semiconductors

The Innovators of the Future Awards are a highlight of the FLEX Conference and Exhibition, bringing out the best and the brightest in the flexible electronics industry. Review the winners for FLEX 2022.

With sustainability and workforce development two big themes at SEMICON West 2022, Françoise von Trapp of 3D InCites spoke with Ajit Manocha, SEMI President and CEO; Shari Liss, Executive Director of the SEMI Foundation; and Mousumi Bhat, Vice President of SEMI Sustainability Programs. Listen in.

Rick Eram, Excellicon’s VP of sales and operations, discusses ways for designers to compare the physical floorplan against the actual register transfer level (RTL) code and constraints, chip design trends and complexity, and a few of his predictions for the design and verification market.

Antoine Amade, VP of sales for the Microcontamination Control division at Entegris, discusses innovation opportunities for semiconductor technologies entering the automotive domain, views on design and process engineering, and collaboration between the semiconductor and automotive industries.

Alternative career paths are more important today than ever before, particularly in the semiconductor industry, where an aging workforce and a host of new fabs under construction threaten to worsen the existing talent shortage. The industry faces a multifaceted challenge in the coming years– people.

Vikram Bhatia, Director of the Synopsys Cloud Go-to-Market and Product Strategy, discusses leveraging a flexible, pay-per-use approach to fuel the next phase of semiconductor innovation - bring your own cloud (BYOC) and software as a service (SaaS) deployment model.

In January 2022, SEMI Taiwan released SEMI E187 – Specification for Cybersecurity of Fab Equipment. What cybersecurity pain points does SEMI E187 ultimately address?

Atomic Layer Deposition (ALD) players are poised to seize a new growth opportunity after the chip shortage pushed manufacturers to announce fab capacity expansions worldwide. Driven by the wafer production volume increase, ALD solutions are now expected to grow and enter the MtM devices market.

The SEMI FlexTech R&D program recently completed project FT19-19-190 with SAFI-Tech to create a solder material with a substantially lower melting point than conventional solder paste, reducing the thermal stresses created by high-temperature processing used for smaller packaging technologies.

A critical foundation for success in this new multiphysics reality is the development of open, extensible and cloud-optimized platforms that enable many different tools and data sets to work together and build towards a realistic and accurate simulation of physical reality.