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Blog
Building the Digital Twin Backbone: Why Scalable Data Platforms Are No Longer Optional
Digital Twins are no longer a futuristic concept in semiconductor manufacturing—they’re fast becoming the backbone of next-generation fabs. But here’s the challenge: without a robust, scalable data...
SEMI Press Release
SEMI Issues Statement on U.S. H1-B Visa Policy Announcement
MILPITAS, Calif. ─ September 21, 2025 ─ SEMI, the industry association serving the global electronics design and manufacturing supply chain, today released the following statement from SEMI...
Member Press Release
ElevATE Semiconductor Appoints Heather Kirkby as New Chairwoman
San Diego, CA — [Date] – ElevATE Semiconductor, a leading provider of advanced pin electronics (PE) and device power supply (DPS/PMU/VI) IC solutions for the semiconductor test market, proudly...
Blog
SEMI PFAS Transparency Working Group Session at SEMICON West 2025
As the volume of regulations grows across all levels of government, both in the U.S. and abroad, the semiconductor industry is increasingly struggling to keep up with its reporting obligations....
SEMI Press Release
SEMI Europe and Partners Host High-Level Forum to Tackle Semiconductor Talent Gap
“Accelerating Europe Tech Advantage” Event to be held Oct. 2 in BrusselsBrussels, Belgium – September 17, 2025 – SEMI Europe, in partnership with the European Chips Diversity Alliance...
SEMI Press Release
3DIC Advanced Manufacturing Alliance Debuts at SEMICON Taiwan 2025
Alliance Unites Industry Partners to Strengthen Collaboration, Boost Supply Resilience, and Establish Technical Standards 【Sept. 11th, 2025 – Hsinchu】With surging demand for generative AI, high...
SEMI Press Release
SEMICON Taiwan 2025 Grand Opening Celebrates 30 Years of Innovation
CEO Summit Unites Global Industry Leaders for Dialogue on Semiconductor Innovation and Global Opportunities【Sept. 11th, 2025 – Hsinchu】SEMICON Taiwan 2025 opened yesterday at the Taipei Nangang...
Member Press Release
Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking
Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration...
Blog
Finalists for SEMI Startups for Sustainable Semiconductors to Present Live Pitches at SEMICON West 2025
The SEMI Startups for Sustainable Semiconductors (S3) program announced 15 startups chosen as finalists for pitching to the industry at SEMICON West 2025 in Phoenix, Arizona. The finalists were...
Blog
Women in Semiconductors, A Year of National Expansion
This year, the Women in Semiconductor (WiS) program takes a huge step growing nationally — hosting events in New York, Michigan, Ohio, California, and Arizona. Managed by the SEMI Foundation, the WiS...
Blog
SEMI Advocacy Update: Working Together on the U.S. Patent Fee Proposal
As the Department of Commerce explores options to adjust patent fees, these changes will have important implications for the semiconductor industry, where thousands of patents are filed each year to...
SEMI Press Release
MEMS & Imaging Sensors Summit to Spotlight Sensing Revolution for Europe’s Leadership
Event Highlights Advances in AI-based MEMS and Imaging OptimizationMUNICH – September 10, 2025 – Industry experts will gather November 19-20 at the SEMI MEMS & Imaging Sensors Summit 2025 to...