Latest insights in 3D integration and systems for semiconductor manufacturing and applications
DRESDEN, Germany – 23 October, 2018 – The future of intelligent systems powered by artificial intelligence (AI) will highlight the inaugural SEMI 3D & Systems Summit, 28-30 January, 2019, in Dresden, Germany, as the industry gathers for the latest insights and developments in 3D integration and systems for semiconductor manufacturing and applications. Registration is now open with early bird pricing until 30 November 2018.
SEMI 3D & Systems Summit debuts after six successful editions of the European 3D Summit, featuring a broader scope of topics aimed at driving business opportunities and innovation in areas including:
- 3DIC Through-Silicon-Via (TSV) technology
- 2.5D, 3D FO-WLP/e-WLB
- Active and passive interposers
- Stacked dies or stacked wafers
- 3D alternative technologies
- 5G Integration
Professor Hubert Lakner, director, Fraunhofer-Institute for Photonic Microsystems IPMS, will kick off the summit with his keynote Heterointegration – The Path to Future Complex Intelligent Systems.
Lakner will explore connected intelligence opportunities arising from the transition to autonomous driving, the digitalisation and electrification of cars, and the digitalisation of industry and electrical power grids. These capabilities will be enabled by artificial intelligence (AI), improved cybersecurity, reinforced connectivity through 5G, edge computing, low-power components, sensors and power management.
Lakner will examine how these technology trends are expected to disrupt value chains, calling for more distributed supply and tighter cooperation across various value chains based on heterointegration technologies. He’ll also offer insights on the emergence of AI and its impact on how data is processed, analysed and shared, redefining the way it influences our lives.
3D & Systems Summit speakers include experts from companies such as Orbotech, GLOBALFOUNDRIES, Fraunhofer-Institute for Photonic Microsystems IPMS, EPIC – European Photonics Industry Consortium, McKinsey, System Plus Consulting, ASE Group, imec, DISCO HI-TEC EUROPE, STMicroelectronics, G-ray, Amkor, TU Dresden, Huawei, Fraunhofer IZM, AT&S AG, Deca Technologies and Miland.
The exhibition will showcase the most prominent names in 3D integration microelectronics manufacturing. See the floorplan here. More information on the 3D & Systems Summit is available here.
3D & Systems Summit attendees are also invited to join Symposium Panel Level Packaging 2019. Following the 3D & Systems Summit, the event is organized by Fraunhofer IZM, 30 January 14:00-18:00. To register for the event, please click here. More details are available here.
About SEMI
SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.
Association Contact
Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]
