Micron Technology
ABSTRACT COMING SOON
BIOGRAPHY
Michel Koopmans received his Bachelor’s degree in Mechatronics from the Technical Institute of Arnhem, Netherlands in 1992. In 1999 he joined Micron Technology where he held multiple Advanced Packaging development responsibilities from Wafer Level Packaging to Micron’s 3D TSV Hybrid Memory Cube and High Bandwidth Memory. He is currently leading the advanced packaging engineering team in Boise, ID, working on wafer-to-wafer bonding and chip-to-wafer bonding process development. He has received over 40 US issued patents.