반도체 장비는 보통 공장이라고 하는 제조 시설에 있는 통합 장비 제조(I.C.s)에 있어서 중요한 역할을 합니다. 반도체 장치의 종류 또는 카테고리는 다음과 같습니다.
SEMI의 업계조사 및 통계에서는 다음과 같은 이점을 제공하는 시장데이터를 제공합니다:
- 보다 신속한 정보 제공으로 경쟁 우위 확보
- 비즈니스 계획, 전략적 계획, 및 예측에 관한 보다 빈번한 조언
- 이순환형 산업에 대한 더 나은 이해
RECENT EQUIPMENT MARKET NEWS
Semiconductor Manufacturing Monitor
Equipment Market Data Subscription (EMDS)
Historical Book-to-Bill Report (1991-2016) and Billings Report (2017-2019)
Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Historical Report (1991-2019)
SEMI Industry Research and Statistics delivers powerful market data intelligence that enables you to:
- Stay ahead of your competition by being more quickly informed
- Obtain more frequent input for business planning, strategic planning and forecasting
- Get a better understanding of this cyclic industry
There are various types of electrical and reliability tests conducted at different stages of assembly and for different purposes once the wafer fabrication process is finished. Tests include die sort test on wafers, electrical and environmental testing, and burn-on on packaged devices.
Semiconductor fabrication consists of a series of processes in which a device structure is manufactured by applying a series of layers onto a substrate, most commonly on silicon. This involves the deposition and removal of various thin film layers. The areas of the thin film that are to be deposited or removed are controlled through photolithography. Each deposition and removal process is generally followed by cleaning as well as inspection steps.
Other Front-End equipment is "catch-all" phrase for equipment that is used in front end manufacturing but not in wafer processing. It includes: Wafer Manufacturing equipment, Photomask/Reticle equipment and Fabrication Facility equipment.
There are two main purposes for assembling the bare semiconductor device into a package. First, the package provides mechanical and environmental protection to the bare die. Second, the package provides and electrical connection between the die and the printed circuit board (PCB). Nowadays, there are tremendous number of package types, form factors, and process techniques used in assembly packaging.
= are only available to SEMI Members
SEMI members: Please create a profile to access resources. If you already have a profile, please log-in with your credentials.
Not a SEMI member? Click here to learn more about SEMI Membership