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SEMI Press Release
Cassandra Melvin Honored with Spark Excellence Award for Leadership and Commitment to Inclusion in the Semiconductor Industry
MUNICH – December 9, 2025 – The European Chips Diversity Alliance (ECDA) today announced Cassandra Melvin, Senior Director of Business Development and Operations at SEMI Europe, as the recipient...
Member Press Release
Best in Class Abatement System: DAS Environmental Experts Exceeds Efficiency Benchmarks in Semiconductor Greenhouse Gas Treatment
Validation underscores DAS EE’s 35 years of leadership in advanced and sustainable abatement solutions
Dresden, Germany, November 28, 2025 — As the semiconductor industry intensifies its efforts to...
SEMI Press Release
SEMI Reports Global Semiconductor Equipment Billings Increased 11% Year-Over-Year in Q3 2025
Growth Driven by Robust Investments in Leading-Edge Logic, DRAM, and Packaging Technologies to Support AI WaveMILPITAS, Calif. – December 2, 2025 – SEMI, the industry association serving the...
Member Press Release
Fasoo Strengthens Screen Security and Audit Controls to Deter Unauthorized Actions in Semiconductor Supply Chains
SEOUL, SOUTH KOREA, November 18, 2025 — As the semiconductor industry accelerates global collaboration and complex supply chain operations, sensitive design and process data are increasingly exposed,...
SEMI Press Release
SEMI Names Royal Kastens as Head of Global Advocacy and Public Policy
MILPITAS, Calif. — December 1, 2025 — SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced the...
Blog
Driving Global Innovation: Empowering Deep Tech Startups through Semiconductor Collaboration
As the world enters a new era of deep tech innovation, fields such as AI chips, Advanced Computing, Autonomous Vehicles, Smart Manufacturing, and MedTech have become strategic priorities for...
Blog
Circular Collaboration Leverages EDA Advances
The SEMICON West 2025 design program “The Convergence of Semiconductor Manufacturing and Design,” organized by the ESD Alliance (ESDA), a SEMI Technology Community, featured presentations...
Blog
Bridging Europe’s Chip Talent Gap: How the European Chips Skills Academy (ECSA) is Leading the Way
As Europe’s microelectronics industry enters a new era of growth, one question stands out: do we have the talent pipeline to match our ambitions? The European Chips Skills Academy (ECSA), coordinated...
Member Press Release
Beneq Launches Beneq Transform® XP – Redefining Atomic Control in ALD
Second-generation platform delivers advanced control, in-cycle annealing, and high-throughput performance for Wide Bandgap power and RF device manufacturing
Espoo, Finland, November 24, 2025 – Beneq...
Member Press Release
Breker Verification Systems and Frontgrade Gaisler Collaborate on High-Reliability RISC-V Fault-Tolerant Processor Core
Breker Verification Systems today confirmed its RISC-V functional verification solutions were pivotal for verification of the NOEL-V, one of Frontgrade Gaisler’s fault-tolerant RISC-V processor IP...
Member Press Release
Beneq Unveils Beneq Transmute™ – High-Throughput ALD for Power, RF, and μLED Device Production
New platform delivers ALD film quality at production throughput for Wide Bandgap and other specialty device manufacturing
Espoo, Finland, November 19, 2025 – Beneq, a global leader in Atomic Layer...
Member Press Release
Agileo Automation Launches Agil’SECS-II to Enable Semiconductor OEMs, Multi-Industry Fabs, and Labs to Accelerate Equipment Integration on Production Lines
New SECS-II library helps fabs and OEMs integrate semiconductor tools with the MES in hybrid manufacturing sites, ensuring faster time to market and limiting integration costs
MUNICH, November 18,...