downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path

July 15, 2024

Join us for the SEMI Standards

3D Packaging & Integration (3DP&I)

North America Technical Committee Chapter Meeting!

Date: Monday, July 15, 2024

Time: 13:00-14:30 Pacific Time

Online via Web Conference

To receive the calendar invite, please reach out to the contact below.

 

AGENDA

(Subject to change)

Last updated:  June 14, 2024

 

Time

1:00 pm - 2:30 pm

Add to Calendar 2024-07-15 13:00:00 2024-07-15 14:30:00 3D Packaging & Integration North America TC Chapter Meeting Join us for the SEMI Standards3D Packaging & Integration (3DP&I)North America Technical Committee Chapter Meeting!Date: Monday, July 15, 2024Time: 13:00-14:30 Pacific TimeOnline via Web ConferenceTo receive the calendar invite, please reach out to the contact below. AGENDA(Subject to change)Last updated:  June 14, 2024  Virtual United States SEMI.org [email protected] America/Los_Angeles public
Location

Virtual
United States

Note

SEMI Standards Meetings are open to all registered SEMI Standards Program Members. 

If you are not yet a SEMI Standards Program Member, please fill out the Application Form. Membership is free.

Virtual Platform

SEMI uses RingCentral to host virtual meetings. Make sure to download the latest version of RingCentral and test your audio connections prior to the meeting.

To download and install the RingCentral Meetings application to your computer:

https://support.ringcentral.com/download.html

To receive the calendar invite, please reach out to the contact below.

Contact

Laura Nguyen
Sr. Coordinator, International Standards