Showing 2473-2484 of 2680
Blog
MEMS – One Product, One Process?
SEMI spoke with Udo Gómez, senior vice president at Robert Bosch GmbH, about MEMS technology requirements relative to standard IC design and manufacturing. Gómez highlighted solutions to challenges...
Blog
Part 2 of 2: The End of the Memory Growth Rally? Where Are We in the Memory Inventory Cycle?
Part 1 of this article discussed the Memory Inventory Cycle Index and compared it with memory device sales and memory fab equipment investments. This article, the second of the two-part series,...
Blog
Automating 200mm Semiconductor Fabs to Meet Growing Demand
SEMI met with Heinz Martin Esser, managing director at Fabmatics GmbH, to discuss how existing 200mm semiconductor fabs can master the challenges of a 24x7 production under highest cost and quality...
Blog
The Gigafab Minute and SEMI Standards: A Modern Miracle
Even for someone who has been in this industry since the days of the TI Datamath 4-function calculator and the TMS1100 4-bit microcontroller (yes, that’s been a LONG time – the...
Blog
Wafer-Level Chip Scale Packages: Reliability and Validation Testing Using Simulation Methodology
SEMI spoke with Balaji Nandhivaram Muthuraman, Package and Material Simulation engineer at Dialog Semiconductor, about the state of reliability testing for wafer-level chip scale packages ahead of...
Blog
Part 1 of 2: The End of the Memory Growth Rally? Where Are We in the Memory Inventory Cycle?
Micron, one of the top three memory semiconductor companies, reported solid results for the fourth quarter of fiscal 2018 (June to August) to extend a multi-quarter string of strong growth. However,...
Blog
Japan – A Thriving, Highly Versatile Chip Manufacturing Region
On June 1st, 2018, Toshiba sold Toshiba Memory, Toshiba’s memory business, to an investment group led by Bain Capital. Toshiba Memory was then owned by a consortium of American, Japanese and Korean...
Blog
3D Heterogeneous Integration Drives Demand for New Materials and Integration Solutions
SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies and their need for new materials and integration solutions. The two...
Blog
SEMI Calls for Exclusion Process for Products in New China Tariff List
Last week, SEMI joined a coalition of business groups in calling for Ambassador Robert Lighthizer, U.S. Trade Representative, to enact an exclusion process for the most recent tranche of tariffs...
Blog
Power Subsystems: Surging on a Wave of Vacuum Processing Equipment
Process power and reactive gas subsystems for semiconductor manufacturing equipment have grown at a CAGR of 21% since 2013. The segment growth is considerably above the critical subsystems industry...
Blog
SEMI Korea Members Day: Takeaways and Tech Trends as Korea Leads in Fab Investment
Korea is on track to top all other regions in fab investment, spending $63 billion between 2017 and 2020, with powerhouses Samsung Electronics Co. and SK Hynix leading the way, according to latest...
Blog
Amid U.S.-China Trade War, SEMI Urges International Cooperation in Shanghai Press Conference
Tensions between the U.S. and China have reached fever pitch as the Trump administration imposed higher tariffs on $200 billion of Chinese goods last Monday, adding to the $50 billion in goods hit...