semiconductor manufacturing

On December 13, SEMI submitted its response to a Request for Information (RFI) from the U.S. Department of Commerce (the Department) regarding the newly launched American Artificial Intelligence (AI) Exports Program. The intent of this program is to position U.S. firms as global leaders in AI by connecting them with international buyers, leveraging the Department's export promotion tools and supporting industry-led consortia through targeted government backing. By issuing this RFI, the Department intends to solicit input on the development of industry-led consortia capable of delivering full-stack American AI export packages under the American AI Exports Program. Working with member companies, the SEMI Public Policy and Advocacy (PP A) team developed a response highlighting the importance of the semiconductor supply chain to the AI ecosystem, and offering various recommendations for consortium formation, federal support, strategic objectives, and proposal evaluation. The response was informed by direct discussions between SEMI PP A and Department officials implementing the program. Some of the key aspects of SEMI's response include the following:Broader AI Tech Stack Definition: The Department should recognize semiconductor manufacturing technologies, mature node semiconductors, and energy/environmental control systems as foundational elements of the AI technology stack. Evaluation Framework: Evaluation criteria for consortium proposals should align with CHIPS for America requirements and guardrails, focusing on national security, economic competitiveness, and commercial viability, as well as infrastructure needs.Consortia Governance: Consortia should be industry-led and feature: honest brokers capable of coordinating commercial actors while advancing national interest objectives; modularity to ensure that the various technology layers function as distinct yet interoperable units; and clear frameworks for intellectual property protections and regulatory compliance. Foreign Participation: Vetted foreign entities should be allowed to participate in the program in order to reflect the global nature of the AI ecosystem and to strengthen allied and partner nation supply chain resilience.Federal Support Mechanisms: The Department should leverage the unique capabilities of the National Institute for Standards and Technology, Center for AI Standards and Innovation, Bureau of Industry and Security, Export-Import Bank, Development Finance Corporation, and others, including expedited licensing, financing tools, tax incentives, and interagency liaisons to accelerate exports. National Security Compliance: SEMI's comments emphasize robust compliance programs, cybersecurity, supply chain security, and risk-based licensing to prevent misuse or diversion of AI technologies. Global Competitiveness and Standards: SEMI urges rapid implementation, international promotion of U.S. AI technologies, and leadership in global standards to ensure interoperability and trusted adoption worldwide.SEMI is grateful for the feedback provided by our member companies in developing this comprehensive response to the Department's RFI. Visit SEMI Global Advocacy to learn more about public policy efforts and developments as well as how your company or organization can get involved.Ben Kallen is Sr. Manager, Public Policy Advocacy at SEMI.

The CxO Summit at SEMICON Europa 2025 spotlighted Europe’s ongoing efforts to build a resilient and globally competitive semiconductor industry, while calling for greater ambition, speed, and unity in execution. Following global disruptions with the automotive supply chain crisis, the European Union launched a continent-wide strategy through the EU Chips Act. While the Act has already spurred significant developments, including construction of the new ESMC fab in Dresden, Europe remains far from its goal of achieving a 20% share of global semiconductor production by 2030. The CxO Summit, part of the SEMICON Europa event in Munich, provided an opportunity for industry leaders to share ideas about how to catalyze the next phase of the European industry’s growth.Ajit Manocha, President and CEO of SEMI opened the summit by describing today’s industry landscape with one word: “unprecedented.” Manocha said, “The global growth of the industry is unprecedented, with 107 new fabs set to come online by 2028, but the uncertainties are unprecedented, from geopolitics to the talent shortage to environmental concerns. So we need unprecedented solutions.” Ajit Manocha, President and CEO, SEMILaith Altimime, President of SEMI Europe echoed the mood of uncertainty, describing Europe as caught “in a perfect storm.” Altimime said, “As we face a combination of internal challenges and intensifying external competition, collaboration is not optional — it is mission critical.” Laith Altimime, President, SEMI EuropePierre Chastenet, Head of the Unit for Microelectronics and Photonics, European Commission, highlighted the tangible progress made under the EU Chips Act. “We now have a proper toolbox to handle a future crisis in the supply chain. The Chips for Europe initiative has led to the creation of five pilot lines for advanced technologies such as FD-SOI and wide bandgap semiconductors.” Chastenet added, “Europe must now capitalize on its strengths, from materials and equipment to design tools and cutting-edge research emerging from our RTOs.”Pierre Chastanet, Head of the Unit for Microelectronics and Photonics, European CommissionEchoing the call for action, Oliver Schenk, Member of the European Parliament, urged stronger regional unity. “Europe must act together, act faster, and act with much bigger ambition,” Schenk said, reinforcing the need for cross-border commitment to strengthen the continent’s semiconductor position.Oliver Schenk, Member of the European Parliament, European ParliamentHighlighting Europe’s most critical technology gap, Luc Van den hove, President and CEO of imec, unveiled plans for a new advanced fab backed by €2.5 billion in investment from the EU, the Flemish government, and ASML. Van den hove urged Europe to commit wholeheartedly to advanced technologies: “We must be more ambitious, and focus on disruptive breakthroughs rather than incremental change if we want to ensure a prosperous future.”Luc Van den hove, President CEO, imecAt the CxO Summit, CEA-Leti and ASML signed a memorandum of understanding (MoU) to deepen their collaboration and accelerate innovation in mainstream semiconductor technologies. Building on promising results in hybrid bonding, the partnership will now target 'More-than-Moore' innovations, including heterogeneous integration and novel substrates like SiC and GaN. “We aim to combine ASML’s world-class lithography expertise with CEA-Leti’s system-level innovation,” said Sébastien Dauvé, CEO of CEA-Leti. The collaboration is set to strengthen Europe’s ecosystem by shortening the path from early research to industrial impact.Left: Anne Hidma, Senior Vice President EUR US, ASML; Right: Sébastien Dauvé, CEO, CEA-LetiTurning to Europe’s industrial base, Christian Senger, CEO of Volkswagen Autonomous Mobility, emphasized the need to shift from risk-aversion to opportunity. While the region’s automotive sector faces intense global competition, particularly from China, Senger highlighted that Europe has the potential to lead in new mobility markets. “The market for autonomous roboshuttles for people transport in large cities is forecast to be worth €400 billion in the US and Europe alone,” he said. With American firms like Waymo and Uber leading the robotaxi space, Senger stressed that Europe must “act swiftly to create an environment that supports an autonomous mobility industry here.”Christian Senger, Member of the Board for Fully Autonomous Mobility and Transport CEO of ADMT GmbH, VolkswagenEurope’s Potential to Create Advanced TechnologyOne of these RTOs, CEA-Leti, is responsible for the FAMES pilot line for FD-SOI technology. Sébastien Dauvé, CEO of CEA-Leti, agreed with Pierre Chastenet that the pilot lines show great promise. He said, “FD-SOI is a big trend in semiconductors, because it enables very low power consumption in embedded devices. We think that adoption of the technology will grow in the coming years, and that is good, because most of the technology is produced in Europe.”Sébastien Dauvé, CEO, CEA-LetiEurope is also widely recognized to be the leading global voice on sustainability – a huge issue of concern to the semiconductor industry. Henri Berthe, President of the Semiconductor and Battery Segment at Scheider Electric, told the summit that 500 million tonnes of CO2 emissions per year are attributable to the semiconductor industry – “more than the whole of Mexico emits!” he said. “We need to make fabs more efficient, and that is why Schneider Electric has launched a new playbook with Applied Materials for sustainable energy abundance for the industry.”Henri Berthe, President of the Semiconductor Segment, Schneider ElectricAnother aspect of Europe’s playbook is support for new fabs. The flagship is ESMC, the joint venture between TSMC, NXP Semiconductors, Bosch, and Infineon. Christian Koitzsch, president and managing director of ESMC, reported to the summit that the project to build in Dresden a 12nm FinFET foundry and a 28nm CMOS line, requiring a total investment of €10bn, is on schedule. “We are now developing local supply chains, hosting a series of ESMC Supplier Days which are open not only to German but generally to European suppliers,” said Koitzsch.Christian Koitzsch, President and Managing Director, European Semiconductor Manufacturing Company (ESMC)As Manfred Horstmann, General Manager and Senior Vice President of Global Foundries, pointed out, the building of the ESMC fab means that Dresden is established as the center of a cluster of semiconductor industry companies. “Global Foundries has its Fab 1 and a mask center in Dresden. In fact, one-third of the chips produced throughout the whole of Europe now comes from Dresden.”Manfred Horstmann, General Manager and Senior Vice President, GlobalFoundriesAn example of ambition was given by Terence Gan, Executive Director of the Institute of Microelectronics of Singapore. Gan told the summit how Singapore has used pilot lines to stimulate research and development in new technologies. He said: “We started research into advanced packaging as long ago as 2011. Most people thought we were mad! But today, there is strong demand for our advanced packaging capabilities because of the rise of AI and its need for high-performance computing.”Terence Gan, Executive Director, Institute of MicroelectronicsBreaking Barriers to ProgressDespite momentum, bureaucratic inefficiencies continue to hamper progress. Narjiss Haddaoui, Managing Director of European Economics called for faster decision-making: “In global competition, speed is a decisive factor. To act fast enough, the EU must change its ‘software’ - the processes by which it considers and makes decisions.” Narjiss Haddaoui, Managing Director, European economicsThe stifling character of European bureaucracy is reflected in the region’s approach to building fabs. Herbert Blaschitz, Executive Vice President of Advanced Technology Facilities at Exyte, compared fab construction timelines: 20 months in Taiwan, 34 in Europe, and 38 in the U.S., attributing delays in Europe to paperwork bottlenecks.Herbert Blaschitz, Executive VP of Advanced Technology Facilities, ExyteFabio Gualandris, President for Quality, Manufacturing and Technology at STMicroelectronics raised another concern — 100% of raw materials used in European fabs come from outside the region. Christophe Frey, Vice-President for EU Engagements at Arm France, added that geopolitical tensions are clouding the path forward: “We are a bit lost in the smoke from the big fire in the world’s semiconductor industry.” Fabio Gualandris, President Quality, Manufacturing Technology, STMicroelectronics Christophe Frey, Vice-President of EU Engagements, Arm FrancePlaybooks For Future SuccessSo amid the uncertainty and global tension, what lessons can the industry learn from successful regional examples? Tuomas Korpela, Business Development Senior Manager at Nokia, credited Finland’s strategic procurement and policy tools with enabling a vibrant semiconductor ecosystem: “Finland creates demand for advanced chips using industrial policy tools, alongside strategic procurement in sectors such as defense and aerospace, and connectivity.” Tuomas Korpela, Business Development Senior Manager - Corporate Development Organization, NokiaAt a regional level, Joerg Schulze, Director of the Bavarian Chips Alliance, said that his organization was supported by the Bavarian State Ministry of Economic Affairs, as well as by companies and universities. “We help semiconductor companies to establish themselves and grow here through help with site searches, networking and contacts, funding and support, and talent acquisition,” said Schulze.Joerg Schulze, Spokesperson for the Bavarian Chips Alliance, Director of the Fraunhofer IISB, Bayern Innovativ GmbHCompanies in the European semiconductor supply chain also provided the summit with their insights into the roots of global success. André Grede, Chief Technology Officer of Comet, described how his company’s strategy is not to wait for customers to tell it what they need, but to be “ahead of the curve.” Grede said: “Is staying in sync with the customer enough? Not for us - we are deeply embedded with our customers, and constantly looking to broaden our relevance to them.”André Grede, CTO, CometChristophe Maleville, Chief Technology Officer of Soitec, provided a real-world example of how this is done. He said: “Our engineered substrates using RF-SOI technology reduce the drain on a mobile phone’s battery power, and cut our customers’ board footprint thanks to RF front end integration. As a result, our products are now in 100% of 5G smartphones.”Christophe Maleville, CTO, SoitecAnne Hidma, Senior Vice-President for Europe and the US at ASML, shared the company’s success formula: “The reasons for ASML’s success include customer focus – decide which markets you are going to be in, and which you are not. We are also all-in on innovation. We nurture an ecosystem, which for us includes imec and CEA-Leti, as well as partnerships with academia. And lastly, we have a strong supply base, which is a core strength of Europe.” In a time marked by both uncertainty and opportunity, the example of ASML shows how the European semiconductor supply chain can survive and thrive.Anne Hidma, Senior Vice President EUR US, ASMLEurope’s Path ForwardThe CxO Summit made one thing clear: Europe has world-class innovation, policy momentum, and industrial commitment. What’s needed now is faster execution, deeper collaboration, and the courage to invest in the technologies of tomorrow. As the industry heads toward the $1 trillion milestone, the decisions made today will shape Europe’s place in the semiconductor world for decades to come.On behalf of SEMI, the SEMI Europe team would like to express appreciation to the industry leaders for sharing their visions and readiness to collaborate during the CxO Summit.SEMI ContactLaith Altimime, President SEMI [email protected]

SEMI has submitted comments to the U.S. Department of Commerce’s Bureau of Industry and Security (BIS) in response to its Section 232 National Security Investigation of Imports of Robotics and Industrial Machinery.The submission highlights the vital role robotics and precision machinery play in semiconductor fabrication, packaging, and inspection and emphasizes the need for a balanced, risk-based approach to any future trade actions that strengthen U.S. national security while preserving access to robotics and industrial machinery essential to expanding the domestic semiconductor industry. SEMI RecommendationsSEMI outlined five key recommendations to the Administration.Encourage Investment and Maintain Existing Competitiveness. SEMI recommends excluding essential robotics and industrial machinery where domestic sourcing is not yet viable. If trade actions are taken following the investigation, SEMI recommends providing tariff reductions or waivers for companies investing in U.S. manufacturing capacity. SEMI emphasized protecting small and medium suppliers that keep the ecosystem running.Avoid Stacking Tariffs. Coordinate Section 232 actions across potentially overlapping actions and ongoing investigations, such as on imports of steel and aluminum, semiconductors, critical minerals, and polysilicon. This will help prevent duplicative or compounding tariffs that could raise costs and slow U.S. capacity building.Implement Adjustment Periods and Sunset Provisions. SEMI recommends any trade actions should phase in gradually to allow for domestic adaptation and include regular review mechanisms to recalibrate as the market evolves.Pair Trade Actions With R D, Workforce, and U.S.-Allied Collaboration. Strengthen domestic capacity through targeted federal research and development (R D) programs, workforce training, and deeper partnerships with trusted U.S. allies to build resilient technology ecosystems.Develop a National Robotics Strategy. Given robotics’ foundational role across semiconductor and advanced manufacturing sectors, SEMI recommends that the Administration develop a National Robotics Strategy. The strategy should align federal programs including those at NIST, NSF, and Department of Energy to accelerate robotics innovation, update technical standards, and drive U.S. leadership in automation and manufacturing competitiveness.The Global ContextWorldwide installations of industrial robots surpassed 540,000 units in 2023, with the market projected to exceed $73 billion in 2025.Robotics and industrial machinery are integral to semiconductor production ensuring cleanroom integrity, precision, and throughput. Broad or overlapping tariffs could raise costs and undermine U.S. competitiveness at a time when historic investments in domestic semiconductor manufacturing are taking hold.Next StepsSEMI looks forward to working with the Department of Commerce and other federal partners to ensure that Section 232 policies enhance both U.S. national security and the industry’s global competitiveness.Read SEMI’s full submission on Regulations.gov by searching Section 232 Investigation of Imports of Robotics and Industrial Machinery (XRIN 0694-XC138).Visit SEMI Global Advocacy to learn more about public policy efforts and developments as well as how your company or organization can get involved.Marc Coldiron is Director, Global Public Policy Advocacy at SEMI.

The Department of Commerce (DOC) has issued an amended version of the semiconductor supply chain Notice of Funding Opportunity (NOFO), commonly referred to as “NOFO 2.” This NOFO is explicitly geared toward projects that would construct, expand, or modernize semiconductor materials facilities or semiconductor manufacturing equipment facilities. Initial concept plans will be accepted until November 1, 2026. DOC released the first version of NOFO 2 in September 2023. While the amended version maintains the focus on upstream suppliers of semiconductor manufacturing materials and equipment, it differs in several key aspects from the original. Outside of the application deadline extension, some of the most notable differences include the following.Project Cost: The amended NOFO 2 removes the $300 million cap on individual projects but argues that individual projects under $20 million are unlikely to reach a scale necessary for achieving strategic objectives.Cost Sharing: The amended version lacks a cost sharing requirement but notes that individual applicants "must be able to demonstrate that they have sufficient resources available to complete the proposed project, when combined with the requested CHIPS Incentives."Fab Clusters: NOFO 2 includes a focus on supporting "the development of vibrant, sustainable semiconductor clusters" by, for example, "reducing the burdens associated with transporting critical supply chain inputs." Evaluation Criteria: Proposals will be evaluated using the following five criteria:Economic and National SecurityCommercial ViabilityFinancial StrengthProject Technical Feasibility and ReadinessWorkforce Development Available Funding: The amended NOFO 2 does not specify a total amount of available funding, which is a departure from the September 2023 version, which set aside $500 million for the entire endeavor. Eligible Applicants: Eligible applicants include private sector organizations, non-profit organizations, consortia of private sector organizations, and consortia of private, public, and/or nonprofit organizations “with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment.”Application Structure and Deadlines: Initial concept plans will be accepted until November 1, 2026. DOC will notify applicants that have been invited to submit full proposals on an individual basis. Sources and Additional Information:NOFO 2NOFO 2 FAQ Visit SEMI Global Advocacy to learn more about public policy efforts and developments as well as how your company or organization can get involved.Ben Kallen is Sr. Manager, Public Policy Advocacy at SEMI.

On Friday, September 19, 2025, the President signed a proclamation requiring a new $100,000 fee for United States H-1B visa applications effective September 21, 2025 seeking to curb what the administration views as significant overuse. A memorandum later issued by the United States Citizenship and Immigration Services (USCIS) Director clarified that the fee applies only to new, unfiled petitions. Current visa holders can continue traveling to and from the United States.While SEMI recognizes the economic and strategic concerns raised by the administration, the high cost of the new fee poses a significant burden on SEMI members and the broader technology industry. As SEMI members continue to share the impact this policy will create on their operations, SEMI will work with fellow trade associations to address the high-cost of the fee and find solutions for the administration’s policy concerns.The proclamation cites misuse and calls "abuse of the H-1B program" a "national security threat." All entries under an H-1B visa beginning September 21, 2025, are restricted unless supplemented by the $100,000 payment. The administration must review this restriction annually, and DHS will issue implementation guidance. The proclamation also directs DHS to revise prevailing wage levels and prioritize "high-skilled and high-paid" applicants.The H-1B program currently caps new visas at 65,000 annually, plus 20,000 for those with U.S. master's degrees or higher. Employers must petition for these visas. Demand for skilled workers—especially in technology-driven industries like semiconductors—far exceeds the limited H-1B supply. The changes risk driving away U.S.-educated foreign graduates and their skills to foreign markets, further straining workforce needs.SEMI recognizes the impact of the proposed H1-B visa fee on companies, particularly the additional burden it places on smaller firms. While SEMI supports the administration’s objectives, the policy will create near-term challenges — especially for companies working to scale in order to meet the goals set by Congress and the administration to strengthen economic and national security. By straining the talent and resources these companies rely on, the fee risks undermining those objectives.In the coming days, SEMI will be gathering information to better understand the impact across the industry, with particular attention to smaller companies. This input will guide our communications with the administration as it refines the policy. We will also be meeting with member companies to assess the impact and prepare talking points for upcoming discussions with the administration.Next Steps: SEMI issued an initial statement recognizing the administration's economic and security concerns while urging collaboration on solutions that benefit economic growth and talent retention. SEMI will work with industry groups, the administration, and Congress to address H-1B challenges and help grow the American workforce while retaining global talent. SEMI is spearheading a letter to the administration highlighting industry concerns while expressing the desire to work together, and we will be inviting related industry associations and groups to join us. SEMI encourages members to share details on the anticipated impact of the policy on their operations. Please reach out to Christina Banoub at [email protected] policy aligns with forthcoming H-1B rulemaking that would weigh applications by wage levels instead of the current lottery system. The rule hasn't yet appeared in the Federal Register but should follow soon.Visit SEMI Global Advocacy to learn more about public policy efforts and developments as well as how your company or organization can get involved.Royal Kastens, Senior Director of Public Policy and Advocacy at SEMI.

As the Department of Commerce explores options to adjust patent fees, these changes will have important implications for the semiconductor industry, where thousands of patents are filed each year to protect groundbreaking technologies. At SEMI, we understand the complexity of getting this right for our member companies. The fee proposal is not only about rates, but also about how fees are structured, applied across different types of filers, and administered in practice. Designing a system that is fair and workable is a significant challenge and one that requires close collaboration between government and industry. The SEMI Global Advocacy team is consistently engaged with the Trump Administration and Congress as a resource. We want to ensure the unique needs of the semiconductor sector are understood and that any adjustments to the fee schedule strengthen U.S. innovation without creating unintended barriers. By working together, SEMI members with U.S. operations can help shape an approach that supports the U.S. Patent and Trademark Office's mission and U.S. competitiveness. Next Steps: SEMI will continue to provide technical insight from across our membership as this process develops and looks forward to partnering with policymakers. We will also share updates as information on new patent fees become available beyond the initial reporting by the Wall Street Journal and other news outlets.Visit SEMI Global Advocacy to learn more about public policy efforts and developments as well as how your company or organization can get involved.Scarlett Bickerton, Manager, Federal State Affairs at SEMI.

On July 7, President Trump issued an executive order (EO) extending the ten percent baseline tariff rate through August 1, 2025. In addition, the EO suspends the variable "reciprocal" tariffs imposed under the International Emergency Economic Powers Act (IEEPA) until August 1. The order applies to nearly all countries except Mexico, Canada, and China. These changes do not impact separate reciprocal tariff actions on China or alter existing Section 232 measures on steel, aluminum, autos, and their derivative products. At the time of this posting, letters had been sent to 20 trading partners outlining expected tariff rates if no agreement is reached by August 1; bilateral negotiations are ongoing. Eleven of the 21 countries received rate cuts compared to the "Liberation Day" announcements on April 2, ranging from one to 13 percent. President Trump indicated rates could rise around 25 percent if trading partners retaliate. Next Steps: The extension offers short-term stability for SEMI member companies to assess supply chain exposure. SEMI continues to monitor bilateral trade and tariff policy negotiations, including for discussion related to the semiconductor supply chain. We aim to keep member companies informed of relevant tariff escalations. If your company is directly impacted by a country-specific rate shift, please reach out to your region’s SEMI Global Advocacy contact with any feedback on how these tariffs are affecting your operations.Visit SEMI Global Advocacy to learn more about public policy efforts and developments as well as how your company or organization can get involved.Scarlett Bickerton, Manager, Federal State Affairs at SEMI.

In a letter sent to the United States Congress, SEMI, the leading industry association serving the global electronics design and manufacturing supply chain, and 16 member companies urged Congress include in reconciliation an expansion and extension of the Advanced Manufacturing Investment Tax Credit. The letter calls for the expansion of eligibility for the federal investment tax credit (ITC) to make the entire semiconductor manufacturing supply chain, as well as R D and design expenditures eligible for the ITC and extend the credit beyond the current 2026 expiration date—to allow sufficient time to plan and execute investments. The U.S. semiconductor market is growing to meet the needs of critical technology applications like artificial intelligence (AI), telecommunications, and bioengineering that rely on semiconductors. That growth requires increased investment for upstream materials, chemicals, and electronic design automation (EDA), which are currently excluded from receiving the tax credit (also known as Sec. 48D). Excluding these critical manufacturing and R D projects undermines domestic investment efforts potentially ceding U.S. leadership and competitiveness. Semiconductor infrastructure requires billions of dollars in upfront investment, and tax incentives are essential to help offset these exorbitant costs. A competitive tax environment encourages semiconductor companies to invest in the U.S., strengthening domestic manufacturing and innovation while helping the U.S. meet its goals of maintaining global leadership with lower-cost regions also providing incentives.Also, the credit expires at the end of 2026, leaving insufficient planning and implementation time for the billions in upfront investment required to support semiconductor infrastructure in the United States. To support the success, growth, and innovation of the U.S. semiconductor ecosystem, SEMI and its members urge Congress to include in the reconciliation package:Expansion of the Sec. 48D tax credit for the entire supply chain—as included in the SEMI Investment Act (S. 1642)Extension of the credit to allow enough time for businesses to plan and execute needed investments as included in the BASIC Act (H.R. 3204)Recognition of R D and design expenditures as eligible Sec. 48D projects as included in the STAR Act (H.R. 802)These inclusions are crucial to maintain U.S. competitiveness in attracting global semiconductor industry investments.The letter was signed by CEOs or presidents of the following leading companies: SEMI; ASML; ASM; Advantest America, Inc.; Axcelis Technologies Inc.; Brewer Science; Chemours; Dupont’s Electronics business, and Qnity™; Entegris; Evatec NA, Inc.; EFC Gases Advanced Materials; GlobalWafers Co., Ltd.; Lam Research Corporation; Micron Technology; Tokyo Electron America, Inc. TEL Manufacturing and Engineering of America, Inc.; SACHEM, Inc.; SkyWater Technology.Visit SEMI Global Advocacy to learn more about public policy efforts and developments as well as how your company or organization can get involved.Christina Banoub, Senior Manager, Federal Affairs at SEMI.

Gone are the days when companies were said to go “beyond compliance” if they had sustainability ambitions and operated in a largely voluntary space.Corporate sustainability now sits in a tangle of business priorities, stakeholder expectations, and regulatory obligations. New landmark legislation and policies have changed the game in many markets where semiconductor value chain companies do business. Today, accuracy of information, threshold-setting, evaluation criteria, and due diligence are subject to scrutiny, fines, and litigation.A myriad of compliance risks are now linked to business actions that were historically voluntary in a sustainability context. Fueling the shift are regulations such as the EU’s Corporate Sustainability Due Diligence Directive (CSDDD) and Corporate Sustainability Reporting Directive (CSRD).Across the semiconductor value chain, it is crucial for companies to have a solid regulatory strategy for their sustainability activities. They must take into account, for example, mandatory rules that drive up risks from selectively taking action on some sustainability issues while demoting others.Semiconductor manufacturing and design firms, together with their business partners, face heightened pressure to navigate business and sustainability priorities around the climate transition, human capital management, supply chain management, and a host of other environmental, social, and governance issues that are high on regulatory agendas.The SEMI Sustainability Initiative hosts several working groups that bring to light common concerns and provide a forum for sharing response strategies. To sharpen the guidance that SEMI offers, the Sustainability Initiative is launching the webinar series, Global State of Play: Sustainability Regulations, Reporting, Incentives. This series offers semiconductor industry professionals the chance to learn from top-tier experts on the most pressing challenges in compliance, disclosure, and strategy for sustainable business.The first webinar, Developing a Regulatory Strategy for Sustainability: How to Navigate Key Sustainability Decisions, will feature Ashley Walter, Partner and Chief Sustainability Officer at Orrick Herrington Sutcliffe LLP.As the global business association for the electronics design and manufacturing value chain, SEMI is pleased to convene experts to address improving sustainability strategies for our industry. The SEMI Sustainability Initiative invites industry stakeholders to see the importance of building a regulatory strategy that coordinates across functions, from engineering to the boardroom.Learn more and register.Jordan Famularo, PhD, is Programs Manager, Sustainability at SEMI.

The semiconductor industry, once a hidden force in technology, is now recognized as a pivotal driver of the modern economy. As the engine behind everything from smartphones to smart cities, semiconductors fuel innovation and shape how students learn, play, and engage with the world, making chips a crucial factor in shaping our collective future as the climate changes.In line with SEMI Sustainability Initiative participation at Climate Week NYC, we are preparing a groundbreaking pilot program at the intersection of youth empowerment, workforce development, and climate action. To help the semiconductor industry develop a climate-literate workforce, the SEMI Climate Equity Social Impact Working Group and the SEMI Foundation have partnered to develop a global K-12 program open to all SEMI members for participation and sponsorship. The program will share best practices and resources such as those that follow in this article.SEMI will announce the program at the 29th United Nations Climate Change Conference, more commonly known as COP29, which will be held in Baku, Azerbaijan from November 11-22, 2024. SEMI members are encouraged to become partners and help shape the program ahead of COP29. Contact us to learn more and participate in the announcement.The Opportunity for Semiconductor Industry Climate Leadership It’s not enough for students to simply be aware of climate change and the United Nations Sustainable Development Goals. Awareness alone won’t protect communities or help solve the problems we may all face in the future. We must prepare the next generation to be climate-literate — providing them with the knowledge, tools, and skills to understand complex issues, work collaboratively across the globe, and develop practical, real-world solutions. With this foundation in place, young people become proactive global citizens with the skills to solve problems.The semiconductor industry doesn’t need to reinvent the wheel or build new networks to drive partnership at the intersection of sustainability and workforce development. Companies in our value chain are already well positioned to scale equitable opportunities, promote STEM and AI skills, and empower students to tackle real-world climate challenges as we help prepare them for future careers. Global networks of sustainable schools focused on climate action are well-established in key semiconductor regions. In Taiwan alone, over 330,000 students will participate this year.Sustainable schools networks engage teachers and students with programs that are fun, motivating, and spark curiosity by providing ownership over solving real-world challenges. These mostly free programs can also help drive gender and racial equity into the tech, science and engineering fields for communities and schools that might otherwise be left behind.Examples of programs with youth-designed climate actions are all around us. Students in one New Taipei City, Taiwan school conducted their own energy audits to reduce energy consumption in their medium-income community. Students in a North Pennsylvania, U.S. school of limited resources created a community garden that sparked interest in biodiversity and STEM.Our industry has a unique opportunity to tap into existing sustainable schools networks and help them grow, while amplifying youth-led climate action. These efforts will empower the next generation to drive meaningful change in their communities and inspire young people of every demographic to see the semiconductor industry as a place where they can build impactful careers.Leading the Way: Why the Semiconductor Industry is PivotalGiven the essential role of semiconductor companies in the global electronics design and manufacturing value chain, industry leaders have a unique opportunity to lead the way in cultivating a climate-literate generation of students for the future workforce. Early education on sustainability and technology integration is crucial, positioning leading companies and their partners to shape the emerging global workforce. The long-term semiconductor workforce development effort must cultivate global citizens who understand how to apply their skills in solving challenges. Opportunities for All Schools: Making Climate Education InclusiveWhile some high-resource schools may be able to integrate advanced environmental science and technology projects, it’s important to ensure that all students have access to meaningful climate learning opportunities. For example, students at schools with fewer resources can engage in projects like programming inexpensive micro:bit sensors to measure local water quality or sample moisture levels in their community gardens. Projects such as these are affordable, scalable, and can be implemented in any school, providing students with hands-on experience in environmental science and technology.More importantly, they build critical thinking and problem-solving skills that empower students to take ownership of climate issues affecting their communities.Additional powerful examples already in existence that provide a basis for scalable teaching, learning and partnership for schools globally include:1. Global Climate Pathways (GCP) is a program where various middle schools around the world work together to solve climate problems. Schools that participate receive learning opportunities and tangible STEM learning tools, including STEM kits. These innovative tools provide learning opportunities in coding and circuits.2. EcoSchools U.S. is a global sustainability education program run by the National Wildlife Federation (NWF). This transformative program is student-led, integrating green STEM through project-based learning. It provides opportunities for students to take ownership of their learning by addressing real-world challenges, drives student and teacher engagement, and creates tangible sustainability impacts across school communities. EcoSchools US fosters the development of transferable skills highly valued by employers, such as problem-solving, critical thinking, and interpersonal skills.3. Global Classroom Project is an initiative by Fairfax County Public Schools in Virginia, USA, designed to enhance students' global awareness and cultural understanding. It typically involves integrating international perspectives and global issues into the curriculum, promoting cross-cultural exchanges, and connecting students with peers from around the world.New Jersey Institute of Technology President Teik C. Lim hosts an exchange of Taiwan educators during their visit to advance global collaboration for students.A Common Ground for All Stakeholders: Education with a PurposeA challenge in K-12 engagement is the differing perspectives on its purpose among stakeholders. Companies in the semiconductor value chain may view this student outreach as a way to develop technical talent, while green nonprofits often emphasize climate education and sustainability.Bridging these perspectives requires building a platform that any classroom or school can access if they choose. Adopting a public-private partnership approach brings together corporate, government, and nonprofit stakeholders around a shared set of values. This collaborative effort aims to create opportunities and solutions for communities globally.By investing in early education, the semiconductor industry will not only prepare young people to tackle environmental and technical challenges but also ensure they are ready for future job opportunities and educational pathways. These efforts will help attract students to become part of an industry that values their contributions and future, shaping a workforce equipped to lead and innovate in a rapidly evolving world.This is the moment for companies in the semiconductor value chain to lead by example, demonstrating their investment not just in technology but in the sustainability and health of our planet. By supporting K-12 education with a focus on climate literacy, international partnership, sustainability, and STEM, companies in our value chain can build a brighter, more sustainable future for us all—while ensuring that today’s students are prepared to address the challenges of tomorrow. Justin Harris is Senior Advisor for Climate Equity Social Impact at SEMI, Bia Hamed, Ph.D. is Program Manager, Global Education Initiatives at the SEMI Foundation, and Marley Hauser is senior coordinator for the Climate Equity Collaborative. Acknowledgements Partners We thank our first round of partners for the SEMI global K-12 climate engagement program for their contributions of time and thought leadership to this effort: SEMI members, Climate Equity Collaborative, National Wildlife Federation, ARCedTech, Fairfax County Public Schools, Kaohsiung City Education Bureau, U.S. Environmental Protection Agency, Taiwan Ministry of Environment, Sustainable Jersey for Schools, New Jersey Department of Education, Dr. Prabhakar Shrestha of New Jersey Institute of Technology (NJIT), Dr. Tim Hsu of Global Environmental Enhancement (GEE) in Taiwan, New Jersey Audubon, and the students of NJIT and Readington Middle School in Whitehouse, New Jersey. Special thanks to Shari Liss, Vice President for Workforce Development at SEMI Foundation, and Dr. Mousumi Bhat, SEMI Vice President for Sustainability.