Showing 2749 - 2760 of 8235
Event
FEMC#27 Digital Twin Models for Semiconductor Manufacturing Unit Process
Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical...
Member Press Release
Brewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes
Brewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes
OptiStack® SOC450 material provides zero shrinkage up to 550°C when baking in...
Member Press Release
Discover ViTrox’s Latest and Advanced Wafer Inspection Solution – the Wi8i G2 PRO!
PENANG, MALAYSIA - FEBRUARY 2023 Wafer inspection is always a critical stage for quality assurance for wafer foundry, integrated device manufacturing (IDM), fabless, and outsourced semiconductor...
Blog
The Time is Now to Move to Smarter Manufacturing
Ride the Wave of Smarter Manufacturing
The year 2020 sparked a tremendous acceleration in the digital transformation worldwide, driving a sharp rise in demand for semiconductors and escalating...
Blog
Getting Better by Design
SEMI’s mantra is: Connect, Collaborate, Innovate. This mantra has delivered industry-enabling value to our members since SEMI’s beginnings in 1970. It has been essential for SEMI members to grow...
Page
GSMC 2021 Bio - Jerry Chen
Bio
Jerry Chen is Director of Global Business Development at NVIDIA for Manufacturing & Industrials
Over 20+ years at NVIDIA Jerry has led initiatives in scientific HPC, AI, graphics, and...
Page
ITPC Abstract - Advanced Packaging, Heterogeneous Integration, and Big Data
Advanced Packaging, Heterogeneous Integration, and Big Data
Abstract PDF
The world around us is becoming more and more dependent on data. As Clive Humby, UK Mathematician, put it “Data is the new...
Page
SMC 2026—Strategic Materials Conference Speaker Bio - Pooya Tadayon, PhD
Enabling Quantum Computing Through Advanced Packaging Quantum computing is rapidly approaching an inflection point, with emerging roadmaps projecting orders-of-magnitude increases in qubit...
SEMI Press Release
ASMC 2024 to Showcase AI, Smart Manufacturing and Sustainability to Advance Chip Industry Manufacturing Expertise
MILPITAS, Calif. — March 26, 2024 — More than 125 experts will offer insights into the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at...
Member Press Release
PEER Group joins SEMI Midwest Chapter as a founding member, supports the advancement of the North American semiconductor industry
PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, has been announced as one of the founding members of the newly established SEMI®...
Member Press Release
Brewer Science presents best practices for workplace culture at SEMICON West
San Francisco, California–December 7, 2021– Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics...
SEMI Press Release
SEMI Applauds European Chips Act, Aimed at Boosting Semiconductor R&D and Manufacturing
BRUSSELS, Belgium – September 30, 2021 – SEMI, the global industry association representing more than 2,400 semiconductor and electronics manufacturing companies worldwide, today applauded the...