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SEMI Press Release
MSEC Tech Showcase to Highlight MEMS & Sensors Innovations
MEMS & Sensors Industry Group announces Technology Showcase finalists for MEMS & Sensors Executive Congress
MILPITAS, Calif. – October 3, 2018 – MEMS & Sensors Industry Group (MSIG), a...
Blog
3D Heterogeneous Integration Drives Demand for New Materials and Integration Solutions
SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies and their need for new materials and integration solutions. The two...
Blog
SEMI Calls for Exclusion Process for Products in New China Tariff List
Last week, SEMI joined a coalition of business groups in calling for Ambassador Robert Lighthizer, U.S. Trade Representative, to enact an exclusion process for the most recent tranche of tariffs...
Blog
Power Subsystems: Surging on a Wave of Vacuum Processing Equipment
Process power and reactive gas subsystems for semiconductor manufacturing equipment have grown at a CAGR of 21% since 2013. The segment growth is considerably above the critical subsystems industry...
Member Company
PEMTRON Corporation
On the basis of the fundamental technology of 3D precision measurement, Pemtron Corporation has developed and supplied 3D SPI(Solder Paste Inspection System), 3D AOI(Automated Optical Inspection...
SEMI Press Release
Industry Visionaries to Present at SEMICON Japan 2018 SuperTHEATER
Global Industry Leaders Toyota, Honda, Denso, Toshiba, Bosch, Qualcomm and GLOBALFOUNDRIES to Headline SEMICON Japan
TOKYO — October 1, 2018 — Visionary keynote speakers and industry luminaries will...
Blog
SEMI Korea Members Day: Takeaways and Tech Trends as Korea Leads in Fab Investment
Korea is on track to top all other regions in fab investment, spending $63 billion between 2017 and 2020, with powerhouses Samsung Electronics Co. and SK Hynix leading the way, according to latest...
Member Company
Ajinomoto Co., Inc.
Insulating film materials for IC package substrate, Ajinomoto Build-up Film(ABF)
Blog
Amid U.S.-China Trade War, SEMI Urges International Cooperation in Shanghai Press Conference
Tensions between the U.S. and China have reached fever pitch as the Trump administration imposed higher tariffs on $200 billion of Chinese goods last Monday, adding to the $50 billion in goods hit...
Blog
QuickLogic ultra-low power eFPGA on GF's 22FDX FD-SOI and in PULP/RISC-V SoC
[caption id="attachment_12359" align="alignright" width="300"] (Courtesy: PRNewsfoto/QuickLogic Corporation)[/caption]
Some great pieces of FD-SOI news from QuickLogic. The company recently...
Blog
1st Highlights from Shanghai FD-SOI/RF-SOI Events – Amazon/Blink, Intellifusion, Foundries, China Mobile, Nokia, Qorvo and More
Excellent news and exciting applications made headlines at the recent FD-SOI and RF-SOI events in Shanghai. During the FD-SOI day, Amazon/Blink and Intellifusion shared news about their new chips,...
Blog
Tracking the Changing OSAT Market
Outsourced Semiconductor Assembly and Test (OSAT) service providers experienced strong growth in 2017, but will this growth continue? In the last few years, OSAT growth has been driven by...