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BIOGRAPHY  Mike Corbett has been involved with semiconductor processes and materials consumed in both front end of the line (FEOL) and back end of the line (BEOL)...

ABSTRACTAs the industry enters the new era of AI and high-performance computing, advanced packaging in the form of chiplets is becoming increasingly important.   There are many package options...

Adaptive Approach to Digital TwinsABSTRACTApproach to building an AI platform in gas, chemical, and slurry systems in semiconductor facilities.BIOGRAPHY  Dawood is...

BIOGRAPHY  Jongjoon Kim is a sales manager in the electronics wafer process materials team at Resonac America. Jongjoon joined Resonac Group in 2010. Before being...

As a Project Development Executive, Chase is a key contributor to the Phoenix office leadership team providing insight and strategic direction for our Arizona business. With nearly 20 years of...

Tier 2 Perspectives: ESGS Supply Chain Challenges and Opportunities ABSTRACTAs the semiconductor industry advances toward complex devices and novel precursors, Tier 2 suppliers face growing...

ABSTRACTThis presentation serves as a review and look ahead of Trump Administration and Congressional action.BIOGRAPHY  Jamie Girard works as Principal, Girard...

The Glue Layer of Semiconductors: How AI Powers New Materials ABSTRACTThe semiconductor industry is at a transformative moment, where advanced nodes, chiplets, and heterogeneous integration are...

Online Monitoring of PPQ-Level Metals, Nanoparticles, and Molecular Organic Impurities in Semiconductor Process Chemicals BIOGRAPHY  Ripudaman Singh Shekhawat...