semiconductor manufacturing

How Cool is That - Northrop Grumman’s “World’s Fastest Microchip” won the 2024 “Coolest Thing Made in California” contest, organized by the California Manufacturers Technology Association (CMTA). Public votes were cast for 138 California-made products in four rounds, culminating in this microchip—boasting speeds up to 1 terahertz—being crowned the winner. Manufactured in Redondo Beach, CA, the chip is 1,000 times faster than smartphone processors and represents California’s cutting-edge manufacturing sector. The contest and award ceremony were celebrated during CMTA’s MakingCA Conference, honoring manufacturing’s $310 billion contribution to the state’s economy. Doing the Green Wave - NIST scientists have successfully created a compact, full-spectrum laser covering the green-yellow-orange wavelengths, long considered challenging to produce. Traditional semiconductor lasers struggled with green wavelengths due to material limitations, so NIST turned to nonlinear optics, producing different wavelengths by adjusting silicon nitride device geometry and laser input. This breakthrough enables more precise, pure wavelengths ideal for quantum computing, medical devices, and underwater communications. Their method combines pump laser tuning and device adjustments, achieving 150+ wavelengths, demonstrating a significant advancement in accessible, high-quality lasers.Source: NIST’s Compact Green Semiconductor Laser - IEEE SpectrumEnergy Hero - At the 2024 ITF World conference, AMD CEO Lisa Su spotlighted a new goal: a 100x boost in computing efficiency by 2027. As shrinking transistor sizes yield diminishing returns, materials innovation has become essential for boosting performance and efficiency. Applied Materials has responded with advanced materials engineering solutions, harnessing exotic elements and 3D chip designs to improve efficiency. For instance, Applied’s Integrated Materials Solution™ combines six process technologies to reduce chip wiring resistance by 25%, a critical advance as semiconductor nodes shrink to the atomic scale. These methods promise breakthroughs in power efficiency across AI, personal electronics, and more. Building Automation of the Future - Imagine a future where every device in newly built structures— from HVAC systems and appliances to light switches and sensors—is equipped with a microprocessor and linked through a reliable communication network. This could transform how buildings operate, yielding substantial benefits across various sectors. Chip manufacturers would see new growth opportunities, while builders could offer smarter, more efficient homes. Consumers would gain convenience and comfort, as buildings could dynamically adjust to personal preferences and real-time needs. For instance, rooms would automatically adapt their temperature as people move through them, making manual thermostat adjustments obsolete. This automated approach wouldn’t just create a more comfortable environment but would also optimize energy use, potentially lowering costs and benefiting the environment.Source: Building Automation of the Future - EE TimesDo you have a fun fact to share? We invite SEMI members to share fun facts about the industry or their company. We’ll consider your tidbits for inclusion in future blog articles and or posting on social media. Complete our survey form or email [email protected]. Learn more about the SEMI Foundation and its initiatives to promote industry awareness and help provide a path for those interested in rewarding careers in microelectronics. Follow the SEMI Foundation on LinkedIn, Instagram, X and Facebook. Margaret Kindling is Senior Program Manager for Diversity, Equity, and Inclusion at the SEMI Foundation. She promotes inclusion and belonging via Women in Semiconductors, Semiconductor PRIDE and SEMICON West Workforce Development Pavilion programming.

SEMI Korea Members Day 2025 in September featured a wealth of insights on semiconductor industry market and technology trends. As the two-year semiconductor inventory correction eases, Soo-Kyoum Kim, vice president at International Data Corporation (IDC), provided a market update during his address to the event’s 400 attendees at the Suwon Convention Center. He highlighted that the semiconductor market is showing signs of gradual recovery, with growth predicted for the second half of 2024 and into 2025. This growth, he said, is being fueled by rising demand for artificial intelligence (AI) and high bandwidth memory (HBM). He projected that the total semiconductor market would grow to $779.8 billion in 2025, marking a 15.8% increase from this year's estimate of $673 billion. By next year, the memory market is expected to rise by 24%, largely driven by demand for AI. Although consumer demand will likely weaken due to a slowdown in the Chinese market, Kim shared that easing inventory adjustments will lead to a rebound during the second half of 2024, particularly in the growth of DRAM and NAND. Kim also predicted that the non-memory market, which reached $503.4 billion this year, will grow to $569.4 billion by 2025.Additionally, the compound annual growth rate (CAGR) for semiconductor network and data center sales is projected to be 26.4% and 16.2% by 2028, respectively. Kim explained that the strong demand for AI semiconductors in data centers and networks will help the semiconductor market maintain an 8% CAGR over the next five years, following the 2023 market adjustment.SEMI Korea Members Day HighlightsH.D. ChoThe AI-driven industrial transformation is demanding more advanced processes. To accommodate AI, the industry has shifted its focus away from miniaturization toward back-end processes. However, the challenges facing Korea's semiconductor industry have also intensified. Leading semiconductor research firms shared in-depth market forecasts and presented their latest semiconductor technology roadmaps, offering insights on business strategies for Korea’s semiconductor ecosystem.In his opening remarks, H.D. Cho, president of SEMI Korea, expressed deep gratitude for the exceptional resilience of SEMI Korea’s members, who continue to overcome roadblocks despite global uncertainties. He also highlighted the growth of SEMI Korea’s member companies, emphasizing their positive role in the global semiconductor supply chain, as well as SEMI's ongoing commitment in supporting their innovations.Call for Renewable Energy Policy Reform to Achieve Net ZeroBora Lee, leader of Solutions For Our Climate (SFOC), emphasized the strong correlation between the semiconductor industry and Korea's economic growth. Lee also outlined key factors contributing to the high costs that hinder renewable energy adoption in the semiconductor sector. "Korea's levelized cost of electricity (LCOE) for renewable energy is about 2-3 times higher than the global average," she said. "The establishment of a policy council involving semiconductor companies is a crucial step in developing cooperative strategies to promote the use of renewable energy." In addition, Lee stressed that collaboration among suppliers, consumers, and policymakers is necessary to address these barriers and accelerate the transition to renewable energy within the industry. AI is Reshaping the Global Memory MarketPeter Lee of CITI Group shared that the convergence of cloud and edge computing is helping support new demands from AI, the metaverse, and automotive applications. As a result, this will increase long-term demand for memory. "The growing demand for AI is diversifying the memory market," Lee said. "This includes products such as HBM, LLW, LPDDR5T, and CXL, all of which are expected to see increased adoption according to AI computing requirements."As the need for parallel processing in AI training and inference tasks grows, Lee predicted the demand for HBM3 and DDR5 will significantly rise. HBM's share of total DRAM revenue is expected to increase dramatically – from 11% in 2023, to 30% by 2027. Expected Growth of the GaN Power Semiconductor MarketHo-Young Cha, a professor at Hongik University and co-founder and CTO of ChipsK, highlighted that the GaN power semiconductor market is expected to see continuous growth due to its advantages over silicon-based devices. The expansion of GaN technology applications in various industries, including consumer electronics, automotive, and telecommunications, he said, will drive additional growth."The GaN power semiconductor market will grow from $180 million in 2022 to $2.04 billion by 2028," said Cha. Growth Outlook for the Semiconductor Equipment and Materials Market in 2025 Clark Tseng, director of the SEMI Market Intelligence Team, projected that the short-term outlook for the global semiconductor market will gradually recover due to improvements in end-demand for major electronic product sectors and surging demand for AI chips. "The equipment and materials markets are expected to show a slight improvement in 2024, with a strong recovery anticipated in 2025," Tseng stated. He noted that the equipment market would grow by approximately 3% in 2024 from $95 billion in 2023 and is expected to grow by 15% in 2025. Regarding wafer fab materials, the silicon wafer market is expected to decline from $14.1 billion in 2023 to $13.2 billion in 2024. However, recovery is anticipated to begin in the second half of 2024, with the market projected to reach a new record of $48 billion in 2025. For more insights on Korea and the industry, attend SEMICON Korea from February 19-21, 2025 at COEX Convention Exhibit Center. Visionaries and leaders will gather to discuss the latest developments, innovations, and business opportunities within the industry. As the region’s premier microelectronics event, SEMICON Korea 2025 is expected to host 70,000 attendees, 500 exhibitors, and 200 speakers. More event information, including registration details, will be available soon.Jaegwan Shim is Senior Specialist, Marketing at SEMI.

In the rapidly-evolving semiconductor industry, maintaining a competitive edge is crucial. To position Europe at the forefront of global semiconductor innovation, imec is leading the NanoIC pilot line initiative. Aligned with the European Chips Act, this initiative is a strategic move to bolster Europe's leadership in key markets like high performance computing, automotive, and healthcare.SEMI spoke with Srikanth Samavedam and Jo De Boeck from imec, Belgium, to learn more about the NanoIC pilot line and to better understand its goals, challenges, and prospects. From transitioning to gate-all-around (GAA) nanosheet devices, to developing advanced memory technologies and interconnects, this conversation highlights the cutting-edge advancements made possible through collaboration across the industry’s value chain.SEMI: How is the NanoIC pilot line working to revolutionize the semiconductor industry, and what are its main objectives?Samavedam: The NanoIC pilot line is a European initiative aimed at bridging the gap between R D and industrial innovation. The project is creating a beyond-2nm system-on-chip (SoC) pilot line, developing advanced logic, memory, and interconnect technologies. This effort supports the European Chips Act's vision for leadership and competitiveness in global semiconductor innovation, particularly in critical markets like high performance computing, communication, automotive, energy, and healthcare. However, advanced technologies come with more complexity, and addressing these complexity challenges requires more mature module baseline flows. By improving baseline flow repeatability and variability while reducing defectivity, we can accelerate the development of future technologies. The NanoIC pilot line is working to provide access to these advanced technologies and baselines to develop future compute systems. This will help ensure European competitiveness across the industry – from semiconductor materials, equipment and design to systems and applications.SEMI: Who are the core partners involved in this initiative?De Boeck: Key partners of the pilot line include CEA-Leti, Fraunhofer-Gesellschaft, VTT Technical Research Centre of Finland, Tyndall National Institute, and the Center for Surface Science and Nanotechnology of the University POLITEHNICA of Bucharest. This project is also supported by the Flemish government, other participating states, and the Chips Joint Undertaking of the EU Chips Act.These institutions and organizations bring a wealth of knowledge and resources, and imec compliments their efforts by providing access to its global partnerships with key industry leaders. The NanoIC pilot line is helping strengthen Europe’s global semiconductor industry leadership while aligning efforts with other regional Chips Acts. SEMI: Can you elaborate on the significance of transitioning from field-effect transistors (FinFETs) transistors to GAA nanosheet devices in CMOS technology?Samavedam: The transition from FinFETs to GAA nanosheet devices is a significant advancement in CMOS device technology. FinFETs have been the backbone of CMOS technology from the 22nm to the 3nm node. But starting at the 2nm node, nanosheet devices will need to be introduced. Nanosheet devices, including variants like Forksheet devices, are expected to drive scaling and performance through three generations – 2nm, A14, and A10. Complementary FET (CFET) architectures are also expected to be introduced around 2031 at the A7 node, which will represent another major inflection point in CMOS device design. This progression requires extensive research into new materials, process modules, equipment, and advanced patterning capabilities using high numerical aperture extreme ultraviolet (high NA EUV) lithography – all of which will be implemented on the NanoIC pilot line. FIGURE PROVIDED BY IMEC │ SCHEMATIC ILLUSTRATION OF A FUTURE COMPUTE SYSTEM. THE SYSTEM IS MADE OF LARGE MULTI-DIE ELECTRICAL-OPTICAL INTERPOSER PROVIDING ELECTRICAL AND OPTICAL INTERCONNECTS BETWEEN THE VARIOUS CHIPLETS (CPUS, GPUS, HBM). ALSO SHOWN ARE CONNECTIONS TO PACKAGE SUBSTRATE, AS WELL AS FIBER CONNECTORS AND AN INTEGRATED LASER SOURCE. CENTRAL PROCESSING UNIT (CPU); GRAPHICS PROCESSING UNIT (GPU); HIGH BANDWITH MEMORY (HBM); PROCESSING UNIT THAT CAN INCLUDE CPUS, GPUS, AND OTHER SPECIALIZED PROCESSORS (XPU); APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC); ELECTRONIC INTEGRATED CIRCUIT (EIC); FF-LEVEL: FEMTOFARAD-LEVEL; FIELD-PROGRAMMABLE GATE ARRAY (FGPA); GAAS QD: GALLIUM ARSENIDE QUANTUM DOT; INTEGRATED SILICON PHOTONICS PLATFORM 300MM (ISIPP300); REDISTRIBUTION LAYER (RDL); SILICON PHOTONICS (SIPHO); THROUGH PACKAGE VIA (TPV). SEMI: What are the key innovations necessary for advancing memory technology?Samavedam: As SRAM scaling slows, the exploration of novel, dense embedded memory concepts will become imperative. Technologies like spin orbit torque magnetic RAM (SOT-MRAM) and 2-transistor 0-capacitor (2T0C) embedded DRAM using deposited semiconductors like indium gallium zinc oxide (IGZO) are promising. These innovations address memory capacity and bandwidth challenges from new workloads in compute systems. Additionally, developing a 3D memory platform to explore future memory options will be essential for improving SRAM and DRAM. These advancements will help meet the demands of new applications like machine learning, augmented and virtual reality, and autonomous vehicles.SEMI: How do advanced interconnect technologies contribute to the future of semiconductor design?Samavedam: Advanced interconnect technologies, like chip-to-chip lateral (2.5D or interposer technologies) and vertical interconnects (3D technologies), play a crucial role in addressing memory capacity and bandwidth challenges. These technologies enable the partitioning of SoC functions into separate dies, allowing for more efficient and scalable designs. Advances like pitch scaling of micro-bumps and copper (Cu) hybrid bonding are facilitating this fine-grained partitioning of SoC functions. Additionally, optical interconnects and 3D interconnect-enabled co-packaging provide high-bandwidth and low-power connectivity at wafer scale. The rise of chiplet architectures and standardization will also increase the demand for low-cost, tight-pitch interconnect technologies like Cu/polymer redistribution layers.SEMI: How do your collaborators benefit from the NanoIC pilot line? De Boeck: One of the biggest collaborator benefits is the pilot line’s commitment to knowledge sharing through R D access and training. We invite foundries, IDMs, materials suppliers, equipment suppliers, and system companies/OEMs to jointly develop the materials, process modules, and integration flows to accelerate the development of beyond-2nm SoC technology pillars.Design pathfinding and system exploration process design kits (PDKs) will be available for start-ups, small- and medium enterprises, universities, and design and system companies to aid in prototyping and testing their designs. The NanoIC pilot line will also offer comprehensive training programs, including virtual PDK training, bootcamps for faculty, and internships and expert courses for students. To learn more, experts and key partners of the NanoIC pilot line will be presenting from 14 -16:40 at SEMICON Europa on November 12. imec’s program, ITF Chip into the Future, will highlight advancements in digital technology, capacity building through the European Chips Act, and the role of the NanoIC pilot line in accelerating beyond-2nm innovation. The conversation will also address industry requirements for pilot lines, emerging initiatives boosting Europe’s innovation and competitiveness, and perspectives on advanced materials and semiconductor equipment. Srikanth Samavedam, Senior Vice President of Semiconductor Technologies at imec, oversees programs in logic, memory, photonics, and 3D integration. Previously, he was a senior director at GlobalFoundries, leading 14nm FinFET technology into production and developing 7nm CMOS. Starting his career at Motorola, he worked on strained silicon and other advanced materials. He holds a Ph.D. in materials science and engineering from MIT and a master's degree from Purdue University. Jo De Boeck, Executive Vice President and Chief Strategy Officer at imec, oversees the company’s strategic direction and serves on its executive board. He joined imec in 1991 after earning his Ph.D. from KU Leuven and has since held various leadership roles, including head of imec’s Smart Systems and Energy Technology business unit and CTO. De Boeck is also a part-time professor at KU Leuven. Maria Daniela Perez / Communications Manager, SEMI EuropePhone: +49 160 2562977Email: [email protected]

Gone are the days when companies were said to go “beyond compliance” if they had sustainability ambitions and operated in a largely voluntary space.Corporate sustainability now sits in a tangle of business priorities, stakeholder expectations, and regulatory obligations. New landmark legislation and policies have changed the game in many markets where semiconductor value chain companies do business. Today, accuracy of information, threshold-setting, evaluation criteria, and due diligence are subject to scrutiny, fines, and litigation.A myriad of compliance risks are now linked to business actions that were historically voluntary in a sustainability context. Fueling the shift are regulations such as the EU’s Corporate Sustainability Due Diligence Directive (CSDDD) and Corporate Sustainability Reporting Directive (CSRD).Across the semiconductor value chain, it is crucial for companies to have a solid regulatory strategy for their sustainability activities. They must take into account, for example, mandatory rules that drive up risks from selectively taking action on some sustainability issues while demoting others.Semiconductor manufacturing and design firms, together with their business partners, face heightened pressure to navigate business and sustainability priorities around the climate transition, human capital management, supply chain management, and a host of other environmental, social, and governance issues that are high on regulatory agendas.The SEMI Sustainability Initiative hosts several working groups that bring to light common concerns and provide a forum for sharing response strategies. To sharpen the guidance that SEMI offers, the Sustainability Initiative is launching the webinar series, Global State of Play: Sustainability Regulations, Reporting, Incentives. This series offers semiconductor industry professionals the chance to learn from top-tier experts on the most pressing challenges in compliance, disclosure, and strategy for sustainable business.The first webinar, Developing a Regulatory Strategy for Sustainability: How to Navigate Key Sustainability Decisions, will feature Ashley Walter, Partner and Chief Sustainability Officer at Orrick Herrington Sutcliffe LLP.As the global business association for the electronics design and manufacturing value chain, SEMI is pleased to convene experts to address improving sustainability strategies for our industry. The SEMI Sustainability Initiative invites industry stakeholders to see the importance of building a regulatory strategy that coordinates across functions, from engineering to the boardroom.Learn more and register.Jordan Famularo, PhD, is Programs Manager, Sustainability at SEMI.

The semiconductor industry, once a hidden force in technology, is now recognized as a pivotal driver of the modern economy. As the engine behind everything from smartphones to smart cities, semiconductors fuel innovation and shape how students learn, play, and engage with the world, making chips a crucial factor in shaping our collective future as the climate changes.In line with SEMI Sustainability Initiative participation at Climate Week NYC, we are preparing a groundbreaking pilot program at the intersection of youth empowerment, workforce development, and climate action. To help the semiconductor industry develop a climate-literate workforce, the SEMI Climate Equity Social Impact Working Group and the SEMI Foundation have partnered to develop a global K-12 program open to all SEMI members for participation and sponsorship. The program will share best practices and resources such as those that follow in this article.SEMI will announce the program at the 29th United Nations Climate Change Conference, more commonly known as COP29, which will be held in Baku, Azerbaijan from November 11-22, 2024. SEMI members are encouraged to become partners and help shape the program ahead of COP29. Contact us to learn more and participate in the announcement.The Opportunity for Semiconductor Industry Climate Leadership It’s not enough for students to simply be aware of climate change and the United Nations Sustainable Development Goals. Awareness alone won’t protect communities or help solve the problems we may all face in the future. We must prepare the next generation to be climate-literate — providing them with the knowledge, tools, and skills to understand complex issues, work collaboratively across the globe, and develop practical, real-world solutions. With this foundation in place, young people become proactive global citizens with the skills to solve problems.The semiconductor industry doesn’t need to reinvent the wheel or build new networks to drive partnership at the intersection of sustainability and workforce development. Companies in our value chain are already well positioned to scale equitable opportunities, promote STEM and AI skills, and empower students to tackle real-world climate challenges as we help prepare them for future careers. Global networks of sustainable schools focused on climate action are well-established in key semiconductor regions. In Taiwan alone, over 330,000 students will participate this year.Sustainable schools networks engage teachers and students with programs that are fun, motivating, and spark curiosity by providing ownership over solving real-world challenges. These mostly free programs can also help drive gender and racial equity into the tech, science and engineering fields for communities and schools that might otherwise be left behind.Examples of programs with youth-designed climate actions are all around us. Students in one New Taipei City, Taiwan school conducted their own energy audits to reduce energy consumption in their medium-income community. Students in a North Pennsylvania, U.S. school of limited resources created a community garden that sparked interest in biodiversity and STEM.Our industry has a unique opportunity to tap into existing sustainable schools networks and help them grow, while amplifying youth-led climate action. These efforts will empower the next generation to drive meaningful change in their communities and inspire young people of every demographic to see the semiconductor industry as a place where they can build impactful careers.Leading the Way: Why the Semiconductor Industry is PivotalGiven the essential role of semiconductor companies in the global electronics design and manufacturing value chain, industry leaders have a unique opportunity to lead the way in cultivating a climate-literate generation of students for the future workforce. Early education on sustainability and technology integration is crucial, positioning leading companies and their partners to shape the emerging global workforce. The long-term semiconductor workforce development effort must cultivate global citizens who understand how to apply their skills in solving challenges. Opportunities for All Schools: Making Climate Education InclusiveWhile some high-resource schools may be able to integrate advanced environmental science and technology projects, it’s important to ensure that all students have access to meaningful climate learning opportunities. For example, students at schools with fewer resources can engage in projects like programming inexpensive micro:bit sensors to measure local water quality or sample moisture levels in their community gardens. Projects such as these are affordable, scalable, and can be implemented in any school, providing students with hands-on experience in environmental science and technology.More importantly, they build critical thinking and problem-solving skills that empower students to take ownership of climate issues affecting their communities.Additional powerful examples already in existence that provide a basis for scalable teaching, learning and partnership for schools globally include:1. Global Climate Pathways (GCP) is a program where various middle schools around the world work together to solve climate problems. Schools that participate receive learning opportunities and tangible STEM learning tools, including STEM kits. These innovative tools provide learning opportunities in coding and circuits.2. EcoSchools U.S. is a global sustainability education program run by the National Wildlife Federation (NWF). This transformative program is student-led, integrating green STEM through project-based learning. It provides opportunities for students to take ownership of their learning by addressing real-world challenges, drives student and teacher engagement, and creates tangible sustainability impacts across school communities. EcoSchools US fosters the development of transferable skills highly valued by employers, such as problem-solving, critical thinking, and interpersonal skills.3. Global Classroom Project is an initiative by Fairfax County Public Schools in Virginia, USA, designed to enhance students' global awareness and cultural understanding. It typically involves integrating international perspectives and global issues into the curriculum, promoting cross-cultural exchanges, and connecting students with peers from around the world.New Jersey Institute of Technology President Teik C. Lim hosts an exchange of Taiwan educators during their visit to advance global collaboration for students.A Common Ground for All Stakeholders: Education with a PurposeA challenge in K-12 engagement is the differing perspectives on its purpose among stakeholders. Companies in the semiconductor value chain may view this student outreach as a way to develop technical talent, while green nonprofits often emphasize climate education and sustainability.Bridging these perspectives requires building a platform that any classroom or school can access if they choose. Adopting a public-private partnership approach brings together corporate, government, and nonprofit stakeholders around a shared set of values. This collaborative effort aims to create opportunities and solutions for communities globally.By investing in early education, the semiconductor industry will not only prepare young people to tackle environmental and technical challenges but also ensure they are ready for future job opportunities and educational pathways. These efforts will help attract students to become part of an industry that values their contributions and future, shaping a workforce equipped to lead and innovate in a rapidly evolving world.This is the moment for companies in the semiconductor value chain to lead by example, demonstrating their investment not just in technology but in the sustainability and health of our planet. By supporting K-12 education with a focus on climate literacy, international partnership, sustainability, and STEM, companies in our value chain can build a brighter, more sustainable future for us all—while ensuring that today’s students are prepared to address the challenges of tomorrow. Justin Harris is Senior Advisor for Climate Equity Social Impact at SEMI, Bia Hamed, Ph.D. is Program Manager, Global Education Initiatives at the SEMI Foundation, and Marley Hauser is senior coordinator for the Climate Equity Collaborative. Acknowledgements Partners We thank our first round of partners for the SEMI global K-12 climate engagement program for their contributions of time and thought leadership to this effort: SEMI members, Climate Equity Collaborative, National Wildlife Federation, ARCedTech, Fairfax County Public Schools, Kaohsiung City Education Bureau, U.S. Environmental Protection Agency, Taiwan Ministry of Environment, Sustainable Jersey for Schools, New Jersey Department of Education, Dr. Prabhakar Shrestha of New Jersey Institute of Technology (NJIT), Dr. Tim Hsu of Global Environmental Enhancement (GEE) in Taiwan, New Jersey Audubon, and the students of NJIT and Readington Middle School in Whitehouse, New Jersey. Special thanks to Shari Liss, Vice President for Workforce Development at SEMI Foundation, and Dr. Mousumi Bhat, SEMI Vice President for Sustainability.

Use of machine learning and artificial intelligence (ML/AI) is on an exponential rise across fields1 including all aspects of the semiconductor industry. In the last decade, the use of ML/AI exploded in the areas of speech recognition, facial recognition, smart phone features, search engines and now large language models like ChatGPT, Bard AI, and CoPilot. The ML/AI growth has been enabled by massive data storage capacity and increased compute performance, leading to projections for the semiconductor industry to reach over $1 trillion in annual revenue by 2030, with about 50% of the industry’s growth related to GenAI2. Figure 1: McKinsey Company on GenAI driving semiconductor industry growthAs semiconductor manufacturing drives toward Industry 4.0, SEMI member companies have a vision of Industry 5.0, truly adaptive manufacturing, integrating human creativity with robotic precision enabled by AI. Along that path, automation and data exchange in every step of manufacturing is essential, with data acquisition, data integrity and relevance, and operational Digital Twins3 as defined steppingstones to the factory of the future.Based on growing member interest in ML/AI, in 2019, SEMI assembled technology communities that quickly engaged in AI discussions and proofs of concept, discovering gaps in the path to Industry 4.0. Successful demonstrations of the value of AI in chip manufacturing process development and factory efficiency, not to mention GenAI uses in society, hastened the pace to produce faster, more powerful chips to accommodate the computation and communication requirements. Recognizing the industry opportunity and the mounting role AI plays in the semiconductor supply chain, SEMI initiated several thought leadership efforts, namely the Smart Manufacturing Initiative, Smart Data-AI Initiative, and the Future of Computing think tank.Smart Manufacturing According to the SEMI World Fab Forecast, over 100 new and expanded wafer fabs will begin volume production by 2027. This massive capacity expansion will need to achieve the highest possible operational efficiency and performance. To this end, the Smart Manufacturing Initiative is a technology community with over 120 member companies collaborating pre-competitively to transform manufacturing. The SEMI Smart Manufacturing Global Executive Committee (GEC), outlined a roadmap vision for the cognitive factory of the future based-on technology, sustainability and future talent. The GEC has been working with members to realize that vision. Figure 2 describes this vision in terms of the technology progression needed and the approximate timeline for implementation by most manufacturers. The proliferation of this vision through Smart Manufacturing Forums at SEMICON events around the globe, newsletters and blogs has garnered enormous interest and participation in the initiative and is central to the mission of connecting and raising awareness within the ecosystem. Figure 2: AI-Driven Smart Factory (Point Systems to Autonomous Solutions) To move the needle on this vision, industry experts in the initiative successfully created and launched the Industry 4.0 Readiness Assessment Model (IRAM) to help assess technology deployment progress. IRAM adoption is steadily growing. Modern front-end and back-end lines produce an extraordinary amount of multi-modal data from a variety of sources, and this is key to success in unlocking the potential of AI in manufacturing environments. The initiative’s global working groups on Data Architectures and Smart Control Room among others are working towards a holistic Cognitive Factory framework uniting the vertical and horizontal flow of information. Integral to the Cognitive Factory are smart manufacturing standards, that will accelerate the vision outlined above, and without which local solutions are unlikely to scale.In 2023, the Smart Manufacturing Initiative brought together industry leaders in a unique Digital Twin workshop to align on the state of semiconductor development and usage. The key takeaways from this workshop are captured in a white paper that highlighted the need to accelerate efforts in multiple areas including standards. Along with SEMI International Standards, Smart Manufacturing supports other standards development organizations (SDOs) and NIST standards development, for example, to identify and drive critical standards for Cognitive Factory implementation. The initiative is planning future workshops on Cognitive Factory Framework requirements, Digital Twins, and Smart Data AI in the coming months. that highlighted the need to accelerate efforts in multiple areas including standards. Along with SEMI International Standards, Smart Manufacturing supports other standards development organizations (SDOs) and NIST standards development, for example, to identify and drive critical standards for Cognitive Factory implementation. The initiative is planning future workshops on Cognitive Factory Framework requirements, Digital Twins, and Smart Data AI in the coming months.The GEC has identified critical interrelationships in addition to the technology focus. At the intersection with sustainability, the initiative has formed a collaborative task force with the SEMI Semiconductor Climate Consortium (SCC) to develop a bottom-up technology roadmap that can be used as a blueprint for device makers to meet their proclaimed sustainability goals faster. The task force organized a technical session at SEMICON West 2024 and will be releasing a white paper in the near future. Similarly, the initiative is working with the SEMI Foundation to identify necessary future skills and to make training available through SEMI University. Smart Data AI – Applying AI to Semiconductor OperationsSEMI’s Smart Data-AI Initiative started by assembling a group of interested companies to explore the pivotal role AI could play in the industry and to address the criticality of data. All stakeholders agreed that a formidable challenge was (and still is) the integrity of that data and the security of sharing that data, which is considered IP to most. The optimal implementation of ML/AI techniques can only be gained by access to the comprehensive data set which is owned by numerous supply chain partners. Consequently, semiconductor R D, process and design have not yet realized the full benefit of Data-AI advances. In response, the initiative developed a framework to create value for members and support industry progress. Four pillars underpinning the strategy are:Educating stakeholdersBuilding communitiesExecuting proof-of-concept projectsDeveloping industry standardsTo explore the data challenges the subject matter experts highlighted, a collaborative proof-of-concept (POC) project was proposed in 2019 and accepted by the initiative's partners at Army Research Laboratories4 along with academic and industry partners. The project has completed two phases and is starting on its third phase under the expert guidance of an Industry Advisory Council (IAC) comprised of leaders in the Smart Data-AI community.The POC project, being conducted by principal investigators at Cornell University, demonstrated significant accomplishments from the first two phases, including:An AI model to predict device geometry by optimizing photolithography and plasma etching processesInitial demonstration of secure data-sharing techniques with software-hardware co-optimizationInnovative metrology ideas to train AI algorithms rapidlyStudents trained in cross-disciplinary skills to address the industry’s critical talent shortageFurthermore, the visionary objectives laid out at the initial stages of the POC proved to be synergistic with the strategic goals of the CHIPS Act5, which articulates the need for “collecting, aggregating, and sharing data sets that enable benchmarking and operational improvements, tools development, the creation of digital twins, and training AI models,” and that “the NSTC could develop a methodology for the voluntary sharing of data that protects the proprietary component and national security while enabling access to appropriate performance data.” Phase 3, to be completed by August 2025, will advance the state-of-the-art toward the following specific objectives:A framework to create and integrate Digital Twins of semiconductor R D and manufacturing process toolsAbility to explore processes and generate virtual devices swiftlyDefined interfaces to combine models for each process module or toolAccurate AI-based models for executing virtual process flows to build virtual devicesAdvanced solutions for secure data-sharing across the ecosystem – for example, federated learning where raw data is protected for each entity by building models locally, and only the outputs of the local models are used to build flow-level AI modelsFoundation for future industry standards for secure data-sharing and for interfaces in the virtual innovation environmentSEMI continues to build the collaborative community for Data-AI and strives to synergize with broader efforts such as the Digital Twin Manufacturing Institute, NSTC, and NAPMP in the U.S., and international standards development. Smart Data AI – System-level Innovation for AI – Future of ComputingThe cross-collaborative and synergistic objectives of Smart Manufacturing, the Smart Data-AI proof-of-concept work, and SEMI Standards merge to advance the state-of-the-art. The objective is to help members realize the full value of technology and innovation. In addition to improving semiconductor operations using AI, the efforts also strive to enable SEMI members to participate in, and ultimately profit from, market growth opportunities. Continued progress in AI is crucial both for the industry’s march towards $1 trillion in annual revenue, and for continuing to realize AI’s benefits to society.There are some hurdles to overcome in such a dynamic market. AI models, and the data they process, are outpacing hardware advances, posing a major roadblock for continued progress. As GenAI becomes more pervasive, the performance and power challenges continue to multiply, and require significant innovation in both hardware and software. While individual companies will develop competitive products in this domain, the entire ecosystem needs to evolve in a synergistic manner. As a global industry association, SEMI can play an important role in ensuring this. SEMI started a series of workshops and technology sessions to develop the community and identify opportunities and challenges. The first in this series was a joint workshop with McKinsey Co., held in October 2023, with a focus on innovations in “Domain-Specific Architectures.” Strategically, it brought together thought leaders from three diverse communities - start-ups, investors, and SEMI member companies across the supply chain. This was followed by an overcapacity audience at the Future of Computing session at SEMICON West 2024, where we explored AI-specific hardware with leaders in academia and industry. The Initiative’s next planned event in October 2024 is a focused workshop that is designed to be highly interactive and bring together visionaries and thought leaders from across the value chain – materials, devices, architectures, algorithms, and critical enabling technologies such as photonics, chiplets, advanced packaging, and 3D and heterogeneous integration. The overarching goal is to identify pre-competitive collaborative actions that would help the entire industry. The “Future of Computing” is the broad path to the industry’s future success. While AI systems are the current major wave on this path, future waves may be about heterogeneous integration of photonics and other components, and ultimately, quantum technologies joining the mainstream. SEMI continues to monitor these future trends, strengthen the ecosystem and enable innovation through pre-competitive collaboration, and accelerate implementation through standards.SEMI is fostering today’s collaborations while helping the industry navigate the future of electronics.Melissa Grupen-Shemansky is CTO at SEMI, Pushkar Apte is a Strategic Technology Advisor and Leader of the SEMI Smart Data-AI Initiative, and Mark da Silva is Senior Director of the SEMI Smart Manufacturing Initiative.Definitions and References:1https://arxiv.org/abs/2405.15828 Eamon Duede, William Dolan, Andre Bauer, Ian Foster, Karim Lakhani2McKinsey Company3Digital Twins for semiconductor manufacturing operations are dynamic, predictive, data-driven virtual models of a physical asset, process, or an entire factory, constantly synchronized with its real-world counterpart through real-time data streams and analytics4Research was sponsored by the Army Research Laboratory and was accomplished under Cooperative Agreement Number W911NF-19-2-0345. The views and conclusions contained in this document are those of the authors and should not be interpreted as representing the official policies, either expressed or implied, of the Army Research Laboratory or the U.S. Government. The U.S. Government is authorized to reproduce and distribute reprints for Government purposes notwithstanding any copyright notation herein.5“A Vision and Strategy for The National Semiconductor Technology Center (NSTC)” published by the CHIPS R D Office.

Jose Fernandez, U.S. Under Secretary of State for Economic Growth, Energy, and the Environment, sat down with Joe Stockunas, President of SEMI Americas, for a fireside chat on the CEO Summit keynote stage at SEMICON West 2024. In the Securing Critical Supply Chains for the 21st Century discussion, Fernandez emphasized the need to form partnerships to address vulnerabilities as the key to creating stable supply chains. It’s important to band together, he said, to protect our standards, values, and democracy. Diversifying the Global Mineral Supply ChainBecause chip fabricators depend on minerals like germanium, gallium, arsenic, indium, and rare earth elements, he highlighted how imperative it is for the industry to access them sustainably. To accomplish this, he stressed the importance of protection against supply chain bottlenecks in the mineral market. “According to a number of experts, we’re going to need 42x the amount of lithium by 2050, 25x the amount of manganese, and 25x the amount of cobalt,” he said. “Those minerals are basically controlled by one country, and that's a vulnerability.”To address these concerns, he shared that the State Department is working to strengthen the upstream and downstream portions of the semiconductor value chain, with the goal of supporting economic security across the globe. Foreign export controls, he said, have led to supply chain disruptions of key minerals, and bans on rare earth elements, processing equipment, and other technologies. As evidence of the State Department’s efforts to diversify, he highlighted the Minerals Security Partnership (MSP) and its work to seek mineral alternatives. Led by the U.S., it currently includes 13 other countries plus the European Union. Partnership and Investment Opportunities To further secure the industry's supply chain, Fernandez discussed the State Department’s efforts to partner with mining countries with untapped semiconductor resources. These countries, he said, also want alternate options for securing critical minerals. Fernandez highlighted Latin America as a key nearshoring focus area, pointing to the Americas Partnership for Economic Prosperity (APEP) as a solution for addressing obstacles to investment in the region. Obstacles, he said, include education levels, insecurity, and rule of law.To overcome such hurdles, he stressed the importance of fostering economic conditions that will attract investments, emphasizing the importance of workforce development initiatives and private sector involvement. “We don’t have enough trained workers in the U.S., and we certainly don’t have enough trained workers abroad,” he said. Fernandez shared that workforce development programs are being established through the U.S. Department of State International Technology Security and Innovation (ITSI) Fund, as well as private sector efforts and university partnerships. Currently, seven countries have been selected for ITSI funding, he said. “We’ve partnered with a number of universities to address the workforce gaps we see in our ITSI partners,” he said. “We’ve created workforce seminars, and we’re going to spend more time training the labor force.” These efforts supplement the work of the SEMI Foundation to develop a holistic workforce development program for the global semiconductor industry.Preventing Chips From Entering RussiaWith U.S. chips crossing into Russia through third parties, Stockunas asked Fernandez how the semiconductor industry could help address this. Despite existing sanctions against Russia, Fernandez shared that Russia still managed to import $1.7 billion worth of microchips from both the U.S. and Europe in 2023. To help slow this down, he highlighted additional due diligence for companies whose products often make their way into the country. The federal government, he said, speaks with these companies about complying beyond what the law requires.Fernandez shared that private sector cooperation with more stringent standards has been positive, noting that some companies have cut hundreds of distributors to further aid in prevention. In addition, he mentioned that sanctions have made a promising impact overall.“[Russia] has had to use outdated equipment, they’re engaging in counterfeiting, and they’re getting help from other countries,” he said. ​​Official SEMICON West Podcast In a podcast with Francoise von Trapp of 3D InCites recorded at SEMICON West, Fernandez discussed critical mineral partnerships, benefits and setbacks of regional supply chains, and chip sanctions against Russia. To learn more, check out the podcast interview with 3D InCites. SEMI Global AdvocacyDiscover how SEMI Global Advocacy Public Policy supports the microelectronics industry across trade, taxes, talent, and R D.John Cooney is Vice President of Global Advocacy and Public Policy at SEMI.

John Kibarian, CEO and founder of PDF Solutions and a member of the ESD Alliance (ESDA) Governing Council, is a keen observer of the semiconductor ecosystem. Since PDF Solutions sits between design and manufacturing, Kibarian shared unique perspectives on both in a recent discussion.Smith: What trends are you seeing in the semiconductor industry. Are there any that surprise you? Kibarian: We see several trends that have been going on for quite a while.As much as we hear Moore’s Law is dead, there's still a strong drive to get to advanced nodes. The benefits are harder to achieve and require more than geometry scaling, but demand for these advanced nodes continues to grow. Another emerging trend is the need for insatiable compute power in data centers to support the explosion in AI applications. In recent history, the mobile phone market has been the key driver of the push to new advanced nodes, but that is changing as the performance needs of data centers and AI applications are now driving the shift.Next, as companies are still learning from the disruptions in the supply chain due to the pandemic, there’s a tremendous amount of movement to make the supply chain more resilient by expanding sourcing options for critical products or test applications. This is happening in conjunction with significant investment in high-performance compute from many countries that want to bring silicon to their shores.The next trend is that electronics companies are looking to limit investing solely in China or the U.S. Their China Plus One or U.S. Plus One strategies results in adding significant additional infrastructure and overhead. If it's not done right, it will cost the industry more money. It will be hard to sustain the cost benefits and economies of scale of the current single source model just by brute force and adding human capital. A new approach is required to manage cost effectively smaller and globally distributed manufacturing facilities.The final trend is the general electrification of the economy. Cars are moving from internal combustion engines to electric. That means more and more of our energy needs are met with electricity, putting a premium on solar and batteries. Batteries require power conversion.Silicon such as high bandwidth semiconductors on silicon carbide and gallium nitride have a tremendous amount of capacity. What is interesting is how fast and aggressive China is in that part of the market; they could be a major producer of the technologies needed to support electrification. With our exposure to the China market as well as the European and U.S. markets, Chinese manufacturers have come up quickly, and we may see a world with more viable suppliers than originally anticipated.Smith: You mentioned data centers and AI. AI is everywhere and revolutionizing the semiconductor industry. EDA companies are talking about incorporating AI. What are you observing? Kibarian: AI is used for chips that are manufactured for use in data centers. For example, our customers use PDF analytics or the Exensio platform via the cloud to analyze large amount of manufacturing data and product or test engineering data. Without this type of automated solution, only a small proportion of these data sets would actually be utilized.Companies staff their product design and test engineering using a budget based on a percentage of revenue. If a company has billions of dollars of revenue, it will put so much more into product and test engineering. But how productive can these people be? Without AI, they can only use some simple reports and graphics to analyze the subset of data they are looking at. AI solutions such as PDF’s Guided Analytics capability apply sophisticated machine learning tools to analyze entire large data sets. AI is enabling engineers to be more productive by allowing them to work with large data sets that ultimately deliver better results in the products.The amount of compute keeps going up at a rate that outpaced the rate of geometric scaling. More compute power makes it cost effective to go through large data sets and identify what is relevant.Additionally, AI is helping semiconductor companies build products. A conventional compute system is chips assembled on boards. AI is making system-in-package take off.The production flow is more complex, as fabless companies are becoming system companies. Conversely, system companies are becoming fabless companies and manufacturers. In the past, they ordered parts from their foundry of choice. Essentially, the foundry was the system manufacturer, supplying package and test yields of 99%.Now companies are building systems in more complex packages potentially with foundry partners, but this requires getting known good die. High bandwidth memory or other components from other suppliers means the company must make sure these products are available at the right time. In essence, they are becoming manufacturers and changing the way customers manage the problem of product test. They're adding more test insertion points and using machine learning and AI to be more productive.Smith: Let’s talk about digital twins or creating virtual models of everything from chips to the whole system. How do you see the impact or effectiveness of digital twins in manufacturing? Kibarian: From a manufacturing perspective, digital twins had been models for chamber behavior on a processing tool like an etch tool or TCAD simulation of devices and structures.The problem is that purely physics-based digital twins don't exist, and we must utilize empirical data. The joke was that the modeling for tomorrow’s systems was based on yesterday's technology. Trying to have the physics catch up with the materials, device structures and behaviors is why it’s so expensive to develop new technology.Principles-based models will never catch up with production. We can model 90-nanometer technology, but it doesn’t work for one or two nanometer wafers. AI and machine learning – and ways of building models using more sophisticated algorithms – can help close that chasm, and that’s starting to happen at the R D level.In production, no one has yet achieved a good merger of the physics-based and AI-modeling worlds to create a virtual model. Virtual modeling is a big opportunity.The rate of change and improvement in algorithms in large language models moves fast because machine learning can scrape the Internet for data to build huge training sets. In the semiconductor world, however, data sources are typically siloed within organizations and often not shared with vendors. This limits the rate at which the industry can take full advantage of existing data and create tangible economic benefit.By and large, there is a lot of wasted capacity in semiconductor manufacturing. The operational effectiveness of factory equipment is up to 90-95%. The reality is that most factories today process product wafers 40-60% of the time – maybe 70-75% of the time on a test floor. It is critical for the industry to start leveraging new types of AI models to increase the productivity of its manufacturing capacity.The industry needs to look at how companies can share data to take advantage of more sophisticated AI and create a new kind of operational digital twins. If the industry doesn't make a change; it will only be the largest facilities with the largest datasets able to take advantage, leaving one or two winners, with the others not being competitive.Smith: Is it possible for the industry to come up with a standard or some way of sharing information to build better models without giving away the underlying proprietary data? Kibarian: We can look at computer science with technology like homomorphic encryption. The relationships between parameters remain, but the underlying numbers or raw data is not visible after encryption. Pharma and the medical industry have ways to add noise to the data while preserving the information, as required by the Health Insurance Portability and Accountability Act (HIPAA).Our industry has a knee jerk reaction when it comes to looking at how to take full advantage of data and prefers to solve it as if information and data is more proprietary than medical data or financial data. And I don't think that’s true.Bob Smith: Is the open-source movement destined to bring change to the industry? Kibarian: PDF is a big believer in open source when it comes to OS-level virtualization and Kubernetes versus proprietary alternatives. We also use open-source database technology like Cassandra but are skeptical of the value of open-source solutions for end-market verticals. Having an underlying open and available IT layer has tremendous value, because it means a more rapid rate of innovation and greater ability to adjust security vulnerabilities and patches versus proprietary systems.Smith: PDF sits right between manufacturing and design. On the EDA side, more collaboration is going on between designers and manufacturing. How would you bring these two domains closer together? Kibarian: That's a good question. My first instinct is to look at the largest design organizations and manufacturers. They often invest heavily to figure out how to get jobs done right. This results in the concentration of the industry on a smaller number of players and leads to less innovation. However, in the world of chiplets and advanced packaging, there are more opportunities to become a chiplet supplier, because the whole system doesn’t need to be built by a single company. A supplier of chiplets could sell it into many systemsFrom a system view, connecting the pieces together through software, data sharing and analytics could drive more productivity gains that will offset some of the natural headwinds. This needs to be addressed in a way that changes the paradigm with software and systems used to bring manufacturing and design closer together.About John KibarianJohn K. Kibarian is President, Chief Executive Officer and Co-Founder of PDF Solutions. He has served as President since 1991 and CEO since 2000. Dr. Kibarian received a Bachelor of Science degree in Electrical Engineering, a Master of Science and PhD degrees in Engineering Computer Science from Carnegie Mellon University.Robert (Bob) Smith is Executive Director of the ESD Alliance, a SEMI Technology Community.

As more than 400 speakers took the stages at SEMICON West 2024, sustainability and workforce development stood out as two major focus areas. The second day of this year’s CEO Summit keynote program, themed Seizing the Global Opportunities and Challenges Ahead, featured sessions on both topics. One of the first sessions of the day was the Chief Sustainability Officer (CSO) panel discussion, titled Bracing for the Evolving Global Risk for the Semiconductor Ecosystem, moderated by Vice President of SEMI Global Sustainability Programs, Dr. Mousumi Bhat. Later that morning, Shari Liss, Vice President of SEMI Global Workforce Development Programs and Executive Director of the SEMI Foundation, moderated a fireside chat, Advocating for Real Change: Why Inclusion and Belonging Need to be Everyone’s Concern, with Sandra Mahadwar from KLA Corporation. Bhat and Liss were later interviewed for a podcast by Francoise von Trapp of 3D InCites to share additional insights on sustainability and workforce development, respectively. Bhat was also joined by Paul Kelly, COO of the New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES). Creating a More Sustainable Semiconductor Industry During their interview, both Bhat and Kelly emphasized that the industry will need to reduce its use of per and polyfluoroalkyl substances (PFAS) to sustainably innovate at today’s nanometer pace. For this reason, Kelly highlighted the importance of learning to balance current production demands with the health of climate.To achieve this balance, they discussed the efforts of the Semiconductor Climate Consortium (SCC). Much of the SCC’s efforts, they said, will focus on driving the industry toward net zero emissions. SEMI and NY CREATES announced a memorandum of understanding (MOU) at SEMICON West 2024 to promote sustainable practices within the industry, with a focus on PFAS reduction. Kelly pointed to the ability of SCC members to test new materials, gases, and chemicals at NY CREATES’ R D facilities in upstate New York to work toward replacing PFAS with more sustainable alternatives. Bhat also shared that this collaboration helps facilitate prototyping, experimentation, and tests and measurements for newer, more sustainable substances.Dr. Mousumi Bhat of SEMI and Dave Anderson of NY CREATES celebrate their organizations’ sustainability MOU at SEMICON West 2024.“The thought leadership comes from the Consortium, and the support on infrastructure comes from NY CREATES,” said Bhat. “This should become a blueprint to solve some of the challenging problems that we have in our industry.” When it comes to reducing emissions, Bhat mentioned two key objectives. The first, she said, is access to clean energy, and the second is the reduction of greenhouse gases. Bhat cited these as the issues that will take the longest for the industry to solve and pointed to the importance of industry collaboration and partnerships to support the needed experimentation. But while partnerships will bring the industry closer to net zero, both Bhat and Kelly cautioned that it won’t be reached overnight. “Much more needs to be done in the industry to reach that net zero goal,” said Kelly. “New chip technologies, new chemicals, and new processes are very much large leaps to achieving that. But right now, even some of the most advanced will only reduce [emissions] by 70%.” To help bridge this gap, Bhat encouraged others to join and participate in the SCC. “Rather than everybody doing a one-to-one experimentation in their own space and spending those resources, I would like to invite anyone that's not part of the climate consortium,” she said. “And [I invite] those that are part of the climate consortium to engage more actively, so that we are all accelerating the journey toward net zero.” Addressing the Talent Shortage This year’s SEMICON West also featured five keynote sessions dedicated to workforce development, as well as a Workforce Development Pavilion that included several talks around diversity, equity, inclusion, and belonging (DEIB). With the estimated one million jobs the industry will need to fill by 2030, Liss shared that every role is needed – from entry level all the way to Ph.D. researchers. “We need to try and bring in as many people as we can over the next few years,” said Liss. “The talent shortage is a global issue, not just a U.S. one.” Shari Liss of SEMI moderated the fireside chat at SEMICON West 2024 with Sandra Mahadwar from KLA Corporation.To begin to close the talent gap, Liss stressed the importance of educating children about the semiconductor industry. “We are just invisible to kids,” she said. “In every part of the globe, they carry chips in their hands all day every day, and they don’t know. So to me, breaking that barrier and making sure kids know about our work as an industry is going to be so critical to making this successful.” Liss also highlighted differences in workforce development programs across the world, noting that what works in one region may not translate to another. For example, apprenticeships are widely embraced in Europe, she said, but they’re a fairly new practice in the U.S. Conversely, she shared that veteran-focused programs wouldn’t work for some regions, but they’re a “powerful win” in the U.S. Each SEMICON show across the world, she shared, includes similar workforce development and DEIB programming, in addition to targeted sessions for students and HR professionals. Companies can interview for open positions at SEMICON shows as well. To learn more about SEMI’s workforce development initiatives and programming, visit semi foundation.org, or check out this overview of DEIB content at SEMICON West 2024. Samer Bahou is director of Marketing Communications at SEMI.

SEMI was honored to welcome U.S. Under Secretary of Commerce for Standards and Technology, Dr. Laurie E. Locascio, to the CEO Summit keynote stage at SEMICON West 2024 on Tuesday, July 9. Locascio, who also serves as the Director of the National Institute of Standards and Technology (NIST), delivered her morning CHIPS Act Update keynote address to a packed room of over 1,000 attendees at the Moscone Center in San Francisco.During her address, Locascio emphasized how far the U.S. chip industry has progressed since 2021. “Prior to 2022 and the passage of the CHIPS and Science Act, the U.S. produced 0% of the world's leading edge chips,” she said. “But now, after these proposed investments, we've changed the global landscape.”Industry Shifts from the CHIPS and Science ActDue to long delays and price increases resulting from supply chain vulnerabilities, Locascio shared that Congress began developing the CHIPS and Science Act with two key goals in mind. The first, she said, was to protect economic security, and the second, was to lower costs for American taxpayers. As part of the CHIPS and Science Act, CHIPS for America was established to advance semiconductor manufacturing in the U.S. CHIPS for America encompasses two offices: The CHIPS Research and Development Office, as well as the CHIPS Program Office - both of which are responsible for implementing CHIPS and Science Act law.CHIPS for America, said Locascio, couldn’t be another procurement program. Instead, it needed to be a purpose-driven approach to build domestic manufacturing capacity. Locascio highlighted that CHIPS for America galvanized several experts from the federal government, R D, and other core areas to work together to revitalize the U.S. semiconductor industry and increase capacity. To achieve this, Locascio pointed to CHIPS for America’s $30 billion in proposed direct funding and $25 billion in proposed direct loans.Locascio also noted diversity of technology as being essential for the American chip industry, citing how Intel, Micron, TSMC, and Samsung have recently expanded in the U.S., with SK Hynix planning to build a fab and R D facility in Indiana. No other economy in the world, she said, has more than two of these companies producing leading edge chips on its shores.“The total public and private investment from our four, leading-edge companies will equal roughly $300 billion between now and the end of the decade, far and away the most investment in new production in the history of the U.S. semiconductor industry,” said Locascio. Industry Investments on the HorizonTo further aid these efforts, Locascio mentioned CHIPS for America’s notice of intent to invest $1.6 billion in an open competition to accelerate advanced packaging domestically and encourage innovation. Funding will be directed toward five key R D areas, including equipment tools, power delivery, connector technology, chiplets, and Electronic Design Automation (EDA), she said. Additionally, Locascio shared that CHIPS for America recently announced its first preliminary memorandum of terms (PMT) to support the upstream supply chain, and shared plans to announce several more PMTs in the future. Lastly, Locascio revealed that CHIPS for America plans to release a model and process for bringing new facilities to life, in partnership with the National Semiconductor Technology Center (NSTC). NSTC members, she said, will gain access to partnership funds and state-of-the-art facilities to support the U.S. semiconductor industry. “Across all these efforts, from manufacturing incentives to research funding, to workforce development efforts, the U.S. must cultivate and build our competitive assets to protect and grow our technological leadership,” said Locascio.In a podcast with Francoise von Trapp of 3D InCites recorded at SEMICON West, Locascio discussed her career background, CHIPS Act investments and the path forward for the semiconductor industry in the U.S. To learn more, check out the podcast interview with 3D InCites. SEMI Global AdvocacyDiscover how SEMI Global Advocacy Public Policy supports the microelectronics industry across trade, taxes, talent, and R D.John Cooney is Vice President of Global Advocacy and Public Policy at SEMI.