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SEMI Press Release
SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
Global Capacity for 7nm and Below to Reach 1.4 Million Wafers Per Month by 2028 MILPITAS, Calif. – June 25, 2025 – SEMI, the industry association serving the global semiconductor and...
SEMI Press Release
SEMICON Taiwan 2025 Marks Official Launch International Semiconductor Week to Steer the Global Industry Forward
Registration is Now Open 【June 18, 2025 – Hsinchu】SEMI today officially announced the launch of SEMICON Taiwan 2025, the annual premier event for the global semiconductor industry. Marking...
SEMI Press Release
SEMI Acquires Linx Consulting’s Market Reports and Conferences to Boost Industry Insights
Deal Amplifies SEMI's Market Intelligence Capabilities in Semiconductor Materials and Specialty ChemicalsMILPITAS, Calif. – June 24, 2025 – SEMI, the global industry association representing...
SEMI Press Release
New GENESIS Project to Advance Sustainable Semiconductor Manufacturing in Europe
58 Partners Charged with Implementing Cutting-Edge Solutions for Emission Control, Materials Innovation, Waste Reduction, and Raw Material ReuseBrussels, Belgium – June 19, 2025 – A pan-European...
SEMI Press Release
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
Request for Proposals Open Until July 14; Informational Webinar June 24MILPITAS, Calif. – June 18, 2025 – FlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to...
Member Press Release
Agileo Automation Announces Future Expansion Of A²ECF-SEMI Automation Framework With SEMI EDA Standards
Integration of EDA empowers OEMs to deliver structured, high-bandwidth data to semiconductor fabs and drive efficiencies for competitive advantageCEA LID World Summit, Grenoble, France, June 17, 2025...
SEMI Press Release
Phoenix to Host SEMICON West 2025 for the First Time, Showcasing Arizona’s Critical Role as a Semiconductor Manufacturing Hub
Event registration now open, with expanded programming and support from key Arizona partnersMilpitas, CA – June 16, 2025 — SEMI, the industry association serving the global semiconductor and...
Member Press Release
Nordson Electronics Solutions develops panel-level packaging solution for Powertech Technology, Inc. that achieves yields greater than 99% for underfilling during semiconductor manufacturing
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing....
Blog
Calibrating Gas Sensors: Past, Present, and Near Future
BackgroundSEMI’s Device Working Group, part of its MEMS & Sensors Industry Group (MSIG), actively works to lower barriers for MEMS-based gas sensor market adoption. In 2022, the group...
Blog
A Surprising Partner Can Answer America’s Trusted Tech Supply Chain Problem
Congress has committed billions of dollars to expand America’s domestic advanced manufacturing capacity in semiconductors and related technologies. To speed up the reshoring process, President Trump...
SEMI Press Release
SEMI Announces Election of Tien Wu, ASE CEO, as International Board Chair
Benjamin Loh, Chairman of Comet AG, Elected Vice ChairMILPITAS, Calif. — June 12, 2025 — SEMI, the industry association representing the global electronics design and manufacturing...
Blog
The Evolution of Semiconductor Equipment Automation Standards from the 1980s to Now
The semiconductor industry's approach to equipment automation has evolved from early serial interfaces to modern, data-centric architectures. From the early SECS/GEM standards to the GEM300...