Showing 4933 - 4944 of 8233
Page
Revision to SEMI S23 Approved
Revision to SEMI S23 Approved
By Kevin Nguyen, SEMI HQ
Semiconductor fabrication equipment generates significant amount of heat. Water is generally used for cooling. Heated water is then removed...
Member Press Release
High customer satisfaction with Picosun’s new service and support model
ESPOO, Finland, 31st August 2020 – Picosun Group’s growth strategy is based on strong expansion into industrial ALD markets. To support this strategy, special emphasis has been placed on...
Blog
Managing Disruption Through Collaboration: SEMICON West Goes Virtual
In many ways it feels like we’ve turned back the hands of time. We are staying at home, playing board games with the family. Outdoors, we can view mountains not seen in decades – air pollution has...
Blog
Building the Talent Pipeline, One Step at a Time
Back in February of this year, we launched SEMI Works™, a landmark SEMI program designed to grow and sustain the electronics industry talent pipeline from the ground up. But it was much more than a...
Blog
China Wafer Production Capacity Growth Fastest in World
Region’s Fab Capacity Expansion Picks up PaceUnwavering in its drive to build a strong, self-sufficient semiconductor supply chain, China plans more new fab projects than any other region in the...
Member Press Release
Closing the Loop – Integrated Waste Gas & Water Treatment Solutions at SEMICON Southeast Asia 2026
Kuala Lumpur, Malaysia, 29 April 2026 – DAS Environmental Experts presents its latest sustainable technologies at SEMICON SEA 2026 (May 5–7, MITEC, Booth 1174). The focus is on closing resource loops...
SEMI Press Release
SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
MILPITAS, Calif. – November 3, 2025 – The SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix,...
SEMI Press Release
European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost Competitiveness of Semiconductor Ecosystem
BRUSSELS, Belgium – November 5, 2024 –The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, today announced the publication of the Skills Strategy report by DECISION...
Page
SEMI SEA ASTC 2023 November Presentation Materials
Thank you for attending Advanced Semiconductor Technology Conference (ASTC) 2023 November at Andaz Singapore!Please find the approved slides for distribution below. We hope you have enjoyed the...
Page
Highlights from Cybersecurity Standards Webinar
Highlights from Cybersecurity Standards Webinar
By Cher Wu, SEMI Taiwan
SEMI recently held a webinar on the introduction and practice of SEMI E187, Specification for Cybersecurity of Fab...
Page
Japan PLP Panel FOUP Activity Highlights
Japan Panel Level Packaging Panel FOUP Activity Highlights
By Shoji Komatsu, Acteon NEXT
The activity of the Panel Level Packaging (PLP) Panel FOUP Task Force (TF) started in May 2018 and over 40...