Test Research, Inc. (TWSE: 3030), the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its successful partnership with Bosch in the development of an AI visual check solution for MEMS packaging.

Bosch has recognized TRI's valuable contribution to their success in MEMS packaging in 2025 with a Certificate of Appreciation. The certificate acknowledges the successful completion of the AI visual check for MEMS packaging, highlighting the strong cooperation and partnership between the two companies.

This collaboration demonstrates TRI's expertise in AI-driven inspection solutions and its commitment to providing valuable solutions for the electronics manufacturing industry. TRI's AI-powered solutions include the AI Defect Detection, AI Smart Programming, AI Verify Host, AI training tool, AI Station, and more.

Please visit the following link to learn more about TRI's AI Solutions:
https://www.tri.com.tw/en/about/about-107-2-2.html

Learn more about the Bosch Group by following the link below:
https://www.bosch-presse.de/pressportal/de/en/company-page.html

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About Test Research, Inc. (TRI)

TRI (TWSE: 3030), offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

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Zhubei, May 8th, 2025 – ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is excited to announce the opening of its latest demonstration center in Zhubei, Taiwan. This new facility will offer chipmakers and OSATs in Taiwan direct access to ERS’s PhotoThermal debonding machine for wafers and panels, LUM600S1, a strategic move to meet the growing demand for panel-level packaging (PLP) technologies in the region.

Panel-level packaging is rapidly gaining traction in the semiconductor industry due to its cost advantages and process scalability. Dr. Yik Yee Tan, Technology & Market Principal Analyst at Yole Group, predicts that the market will grow from $160 million in 2024 to over $600 million by 2030, driven by cost-efficient solutions in advanced packaging. By 2030, high-density fan-out technology, propelled by Generative AI, is expected to dominate the market, capturing more than 50% of the market share. (1). In Chiplet and Heterogeneous Integration demand for larger form factor is driving the growth of PLP in the coming years to meet higher density requirement. For large package size of ~5.5x reticle size limit, PLP can boost carrier area efficiency by more than 80%, compared to just 45% with Wafer Level Packaging (WLP).

In addition to wafer solutions, ERS was among the first to bring PLP equipment to the market, introducing a panel-level debonder in 2018. Today, ERS offers a wide portfolio of semi- and fully-automatic systems, including PhotoThermal debonding machines enabling temporary bonding and debonding (TBDB) processes essential for handling ultra-thin substrates, which is critical for HPC and AI applications, like CoWoS and HBM.

“With LUM600S1, we are providing a high-yield solution tailored for high-volume manufacturing of complex AI chips. Our Taiwanese customers can now experience firsthand how PhotoThermal Debonding enhances efficiency, scalability, and cost-effectiveness,” says Sébastien Perino, Managing Director of ERS Taiwan.
For more information about the Zhubei demonstration center and LUM600S1’s availability for testing and demonstration, please visit ERS’s website to get in contact with regional sales representatives.

About ERS:
ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for wafer probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide.

(1) Sources: Panel Level Packaging 2025 report – Advanced Packaging Market Monitor, Yole Group

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Penang, Malaysia – May 2025 – ViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in SEMICON Southeast Asia 2025, taking place from 20 to 22 May 2025 at the Sands Expo and Convention Centre, Singapore, at Level 1, Booth #L2201. This year marks a significant milestone as ViTrox celebrates its 25th Anniversary, commemorating a quarter-century of innovation and technological breakthroughs in the semiconductor and electronics industries.

SEMICON SEA serves as a premier platform that unites industry decision-makers, showcases cutting-edge products, and presents the latest market and technology trends. As a global leader in vision inspection solutions, ViTrox will unveil its comprehensive range of next-generation innovations, including Middle & Back-end Semiconductor Vision Solutions, SMT PCB Assembly Vision Solutions, Integrated Industrial Embedded Solutions, and Manufacturing Intelligence Solutions Towards Industry 5.0, demonstrating ViTrox’s ongoing commitment to smarter, more efficient, and high-quality manufacturing.

Key breakthroughs:

PX40i Die Sorting, Inspection & Package Solution: An advanced, fully integrated solution designed to streamline and enhance the semiconductor back-end process through high-precision die sorting, six-sided automated optical inspection, and packaging over a wide range of packaging types.

TH3000i Tray-based Vision Handler: Integrates Artificial Intelligence (AI) for next-level semiconductor inspection. The advanced SWIR inspection technology detects microcracks and internal defects with exceptional accuracy, while 4-side direct inspection ensures total quality control. Beyond inspection, the TH3000i is also built for factory automation to help manufacturers minimise manual intervention, optimise workflow, and move closer to a lights-off factory vision.

V510i 3D AOI for Advanced Packaging (Semicon AOI & Micro AOI): An AI-powered solution with advanced 3D optical inspection of wire bonds, die defects, and solder bumps, offering up to 50% yield improvement while significantly reducing operating costs.

Beyond inspection systems, ViTrox will also showcase its powerful Manufacturing Intelligence Solutions Towards Industry 5.0 - V-ONE. This smart manufacturing platform optimises production efficiency through real-time data visualisation, AI-driven insights, and full traceability.

Integrated Industrial Embedded Solutions, designed to strengthen the automation foundation of production lines through a wide range of advanced offerings, including EtherCAT based I/O Solutions, Illumination Systems, and Motion Solutions.

VisionXpert Smart Code Reader (XS Series): A high-performance smart code reader designed to enhance traceability and productivity through advanced decoding, deep learning, and AI auto-tuning.

VisionXpert Smart Camera (XC Series): A compact yet powerful "mini AOI" solution that integrates advanced vision tools, AI auto-tuning, and deep learning to deliver highly accurate inspection results.

Never let technical obstacles hold you back! Our ViTrox specialists will be on-site to answer your questions and provide live product demos. To experience our solutions firsthand, schedule an appointment by clicking this link or scanning the QR code below.

Contact us via [email protected] for more information. We look forward to welcoming you at SEMICON SEA 2025!

About ViTrox Technologies
ViTrox is committed to being the World’s Most Trusted Technology Company and the leading solutions provider by integrating ViTrox's technologies, people, and strategic alliances to provide its customers with the most innovative, advanced, and cost-effective machine vision solutions of excellent quality.

ViTrox offers a full spectrum of solutions, ranging from Middle & Back-end Semiconductor Inspection Solutions, SMT PCB Assembly Vision Inspection Solutions, Integrated Industrial Embedded Solutions, and Manufacturing Intelligence Solutions Towards Industry 5.0. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States and sales and support sites worldwide.

For more information about ViTrox’s products and services, please visit www.vitrox.com.

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[March 26, 2025 – Singapore] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON SEA held at the SANDS Expo and Convention Centre in Singapore from May 20 - 22, 2025. Visit booth #L2632 to learn about AI-powered AOI solutions for Advanced WLP/PLP and SEMI Back-End Package processes.

TRI will be exhibiting the new Wafer Inspection Platform, TR7950Q SII, featuring a High-resolution 2.5 μm 25MP camera and the TSV Metrology Module. The TR7950Q SII can perform Wafer Macroscopic 3D Inspection and micro measurement metrology. The TR7950Q SII can inspect Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, through-silicon via (TSV), and more. The TR7950Q SII can measure TSV at ultra-high speeds, measuring sensing TSV depth, trench depth, oxide, nitride, PR, and PI film thickness.

Additionally, TRI will showcase the TR7007Q SII-S, the high-accuracy 3D SEMI SPI for precise solder measurements, supporting applications such as Mini-LED, C4 bumps (~100 μm Ø), and 008004 paste inspection. The lineup will also feature an X-ray Inspection Demo Station.

Join us at booth #L2632 at SEMICON SEA 2025 to discover TRI's cutting-edge SEMI inspection and metrology solutions!

• Read more about Advanced WLP/PLP and Back-End Inspection at SEMICON SEA 2025

Chip Integration Technology Center (CITC) today announced the appointment of Toni Versluijs as the new chairman of its Supervisory Board. Versluijs will serve as the incoming chairman from September through December. Effective January 1, 2025, he will take over the responsibilities from chairman Roel Fonville who is retiring.

Versluijs has an extensive background of more than 25 years in the semiconductor industry, of which more than 15 years in general and executive management roles. Prior to this appointment, he worked for NXP, where he led the In-Vehicle Networking product line and was NXP Nijmegen site director and statutory director of NXP Netherlands. Most recently, he led the Business Group MOS at Nexperia, served as statutory director for Nexperia in the UK and was part of the company’s global executive leadership team.

He explains his choice for CITC: “I look forward to using my many years of experience in the semiconductor industry to contribute to the success of CITC in Nijmegen. Nijmegen is a location with a long heritage in semiconductor packages that have changed the world. CITC is a unique venture and has a unique position between private parties, the academic world and knowledge institutes.”

CITC is a smaller and different kind of organization than his previous employers, but Versluijs sees the potential: “CITC has attracted quite some talent in recent years, built partnerships and initiated new developments. In short: it has laid the foundation for growth, and it will flourish in the coming years. I am convinced that it has the potential to change the world of semiconductor packaging again.”

The current chairman of the CITC Supervisory Board, Roel Fonville, adds: “The Supervisory Board is very pleased to welcome Toni Versluijs to our midst. His personality and broad experience in the industry and in the Nijmegen region will help the Board to fulfill its role in securing the continued development of the organization.”

About CITC
Chip Integration Technology Center (CITC) is a non-profit, joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC's contribution to the ecosystem is to provide access to innovation, infrastructure, and education. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and is supported by local and regional governments.
www.citc.org

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