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장비 시장


반도체 장비는 보통 공장이라고 하는 제조 시설에 있는 통합 장비 제조(I.C.s)에 있어서 중요한 역할을 합니다. 반도체 장치의 종류 또는 카테고리는 다음과 같습니다.

  • 웨이퍼 제조/웨이퍼 가공
  • 공장 설비 장비
  • 마스크/레티클 기기 
  • 표면 조정/클리닝 및 드라이
  • 처리 장비 저항
  • 노출 및 기록
  • 에치 기기
  • 스퍼터 장비
  • 열처리 장비
  • 화학기계 평탄화(CMP)
  • 화학 증기 증착(CVD)
  • 검사측정
  • 어셈블리 및 패키징 장비
  • SOC&논리시험장비
  • 메모리 시험 장비
  • 취급자
  • 프로브 기기
  • 기타 시험관련 장비



SEMI의 업계조사 및 통계에서는 다음과 같은 이점을 제공하는 시장데이터를 제공합니다:

  • 보다 신속한 정보 제공으로 경쟁 우위 확보
  • 비즈니스 계획, 전략적 계획, 및 예측에 관한 보다 빈번한 조언
  • 이순환형 산업에 대한 더 나은 이해



Semiconductor Manufacturing Monitor

Historical data and forecast through the next quarter covering the semiconductor manufacturing industry from materials...
Published Quarterly (Dec, Mar, Jun, Sep)
$700 Member | $900 Non-member

Equipment Market Data Subscription (EMDS)

Monthly worldwide benchmark data and bi-annual forecast for the semiconductor equipment market
Set of monthly and bi-annual reports
$2,000 Member | $4,120 Non-member
Multi-user licenses are available

Historical Book-to-Bill Report (1991-2016) and Billings Report (2017-2019)

Historical data of North America-headquartered of semiconductor equipment
Updated Yearly
$800 Member | $1,350 Non-member
Multi-user licenses are available

Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Historical Report (1991-2019)

Historical Bookings and Billings data of global manufacturers of semiconductor equipment
Updated Yearly
$1,750 Member | $2,400 Non-member
Multi-user licenses are available


SEMI Industry Research and Statistics delivers powerful market data intelligence that enables you to:

- Stay ahead of your competition by being more quickly informed
- Obtain more frequent input for business planning, strategic planning and forecasting
- Get a better understanding of this cyclic industry


2020 North America Semiconductor Equipment Billings Report Release Dates

Equipment Forecast Definitions

Equipment Related Press Releases/Articles

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SEMI Equipment Brief: Test Equipment (PDF)

There are various types of electrical and reliability tests conducted at different stages of assembly and for different purposes once the wafer fabrication process is finished. Tests include die sort test on wafers, electrical and environmental testing, and burn-on on packaged devices.

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SEMI Equipment Brief: Wafer Fab Brief (PDF)

Semiconductor fabrication consists of a series of processes in which a device structure is manufactured by applying a series of layers onto a substrate, most commonly on silicon. This involves the deposition and removal of various thin film layers. The areas of the thin film that are to be deposited or removed are controlled through photolithography. Each deposition and removal process is generally followed by cleaning as well as inspection steps. 

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SEMI Equipment Brief: Other Front-End Equipment Brief (PDF)

Other Front-End equipment is "catch-all" phrase for equipment that is used in front end manufacturing but not in wafer processing. It includes: Wafer Manufacturing equipment, Photomask/Reticle equipment and Fabrication Facility equipment.

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SEMI Equipment Brief: Assembly and Packaging (PDF)

There are two main purposes for assembling the bare semiconductor device into a package. First, the package provides mechanical and environmental protection to the bare die. Second, the package provides and electrical connection between the die and the printed circuit board (PCB). Nowadays, there are tremendous number of package types, form factors, and process techniques used in assembly packaging. 

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