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Blog
Don’t Touch that Button: Use Voice Instead
The COVID-19 pandemic (caused by SARS-CoV-2) has disrupted lives around the world more than any other catastrophic event in living memory. Those of us fortunate enough to work from home are cheering...
SEMI Press Release
Power and Compound Fab Spending to Rebound in Second Half of 2020, Set New Record in 2021, SEMI Reports
MILPITAS, Calif. — May 5, 2020 — Global fab equipment spending for power and compound devices is expected to rebound in the second half of 2020 to meet resurgent end-product demand and jump 59...
Blog
Japan Expands State of Emergency to All Prefectures, Plans $989 Billion COVID-19 Stimulus Package
On April 16, Japan prime minister Shinzo Abe expanded the state of emergency beyond Tokyo, Osaka and five other prefectures to all 47 prefectures nationwide in an effort to curb the spread of...
Blog
COVID-19: Building Resilience and Maintaining Business Continuity – Views from GLOBALFOUNDRIES (Part 1)
Part 1 of 2Read Part 2. While companies navigate the ongoing COVID-19 crisis, corporate leaders should be evaluating a number of key business continuity issues as well as steps they can take to...
Blog
CMC Designates Leti’s L-UTSOI Standard Model as Chip Industry FD-SOI Standard
The Compact Model Coalition (CMC) has selected Leti’s L-UTSOI as a standard model for FD-SOI in the industry. The CMC is a working group composed of the major semiconductor companies and is part of...
Webinar Replay
Semiconductor Outlook—Navigating Through Turbulent Times
Businesses across the globe are facing a host of new challenges in the wake of the COVID-19 outbreak. With supply chains disrupted and markets dislocated, industry leaders are debating how long until...
SEMI Press Release
Global Silicon Wafer Area Shipments Edge Up in First Quarter 2020 Despite COVID-19 Headwinds
MILPITAS, Calif. — May 4, 2020 — Worldwide silicon wafer area shipments rose 2.7 percent to 2,920 million square inches in the first quarter of 2020, compared with fourth-quarter 2019 shipments of...
Member Press Release
CoreFlow’s non-contact chuck reduces backside particle contamination in semiconductor wafers
CoreFlow Ltd., a leading solutions provider of advanced, aeromechanical-based handling and conveying systems, announced a non-contact chuck for silicon wafer processing applications.
The demand for...
Member Press Release
Picosun provides ALD technology for several new photonics applications
ESPOO, Finland, 29th April 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries, reports several significant new sales...
Blog
It’s Our Anniversary! 15 Years of ASN
Let’s celebrate! As of April/May 2020, Advanced Substrate News – or ASN for short, and now aka the SOI Consortium newsletter – has been bringing you news for 15 years. I hope you’ll forgive me if...
Blog
The SEMI Foundation to Go Virtual with HTU and Open Houses
Since the beginning of the COVID-19 outbreak earlier this year, the world has been flocking online – to connect, to share stories, and, for those who can, to continue to work to help keep the wheels...
Blog
SkyWater Combats COVID-19 With Virus Detection Partnership, Best Practices, FOA Support
As the world confronts the health crisis of a generation in the form of the fast-spreading coronavirus, the microelectronics industry remains firmly in the spotlight. Aware of the central...