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SEMI Press Release

SEMI Forecasts 11.8% Growth in Silicon Wafer Shipments in 2026, With Record Highs Expected through 2029

MILPITAS, Calif. ─ October 21, 2026 ─ Global silicon wafer shipments are projected to increase 11.8% in 2026 to 14,420 million square inches (MSI), SEMI reported today in its annual silicon shipment...
October 21, 2026
SEMI Press Release

SEMI Honors 2026 North America Standards Award Winners at SEMICON West

Leaders Recognized for Significant Contributions to Standards Advancing Semiconductor ManufacturingMILPITAS, Calif. – October 20, 2026 – SEMI, the industry association advancing the global...
October 20, 2026
SEMI Press Release

SEMI Announces Updates to its International Board of Directors

Five New Members Elected MILPITAS, Calif. – October 20, 2026 – SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, today...
October 20, 2026
SEMI Press Release

Electronic System Design Industry Posts $5.7 Billion in Revenue in Q2 2026, ESD Alliance Reports

IC Physical Design & Verification, Semiconductor IP, and Services Reported Double-Digit Year-over-Year Revenue Increase MILPITAS, Calif. — October 19, 2026 — Electronic System...
October 19, 2026
Member Press Release

Agileo Automation Appoints Semitorr – CTW Solutions As Distributor Of E84 PIO Box and Speech Scenario For North American Fab Market

Combined software/hardware solution enables chip makers to conduct comprehensive compliance tests of semiconductor manufacturing equipment upon integration in wafer fabs SEMICON West, San Francisco,...
October 14, 2026
SEMI Press Release

Nordson SonoFlex Acoustic System Wins 2026 Best of West Award

San Francisco, Calif. — October 15, 2026 — SEMI and Semiconductor Digest today announced that the SonoFlex Acoustic System from Nordson Test & Inspection (Booth 5844) has won...
October 15, 2026
SEMI Press Release

Kulicke & Soffa Earns 2026 SEMI Award for North America at SEMICON West

Company Selected for Technical Leadership in Fluxless Thermocompression Bonding SAN FRANCISCO – Oct. 13, 2026 – SEMI, the industry association advancing the global semiconductor and...
October 13, 2026
SEMI Press Release

Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates, SEMI Projects

U.S. Construction Pipeline Expands Amid Strong Global 300mm InvestmentSEMICON West – SAN FRANCISCO — October 13, 2026 — Global 300mm front-end fab equipment spending is projected to reach $149...
October 13, 2026
Member Press Release

Junkosha showcases collaborative cable engineering offering with new 1 mm pitch high-flex cable for semiconductor equipment manufacturers

SEMICON West chosen to demonstrate collaborative approach to developing application-specific cable solutions for space-constrained semiconductor equipment manufacturers SEMICON West booth: Hall...
October 12, 2026
Member Press Release

RENA Technologies Secures Major Orders for High-Throughput Platforms for the Semiconductor Industry

Gütenbach, Germany, October 2026: RENA Technologies has received three additional major orders for high-throughput equipment for the wet-chemical processing of 200 mm and 300 mm wafers. The systems...
October 12, 2026
SEMI Press Release

SEMI and Semiconductor Digest Announce 2026 Best of West Award Finalists

San Francisco, Calif. — October 12, 2026 — SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2026, October 13–15...
October 12, 2026
Blog

MSTC 2026: 7 Key Themes for the Future of MEMS & Sensors

For decades, the MEMS and sensors industry competed on specifications: smaller, cheaper, more accurate. That race is not over, but it is no longer the whole game. Industry leaders explained the shift...
By Paul Carey
October 12, 2026