Showing 9529 - 9540 of 11343
Member Press Release
MRSI Systems Announces "One Stop Shop" Die Bonding Solutions at CIOE and ECOC
STOCKHOLM, Aug. 30, 2018 --
MRSI Systems (Mycronic Group) will be demonstrating our "One Stop Shop" capabilities at the 20th China International Optoelectronic Exposition (CIOE) at...
Blog
pSemi: World’s First Monolithic SOI Wi-Fi FEM
pSemi (formerly Peregrine, now a Murata company) has staked its claim for having the world's first monolithic SOI Wi-Fi front-end module (FEM)—the PE561221. This 2.4 GHz Wi-Fi FEM is the first to...
Member Press Release
Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging
Dragonfly G2 system delivers greater than 50 percent higher 2D inspection speed and accommodates multiple sensor options, including Clearfind™ Technology
Wilmington, Mass. (August 29,...
Blog
Standard for Fan-Out Panel Size Ready to Ballot
The arrival of Fan-Out Panel Level Packaging (FO-PLP) appears to be at a perfect time: This technology will leverage processes developed for Three Dimensional Stacked Integrated Circuits (3DS-IC) as...
Member Press Release
MRSI Launches new MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain
MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3μm high speed die bonder which will be the first of its kind to address the multi-die and multi-process requirements, delivering...
Member Press Release
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3μm high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced photonics such as...
Member Press Release
Edwards to expand Semiconductor offering with the planned addition of Brooks Automation’s cryogenic business
BURGESS HILL, UK. (28th August 2018) - Atlas Copco Group has announced its agreement to acquire the cryogenic business of Brooks Automation, Inc through its wholly owned US entity Edwards Vacuum...
Member Press Release
Versum Materials to Exhibit Materials and Delivery Systems for Semiconductor Manufacturing at SEMICON Taiwan
TEMPE, Ariz. (August 28, 2018) ‒ Versum Materials, Inc. (NYSE: VSM), a leading materials supplier to the semiconductor industry, announced today it will showcase its next-generation CMP slurries,...
Member Press Release
Stress-free ALD from Picosun
ESPOO, Finland, 28th August, 2018 – Picosun Group, a leading supplier of advanced Atomic Layer Deposition (ALD) thin film coating solutions, reports a method to control and eliminate stress in ALD...
Member Company
Bonotec Electronic Materials Co., Ltd.
上海本诺电子材料有限公司（Bonotec Electronic Materials）是一家主要从事电子粘合剂的研发、生产、产品定制和解决方案服务的高科技企业，产品广泛应用于电子、半导体、LED、光纤、液晶显示以及军工等多种行业。目前本诺电子材料的产品分类有IC（集成电路）、LED（发光二极管）、Smart Card（智能卡）、Fiber...
Blog
Video: SEMI Talks Industry Trends, Workforce Development and Trade at SEMICON West
The proliferation of chips driven by artificial intelligence and automotive will spur a record $68 billion in sales of semiconductor equipment in 2019.Building the workforce of the future is at once...
Member Company
Wooptix
Wooptix is an advanced imaging company with patented solutions for the detection of the wave front phase and the light field. Head quartered on the Spanish island of Tenerife, Wooptix was founded...