Autonomous Vehicles

For the semiconductor industry to flourish, all chip ecosystems must embrace closer ties, greater openness, and more flexibility to co-innovate solutions in today’s rapidly unfolding global digital transformation.

In a recent panel discussion, CARIAD SE, a Volkswagen Group company, Entegris, and SEMI shared their perspectives on how the automaker and other members of the automotive electronics ecosystem can collaborate to address new challenges facing the automotive industry.

In my role as lead for the Smart Mobility initiative at SEMI, I recently spoke with Automotive Logistics Magazine about the growing importance of the semiconductor supply chain’s connection with the automotive industry and the semiconductor shortage hampering global automotive production. Following are excerpts from the interview. Automotive Logistics: Why is there a bottleneck in the global supply of semiconductors at the moment and how long is it likely to last? Weiss: The current automotive chip shortage resulted from the sharp, Covid-19-induced decrease in demand for automotive semiconductors in the second quarter of last year when vehicle production came to a near standstill. The automotive market picked up significantly in the fourth quarter and this caused the supply chain constraints we are seeing today. At the same time as the automotive standstill, the pandemic spurred an increase in demand for home computing and networking equipment, and semiconductor manufacturing plants (fabs) had to pivot to these other markets in order to maximize fab utilization and successfully navigate economic headwinds. Every minute a semiconductor fab is idle or has lines down adds up quickly to missed revenue, so their capacity is booked weeks and even months in advance. With this background, I don’t believe this is a structural shortage and expect a gradual recovery over the next two quarters, barring any major shifts in geopolitics or macroeconomics. Automotive Logistics: What needs to be done to remedy the current shortfall for the automotive industry? Weiss: The automotive industry needs to continue to strengthen its connections to the semiconductor manufacturing supply chain. In past years, auto manufacturers used to rely mainly on their tier one suppliers to interface with the semiconductor supply chain. This has changed significantly. Not only are more chips being used in vehicles (roughly 10% of all devices produced globally end up in cars), but the strategic importance of the chips as enablers for ADAS [advanced driver-assistance systems], electrification, safety, connectivity and other consumer-driven features has increased considerably. With this dynamic in play, carmakers have recognized the value of interacting and collaborating more closely with the semiconductor supply chain. This provides vehicle OEMs with access to innovation, the ability to influence technology direction and pace, along with greater visibility into global supply chain developments. The SEMI Smart Mobility initiative is evidence of this transition, with the likes of Audi, BMW, Ford, Uber, Volkswagen and other vehicle OEMs, along with tier one suppliers such as Continental and Bosch, now actively involved in our automotive electronics and mobility activities to do exactly that – influence, partner, accelerate and guide the global electronics design and manufacturing supply chain that SEMI represents. Automotive Logistics: What percentage of semiconductors manufactured for use by US-based companies are for automotive applications and how has this grown in recent years? Weiss: A little over 10% of semiconductors produced worldwide are sold into the automotive segment, but this number is expected to grow at an accelerated pace in the next few years as electrification, connectivity and autonomous driving become more prevalent. Automotive Logistics: How is SEMI working to help the automotive industry get a clearer view of sub-component supply and better manage supply chain risk? Weiss: The SEMI Smart Mobility initiative is designed to engage automotive OEMs, tier ones, semiconductor device makers, design houses, and equipment and materials companies to drive alignment across the supply chain and address shared challenges collectively. To facilitate this engagement, we created the Global Automotive Advisory Council (GAAC), which has active chapters in Europe, US, China, Japan and Taiwan. The GAAC provides an open platform for creating solutions, fostering collaboration and partnering with other industry bodies to accelerate and harmonize industry efforts that benefit the entire ecosystem. Volkswagen and Audi are already SEMI members – both are founding members of the GAAC Europe chapter – and have become vocal champions and critical contributors to our efforts. When all stakeholders work together, I have no doubt that the future of automotive and mobility will continue to be bright. Interested in learning more about this topic? Read the full interview in Automotive Logistics Magazine, A Fab Future for the Automotive Sector. Please contact me at [email protected] for more information about SEMI’s Smart Mobility Initiative, the Global Automotive Advisory Council, and how SEMI can help your organization navigate electronics in the automotive industry to drive innovation in the mobility space. Bettina Weiss is Chief of Staff and Global Smart Mobility Lead at SEMI.

Augmented reality (AR) tyrannosauruses towered on-screen as I interacted with the creatures in a mix of prehistoric and cutting edge. Or, rather, my AR double was doing the playacting. Minutes later, virtual doppelgangers of a small lineup of chip industry executives cut the ceremonial ribbon. Seemingly sweeping away the winter chill, the opening of SEMICON Japan 2019 dazzled with smart technology and the promise of lives, cities and workplaces transformed, with uber-intelligent applications in full display at Tokyo Big Sight. But what resources does the industry need to harness to drive the next era of innovation? The semiconductor industry’s unwavering passion and young talent are key, said Hiroshi Imano, Chairperson of the SEMICON Japan Initiatives Committee, in his opening keynote. And hardly any region of the world is in a better position to help realize that future than Japan, Imano said. The region supplies one third of the equipment and more than half of all materials to the global semiconductor manufacturing industry.Talent was also top of mind for SEMICON Japan 2019 keynote speaker Makiko Eda, Japan's Chief Representative Officer at the World Economic Forum (WEF). Serving as a platform for public-private partnerships, the organization's mandate is to tackle global issues such as climate change and geopolitical strife in making world more resilient to risk and, by extension, more sustainable.Spanning ecology, economy, technology, society, geopolitics and industry, that mission includes reskilling and upskilling a billion people over the next decade, a high priority for WEF, which hosts a conference every January in Davos, Switzerland. The theme of this month's conference – Stakeholders for a Cohesive and Sustainable World – reflects the vital importance of building the international partnerships and global consensus necessary to achieving WEF's goals.One key to that sustainability will be technology and Arm, a global chip design company, will play a key role, with the company’s chips touching over 70 percent of the world’s population, Arm president Yuzuru Utsumi said in his keynote. Today, Arm is driving toward an ambitious goal: Ship 100 billion chips from 2017 to 2021 – the same number produced over the previous quarter century – by powering advances in mobile computing, server and networking infrastructures, and automotive applications.Arm’s innovation ecosystem of more than 1,000 partners will deliver these chips as they continue to work together to develop differentiated technology. Arm plans to increase investments not only in its primary processor business to accelerate market share gains but in the company’s new IoT business to create new revenue streams. The goal: Deliver long-term sustainable growth, Utsumi said. SEMICON Japan 2019 showcases SMART manufacturing and transportation Billed as a showcase of smart technologies, SEMICON Japan 2019 delivered with an array of eye-grabbing exhibitions in the popular SMART Applications Zone. In the SMART Transportation area, the automatic operation pavilion featured a car equipped with open-source software for autonomous driving. The exhibitor, Tier IV, aims to help lead the early commercialization of self-driving vehicles through the adoption of its software, Autoware, which makes it easier to develop self-driving vehicle prototypes using low-power platforms.Sony Semiconductor Solutions demonstrated a vision sensing processor designed to guide autonomous drones. Using two cameras, the processor measured the changing distance between visitors moving about the exhibit and stationary objects in real time, indicating proximity in hues of red (nearby) and blue (at a distance). Many visitors were wowed, describing the multichromatic display as futuristic.Others rode a simple wooden swing hanging by two ropes, but from dizzying heights thanks to Solidray’s Duo-Sight, a virtual reality (VR) system that projects 3D images stretching from wall to floor for immersive experiences. One visitor thrilled at how riding the swing, suspended only a few feet from the floor, felt like soaring on a flying trapeze. Target applications for the technology include virtual rides at amusement parks and presenting interior design options to homeowners.In the SMART Manufacturing area, one highlight was the demonstration by the National Institute of Advanced Industrial Science and Technology (AIST) of a remote-controlled Minimal Fab System designed for low-volume, high-mix chip production with little staffing. Designed to increase production efficiency, the system allows a circuit designer to manufacture a semiconductor by singlehandedly operating equipment up and down the production line. Controlling nearly 50 pieces of equipment, the Minimal Fab System on display manufactured chips that were verified for functional operation and exhibited afterwards.On the SMART Applications stage, exhibitors DENSO and Toyota Motor Corporation announced a new joint venture to conduct research and advanced development of the next-generation in-vehicle semiconductors critical to electric and autonomous vehicle innovation. The venture, operating as MIRISE Technologies, will combine Toyota’s mobility expertise with DENSO’s in-vehicle component prowess. The goal is to build a rapid, competitive development system by 2030, said Yoshifumi Kato, executive director of the DENSO Research and Development Center, and president and representative director of the venture. On track to begin work this year, MIRISE will span three fields of technology development: power electronics, sensing and SoC (System-on-a-Chip). The name MIRISE combines word the Japanese word "mirai" (future) with "rise."Business Continuity PlanningNatural disasters and other emergencies are an ongoing threat to uninterrupted business operations across the semiconductor manufacturing supply chain and particularly in earthquake-prone Japan. To better prepare for business disruptions and restore normal operations as soon as possible after disaster strikes, more companies are teaming on Business Continuity Planning (BCP).THK's Seismic Isolation Experience Car demonstrated one technology designed to help – a seismic isolation device. The car shakes like an earthquake to give people inside a taste of how a building heaves and sways during a quake with and without the device deployed. Visitors were struck by how much the isolator dampens tremors to prevent or minimize damage. In the BCP seminar, representatives from Sony Semiconductor Manufacturing, THK, DISCO and Team Engineering Consulting shared lessons learned from actual disasters and discussed the critical importance of daily disaster drills. Yukihide Keigo, Executive Engineer in charge of Products and Development at Sony Semiconductor Manufacturing, recounted how the company’s Kumamoto Prefecture plant struggled for 96 days to restore full operations after the facility sustained heavy damage in the 2016 earthquake. Keigo said the plant lacked the structural reinforcements necessary to withstand the impact and fell prey to poor planning and accountability. The Kumamoto plant has since implemented measures – structural and procedural improvements – that more accurately account for seismic risks to ensure full recovery within 56 days. The plant’s new procedures include emergency drills for staff including night-shift workers.Innovation abounds at six SuperTHEATER forumsSEMICON Japan 2019 was held in the West and South Halls of Tokyo Big Sight as organizers of the Tokyo Olympics occupied the East Hall, the exhibition's usual home at the venue, to prepare for the 2020 games. For the first time, the main stage, SuperTHEATER, was set up in the cavernous arena near the main entrance. The SuperTHEATER featured six forums over three days. Semiconductor Executive Forum – View by Top Two in the Era of Digitalization with thought leaders from IHS Markit and Sony Semiconductor Solutions SMART Connectivity Forum – Infinite World Brought by 5G Innovation with experts from Softbank and Nokia Solutions Networks SMART Transportation Forum I – Front-line of Automated Driving featuring speakers from Intel and DENSO SMART Transportation Forum II – Revolution of Sky Transportation, supported by the U.S. Commercial Service in Japan, with presenters from Ministry of Economy, Trade and Industry (METI), Subaru and Bell Helicopter Manufacturing Innovation Summit – Issues and Innovation: What will Drive Growth to 2030 featuring thought leaders from VLSI Research, Applied Materials, KLA, Nikon and Tokyo Electron Mirai Vision Forum – Future Relation of Technology and Body 2.0 with speakers from Leave a Nest, Ory Lab and Autonomous Control Systems Laboratory The Mirai Vision Forum highlighted advanced technologies that could lead to societal improvements. One presenter, Kentaro Yoshifuji, CEO at Ory Lab, recalled how, as a child, he once stayed home from school while recovering from an illness. His imagination in full flight, the youngster imagined having a clone that could attend school and be with his classmates. The experience eventually inspired him to develop OriHime, a robot that gives socially isolated people a way to communicate with friends or colleagues remotely. Originally developed for physically impaired people, OriHime today is used to help the able-bodied. The robot is situated with the companion and the user operates OriHime remotely. A camera and monitor in OriHime’s face provide the visual and audio connection and the user controls the device with a smartphone or tablet or, for those who are paralyzed, through eye movement. One potential application: With OriHime stationed at a business office, working mothers could use OriHime to telecommute to better balance their careers with their parenting responsibilities at home. The robot would be a mother’s go-between, enabling her to communicate directly with colleagues.The next generation of innovators also took the stage as five teams presented innovative business ideas in friendly competition. The top prize in The TECH CAMP Hackathon went to the group that hatched an ingenious plan to develop a jacket that trains users to move their bodies in preprogrammed ways. For example, legendary Japanese professional baseball player Shigeo Nagashima could wear the gear while batting to program the device, then give the jacket to someone who’s never swung a baseball bat. The jacket would help the user replicate Nagashima’s swing. Now comes the real work of any innovator – executing on the vision.And then came two soccer-playing artificial intelligence (AI) robots that squared off and ... Scored! The demonstration by the Toyota National College of Technology started as a research project by Toyota National College students in 2002. The young innovators designed and developed all the robotic hardware and software from scratch. Looking ahead to SEMICON Japan 2020!SEMICON Japan 2019 not only gathered leading Japanese semiconductor materials and manufacturing equipment providers to demonstrate their latest innovations. The premiere regional event also provided insights on key trends critical to the entire electronics manufacturing supply chain. This year’s event drew more than 51,000 visitors and 695 exhibitors from 15 regions filling more than 1,700 booths.SEMICON Japan 2020 returns to East Hall at Tokyo Big Sight in December 2020. I look forward to seeing you there!Jim Hamajima is president of SEMI Japan.

Smart technologies have gripped the world’s imagination with their promise to revolutionize the way we live and work. With the semiconductor supply chain central to these advances, SEMI Japan in October hosted 200 members for SEMI Japan Members Day as speakers from three of the world’s top device manufacturers – Denso, Sony and Kioxia – offered their perspectives on the strides the semiconductor industry needs to make in three key areas: automotive, smart manufacturing and 3D flash memory manufacturing technology. Automotive Evolution and Electronics – DensoThe automotive industry is re-inventing itself to innovate across connectivity, autonomy, sharing and electric (CASE) and ensure safe, comfortable and environmentally friendly autonomous driving, said Nobuaki Kawahara, executive fellow and director of the Advanced Research and Innovation Center at Denso. Key focus areas of Denso in CASE innovation are Extraordinary Safety and Everyday Confidence. The company’s goal is to minimize damage to vehicles involved in collisions or one-car accidents by making it easier for drivers to detect and steer clear of objects in their path.To improve automobile safety and security, the company is developing advanced driver-assistance systems (ADAS) and autonomous driving technologies as it promotes the confluence of four areas of technology – HMI (Human Machine Interface), environmental recognition, vehicle control assistance, and information and communications. One use case Denso sees as a significant opportunity is deploying sensors such as millimeter-wave radar, cameras and LiDAR to monitor a vehicle’s surroundings, using GPS and precision mapping to pinpoint its location and determine the best route for safety and distance, and then transmitting that information to a motion-control system.Denso is also out to solve the hard challenges associated with autonomous driving in dynamic road conditions. Kawahara pointed out that road conditions vary and that rules for "driving at certain intervals in a certain lane" vary depending on the time of day. Also, on public roads in Abashiri, Hokkaido, where the company is currently conducting field tests, snowfall makes it difficult to recognize road images and gather sensor information. In Asia, it is also common for motorcycles and automobiles to speed along with very little space between them.Image Sensors to Accelerate Development of Smart Manufacturing – SonyTo fulfill the promise of smart manufacturing, the semiconductor supply chain must continue to invest in sensor and imaging technology innovation, said Shigeo Ohba, deputy senior general manager of the Imaging System Business Division at Sony Semiconductor Solutions. For its part, Sony is developing imaging sensors that help network and automate factories to achieve new production and cost efficiencies. For example, the company plans to design devices to increase equipment uptime through predictive maintenance, reduce defect rates and drive other manufacturing efficiencies. The challenge with today’s factory lines that produce a number of different devices is that they are highly complex to manage and therefore prone to human error, undercutting manufacturing efficiency. In the future, AI-powered machines will leverage data analysis to help streamline operations. Adapting an image sensor with AI to machine vision applications can simplify key processes such as measurement and inspection processes while reducing safety and security costs.Of the vast amount of information on all machines connected to the cloud, only essential details will be processed at the edge since edge data processing offers stronger security and reduces data transfer time. Ohba said image sensors will evolve based on edge AI, adding that "AI will be a paradigm shift for image sensors if it’s economically feasible."3D Flash Memory Manufacturing Technology Challenges – KioxiaIncreasing connectivity in factories for smarter, more efficient operations places huge demands on memory since networked devices typically store duplicate data, said Hideshi Miyajima, head of the Advanced Memory Development Center (AMDC) at Kioxia. To meet demand for higher networking speed and capacity, 2d NAND flash memory is moving to 3D and, in particular, three 3D techniques: multivalued memory, cell partitioning and layer stacking.To increase storage capacity, the third-generation 64-layer BiCS FLASH™ stacks layers to form nearly two trillion holes with a diameter of 100nm and a depth of 5μm on a wafer and places a uniform 2-3nm thin film on the inner wall of each 5-μm hole. For its BiCS FLASH™, Kioxia uses a dry etching technique that forms a straight, elongated through-hole and atomic layer deposition (ALD) technology, which creates a uniform laminate atomic layer on the wafer surface to grow materials uniformly and with high precision on large, complex substrates.In order to meet the cost expectations of high-volume 3D flash memory manufacturers, outlays across fabs must be reduced by better monitoring plasma control, enhancing yield through particle control, speeding film formation, and reducing gas, power and water usage, Miyajima said.SMART Transportation and SMART Manufacturing in the Spotlight at SEMICON JapanPlease join us at SEMICON Japan 2019, December 11-13 at Tokyo Big Sight, for the latest developments and trends in SMART Transportation and Smart Manufacturing. There are also a few other great reasons to attend. We look forward to seeing you in Tokyo!Jim Hamajima is president of SEMI Japan.

On the day I joined SEMI in March of 2017, I was filled with excitement to be on-boarding at a time when great, leaping strides in innovation were driving the rapid expansion of our ecosystem. In my many conversations with members that followed, I was not surprised that a vast majority ranked among their top concerns the persistent challenge of attracting, training and retaining the talent needed to grow their businesses. Later that year, I raised the global talent shortage issue in my article Securing Talent to Connect, Collaborate and Innovate. As an industry veteran I knew that the decades-long workforce development challenge will only worsen with the proliferation and increasing complexity of technology.Innovation has never been more technology-intensive. Developing the technology and producing the components required for applications powering next-generation communications (5G), artificial intelligence (AI) and machine learning, autonomous vehicles, and the Internet of Things (IoT) require bright minds in diverse fields of science to fill critical positions in the global electronics manufacturing industry. Today, that talent struggle is acute, threatening to undermine our industry’s potential to grow to $1 trillion by 2030.The electronics industry needs a comprehensive, integrated program to build the talent pipeline. The program should inspire school-age children to adult learners to pursue careers in this great but underrecognized industry. It needs to shine a spotlight on career opportunities. It must prepare workers with standardized skills sets transferable across the industry. And it must connect trained workers with hiring companies.SEMI is uniquely positioned to deliver this solution. Launched almost two years to the day after I joined SEMI, SEMI Works is SEMI’s branded workforce development initiative. We realize that trade associations don’t create jobs. Their members do. Think of SEMI Works as SEMI’s commitment to build and maintain the needed infrastructure – the talent pipeline. SEMI Works is comprehensive. The program, supported by SEMI members, is a wide-ranging effort by our Global Advocacy team to ensure education is demand-driven, training programs better meet the needs of the industry, more people pursue careers in electronics and our members have access to the talent pool that we are cultivating. With SEMI Works, SEMI is developing scalable solutions to improve connections among training and education providers, prospective workers and the industry. Key features of SEMI Works will include SEMI-certified education courses and training programs linked to industry requirements and skills credentialing for workers.SEMI Works starts with raising awareness of SEMI-certified programs as a key bridge connecting prospective talent, the industry and applicable training and education programs. Growing awareness of the programs will enable SEMI to build an extensive database of employers and qualified talent and link both to the right training. SEMI will continue to drive and endorse programs that help meet member needs throughout the education continuum – from K-4 to higher education and adult training. But the infrastructure and ecosystem required to support and scale these programs is the key for all of us to win together. At a high level, SEMI Works consists of several important components: Linking the required industry competencies to education and training course curriculum – Similar to the establishment of SEMI standards, SEMI will certify education and training programs that dovetail with the industry competency model. Initial certification and annual re-certification ensure continued updates, relevance and sustainability of the programs. SEMI will raise awareness of SEMI Works certified programs as the standard for meeting the industry’s talent requirements. Developing and maintaining the electronics industry competency model – Through established working groups and ongoing dialogue with our members, we are developing a competency model – a tiered matrix of required competencies used to link course curriculum to the talent needs of employers. The competency model consists of interpersonal and individual skills, academic and general industry requirements, advanced manufacturing competencies, and competencies by job. SEMI will establish and maintain the model with regular updates. Improving access to talent – Through SEMI Works, SEMI will build an extensive database that brings together programs, talent and employers. People and organizations opting into a SEMI-certified program or acquiring a SEMI program certification will be part of the SEMI database. Job seekers will be able to set up a profile and resume and search for training and employment opportunities, and employers will search the talent pool – much as job-search sites work today – assured of a skills match based on the SEMI certification. I am passionate about education and proud of all of SEMI’s efforts. I am especially proud of the work we are doing to help provide a pathway to meaningful careers for children and adults all around the world. We no longer have the luxury of a piecemeal approach to training and education.It is my hope and belief that SEMI Works, together with our efforts to improve diversity and inclusion in the workforce, will be SEMI’s lasting mark on the global electronics industry.Ajit Manocha is president and CEO of SEMI.

The more than 53,000 people who flocked to SEMICON Korea last month were treated to a motherlode of insight into the future of the semiconductor industry as 470 companies exhibited innovative technologies in more than 2,000 booths. But the annual event’s most arresting numbers came in keynotes and other presentations pointing to the extraordinary industry growth that lies ahead.“It is no exaggeration to say that 90 percent of the world’s data has been generated in the last few years,” said Jim Feldhan, president of Semico Research. “This explosive growth of data is expected to continue. That's why server shipments will grow by 20.3 percent, or 30 million units, this year alone.”Feldhan said that the Internet of Things (IoT) will be a chief driver of semiconductor industry growth, with IoT expected to be applied in areas as varied as automotive, smart cities, edge computers, finance, architecture, agriculture and healthcare. For its part, artificial intelligence (AI) will start to exercise human-like judgment. Feldhan noted that in many instances in these fields, “it is more accurate to apply AI and vision systems than to rely on traditional decision-making.”Yoon Jong Lee, senior vice president of DB HiTek, predicted that the Internet, AI and 5G will drive market growth. “Looking back over the past 30 years, semiconductor market growth was powered by PCs, the Internet and cell phones, yet last year memory accounted for 35 percent of total semiconductor sales, more than double the figure in 2016,” he said. He predicted that, in 2019, the foundry sector will outstrip the semiconductor market in growth, noting that the average growth rate of the semiconductor industry is expected to be 4.1 percent, compared to 7.1 percent for the foundry market. Clark Tseng, director of SEMI, reported that the strong semiconductor growth in 2018 is unlikely to continue in 2019 due to the decline in memory pricing, as well as mobile and PC demand. “Demand for semiconductors is likely to decline in the first half as the industry is still digesting inventory and rebound in the second,” Tseng said. Semiconductor industry growth headwinds include decreases in high-end smartphone purchases, PC demand and demand for DRAMs for servers in data centers, Tseng said. Declines in economic growth and consumption in China and the U.S.-China trade war will also contribute to a slowdown. However, Tseng noted that, over the long term, technology innovation will continue and that the semiconductor industry’s prospects remain bright.One key innovation will be the elimination of AI’s reliance on Internet connections in the future. In his opening day keynote, Eunsoo Shim, senior vice president at Samsung Electronics, emphasized that AI technology that operates without the Internet in the future is essential. “We are developing 'on-device AI' technology that incorporates AI algorithms in products such as smartphones and autonomous vehicles,” he said. "When on-device AI technology is implemented, it reduces reliance on the Internet, battery consumption, and data latency.” Reducing latency will significantly improve device response time.Walden C. Rhines, CEO Emeritus of Mentor, a Siemens business, predicted that AI will fuel rapid memory growth. The memory semiconductor (DRAM, NAND flash) market is expected to see a temporary slowdown this year, with the market expected to rebound in 2020. Rhines said that memory could be seen as an early market with rapid future growth, citing memory market super-booms in 1995 and 2000.“Memory production has not decreased since 1995 or 2000,” he said. “Although memory prices will temporarily fall this year after significant market growth in 2017 to 2018, the market will continue to grow as memory production increases,” he said. Rhines added that “although memory prices will drop by about 10 percent this year, he believes prices will increase 6 percent next year.” He also predicted the steady growth of the non-memory semiconductor market as AI technology matures and China’s investment in fabless companies continues.Indeed, SEMICON Korea speakers made it clear that concerns about the growth of the semiconductor industry are expected to be short-lived. While overall growth is likely to slow in 2019, the industry is expected to rebound steadily – powered by the semiconductor industry paradigm shift led by AI, IOT, and autonomous driving – and reach a new high of nearly $541 billion in 2020.Jaegwan Shim is a marketing specialist at SEMI Korea.

The Japan semiconductor manufacturing supply chain is a global semiconductor industry workhorse, producing about one third of world’s chip equipment and more than half of its semiconductor materials. In contributing the vast majority of these products, SEMI Japan member companies hold the high distinction of enabling continuous development of the worldwide semiconductor industry. Aptly, then, technology powerhouses IBM, Nissan Motors and Toshiba offered insights into the latest trends and innovations in computing and smart cars at the late-May SEMI Japan Members Days in Tokyo with 133 technologists from member companies in attendance. As the audience discovered, chip innovation never sleeps and, as futuristic as it can be, invariably gives rise to possibilities beyond the human imagination. That was the message of kickoff presentation “Computing Reimagined – AI/Quantum/IoT” – by Dr. Shintaro Yamamichi, Senior Manager, Science Technology at IBM Research-Tokyo. Dr. Yamamichi cited three examples of how semiconductors uncover new technology frontiers. Computational materials discovery, a novel methodology, is the application of theory and computation to unearthing new materials and the key to enabling an ongoing stream of semiconductor innovation. In particular, using cognitive technology to mine huge volumes of literature reveal new insights into materials that uncover even more functionality such as greater conductivity and heat resistance. With new materials the oxygen of ever more advanced semiconductor chip manufacturing, the semiconductor industry will surely benefit from this methodology. The opportunity to accelerate quantum computing innovation is now. Launched in May 2016, the IBM Quantum Experience gives students, researchers and general science enthusiasts hands-on access to IBM’s experimental cloud-enabled quantum computing platform. The online platform features a forum for discussing quantum computing topics, tutorials on how to program IBM Q devices, and other educational material about quantum computing. Dr. Yamamichi encouraged the audience to join the program. The world’s tiniest computer, unveiled by IBM at the company’s Think 2018 conference in Las Vegas, packs several hundred thousand transistors and, IBM claims, the equivalent power of a 1990s x86 chip into a package smaller than a grain of salt. The computer’s small form factor (less than 1mm x 1mm) and low manufacturing cost means it can be embedded in product price tags and packages as an anti-fraud device using blockchain technology. Vehicles need to be both electric and intelligent as countries become more populous and traffic density increases. More drivers extend average drive time, boost greenhouse emissions, devour precious energy resources and lead to more traffic congestion and accidents. Dr. Haruyoshi Kumura, fellow at Nissan Motor, highlighted these issues in stressing the importance of a new era of intelligent mobility. To mitigate these problems, Nissan is focusing on the electrification and intelligence of its vehicles: Nissan’s electric vehicle, Leaf, reduces accidents with electric intelligence systems such as e-Pedal, which uses an accelerator pedal only for both acceleration and deceleration, and ProPILOT Park, a feature that automatically parks the car by using multiple cameras and ultrasonic sonars to detect pedestrians and other objects around the vehicle. With more than 90 percent of traffic accidents caused by driver error, Nissan plans to introduce autonomous driving on multi-lane highways by the end of 2018 and on city streets by 2020. By 2022, the company plans to roll out full autonomous driving to reduce traffic accidents caused by inattentive drivers. For full autonomous driving to materialize, sensor fusion technology must incorporate a combination of technologies – radar systems, light detection and ranging (LiDAR) systems and cameras – to identify the shapes and locations of nearby moving objects and measure their speed. Sensed information is then processed by a 3D graphic analyzer to make electric throttle, braking and steering decisions. The outlook for automotive industry includes car sharing and more electrification – both insights from Yoshiki Hayakashi, general manager, automotive solution strategic planning division at Toshiba Electronic Devices Storage, who offered his perspectives on trends in Japan’s automotive industry and beyond. To meet the requirements of the COP21 Paris agreement, the global automotive industry is shifting to electrification. Toshiba estimates 60 percent of new cars will be electric vehicles by 2040 to meet the International Energy Agency’s global EV outlook. In Japan, autonomous driving or advanced driver assistance systems (ADAS) will be offered in certain areas by 2020, the year of the Tokyo Olympic games. Growth of these advanced driving systems hinges on infrastructure development. Supporting data centers, intelligent transport systems, vehicle-to-everything connections, and smart city are all necessary components. Car ownership will begin to cede ground to car sharing with technology elites such as Tesla, Apple and Google leading the way. To expand the car-sharing industry, new alliances will take shape between new and old-guard automotive companies and electronics manufacturing services (EMS) providers. Autonomous driving requires precise 3D renderings of actual roadways using sensors for route mapping. While sensor fusion must be deployed for these capabilities, LiDAR offers better sensing range and space resolution precision than ultrasonic sonars, radars, and cameras. The next SEMI Japan members day is scheduled for October 30 in Tokyo. SEMI holds similar events in most regions where SEMI and its members operate. For the members events in your region, contact the SEMI office nearest you. Yoichiro Ando is a marketing director in SEMI Japan.

Storage and memory chipmaker and SEMI China member Tsinghua Unigroup is gearing up to meet burgeoning product demand with huge investments in its manufacturing plants. But the high-tech enterprise under Tsinghua University is eyeing a much bigger prize – growth of the region’s semiconductor industry and the realization of its ambition to become a more prominent force on the global stage.Inspired by the national strategy, the Tsinghua Unigroup’s big spends include USD 24 billion in Wuhan (Yangtze Memory Technologies Co., Ltd.,) USD 30 billion in Chengdu, USD 30 billion in Nanjing and USD 100 billion in Chongqing, said Liu Hongyu, senior vice president of Tsinghua Unigroup, speaking at the SEMI China Equipment and Materials Committee meeting last month.Advanced packaging is another rich vein of opportunity the region is tapping for expansion, said Liu Hongjun, vice president of China Wafer Level CSP Co., Ltd., another SEMI China member attending the event, hosted by NAURA in Beijing. Hongjun sees strong growth for Fan-in, Fan-out, FCBGA, 2.5D and 3DIC, with Fan-out out front. Liang Sheng, administrative commission director at BDA, a business advisory firm supporting high-technology manufacturing in the E-Town economic development zone, pointed to 5G chips and smart, networked electric automobiles as drivers of the next growth phase of Beijing’s integrated circuit (IC) industry.Global tailwinds are lifting China’s semiconductor industry and the region’s hopes, with SEMI and major industry analysts raising their semiconductor industry growth projects for 2018 to between 9 percent and 16 percent. According to SEMI’s latest market report, global semiconductor industry manufacturing equipment revenue reached USD 17 billion in the first quarter of 2018, logging all-time highs after jumping 12 percent from the previous quarter and 30 percent year-over-year. Korea was the top-performing region at USD 6.26 billion, followed by China at USD 2.64 billion.Tighter integration with the rest of the global semiconductor industry is critical to the growth of China’s chip sector, and SEMI China is squarely focused on this assimilation, said SEMI China president Lung Chu. The spearhead of this effort is the SEMI Innovation Investment Platform (SIIP) China, established by SEMI China last year to help grow China’s pool of skilled workers, promote advanced technology, generate industry capital, and expand China’s semiconductor industry while developing stronger connections with chip sectors in other regions. To strengthen ties with other regions, SIIP China will stage a number of innovation and investment forums this year including Chinese Night at SEMICON West (July 10-12) and a SIIP China Forum in Silicon Valley (July 15). In August, representatives from the Korea chip industry will visit counterparts in China (August), and a China delegation will travel to Japan for meetings (October). SIIP China is also strengthening the region’s links with Germany and Israel as SEMI serves as a crucial bridge between China’s semiconductor sector and the global industry.At the invitation of Shanghai authorities and the Ministry of Commerce of the People’s Republic of China, SEMI China in November will join the China International Export Import Exposition in Shanghai, an event that will underscore China’s commitment to the openness and cooperation of its semiconductor industry with the international chip community. As part of the exposition, SEMI will work with the Ministry of Commerce and domestic chip manufacturers to begin development of a special integrated circuit (IC) zone. SEMI China members are welcome to participate.With workforce development no less vital to the future of China’s semiconductor industry, the Equipment Materials Committee offered potential solutions to the industry’s talent gap. Measures included targeting university students and engineers with industry lectures and courses in key cities, campus recruiting, talent training that members said they are willing to help SEMI coordinate and stage and, much like the push to better integrate China with the global semiconductor industry, mobilizing member resources around a campaign to polish the image of the industry to make it more attractive to students and young workers. Members of the SEMI China Equipment Material Committee gathered at NAURA in Beijing in June for a warm and lively discussion about global semiconductor industry cooperation and growing China’s semiconductor sector.Cherry Sun is a marketing manager at SEMI China.

What’s next for smarter, more connected electronics manufacturing - Part 1The fast-maturing infrastructure now enabling applications for big data and artificial intelligence means disruptive change not just at individual companies but also in data connections among companies across the microelectronics manufacturing value chain. SEMI expands its smart manufacturing program with a Smart Manufacturing Pavilion with displays and three full days of talks to address these industry-wide developments at SEMICON West, July 10-12 in San Francisco.Autonomous autos’ demand for zero-defect systems and 100 percent traceability back to the manufacturing data for each die is driving a push to traceability across the chip sector. “Far more chips are being used by the automotive sector, and its very different requirements are driving demand for traceability,” says Tom Ho, president of BISTel America. “Our chipmaker customers are looking for traceability solutions and the trend is the same in backend packaging and assembly – automotive applications are driving the sector to traceability.”Traceability is also driven by the growth of systems in a package as fabless chipmakers look to connect back to the packaging companies’ fault analysis labs and die interconnect history to diagnose and fix the cases where known-good die are failing in the system, adds Mike Plisinski, CEO of Rudolph Technologies. Plisinski adds that makers of consumer products like phones that can also see harsh conditions are demanding higher quality and traceability as well. The electronic manufacturing services (EMS) sector also must establish an architecture for traceability to collect critical manufacturing-related data and to interface with OSATs and semiconductor fabs. The reason is that EMS companies are adding traditional OSAT processes such as assembly of products with bare die and complex optics modules requiring clean rooms. “A unified sand-to-smart-phone smart manufacturing roadmap should be established,” says Dan Gamota, vice president of Engineering and Technology Services at Jabil. “We need to identify protocols for manufacturing data communications that can be adopted across the supply chain.”To enable smart manufacturing, vendors need to collaborate on getting their production equipment to interoperate and support factory analytics and data management systems. Source: SEMI One big challenge, of course, is how to format this diverse data so it can be linked and used by various supply chain stakeholders. “Smart data needs to be contextual and it needs data standards across the supply chain so it’s easy to link from the front end to the back end, follow common lot IDs front and back end, and have a way to map streaming data from sensors to a discrete lot ID,” notes Ho. New approaches to metrology, analysis and test that increasingly exploit machine learning on simulations will also be needed to help predict which die and connections that test well now may fail in the future as conditions change.Another issue is how to securely share the needed data across companies without jeopardizing IP. “On the equipment side we collect data across customers on how the tool is running to improve the equipment,” notes Neal Callan, ASML VP Silicon Valley. “Next we need to integrate performance and reliability data that today is not as well shared.”The other big hurdle is how to pay for data sharing. “The challenge is that the final manufacturers reap the benefit of traceability, but since they expect their suppliers to deliver good die, they don’t want to pay more for it,” notes Plisinski. He suggests that over the next two to three years, traceability and predictive fault prevention will become the norm as the automotive sector is compelled to invest in it to assure safety. Meanwhile, fabless companies will face so much complexity in integrating different die from different suppliers in SiP that they will no longer be able to afford to simply use the cheapest supplier, potentially driving a fundamental shift in relations and division of labor among fabless chipmakers, OSATs and fabs. Standards extend across supply chainSEMI member committees are collaborating to build the infrastructure to enable these developments. Standards committees are updating standards for higher bandwidth data exchange and extending semiconductor-like vertical and two-way horizontal equipment communication standards to flow shops to enable assembly players to optimize and trace back results across players. The SMT/PCBA community is integrating its smart manufacturing work into SEMI standards, and the SEMI A1 standard was a key reference document in the development of the Japan Robotics Association’s Equipment Link Protocol.Speakers addressing these issues at SEMICON West include Active Layer Parametrics, Applied Materials, Applied Research Photonics, ASML, Bosch Rexroth, Cimetrix, Coventor, ECI Technologies, Edwards Vacuum, Final Phase Systems, GE Digital, Infineon, Jabil, Lam Research, Osaro, Otosense, PEER Group, Qualcomm, Rockwell Automation, Rudolph Technologies, Schneider Electric, Seagate, Siemens, Stanford University, TEL, TIBCO Software. See semiconwest.org.What’s next for smarter, more connected electronics manufacturing - Part 2What’s next for smarter, more connected electronics manufacturing - Part 3Paula Doe, SEMI