downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Group 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content

About the SEMI Billings Report

The SEMI Billings Report provides a first look at the billings trends for North American Headquartered Semiconductor Equipment Manufacturers. The three-month average global billings are a strong indicator for trends in the worldwide semiconductor industry. SEMI follows the protocol established by the U.S. Department of Commerce in publishing our figures only on a three-month average basis. We do this in order to smooth out the natural volatility in billings. This report is distributed monthly approximately three weeks after the close of each month. Categories covered include front-end (wafer processing/mask/reticle/wafer manufacturing/fab facilities) equipment and final manufacturing (assembly/packaging/test) equipment.

2020 North America Semiconductor Equipment Billings Report Release Dates

Important: Dates are subject to change; Report is released at 3:00 pm Pacific Time.

January 23 July 23
February 20 August 20
March 19 September 17
April 23 October 22
May 21 November 19
June 18 December 17

Link to Press Releases

Notice Regarding the Book-to-Bill Report

SEMI ceased publishing the monthly North America Book-to-Bill report in 2017. The December 2016 report and press release marked the last publication of bookings data.  The decision to discontinue the Book-to-Bill report was based on changes in reporting by some participants where the reporting of orders/bookings into the data collection program became an unnecessary component of their industry analysis.

SEMI continues to publish a monthly billings report and issue a a press release that compares month-to-month and year-over-year trends billings activity of equipment companies based in North America. Additional detailed billings data will also be available in the monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report that SEMI prepares in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings and bookings data by 24 equipment segments and by 7 end market regions. 

SEMI also tracks semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1000 fabs worldwide.

Additional Benchmarking Tools

The SEMI Market Information team provides tools to help you benchmark the industry.

World Fab Forecast
A comprehensive fab database containing over 1,000 records and details by fab. Includes forecast on a quarterly basis on capacity, construction and equipment spending, wafer size, and technology node. Click here for more information.

Materials Market Data Subscription
An excellent source of regional semiconductor materials data including fab materials and packaging materials from global companies on a quarterly basis. Includes a three-year forecast as well as current and historical revenue data. Click here for more information