Showing 1981-1992 of 2576
SEMI Press Release
North American Semiconductor Equipment Industry Posts October 2019 Billings
MILPITAS, Calif. — November 19, 2019 — North America-based manufacturers of semiconductor equipment posted $2.11 billion in billings worldwide in October 2019 (three-month average...
SEMI Press Release
SEMICON Korea 2020 to Showcase AI, Smart Mobility and Manufacturing, MEMS and Sensors, Talent
SEOUL, South Korea – November 19, 2019 – With Korea the world’s largest manufacturer of memory semiconductors and leading in 300mm fab construction in 2019, the region is paving the way to SEMICON...
Blog
MEMS and Sensors Fuel Intelligence Movement - Part 2
Part 2 of 2-part series on MSEC 2019 highlights. Read Part 1. Neural Networks on ChipTo be sure, low power is king when bringing machine learning to the sensor edge. Battery-powered, always-on...
Blog
Jim Cable (pSemi) & Herb Huang (Ningbo Semi) Honored for Pioneering RF-SOI Work
The SOI Industry Consortium awarded two luminaries of the semiconductor industry for pioneering advances in RF-SOI, a technology now found in all cellphones. Jim Cable (shown on the left in the photo...
Event Presentation
power laser display technology
Dr. Wang Lin from Shenzhen Guangfeng Technology Co., Ltd. presents on the topic of power laser displays.
SEMICON China 2019 - Shanghai, China
Event Presentation
New Optical Films for Implementation of Next Generation AR Head Up Displays (HUDs)
This presentation discusses the development of new optical film technologies for the automotive industry and compares the thermal load placed on various film surfaces.
SEMICON China...
Event Presentation
Packaging Integration - A Complementary Solution to CMOS Scaling
Russell Liu from WLCSP Innovative Technologies discusses Advanced Packaging solutions, trends, and forecasts.
SEMICON China 2019 - Shanghai, China
Event Presentation
THE DEVELOPMENT OF FORMULATED CLEANS FOR ENABLING PACKAGING PROCESSES IN HETEROGENEOUS INTEGRATION
Tianniu Rick Chen, Ph.D., Vice President Global SP&C (Surface Preparation & Cleans) Business, Versum materials provides a roadmap of packaging cleans and discusses the drivers and challenges...
Event Presentation
Heterogeneous Integration for SiP
Jensen Tsai from SPIL discusses SiP modules and trends across a broad spectrum of technologies.
SEMICON China 2019 - Shanghai, China
Event Presentation
Semiconductor memory technologies: innovations and competitive landscape
Simone BERTOLAZZI, PhD, Technology and Market Analyst, gives an overview of the Memory market and discusses emerging technologies and strategies.
SEMICON China 2019 - Shanghai, China
Event Presentation
Memory Evolution for Code Storage
Michael Wang, VP Corporate Strategy & Marketing, GigaDevice Semiconductor, explains how Memory has evolved over the years and further discusses the presence of NOR Flash in today's...
Event Presentation
BRINGING FUTURE VEHICLES TO MARKET FASTER
Xi Zhang from NXP discusses global automotive trends and the need for efficient automotive software development.
SEMICON China 2019 - Shanghai, China