Internet of Things

How are flexible electronics impacting the automotive sector? How will medical diagnostics and life sciences be changing with the advent of flexible, conformable electronics? How does space exploration intersect with the continued development of flexible sensors and Internet of Things (IoT) systems? The upcoming 2019FLEX Japan / MEMS SENSORS FORUM in Shinagawa, Tokyo, May 22-23, 2019, will explore these questions and more. The event, the third FLEX Japan, is expected to gather 300 designers, technologists, researchers, analyst and product developers to hear presentations, discuss their approaches, and create connections. The transformation of the automotive industry will receive special attention with speakers from Yole Développement and a deep exploration of the new sensor form factors and capabilities. Professor Shoji Kawahito of Shizuoka University will discuss the impact of image sensors on automotive LIDAR, night vision and monitors for the driver and passengers. Dr. Yoshifumi Sakamoto of IBM Japan will share his views on key trends in smart transportation and what they mean for the supply chain. Beck Oh, president and CEO of PNI Sensor, will share how parking sensors are transforming our driving – and parking – experience. Hideo Fukunaga, project manager for Velodyne LiDAR, will discuss his work using LIDAR, often seen as the most promising and the most difficult and expensive component of autonomous driving. Jerome Joimel, CTO of ISORG, will discuss integration of organic image sensor behind display.Medical and home electronics devices are moving out of their boxes and hospitals, and flexible electronics, new sensor designs and new power options are playing a major role in that transformation. Jenax, Kobe University, Toyo University, Osaka University, and Daiwa House are just some of the presenters in this area. Researchers are steadily overcoming key technology hurdles, such as electronic interconnects between soft and rigid surfaces, and energy harvesting techniques for no-power devices, as well as ultra-thin RF components, and advanced microfluidic systems. Space, the final frontier, will be the backdrop for the general keynote talk of Mayya Mayyappan, chief scientist for exploration technology at NASA’s Ames Research Center. His team is investigating new printed and flexible sensors and electronics that can be printed in zero-gravity and how these devices will enable IoT.The only event in Japan focused on flexible and printed electronics, with special focus on the complementary areas of sensors and MEMS, 2019FLEX Japan / MEMS SENSORS FORUM provides an excellent opportunity to meet with industry players considering integration and application of new form factor electronics. More than 20 exhibitors will showcase the building blocks for conceptualizing and designing new products immediately.Register now!

SEMI has long promoted the industry collaboration that has contributed to the rise of the smart digital world we live in today. A world where data is being generated continuously by systems, gadgets, and sensors around us – often referred to as the Internet of Things (IoT). In our personal lives, most of us have smartphones, smart watches, smart TVs and smart cars, and we live in smart homes and smart cities generating huge amounts of data.In the work world, data and analytics are now influencing almost every industry including healthcare, government, financial services, construction and transportation. This data has the potential to transform our lives and make our world even smarter – if we can communicate and process this data, and use it to come up with actionable recommendations or actions. Artificial Intelligence (AI) and Machine Learning (ML) techniques have generated much excitement precisely because they offer us ways to realize the full value of data by harnessing it and transforming it into active intelligence.Data-intensive technologies are required to store, communicate and analyze data. And it all starts with innovation in microelectronics chips and systems spanning processors, memory, sensors, radios and other devices, presenting a huge opportunity to producers of these technologies. However, with Moore's Law beginning to slow, technology paths and innovation options are diverging. Companies must swiftly assess these options in order to develop competitive offerings. But the technological complexity and divergence makes it increasingly expensive or even unaffordable for many companies to track and pursue these options.The good news is that cost-effective early assessment is possible through pre-competitive collaboration that can produce new and often unexpected cross-disciplinary insights by overcoming traditional silos in industry and academia. Unfortunately, important collaborative industry platforms, such as the International Technology Roadmap for Semiconductors (ITRS), have folded, opening a collaboration gap in the global microelectronics ecosystem.As part of its mission to help companies connect, collaborate, and innovate, SEMI has built a collaborative, cross-supply-chain platform – the Strategic Innovation Platform (SIP). The goal is to provide early and comprehensive assessment of future technologies that are five to eight years away from commercialization. The assessment identifies not just technical barriers but also manufacturing and supply-chain constraints to implementing new technologies. SIP brings together the entire microelectronics ecosystem including strategic technology thought leaders, subject matter experts, technology and application developers, academia, researchers, start-ups and government. With more than 2,100-member companies spread across the global electronics manufacturing supply chain, SEMI is uniquely positioned to enable this critical collaboration. Award-Winning First ProjectThe inaugural SIP project assessed key drivers of future technologies. A key finding was that fast, efficient interconnects between devices and components are critical to the system performance important to customers and users, implying that system-level optimization is required. For data-intensive applications, interconnects have emerged as a key bottleneck for both performance and power in various circuits and systems in part because the slowing of Moore’s Law has decelerated advances in individual device performance, and in part because systems are becoming more complex, requiring heterogeneous integration.To address this challenge, SIP brought together industry experts from ASE Inc., Dow Chemical, Lam Research, Qualcomm and Xilinx to assess the future impact of interconnects for data-intensive applications. SEMI also involved Stanford University professors to collaborate on modeling and simulation. Through this unique cross-disciplinary collaboration, SIP developed a realistic model to evaluate the system-level performance of single-chip systems, as well as multi-chip systems – including traditional 2D packages, high-performance 2.5D systems that use interposers, and futuristic 3D systems. SIP also explored supply chain challenges in business continuity, manufacturability, Environment, Health and Safety (EHS) and the regulatory environment. SEMI worked with a broad range of industry partners to ensure that the model parameters accurately reflected realities on the design and factory floors to ensure usable results. Experimentation has become ever more expensive, with one industry player reporting that “it costs us $100 million to do a good experimental evaluation.” Accurate models can go a long way toward reducing the cost of technology assessment. The SIP collaboration produced key quantifiable insights including comparisons that highlight the benefits and limitations of various materials being explored for future interconnects, and of architectures under consideration for future data-intensive applications. For example, the current workhorse for artificial intelligence (AI) platforms – 2.5D technology – delivers a 4X improvement over 2D packaging but falls short of providing the orders-of-magnitude improvement that future AI/ML applications may require. These findings enable the industry to begin to identify ways to optimize 2.5D architectures, transition to 3D heterogeneous integration for performance-critical applications in the medium term, and to eventually evaluate new paradigms such as neuromorphic and quantum. The project findings were presented late last year in the form of two research papers at Electronics System-Integration Technology Conferences (ESTC) and International Microelectronics Assembly and Packaging Society (IMAPS) recently. One received the “Best Paper of the Session” award at IMAPS – a recognition that affirms the power of a collaborative platform such as SIP to produce valuable insights to address the growing technology complexity within the microelectronics industry. The microelectronics industry is on the cusp of a historic inflection point, where it could fuel the rise of emerging applications in AI/ML and IoT, and can grow into a trillion dollar industry over the next several years. More importantly, the industry is poised to help solve some of society’s most complex problems in areas including healthy living, climate change and transportation. No company can do this alone, and pre-competitive platforms such as SIP are key both to accelerating innovation through cross-disciplinary collaboration, and to reducing costs for individual companies. Please contact Tom Salmon at [email protected] or Pushkar Apte at [email protected] for more details and to get involved in future projects.Tom Salmon is vice president of Collaborative Technology Platforms. Pushkar Apte is a strategic technology advisor at SEMI.

The more than 53,000 people who flocked to SEMICON Korea last month were treated to a motherlode of insight into the future of the semiconductor industry as 470 companies exhibited innovative technologies in more than 2,000 booths. But the annual event’s most arresting numbers came in keynotes and other presentations pointing to the extraordinary industry growth that lies ahead.“It is no exaggeration to say that 90 percent of the world’s data has been generated in the last few years,” said Jim Feldhan, president of Semico Research. “This explosive growth of data is expected to continue. That's why server shipments will grow by 20.3 percent, or 30 million units, this year alone.”Feldhan said that the Internet of Things (IoT) will be a chief driver of semiconductor industry growth, with IoT expected to be applied in areas as varied as automotive, smart cities, edge computers, finance, architecture, agriculture and healthcare. For its part, artificial intelligence (AI) will start to exercise human-like judgment. Feldhan noted that in many instances in these fields, “it is more accurate to apply AI and vision systems than to rely on traditional decision-making.”Yoon Jong Lee, senior vice president of DB HiTek, predicted that the Internet, AI and 5G will drive market growth. “Looking back over the past 30 years, semiconductor market growth was powered by PCs, the Internet and cell phones, yet last year memory accounted for 35 percent of total semiconductor sales, more than double the figure in 2016,” he said. He predicted that, in 2019, the foundry sector will outstrip the semiconductor market in growth, noting that the average growth rate of the semiconductor industry is expected to be 4.1 percent, compared to 7.1 percent for the foundry market. Clark Tseng, director of SEMI, reported that the strong semiconductor growth in 2018 is unlikely to continue in 2019 due to the decline in memory pricing, as well as mobile and PC demand. “Demand for semiconductors is likely to decline in the first half as the industry is still digesting inventory and rebound in the second,” Tseng said. Semiconductor industry growth headwinds include decreases in high-end smartphone purchases, PC demand and demand for DRAMs for servers in data centers, Tseng said. Declines in economic growth and consumption in China and the U.S.-China trade war will also contribute to a slowdown. However, Tseng noted that, over the long term, technology innovation will continue and that the semiconductor industry’s prospects remain bright.One key innovation will be the elimination of AI’s reliance on Internet connections in the future. In his opening day keynote, Eunsoo Shim, senior vice president at Samsung Electronics, emphasized that AI technology that operates without the Internet in the future is essential. “We are developing 'on-device AI' technology that incorporates AI algorithms in products such as smartphones and autonomous vehicles,” he said. "When on-device AI technology is implemented, it reduces reliance on the Internet, battery consumption, and data latency.” Reducing latency will significantly improve device response time.Walden C. Rhines, CEO Emeritus of Mentor, a Siemens business, predicted that AI will fuel rapid memory growth. The memory semiconductor (DRAM, NAND flash) market is expected to see a temporary slowdown this year, with the market expected to rebound in 2020. Rhines said that memory could be seen as an early market with rapid future growth, citing memory market super-booms in 1995 and 2000.“Memory production has not decreased since 1995 or 2000,” he said. “Although memory prices will temporarily fall this year after significant market growth in 2017 to 2018, the market will continue to grow as memory production increases,” he said. Rhines added that “although memory prices will drop by about 10 percent this year, he believes prices will increase 6 percent next year.” He also predicted the steady growth of the non-memory semiconductor market as AI technology matures and China’s investment in fabless companies continues.Indeed, SEMICON Korea speakers made it clear that concerns about the growth of the semiconductor industry are expected to be short-lived. While overall growth is likely to slow in 2019, the industry is expected to rebound steadily – powered by the semiconductor industry paradigm shift led by AI, IOT, and autonomous driving – and reach a new high of nearly $541 billion in 2020.Jaegwan Shim is a marketing specialist at SEMI Korea.

SEMI and imec are joining forces to drive innovation and deepen industry alignment on technology roadmaps and international standards while adding technology depth to SEMI’s five vertical application platforms including Smart Transportation, Smart MedTech and Smart Data.Under a Memorandum of Understanding announced today at ISS 2019, the two organizations have set their sights on bringing together key industry players to advance cutting-edge technologies including Internet of Things (IoT), artificial intelligence (AI) and machine learning that enable new capabilities across healthcare, automotive and semiconductor manufacturing. The partnership also aims to speed the time to better business results for SEMI and imec members and partners. SEMI brings to the partnership access to the $2 trillion global electronics manufacturing supply chain and imec its global research and development (R D) and innovation leadership in nanoelectronics and digital technologies.Under the MOU, the two organizations will co-produce SEMI Think Tanks, extend SEMI’s International Standards platform to non-CMOS technologies, identify and fill gaps in technology roadmaps, and tighten imec’s engagement with SEMI in European workforce development efforts.Bettina Weiss is Chief of Staff at SEMI.

We are living in a digital world where semiconductors are taken for granted, AI is bringing semiconductors back into the deserved spotlight, and now we are witnessing the dawn of the Cognitive Era enabled by semiconductors,” SEMI president and CEO Ajit Manocha said to an audience of more than 500 during his presentation – Rebirth of the Semiconductor Industry – at the First Global IC Entrepreneur Conference.Speaking at the Shanghai event in mid-December, Manocha recalled how, when he first entered the semiconductor industry in the 1980s, semiconductors revenue topped out at about $10 billion. Now, with sales having swelled to a staggering $450 billion, the industry is on a much faster growth track. Revenue could reach $500 billion by the end of 2020 and trillions of dollars by 2030. Over the past two decades, chips have given rise to social media and e-commerce powerhouses such as Google, Facebook, and Alibaba. All rely on heavily on chips, the engines of data centers across all industries. Wave after wave of technology innovation have been powered by semiconductors – from mainframe computers in the 1970s, personal computers in the 1980s, the Internet in the 1990s, and mobile and social networking in the early 20th century, to the current shining stars of technology such as IoT, big data, new memory, virtual reality, autonomous driving and artificial intelligence, Manocha said. New applications across areas such as smart manufacturing and digital healthcare are stoking the latest round of semiconductor growth.The rise of AI, like all the technologies before it, has renewed the semiconductor industry once again with its promise to drive growth of all industries worldwide, Manocha said. Five years ago, IoT was but a gleam in a technologist’s eye, more hype than reality with doubt about its viability running deep. Today, with about 60 percent of people in the world connected to the Internet, the enormous promise and potential of IoT is flowering. Industry growth will explode as the melding of AI and IoT birth countless applications and innovations in SMART transportation (0 emissions; 0 fatalities; 0 congestion), smart sensors (agriculture, infrastructure, healthcare) and SMART “Everything” (people, devices, homes, cities, industries, and the list goes on). Indeed, AI is now widely recognized as a chief growth driver of the semiconductor industry well into the future, with semiconductor technology at the core of AI innovation, he said. Semiconductors are thrusting the fifth industrial revolution into the fast lane. China’s much-anticipated rise as an industry powerhouse over the next few years will only accelerate industry growth, turning current disruptions into future opportunities as SEMI China continues to cultivate connection, collaboration and innovation in China’s fast-growing semiconductor sector.Cherry Sun is a marketing manager at SEMI China.

Five young dancers bathed in a striking rainbow of colors with their silhouettes cast in the background dazzled SEMICON Japan 2018 attendees at the opening ceremony in mid-December. Gone were the standard opening keynotes and ribbon cutting, replaced by live performance and media art set against a dramatic black backdrop. There was no mistaking the wide-eyed looks of wonder in the audience.In its sheer vibrance, the opening ceremony thrilled with an excitement that seemed to embody the extraordinary growth expectations for the global semiconductor supply chain over the next five years, with the industry poised to double sales from $2 trillion to a staggering $4 trillion – a phenomena SEMI president and CEO Ajit Manocha has called The Rebirth of the Semiconductor Industry. Driving this unprecedented growth will be SMART applications that are transforming industries and applications worldwide, powered by artificial intelligence (AI) and Internet of Things (IoT) technologies.The dramatic scene at SEMICON Japan 2018 was staged by Rhizomatiks, a media arts company that produced the Rio Olympic Games closing ceremony and is famous for its pop music spectacles. The company’s CTO, Motoi Ishibashi, the event’s first keynote speaker, described his team’s development of drones and vehicles guided by motion and precision-control technologies. It was some of these SMART vehicles that maneuvered the opening ceremony performers from the dance company Elevenplay onstage. Only Rhizomatiks, Ishibashi said, has this capability. In its mission to enrich people’s lives through new media arts, Rhizomatiks uses the latest virtual and mixed-reality technologies to orchestrate not only dance performances but music videos, commercials, fashion shows and festivals.Toru Nishikawa, the second keynote speaker and CEO at Preferred Networks, a leading Japan-based developer of deep learning software programs, surprised the SEMICON Japan audience with his discussion of his company’s work to develop a specialized chip for deep learning processing, joining technology giants Apple, Google, Alibaba and Microsoft in chip design. As more IT and software companies develop specialized, differentiated chips, the devices are quickly becoming the heartbeat of SMART technologies. The company’s approach has taken hold. Only four years old, Preferred Networks is enjoying rapid growth by working with global powerhouses including Toyota, NTT, Panasonic, Fanuc, NVIDIA, Intel and Microsoft. Ishibashi’s and Nishikawa’s fresh visions and the media arts extravaganza reflected the success of SEMICON Japan, held again at Tokyo Big Sight: The event’s 1,881 booths – filled by 727 exhibitors from 14 regions – was the highest count in six years. With Japan home to companies that supply about 40 percent of semiconductor equipment and materials worldwide, top suppliers historically have occupied the largest spaces on the SEMICON Japan show floor.According to IDC, personal computers and smartphones, long the largest revenue sources for the semiconductor industry, will remain top revenue drivers in the coming years. But revenue from new SMART technologies for applications such as automotive and factory automation is growing, a trend expected to continue with a 2018-2022 CAGR of 9.5 percent for automotive and 5.2 percent for manufacturing, compared to 1.1 percent for PCs and 2.9 percent for smartphones.SEMICON Japan’s new SMART Applications zone highlighted these and other new market opportunities for semiconductor growth with product and technology exhibits from companies including Bosch, IBM, Microsoft, NEC, Preferred Networks, Sony, SAS, Siemens, Tesla and Toyota. But the zone wasn’t all work and no play. The ROBOT SQUARE and SPORTS x IOT robot exhibits took visitors back to their school days, with robot anime – from Astro Boy to Gundam and Evangelion – that they could ride and control! As the World Gets Smarter, So Must SEMICON and the IndustryWe all agree the world is getting smarter at a fast pace. New cars are easier to drive – some models are almost fully autonomous on highways and streets. Your SMART speaker has gone well beyond an audio playback device and is more like a home AI platform. Almost all storefronts are equipped with video cameras. Your workplace, whether an office or a factory, is driven by automation. The reliance of these environments and devices on semiconductors is driving exponential chip and changing the world. Businesses need to adapt and so do SEMICON events. We’re doing just that as SEMICON Japan 2018 demonstrated – from an opening ceremony enabled by technology innovation to new faces of the industry to the SMART Application zone. As the SEMICON Japan presidents’ reception concluded the first day of the show, a robot from the ROBOT SQUARE suddenly appeared in the reception hall in front of about 250 executives from the global industry. Everyone at the reception was impressed and stepped forward to the stage, reflecting the overall excitement about SEMICON Japan, which for many years showcased only chip manufacturing equipment and materials. This year, to keep pace with the changing world, it was much more than that.SEMICON Japan 2019 will again take place in December at Tokyo Big Sight. However, organizers of the Tokyo Olympics will be using the East Exhibit Hall usually occupied by SEMICON Japan to prepare for the games. As a result, SEMICON Japan will be held in the West and South Halls instead. Look for more changes to the event. I hope to see you next year!Jim Hamajima is president of SEMI Japan.

Artificial intelligence (AI) is on the verge of transforming entire industries as it gears up to power semiconductor industry innovation and growth, thrusting the technology to front and center at SEMICON Japan 2019, December 12-14 at the Tokyo Big Sight (Tokyo International Exhibition Center).The SMART Technology Forum at SEMICON Japan will highlight the latest AI developments and trends. Supported by U.S. Commercial Service in Japan, the forum will feature Yutaka Matsuo of the University of Tokyo. An authority on AI, Matuso will give an overview of both AI business and technology. His presentation will be followed by an AI outlook from Microsoft Japan, Amazon Web Services and DefinedCrowd.A number of Japanese startups are on leading edge of AI innovation in machine and deep learning. One is Preferred Networks Inc., a company that applies cutting-edge deep learning technology to Internet of Things (IoT) applications across transportation, manufacturing and healthcare.In his opening day keynote at SEMICON Japan, Toru Nishikawa, president and CEO of Preferred Networks, Inc., will highlight the latest developments and promise of using deep learning for industrial applications. Nishikawa will unpack how AI companies jockeying for competitive advantage will win by harnessing technologies to process massive amounts of data efficiently and quickly.Following is look at Preferred Networks, Inc. and five other Japanese startups that are driving AI innovation. Within Japan's world of AI, machine learning, and deep dearning, Preferred Networks is likely the most well-known Japanese company. The parent company, Preferred Infrastructure, was founded in March 2006 by Toru Nishikawa and Daisuke Okanohara, who focused on search engine development before turning to machine learning and establishing Preferred Networks to commercialize the technology.Preferred Networks established itself as one of the world’s top providers of machine learning technology with the development of Chainer – an open source deep learning framework that has been offered free of charge since June 2015 and was released before TensorFlow, Google’s renowned Deep Learning framework. Established in 2012, ABEJA is thought to be Japan’s first venture company to specialize in deep learning. ABEJA's core technology is its AI platform ABEJA Platform. Based on this platform, the company offers various solutions to more than 100 client companies. ABEJA also offers ABEJA Insight, a specialized package service for the retail and distribution, manufacturing, and infrastructure industries. Data analytics provider BrainPad Inc. was the first Japanese AI venture listed on the Tokyo Stock Exchange. Established in 2004, before the advent of big data, BrainPad Inc. cultivated a vision of analyzing vast amounts of data in increase the competitiveness of Japanese companies. LeapMind Inc. aims to offer deep learning technology that uses fewer computing resources and draws less power. Both are important capabilities since deep learning requires considerable computing resources to perform image and speech recognition. The company’s answer to this deep learning challenge is a small form factor FPGA with low power consumption.In April 2018, LeapMind started offering the tool DeLTA-Lite to support model construction for Deep Learning. The tool simplifies the development of deep learning design models, eliminating the need for model design, hardware, and software expertise. Hacarus Inc.’s HACARUS-X AI technology, which combines sparse modeling and machine learning technology, features low power consumption and small devices such as FPGAs. In collaboration with semiconductor trading company PALTEK, Hacarus is integrating HACARUS-X algorithms with Xilinx's FPGA Zynq UltraScale + MPSoC. Both companies area also implementing HACARUS-X algorithms in a box computer.Sparse modeling is gaining attention as a modeling method by which humans can understand the judgment process of AI by extracting features from a small amount of learning data. With expertise in life science fields such as medical and biology and image processing technology, LPixel, Inc. develops image analysis systems with original algorithms and machine learning techniques. It has developed a cloud-based AI image analysis platform and an AI medical image diagnosis support technology that streamlines the review of large amounts of research data and detects image fraud in research papers and other documents for the medical and biology fields, freeing researchers to devote more time to their core work. Yoichiro Ando is a marketing director at SEMI Japan.

The march to greater precision, efficiency and safety – the lifeblood of high-technology manufacturing facilities – has taken on a new urgency as emerging applications such artificial intelligence (AI), the Internet of Things (IoT) and Industry 4.0 give new meaning to smart factories. Facing fiercer competition and ever more sophisticated fabrication processes, semiconductor fabs are under intense pressure to keep pace with new technologies as they work to upgrade. Nowhere are the stakes higher than in Taiwan, where high-tech manufacturing contributes mightily to the region’s GDP growth. To help Taiwan fabs confront the challenges and opportunities of designing smarter factories, SEMI and its High-Tech Facility Committee hosted the High-Tech Facility Workshop in June. SEMICON Taiwan 2018 High-Tech Facility Pavilion exhibitors gathered to explore how they can build smarter factories by deploying smart surveillance and disaster prevention technologies along with smart communications systems that better use manufacturing data to drive new safety and product quality efficiencies.During the workshop, SEMI High-Tech Facility Committee representatives shared strides it has made upgrading overseas facilities and developing standards to help establish smart factories in Taiwan.SEMICON Taiwan – 5-7 September at Taipei’s Nangang Exhibition Center – is also an important event for advancing smart manufacturing in Taiwan. Nearly 30 leading global manufacturers will exhibit at the SEMICON Taiwan High-Tech Facility Pavilion. The venue covers operational aspects of semiconductor manufacturing vital to becoming smarter including energy savings, nano-contamination control, facility information modeling, precision instrumentation and control, fire protection, mechatronics, and automation control. The pavilion will also feature a series of theme events offering a comprehensive overview of topics including the latest practices for integrating smart facility capabilities from the perspective of an advanced fab designer.At the TechXPOT stage, High-Tech Facility Pavilion exhibitors will also demonstrate the latest technology breakthroughs and cutting-edge smart factor solutions.The September 6th High-Tech Facility International Forum at SEMICON Taiwan will again gather factory experts and thought leaders from industry and academia to examine “Effective Ways to Make a Facility Smart.“ Experts from industry heavyweights in the fields of wafer foundry, LCD, memory and semiconductor packaging including TSMC, UMC, Innolux, ASE, Micron Taiwan, Winbond and VIS will offer insights into key areas of high-tech facilities including facility electricity, machinery, water management, vaporization and automation systems. On the same day as the forum, the High-Tech Facility Get-Together and High-Tech Facility VIP Dinner will bring together industry elites, academic professionals, and government officials to explore partnership opportunities. SEMI Taiwan and the High-Tech Facility Committee share HTF market trends information, technology updates and standards with SEMI members and exhibitors. Founded in 2013, the High-Tech Facility Committee now has 85 corporate members. Dedicated to accelerating industry collaboration through the integration of Taiwan industrial, government and academic resources, the committee each year holds several group meetings focusing on topics including energy savings, earthquake and fire protection, nano-contamination control, and precision instrumentation and control to advance critical technologies and facilitate standardization. The committee also aims to help the industry become more competitive faster by promoting technology standards that boost productivity and reduce production costs.Please visit www.semi.org and www.semicontaiwan.org for more information about SEMI’s high-tech facility initiatives.Iris Tsou is a marketing specialist at SEMI Taiwan.

The fast-growing automotive semiconductor market means big change for the IC supply chain. Beyond the obvious demands for reliability and traceability, the sector is moving towards simpler and lower-cost solutions while facing the daunting challenge of automating driving in a complex world. The need for simpler and cheaper automotive intelligence will likely drive acquisitions to build complete platform solutions that are easier to integrate. This demand has already spawned a market for pre-configured test cars to save developers time and money, and is driving LiDAR (Light Detection And RADAR) towards lower-cost, solid state solutions. “The growth of the automotive electronics market provides a great opportunity for the IC supply chain to differentiate on specialty processes and quality for the high-volume automotive business with its long design cycles,” says Scott Jones, principal, strategy, at KPMG, who will speak in the automotive program at SEMICON West. “This differentiation is a chance to reduce chip suppliers’ dependence on scaling volume for the mobile phone world with its short-cycle volatility of winning and losing sockets.” He notes that increasing demand for automotive ICs is also reinvigorating the eight-inch supply chain and spurring opportunity for specialty products such as compound semiconductor devices for power efficiency. Supplying the automotive market also means addressing automotive reliability requirements, which can be 10 times more stringent than for consumer devices. At the same time, the industry must sustain fast-paced development cycles required for the volume and diversity of low-cost IoT devices, manage the segmented supply chain for both those markets, and still spread development costs. Another big challenge for the supply chain will be to automate testing and update vast amounts of embedded software in these automotive devices. “The more complete solution a company can put together, the more the automakers will gravitate to it. They want simplicity,” Jones suggests. Smaller players will need to differentiate with IP and acquire other IP provider to build a broader platform, or be acquired and folded into an all-in-one solution.AutonomouStuff helps accelerate and simplify development of autonomous driving solutionsAutonomouStuff is helping to speed development of these platforms. The company has grown from a sensor distributor into a supplier in the emerging niche of vehicles preconfigured with key interfaces for sensors and controls. These interfaces can then be customized by integrating different components for developers to test their applications. AutonomouStuff offers developers a lineup of vehicle models pre-configured with the interfaces needed to add desired chips, sensors and software to develop their autonomous vehicle systems. Source: AutonomouStuff.“Whether they’re major chipmakers or AI software startups, they don’t have a year to build their own vehicle platforms themselves for developing autonomous vehicle systems,” says Wolfgang Juchmann, VP sales and business development at AutonomouStuff. Juchmann, a SEMICON West speaker, will bring a demonstration vehicle to the show. “In four to six weeks we can prepare a custom test car with selected sensors, enabling users to start testing their computer platforms and software. It’s faster and more cost-effective for us to supply the car with the needed interfaces.” He notes that developers are using some 300 AutonomouStuff vehicles in the field. AutonomouStuff customers are starting to transition from testing on a single car or two to testing on mini-fleets with 50 to 100 vehicles. Beyond sensors and pre-configured vehicles, the next step will be to add more data intelligence services to help with capabilities like tagging the data for training, Juchmann says. AutonomouStuff already offers hardware to support Baidu’s Apollo open-source software stack and data set. The company was recently acquired by the Swedish holding company Hexagon to help support expansion.CMOS silicon LiDAR nears automotive qualificationInnovations in the hyper-competitive LiDAR market, where burgeoning demand is driving the race to develop various types of solid-state devices, may also help reduce the cost of autonomous vehicles. Among the roughly 40 LiDAR suppliers, at least one – Quanergy – is taking advantage of 45nm and 32nm foundry CMOS volume production. The company uses voltage through the semiconductor stack to change the refractive index, controlling the phases of optical beams and the resulting interference patterns of light exiting the chip to quickly steer the laser beam without the need for moving parts, much like the phased array radar its team developed earlier. Solid state LiDAR image with object recognition software. Source: QuanergySo far, most of the small LiDAR units have shipped to the security, industrial automation, drone, robots and 3D mapping markets. However, Quanergy CEO Louay Eldada, another SEMICON speaker, says the company is also winning automotive designs and expects automotive shipments to take off early next year, once automotive certification testing is completed. “We can get design wins because standard CMOS production at TSMC makes us a known entity,” says Eldada. To prevent component misalignment, the company produces its own specialized packaging to secure the laser, phase control ASIC, optical phased-array emitter, detector array, and receiver readout ASIC at its plant in Silicon Valley or the facility of its automotive partner Sensata. Through its software business, Quanergy offers an artificial intelligence (AI) perception program for object recognition and LiDAR tracking. The solution uses the people-tracker software the company acquired from Raytheon.SEMICON West this year expands to three full days of automotive electronics programming and features a Smart Transportation Pavilion. Other companies with experts who will speak as part of the program include XPT/NIO, Infineon, McKinsey, Voyage, GM Cruise, Bosch, Deepen AI, Airbus A3, Nvidia, Excelfore, Byton, Macronix, SK Hynix, SAP, Xilinx, Achronics, California Fuel Cell Partnership, Velodyne, Lam Research, KLA-Tencor, SCREEN, Rockwell, Versum Materials, TechSearch International, Entegris, ASE, Amazon, Continental and Wind River. www.semiconwest.orgPaul Doe, SEMI