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Micron TechnologyABSTRACT COMING SOONBIOGRAPHYMichel Koopmans received his Bachelor’s degree in Mechatronics from the Technical Institute of Arnhem, Netherlands in 1992. In 1999 he joined Micron...

Material Qualification for Yield Improvement and Cost Saving in Advanced FEOL and Packaging ProcessesWhile new materials, device structures, and packaging technologies drive the latest advancements...

Advancing Material Innovation to Meet the Evolving Needs of the Semiconductor IndustryIn this presentation, we will explore the dynamic landscape of material innovation within the Mitsubishi Chemical...

BIOGRAPHYJames Amano is Senior Director, EHS, at SEMI. After leading the SEMI International Standards Program for nearly 10 years, he launched the SEMI Sustainability Initiative in 2021, and is now...

Low Cost Advanced Chiplet Packaging Options and Challenges Advanced chiplet packaging is increasingly favored in the semiconductor industry due to its ability to enhance performance, optimize...

KEYNOTE - The Opportunity to Accelerate the Semiconductor Industry using AI in Materials DiscoveryThe pursuit of new materials for next-generation semiconductor devices represents a formidable...

Thank you for attending the SEMI Silicon Manufacturers Group (SMG) Briefing & Networking at SEMICON WestJuly 10, 2024Sponsored by ePAKGlobal Economics:  Into a Growth Slowdown (Does it...