, two energy-intensive technologies. He leads teams of researchers devising new methods to process data more efficiently and accelerate the pace of progress towards sustainable quantum, AI and hybrid cloud infrastructure while advancing the industry’s drive to net zero emissions.

Aamir Paul led Schneider Electric’s partnership with Applied Materials and Intel to launch the pioneering Catalyze program. Unveiled at SEMICON West 2023, the Catalyze program promotes the adoption of a renewable and low-carbon energy roadmap for the chip sector and provides global partners in the semiconductor value chain with better access to renewable energy solutions and comprehensive decarbonization assistance. By collaboratively digitalizing energy for efficiency and sustainability, the Catalyze program’s partners allow energy transition to be advantageous for businesses and environmentally beneficial for all.

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Honors Semiconductor Industry Sustainability Leaders

MILPITAS, Calif. – December 11, 2023 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the first award of U.S. CHIPS and Science Act incentives to strengthen the United States semiconductor industry ecosystem.

“We commend the thoughtful approach the U.S. Department of Commerce has taken in awarding incentives and are pleased to see the advancement of incentives to bolster the resiliency of the domestic semiconductor supply chain,” said Joe Stockunas, President of SEMI Americas. “In order for the global semiconductor industry to support the push for digitalization and a diverse range of smart applications over the coming years, we must go beyond elevating just one facet of the supply chain and pursue a fortified ecosystem encompassing equipment, materials and advanced packaging. SEMI has advocated with the U.S. Chips Program Office to distribute incentives with this goal in mind, and we are confident in their understanding of the industry’s needs."

The CHIPS and Science Act provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new or updated semiconductor-related manufacturing programs. The funding includes $39 billion for grants available to semiconductor manufacturers as well as equipment and materials suppliers and $11 billion for federal semiconductor research programs.

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

SEMI Contact

Samer Bahou/SEMI

Phone: 1.408.943.7870

Email: [email protected]

• Read more about SEMI Applauds Advancement of U.S. CHIPS and Science Act Incentives

TOKYO — December 12, 2023 — Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach $100 billion in 2023, a contraction of 6.1% from the industry record of $107.4 billion posted in 2022, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2023. Semiconductor manufacturing equipment growth is expected to resume in 2024, with sales forecast to reach a new high of $124 billion in 2025, supported by both the front-end and back-end segments.

“We anticipate a temporary contraction in 2023 due to the cyclical nature of the semiconductor market,” said Ajit Manocha, SEMI President and CEO. “2024 will be a transition year. We then expect a strong rebound in 2025, driven by capacity expansion, new fab projects, and high demand for advanced technologies and solutions across the front-end and back-end segments.”

Semiconductor Equipment Sales by Segment

After registering a record $94 billion in sales last year, the wafer fab equipment segment, which includes wafer processing, fab facilities and mask/reticle equipment, is projected to slip 3.7% to $90.6 billion in 2023. This contraction marks a significant improvement from the 18.8% decline forecast by SEMI in its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective. The upward revision is primarily due to strong equipment spending by China. Wafer fab equipment segment sales are projected to grow at a modest 3% in 2024 from the revised 2023 base due to limited memory capacity addition and the pause of mature capacity expansion. A growth path with a further 18% expansion in 2025 is expected as new fab projects, capacity expansion and technology migrations drive investments to nearly $110 billion.

The decline in back-end equipment segment sales started in 2022 and continued in 2023 due to challenging macroeconomic conditions and softening semiconductor demand. Semiconductor test equipment market sales are projected to contract by 15.9% to $6.3 billion in 2023, while assembly and packaging equipment sales are expected to drop by 31% to $4.0 billion in the same year. The test equipment and assembly and packaging equipment segments are forecast to expand by 13.9% and 24.3%, respectively, next year. Back-end segment growth is expected to continue in 2025, with test equipment sales rising 17% and assembly and packaging sales increasing 20%.

Semiconductor Equipment Sales by Application

Equipment sales for foundry and logic applications, accounting for more than half of total wafer fab equipment receipts, are expected to log a 6% increase year-over-year to $56.3 billion in 2023 despite softer end-market conditions. The application segment is forecast to contract 2% in 2024 as mature technology expansion slows and spending on leading-edge technology improves. Foundry and logic equipment investments are projected to increase 15% in 2025 to $63.3 billion, driven by increased capacity expansion purchases and the introduction of new device architectures.

As anticipated, memory-related capital expenditures will see the sharpest decline in 2023. NAND equipment sales are predicted to drop by 49% to $8.8 billion in 2023 but will surge 21% to $10.7 billion in 2024 and rise another 51% to $16.2 billion in 2025. DRAM equipment sales are expected to remain stable, growing by 1% and 3% in 2023 and 2024, respectively. Supported by continuous technology migration and expanding demand for high-bandwidth memory (HBM), DRAM equipment segment sales are expected to increase an additional 20% to $15.5 billion in 2025.

Semiconductor Equipment Sales by Region

China, Taiwan and Korea are expected to remain the top three destinations for equipment spending through 2025. China is projected to maintain the top position over the forecast period as the region’s equipment billings continue to soar. Equipment shipments to China are projected to surpass a record $30 billion in 2023, widening its lead with other regions. While equipment spending for most tracked regions is expected to fall in 2023 before resuming growth in 2024, China is expected to see a mild contraction in 2024 after heavy investments in 2023.

The following results reflect market size by segment and application in billions of U.S. dollars:

Source: SEMI December 2023, Equipment Market Data Subscription

* Total equipment includes new wafer fab, test, and assembly and packaging. Total equipment excludes wafer manufacturing equipment. Totals may not add due to rounding.

The SEMI forecast is based on collective input from top equipment suppliers, the SEMI Worldwide Semiconductor Equipment Market Statistics (WWSEMS) data collection program and the industry-recognized SEMI World Fab Forecast database.

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

• Monthly SEMI North American Billings Report, an early perspective of equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and more than 22 market segments
• Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market

For more information online, please visit SEMI Market Data.

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Total Semiconductor Equipment Sales Forecast to Reach Record $124 Billion in 2025, SEMI Reports

TOKYO ─ December 12, 2023 ─ SEMICON Japan, the largest and most influential gathering of the microelectronics manufacturing supply chain in Japan, opens tomorrow at Tokyo Big Sight with more than 900 exhibitors from 19 regions showcasing their latest products and technologies. Registration is open for the Dec. 13-15 exhibition, conferences and technology symposiums.

Themed Forward as One, SEMICON Japan 2023 will highlight cutting-edge technology innovations in areas including artificial intelligence (AI), robotics, power electronics, Internet of Things (IoT), smart mobility, and quantum computing. The event will also feature presentations and executive panels on key industry topics with thought leaders from the electronics design and manufacturing ecosystem, academia, and government. 

This year the exhibition expands to the East Exhibition Hall of Tokyo Big Sight, spotlighting semiconductor manufacturing technologies, equipment, and materials as well as Smart applications for mobility and IoT devices.

SEMICON Japan 2023 Opening Keynote Panel

The Opening Keynote Panel with the following speakers will address global trends and Japan's strategy for the future of the semiconductor industry.

• Akira Amari, Member of House of Representatives, Japan
• Terry Higashi, Chairman of the Board of Directors, Rapidus
• Ajit Manocha, President & CEO, SEMI

Concurrent Events with SEMICON Japan 2023

• Advanced Packaging and Chiplet Summit (APCS)
  • Themed A New Era for the Semiconductor Packaging Industry: Direction of Evolution, this year’s APCS will combine an exhibition of the latest advanced packaging technologies with presentations by thought leaders and business networking.

• FLEX Japan 2023
  • Themed A New Era of Business Created by Sustainability, the FLEX Japan 2023 exhibition and conference will spotlight cutting-edge flexible hybrid electronics technologies and applications, including thin, lightweight bendable electronics.

SEMICON Japan 2023 Technology Pavilions

The event’s Technology Pavilions will showcase leading technologies driving semiconductor and electronics market demand.

• SEMI Smart Mobility Pavilion
  • Chinese automobile manufacturer Human Horizons will exhibit its HiPhi Z electric vehicle for the first time in Japan. The car, the automaker’s vision of the future of mobility in the self-driving era, will showcase a new in-car system with innovative video entertainment, navigation and telecommunications capabilities to enhance the mobility experience for drivers and passengers. The Electronic Controller Unit (ECU) for the Audi A8 and Tesla Model 3, the central computer system that controls various vehicle electrical systems or subsystems, will also be on display.

• Quantum Computing Pavilion
  • The Quantum Computing Pavilion will highlight semiconductor industry collaboration opportunities to help drive innovations of quantum computing products and technologies. Superconducting quantum chips and semiconductor quantum chips will also be on display as experts discuss the latest technical practices and challenges on stage at the Quantum Computing Forum.

• Power Electronics Pavilion
  • The Pavilion will feature companies, universities, and research institutes developing technologies and materials for use in power devices, modules, systems, and circuits in power electronics in the near future. The Pavilion will also highlight the newest research results including the promise of semiconductors made of diamonds.

• Ministry of the Environment Pavilion
  • The Ministry of the Environment promotes high-quality gallium nitride (GaN) to support the expanded use of next-generation power semiconductors that can significantly increase the power efficiency of semiconductors and help the chip industry decarbonize. The Pavilion will also highlight the latest results of industry-government-academia collaboration to improve semiconductor manufacturing sustainability, future prospects, and challenges.

• Disassembly Exhibition Corner
  • Disassembled components of previous iPhone models will be displayed alongside Huawei's new Mate60 Pro smartphone and ECUs to highlight miniaturization advances that have driven the evolution of semiconductor performance and power usage over the past decade. The exhibit will include expert panels on speed gains of semiconductor components and other aspects of miniaturization technology.

Sustainability

• Sustainability Forum
  • Themed Semiconductors Supporting Global Environmental Protection and Global Economic Development, the Forum will focus on ways to promote sustainable growth throughout the electronics supply chain.

• Sustainability Lounge
  • Details on SEMI’s sustainability initiatives and related topics will be available at the Lounge.

• Company Exhibits
  • More than 130 companies, including Sony Semiconductor Solutions Corporation and Nikon Corporation, will showcase their sustainability-related initiatives at their booths.

Startup Innovations

The Matsuo Lab Startups are a select group of companies founded by or with the support of the Matsuo Lab at the University of Tokyo. The Matsuo Lab will showcase seven startups developing cutting-edge artificial intelligence technologies.

Workforce Development

With talent development a critical issue, female semiconductor industry professionals will gather for the Women in Business program to explore how the industry can build a more diverse, equitable and inclusive workforce. The Academia Award presented at SEMICON Japan will recognize top research institutes in engineering fields such as machinery and electronics, materials and chemicals, and materials science. All award nominees will present their work at dedicated booths, and the three award winners will be announced on Dec. 13th.

Additionally, key figures from industry, government, and academia will discuss the importance of workforce development in the semiconductor industry at the Semiconductor Technology Symposium. The experts will also share case studies and participate in panel discussions on talent development solutions.

For more details, please see the SEMICON Japan 2023 Agenda-at-a-Glance.

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contacts

Shuichi Sato/SEMI Japan
Phone: 81.3.3222.5757
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON Japan 2023 Opens Tomorrow to Showcase Smart Data-AI, Smart Mobility, Sustainability, Advanced Packaging, Talent

BERLIN, Germany — December 6, 2023 — SEMI today announced the SEMI Leadership Accelerator to foster industry growth by assisting organizations in cultivating the next generation of leaders. This initiative will support semiconductor supply chain organizations in evaluating high-potential employees, offering personalized leadership coaching, and delivering tailored training for individual and team development. Developed in a collaboration between SEMI Europe and Mercuri Urval, the SEMI Leadership Accelerator provides science-based, ISO-certified programs, empowering senior leaders, executives, and board members to navigate global challenges, drive business transformation, and achieve sustained growth in the semiconductor sector.

With Europe projected to need 350,000 new workers in the semiconductor industry by 2030, Laith Altimime, President of SEMI Europe, emphasized the imperative for cultivating leaders capable of navigating the complexities of the semiconductor industry. “The semiconductor industry must further develop diverse leaders who can reshape businesses in a complex and fast-changing world of uncertainty. The growing number of job vacancies in Europe’s semiconductor sector risks undercutting its growth potential as companies expand manufacturing capacities. It is essential for leaders in the industry to unlearn outdated approaches and prepare for unforeseen challenges. The SEMI Leadership Accelerator will facilitate this transformative process.”

Mercuri Urval, is a global leadership advisory firm with over 50 years of experience, an extensive global presence, and specialized knowledge across industry sectors. Methodically crafted, semiconductor industry-specific programs tailored by Mercuri Urval and leveraging SEMI’s extensive industry insights and network, will enable the SEMI Leadership Accelerator to address leadership development needs, empowering companies to identify and nurture leaders internally.

Learn more about the SEMI Leadership Accelerator by contacting SEMI Europe at [email protected].

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Launches Leadership Accelerator to Cultivate Future-Ready Microelectronics Industry Leaders

SEOUL, South Korea ─ December 5, 2023 ─ SEMICON Korea 2024 will gather industry experts and visionaries January 31-February 2 at COEX in Seoul for the latest developments and trends in areas vital to industry growth and solutions to some of the world’s greatest challenges. Featured topics will include advanced chip technologies, sustainability, smart manufacturing, government investments in semiconductor manufacturing and workforce development. The region’s premier microelectronics event, SEMICON Korea 2024 will also offer new and enhanced business programs. Registration is open.

Headlining SEMICON Korea 2024 will be keynotes by representatives from SK hynix, Merck KGaA, Darmstadt, Germany, and Eliyan, while more than 30 conferences will feature presentations by 200 thought leaders. The exhibition area, covering more than 37,000 square meters (over 9 acres), will feature nearly 500 companies from across the Korea semiconductor ecosystem showcasing cutting-edge semiconductor manufacturing technologies and services at 2,100 booths.

More SEMICON Korea 2024 Highlights

• STS (SEMI Technology Symposium) – The Symposium will showcase the latest technology advances and roadmaps in sessions on six key semiconductor manufacturing processes:
• Lithography
• Materials
• Device
• Etch
• CMP & Cleaning
• Packaging
• Technology and Market Conferences – Get the latest insights on market trends, sustainability, smart manufacturing, test, metrology and inspection, and SiC power semiconductors.
• Enhanced Business Programs – The Investment Forum, designed to attract investments in Korea semiconductor companies, has expanded to more than double its previous size.
  • New: Europe Investment Forum – Representatives from the European Commission, Belgium, France, Germany, Netherlands, Sweden, Switzerland and the United Kingdom will discuss their innovation policies and investment strategies.
  • New: Southeast Asia Investment Forum – Delegates from Malaysia, the Philippines, Thailand, and Vietnam will participate in the investment forum for the first time.
  • U.S. Investment Forum – Representatives from New York, Arizona, Indiana, and Texas will also participate to discuss their states’ policies for supporting semiconductor manufacturing and updates on the U.S. CHIPS and Science Act.
• New: Start-up Summit – Venture capitalists and Korea start-ups will come together to explore business-matching opportunities. Applied Ventures, LG Technology Ventures, M Ventures, Samsung Ventures, SK hynix, TEL Venture Capital and UDC Ventures will participate.
• Supplier Search Program – This popular SEMICON Korea business-matching program will host nearly 100 meetings between global chipmakers such as Micron, Infineon and Kioxia and suppliers of equipment, materials and parts companies to support domestic semiconductor companies’ expansion into overseas markets.

Workforce Development

The Meet the Experts! program returns to help address the talent shortage, with semiconductor company engineers providing mentoring presentations on career development for science and engineering students aspiring to enter the semiconductor industry.

The Women-in-Technology program will again focus on increasing the diversity of the chip industry workforce. Female leaders in high-tech will offer guidance on career paths for female engineers and present strategies for enhancing workplace diversity.

Online Registration

Online registration for SEMICON Korea 2024 is open through January 24, 2024. Registration for exhibitions and keynote speeches during this period is complimentary, while conference registration is available at an early bird price.

For more details, please visit the SEMICON Korea 2024 website.

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contacts

Jaegwan Shim/SEMI Korea
Phone: 82+10.3014.9807
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON Korea 2024 to Showcase Advanced Chip Technologies, Sustainability, Smart Manufacturing, Talent, New Business Programs

Energy Collaborative to highlight initial sponsors, partners and mission at COP28 2023 United Nations Climate Change Conference

MILPITAS, Calif. — November 30, 2023 — Aiming to reduce global semiconductor ecosystem carbon emissions, SEMI and the Semiconductor Climate Consortium (SCC) have created the Energy Collaborative (EC) to understand and clear roadblocks to the installation of low-carbon energy sources in the Asia-Pacific region. The EC, a collective of industry leaders, will provide a consolidated view of priorities for low-carbon energy in the region.

“Sharing resources to start this foundational semiconductor industry sustainability work now is important to enable wider access to low-carbon energy in the next five to ten years,” stated Young Bae, SCC Governing Council member and sponsor for the SCC Scope 2 Working Group, and Global Business Director, Advanced Cleans Technologies at DuPont. “One of the key action areas the SCC has identified is the lack of low-carbon energy plans and actions in the Asia-Pacific region. The EC will help the SCC by accelerating investments to broaden access.”

The EC sponsoring companies will anchor the collective’s work to engage in roundtables and fact-finding sessions. Initial sponsors include:

• Applied Materials
• AMD
• ASE
• ASML
• JSR
• Lam Research
• Macquarie Group
• Samsung Electronics
• TotalEnergies
• TSMC

McKinsey & Company is a Knowledge Partner to the initiative, providing fact-based analysis and support.

“The semiconductor value chain and its downstream partners and customers have a pivotal role to play in the acceleration of low-carbon energy installations, due to their scale in high-priority markets and the extent to which they will drive growth in future energy demands,” stated Ajit Manocha, President and CEO of SEMI. “To reach the emissions reductions goals of the sector, a step function change in ambition and action is required. The EC is focused on that goal – increasing the pace and scaling of access to low-carbon energy.”

A recent SCC report found that the semiconductor value chain is a significant consumer of energy in almost all key Asian markets. Additionally, a recent analysis by McKinsey & Company[1] shows that even with major semiconductor companies’ latest commitments, which are more stringent than past measures, the industry is not on track to limit emissions to the extent required under the 2015 Paris Agreement. The analysis finds that both individual and collective actions by semiconductor players can help the entire industry increase its sustainability effort and meet the 1.5°C challenge.

SEMI representatives will host a special session on December 2 in the Green Zone at COP28 in Dubai, United Arab Emirates. For more information, contact Heidi Hoffman of SEMI at [email protected].

SEMI welcomes additional sponsors and partners of the Energy Collaborative. To join the collaborative or learn more, contact [email protected].

About the Semiconductor Climate Consortium
Focused on overcoming emissions challenges facing the semiconductor value chain, the Semiconductor Climate Consortium (SCC) was formed based on the principles of collaboration, ambition and transparency. SCC working groups are working to establish more accurate emissions reporting, measure the value chain’s progress and accelerate the development of sustainability solutions. An outgrowth of the SEMI Sustainability Initiative, the SCC has more than 90 members. 

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

[1] https://www.mckinsey.com/industries/semiconductors/our-insights/keeping-the-semiconductor-industry-on-the-path-to-net-zero

• Read more about New Energy Collaborative Aims to Accelerate Creation of Low-Carbon Energy Access in Asia-Pacific for the Semiconductor Climate Consortium

MILPITAS, Calif. – November 30, 2023 – Global semiconductor equipment billings contracted 11% year-over-year to US$25.6 billion in the third quarter of 2023, while quarter-over-quarter billings slipped 1% during the same period, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

“The Q3 2023 dip in equipment billings was due to softening chip demand,” said Ajit Manocha, SEMI President and CEO. “However, China has shown strong demand and spending power for mature-node technologies, a sign of the industry's resilience and growth potential in the long run.”
 

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

Download a sample of the EMDS report.

For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. More details are also available on the SEMI Market Data webpage.

About SEMI
SEMI^® connects 3,000 companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Q3 2023 Global Semiconductor Equipment Billings Drop 11% Year-Over-Year, SEMI Reports