Low Cost Advanced Chiplet Packaging Options and Challenges
Advanced chiplet packaging is increasingly favored in the semiconductor industry due to its ability to enhance performance, optimize integration of diverse technologies, improve scalability, reduce costs, enhance power efficiency, and improve overall reliability. As technology continues to advance, chiplet packaging is expected to play a crucial role in enabling next-generation HPC, Datacenters, AI, and Automotive applications.
An analysis of the various assembly processes for chiplet packaging are investigated. RDL interposer with or without bridge die technology solution strike a balance between cost-effectiveness and performance, making them attractive for a wide range of applications.
BIOGRAPHY
Dr. Nokibul Islam is currently serving as sr. director of worldwide field applications engineering (FAE) at STATS ChipPAC, USA, leading the product business development and advance technology promotion for the company. Dr. Islam has over 20 years of comprehensive experience in semiconductor product management, business development, technology marketing, package design, development, characterization, qualification, reliability evaluation and failure analysis. He received his Ph.D. and MS in Mechanical Engineering from Auburn University, AL, USA.