semiconductor industry

Becoming a Certified B Corporation™ comes with many benefits, most of them extending beyond the walls of the company and into the hands of employees, community members, and industry partners. The designation makes the meticulous and rigorous process to certification well worth the endeavor. In 2021, Brewer Science announced that it’s the first company in the semiconductor industry to become a Certified B Corporation. Our journey to become a Certified B Corporation inspired us to share our top five reasons for meeting the high standards the designation sets for both environmental and social responsibility. 1. Pave a pathway for continuous improvement B Lab™, the certifying organization for B Corps, believes in continuous improvement, and B Corps must create an improvement plan to demonstrate the areas of social and environmental performance they focus on in the coming years. Brewer Science will hold B Corp certification for three years before submitting to a renewal process. In order to be recertified, a company must score higher on recertification than on the previous certification. The assessment evaluates all facets of the company, and it’s a learning process to help the company target and identify ways to improve business practices. Brewer Science has already identified improvement areas for the recertification. We’ve implemented several human resource initiatives that are not written into policy yet, such as flexible and expanded work options. Additionally, we have expanded our use of a cloud-based learning platform to provide employees with more training options and performance conversations held quarterly instead of annually. Brewer Science scored many points for community involvement and charitable giving. However, we are still expanding community engagement by supporting or donating to a new local organization each month. Brewer Science became Certified Employee-Owned in 2020, but since it was the first year of the ESOP and shares were not yet dispersed, B Lab didn’t fully recognize the program. 2. Share the values of your stakeholders In 2006, Brewer Science started externally reporting environmental, safety, and health performance every year through its annual Corporate Sustainability Report in order to be transparent with customers, suppliers, and employees. The impact of this report on all of our stakeholders motivated us to pursue other ways to promote sustainability and inclusion as a shared asset for our customers and suppliers. In 2016, Brewer Science became GreenCircle Certified Zero Waste to Landfill, an annual certification that we have achieved every year since then. Certified B Corporations are businesses that meet the highest standards of verified social and environmental performance, public transparency, and legal accountability to balance profit and purpose. The standard is highly respected standard, in part because of B Lab’s rigor with the questionnaire and certification process. Not only does becoming a B Corp show your stakeholders that you care, and that you are walking the walk, but it also allows you to show how much your company cares through your B Corp Impact Area. Brewer Science pursued the impact area of environmentally innovative manufacturing, a category that required detailed evidence of how Brewer Science manages the manufacturing waste and minimizes its carbon footprint. The B Impact Area Scores reflect the five areas where the business excels. 3. Be competitive in an industry that demands sustainability and social responsibility Sustainability is of growing importance in the semiconductor industry. A company can convey its commitment to sustainability by becoming a Certified B Corp. The B Impact Assessment requires benchmarking to other companies in the industry in areas of social concern, such as sustainability, inclusion, and diversity. While benchmarking was nearly impossible for Brewer Science since we rank high as an innovator in these areas, we were able to not only set the benchmark for ourselves, but other industry partners who pursue B Corp certification in the future through our collaboration with B Lab. 4. Connect with a community that cares Becoming a Certified B Corporation instantly opens companies up to a network of other B Corps across the world. The more than 4,000 B Corps in 150 industries and 74 countries enables makes it easy to network in the areas such as environmental initiatives, attracting top talent, and even just using business as a force for good in the semiconductor industry. Knowing that a business is actively trying to make a positive social change will help attract top talent looking to find meaning in their careers. B Corp certification validates a company’s employee-centric culture, which can help beef up employee retention. What’s more, an exclusive job posting board called B Work, sponsored in part by B Lab, helps connect job seekers with companies that share their values. Employees are connected through an exclusive B Corporation community platform, B Hive, enabling them to collaborate and share ideas with other B Corp employees. There is also a section within the B Hive where other B Corps can share benefits with other B Corp member employees. With such a diverse range of companies that are Certified B Corps, shared benefits can include anything from discounted clothing to travel deals or even free consultations. Additionally, employees of B Corporations can collaborate on local recycling events and community engagement. 5. The bottom line Companies don’t pursue the Certified B Corp designation to drive improvements to their bottom line. Yet by sharpening their focus on environmentally sustainable initiatives and diversity and inclusion, most companies could indirectly see significant return on investment. For example, having a pathway for continuous improvement, sharing the values of your stakeholders, being competitive in the industry, and connecting to clientele and employees that value social responsibility all enable your business to grow. In the long run, becoming certified as a B Corp can save a company money by giving companies access to community data that provides insights into cost-effective ways to be more sustainable. Plus, the certification process helps companies identify wasteful spending. For more information about Certified B Corporations, and to get started on your company's application, visit the Certified B Corporation website. Jessica Albright is a content marketer at Brewer Science, Inc.

As monolithic scaling slows down, the semiconductor industry is increasingly relying on advanced packaging technologies to extend Moore’s law through heterogeneous integration. Higher on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries are driving demand for advanced packaging technologies that address these issues but introduce challenges of their own such as efficient power delivery to all the different domains in a heterogeneous system. SEMI spoke with Kaladhar Radhakrishnan, Intel Fellow at Intel, about heterogeneous system integration trends and new developments in the semiconductor industry. Radhakrishnan shared his views ahead of his keynote at the SEMI Connecting Heterogeneous Systems Summit, 1-3 September 2021, an online event. Join the summit to meet experts from Intel and other key industry influencers. Registration is open. SEMI: What is driving the adoption of electronics and semiconductor devices nowadays and why is the development of new and innovative technologies important? Radhakrishnan: We are living in an increasingly data-driven world where devices have become an integral part of our lives. A recent study estimated that in the United States alone, 13.6 connected devices per capita consume an average of 300 gigabytes worth of data every month. In the workplace, COVID-19 has driven fundamental business changes that has sped up the adoption of digital technologies such as virtual conferencing, remote work, and e-commerce. Organizations are realizing that a high-quality video conference can be an adequate substitute for many in-person meetings. As a result, businesses are accelerating the digital transformation in order to adapt and thrive in this new environment. Five decades of sustained exponential growth in semiconductor performance has conditioned the average digital consumer to expect more from their devices. However, there are some headwinds ahead as traditional scaling slows down and power density rises. Because consumers and businesses are now generating data at a faster rate than they can consume it, technologists need to scale compute, storage, and bandwidth even faster to keep pace. Without investments in research and development of new and innovative technologies to address these challenges, the full potential of this data will go unrealized. SEMI: What forces are heightening the importance of heterogeneous system integration? What are the implications for increased on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries? Radhakrishnan: The semiconductor industry increased transistor density and scaled performance through classical Dennard scaling until the turn of the century. By then, the gate oxide thickness had scaled down to atomic dimensions and the exponential increase in sub-threshold leakage signaled the end of scaling through traditional methods. Since that time, the chip industry has been relying on innovations in transistor materials and structures such as high-k metal gate, strained silicon, and FinFETs to keep pace with Moore’s law. However, this alone will not be sufficient to continue scaling and the industry needs to explore other vectors to augment improvements in transistor technology. Heterogeneous integration through advanced packaging is one key technology that can help drive these gains. Technologies like Foveros can enable device density scaling by creating a 3D stack of multiple die using high-density interconnects. Heterogeneous integration enables chipmakers to move from a monolithic system designed on a single large chip to a heterogeneous system comprised of a number of smaller chiplets. The main benefit of using smaller chiplets is that they improve yield and enable application based customization of the foundry processes. However, if the disaggregation to smaller chiplets is not accompanied by an increase in on-package bandwidth, the power and performance penalties associated with chiplet-to-chiplet communication will hobble system performance. This is why advanced packaging technologies that improve die-to-die communication are key enablers for heterogeneous integration. SEMI: What are some of the key technology challenges in developing heterogeneous systems? Radhakrishnan: The obvious challenge that most people focus on is the need for improved on-package bandwidth. However, as we rely on 3D stacking to continue device scaling at the package level, it is important to comprehend power delivery and thermal challenges as well. Power to the top die has to be delivered through TSVs on the bottom die, which not only adds resistance but also reduces the useful area available on the bottom die. This problem is further exacerbated when we stack more than two die. Excessive noise on the power delivery network can cause timing issues that limit the maximum operating frequency of the transistor. Similarly, when we stack multiple die, we must take into account associated thermal challenges. For example, each interface of the multi-die stack adds thermal resistance, which makes it harder to cool the chips at the bottom. SEMI: What are some of the key global market trends that driving demand for heterogeneous and system-level integration? Radhakrishnan: The number of artificial intelligence (AI) and machine learning applications have grown dramatically due to their ability to solve highly complex problems across a wide range of segments. AI and machine learning models require more memory bandwidth and compute capabilities that are difficult to achieve without some form of heterogeneous integration. Another market trend driving demand for heterogeneous integration is the increasing reliance on custom hardware accelerators. To combat the slowdown in frequency scaling and single-core performance, we have moved to multi-core architectures by tackling the inherent parallelism in our workloads. However, Amdahl’s law tells us that such an approach will hit a bottleneck when we reach the limits of the serial portion of the workload. As these constraints slow the performance of general-purpose processors, the reliance on custom hardware accelerators to boost performance for specific workloads is growing. Heterogeneous integration at the system level with a combination of CPUs, GPUs, FPGAs and other accelerators can optimize system power and performance. SEMI: What solutions is Intel developing to address these market needs? Radhakrishnan: Intel is actively involved in the development of the industry ecosystem for heterogeneous integration. We have developed a number of innovative advanced packaging solutions such as the EMIB and Foveros that are used in products today. Intel is also developing the next generation of advanced packaging technologies, Foveros Omni and Foveros Direct, which will dramatically scale the IO density by using direct Cu-Cu bonding technology. Foveros Omni is a crucial building block technology to enable high-voltage power conversion on the package for efficient power delivery. Intel is uniquely positioned to predict the design needs for future systems and deploy its resources to develop the technology building blocks needed to continue performance scaling. Our IDM 2.0 strategy enables us to leverage our leadership in packaging technologies to design the best products and use the best IP to deliver leading products across a broad range of categories. SEMI: What do you expect from your participation at SEMI Connecting Heterogeneous Systems Summit? Radhakrishnan: I’m hoping to shed some light on some of the new technologies we have been developing at Intel to enable heterogeneous system integration. I also want to bring awareness to the power-related challenges we are facing with heterogeneous systems. I also look forward to listening to what other industry leaders have to say on the topic. Kaladhar Radhakrishnan is an Intel Fellow and a Power Delivery Architect with the Technology Development group at Intel. He plays a significant role in shaping and driving power delivery technologies for Intel microprocessors. His areas of expertise include integrated voltage regulators, advanced packaging and passives technologies. Kaladhar is a two-time recipient of the Intel Achievement Award, the highest Intel honor an individual or small team can receive. He has authored four book chapters, over 40 technical papers in peer-reviewed journals, and has been awarded 35 U.S. patents. He has also served as an adjunct professor at Arizona State University. Kaladhar joined Intel in 2000 soon after receiving his Ph.D. in Electrical Engineering from the University of Illinois at Urbana-Champaign. Serena Brischetto is senior manager of marketing and communications at SEMI Europe.

Spend any time with Ansys’ John Lee, Rich Goldman or Marc Swinnen and you’ll hear plenty of optimism about the semiconductor industry even though they tick off a long list of looming design challenges. The need for reliable and effective electronic systems, they emphasize, is great and runs through high tech, aerospace and defense, automotive, IoT and 5G with communications being a common denominator. The three are especially bullish these days on changing market dynamics brought on by systems companies building company-specific bespoke, or custom, silicon. These systems companies are building chips with a different perspective and a fresh look at silicon design, a move away from the more traditional segment-specific silicon due to much more complexity. Ansys, a member of the ESD Alliance, a SEMI Technology Community, is a 4,100-employee company with a comprehensive portfolio of multiphysics engineering simulation software for product design, testing and operation products and services. John, Rich, Marc and I focused on Ansys’ semiconductor and electronics segment for our conversation. Smith: When did you notice the move by systems companies to build their own chips? What drives this trend? Lee: The inflection point was about three years ago when hyperscale data center and system companies recognized they needed an enterprise system design platform. They are designing bespoke silicon, driven to do this for cost efficiencies and to avoid relying on outside suppliers. They also want differentiation based on their specific platform needs so they can optimize compute power to their specific needs. Smith: What is driving the trend for multiphysics experience to ensure effective and reliable electronic systems? Lee: The increasing need for multiphysics analysis is acute. The physics of 3D IC, for example, brings in mechanical engineering with the convergence of mechanical and electrical as 3D emerges at the intersection of IC and System. As a result, physics becomes a necessity to analyze the stability of the chip in the package. Goldman: As well, the move to stacked chips, 3D IC and wafer-on-wafer requires thermal, electromagnetic and mechanical analysis in addition to the traditional analysis for function, performance and power. They all need to be analyzed together, not serially. It becomes multiphysics, not multiple physics. Smith: Two distinctly different disciplines – multiple physics and multiphysics – are needed for semiconductor design. How are they different? Why the need now? Swinnen: Multiple physics refers to the sheer breadth of physics that is now needed to analyze from the IC up to the largest system whereas multiphysics refers to the capability to analyze several physical effects concurrently, accounting for their impact on the design and interactions between various physics. Multiphysics are necessary to analyze the full context of the system environment – from nanometers to kilometers – for multi-chip packaging, chip-to-package-to-silicon and systems with multi-domain guidance. Goldman: A self-driving car, as an illustration, includes AI systems-on-chip, solid-state sensors, infotainment systems and radar/lidar detectors that must all work in the rain, the heat and the bitter cold. Smith: Why are design groups being reorganized to include expertise in mechanical and electromagnetic issues? Swinnen: Complexity has exploded, driven by a long list of technical requirements and, perhaps, mischaracterization. Goldman: Just consider the system on chip, mischaracterized by the semiconductor industry. The chip is never a system by itself. Rather, it is a complex component in a larger system and must be analyzed in that context. 3D IC is where this comes together and forces a recognition of physics outside the traditional scope of SoC design. 3D IC chips are much closer together on the board and it takes multiphysics embedded into the workflow of semiconductor design, packaging, system design and 3D IC to ensure they work reliably and efficiently. Smith: What is the solution? Goldman: It’s clear a specialized digital thread is necessary to move disparate groups with expertise in systems, physics and silicon together. Today, these groups or disciplines might not exist in the same company, whether it be a foundry, fabless or outsourced semiconductor assembly and test (OSAT) company. Lee: In order to unify the entire system design environment, a cloud-based, open and extensible heterogenous enterprise compute platform is required. It is similar to the SaaS-based business model and known as Simulation-as-a-Service (also SaaS). While vertical integration of design groups is already taking place at leading system design houses, there have also been advances in electronic design tools. These are starting to offer more comprehensive multiphysics capabilities including thermal, fluid dynamics (CFD), mechanical stress and reliability analysis in a single analysis cockpit. Today’s system designers face two platform challenges: First, they need an environment that is open enough to accept analysis results from multiple sources so that they can be overlapped and cross-analyzed. Second, the design platform must have the capacity to handle the enormous amounts of data generated by the latest 3-nanometer chips and 3D IC systems, and this implies an intimate coupling to elastic cloud computing. The days of an engineer writing Perl scripts and handing it off to someone else are gone. We believe that the industry is responding to this challenge with a new generation of design platforms that a cloud-native, open and extensible to allow heterogenous enterprise design. We are definitely at an inflection point in electronic design today, but the electronic industry has faced these before an we are confident it will master these challenges as well. About Rich Goldman Rich Goldman is director of marketing for the Electronics and Semiconductor Business Unit of Ansys. He holds a Bachelor of Science degree from Syracuse University and an MBA and Master of Science degree in Engineering Management. Moscow Institute of Electronic Technology (MIET)’s first honorary professor, he is also the recipient of honorary PhD degrees from Russian-Armenian (Slavnoic) University and State Engineering University of Armenia for contributions to the advancement of Armenia’s high-tech education and economic ecosystem. Rich served on EDAC’s board of directors. About John Lee John Lee is general manager and vice president of the Ansys Electronics and Semiconductor Business Unit. Lee co-founded and served as CEO of Gear Design Solutions (now Ansys), developer of the first purpose-built big data platform for integrated circuit design. He cofounded two other startups (Mojave Design and Performance Signal Integrity), which successfully exited into companies now part of Synopsys. He holds undergraduate and graduate degrees from Carnegie Mellon University. About Marc Swinnen Marc Swinnen is director of product marketing for the Electronics and Semiconductor Division of Ansys. He holds Master degrees in Electronic Engineering and Industrial Management from KU Leuven, Belgium, as well as an MBA from San Jose State University. About Bob Smith Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community. He is responsible for the management and operations of the ESD Alliance, an international association of companies providing goods and services throughout the semiconductor design ecosystem.

The state of Penang, nestled along the northwest coast of Peninsular Malaysia, needs no introduction in the global electronics manufacturing sector. Despite its diminutive stature with just over 1,000 square kilometers of land area and a 1.8 million-strong population, Penang commanded an estimated 5% of global semiconductor exports in 2019, according to data compiled from the Department of Statistics Malaysia (DOSM) and UN Comtrade. The State’s transformation, from a traditional seaport economy into the Silicon Valley of the East, began in the 1970s, when the establishment of Malaysia’s first free trade zone in the State drew key investments from eight Multinational Corporations (MNCs). These pioneering investors – Intel Corporation, Hewlett Packard (now Keysight Technologies and Agilent Technologies), Robert Bosch, AMD, Litronix (now Osram Opto Semiconductors), Hitachi (now Renesas), Clarion and National Semiconductor[1] – sparked the development of a robust ecosystem of ancillary industries, which formed a foundation for the State’s rise as a prominent, offsite manufacturing hub. Today, Penang houses more than 350 MNCs that are supported by over 3,000 manufacturing-related SMEs. As Penang flourished as a vibrant, regional E E manufacturing hub, the local talent pool steadily accumulated a wealth of business intelligence and technical experience, enabling the robust supply chain to evolve in tandem with technology megatrends. This, in turn, enabled the State to focus on pursuing investments that have propelled the industry up the value chain, away from its beginnings as a low-cost manufacturing hub. Consequently, Penang has seen a proliferation of upstream technology-related investments in high value-added functions in recent years, ranging from research and development (R D), design and knowledge-based solutions, and downstream advanced manufacturing and testing to global business service (GBS) and Centre of Excellence (CoE) activities. Penang’s growing significance in the global E E value chain is demonstrated by its steady and resilient export performance in recent years. From 2014 to 2019, the State’s E E exports grew at a compounded annual rate (CAGR) of 12% to reach RM210 billion (US$51 billion). It has emerged as a hub for professional, scientific and controlling instruments (including medical technology), with exports of these products growing at a 5-year CAGR of 15% to reach RM23 billion (US$6 billion) in 2019. E E products, alongside professional, scientific and controlling instruments, collectively contributed between 77% and 82% of Penang’s total annual exports since 2014, and accounted for 50% of Malaysia’s exports in these two segments during the period. More impressively, despite the disruptions from the COVID-19 pandemic, Penang’s total exports continued to rise in 2020, growing 7% year-on-year to RM310 billion (US$75 billion), and a further 14% year-on-year in January and February 2021, driven by strong global demand for semiconductors. Shaping up as the destination of choice for advanced manufacturing investments As part of efforts to move Penang’s industry up the value chain, the State government has placed emphasis on attracting companies with strong commitments in implementing Industry 4.0 and sustainable investing. These efforts have yielded positive results, with the state having gained traction as a hub for advanced manufacturing investments. This is evidenced by the rising trend in investments per new job creation, which saw a six-fold jump from 2012 to 2020, as well as the number of global heavyweights announcing new investments as well as expansions of existing facilities in the State in 2019 and 2020. Penang attracted RM31 billion (US$7.5 billion) in approved direct manufacturing investment inflows in 2019 and 2020, 88% of which involved investments into the E E, equipment and medical technology industries. Prominent new investments included those from Lam Research, Bosch Group, Ultra Clean Holdings, Dexcom as well as Smith+Nephew. Together with planned expansions by a number of existing MNCs in Penang, these new investments, which are on track to commence operations between 2021 and 2023, are poised to bring Penang’s industry to greater heights and further integrate the State into the global value chain. Recent Notable Direct Manufacturing Investments in Penang Source: InvestPenang and respective companies Penang’s conducive business environment nurtures successful homegrown technology companies Penang’s conducive business environment has not only proven successful in attracting foreign direct investments (FDIs), but also successfully nurtured local E E success stories of locally employed engineers turned technopreneurs, who have founded and built companies that have successfully grown to become internationally renowned in their own right. These homegrown E E companies play crucial roles in the ecosystem, particularly in the areas of automated test equipment (ATE), automation, outsourced semiconductor assembly and testing (OSAT) services, electronics manufacturing services (EMS), precision engineering and tooling. The past five years have also seen the emergence of young, fast-growing Penang-based companies such as Experior, Oppstar Technology and Skyechip, which provide IC design and IC test design services to MNC clients globally. Public-private partnerships cultivate Penang’s talent development roadmap The state is cognisant that the development of a robust and skilled talent pool is imperative to support the growth of strategic industries in Penang. Strong public-private partnerships with concerted efforts in supporting talent development are key to Penang’s continued success. Toward this end, the State government has backed Penang Skills Development Centre’s (PSDC) industry-led training and education efforts, which have helped train over 200,000 of workers to support the industry’s needs since 1989. The State has also coordinated collaboration for industries to provide input to local institutions of higher learning on the relevance of the institutions’ courses, and rallied the industry to support State-run scholarships (Penang Future Foundation) and STEM initiatives. Holistic initiatives to make Penang a world-class investment destination for global frontier companies The dynamics of the global value chain, especially for the technology sector, have evolved rapidly since 2018, particularly amid the complex confluence of trade protectionism, COVID-19 pandemic-driven issues and disruptive technologies. The State government believes that strong, geographically localised industry clusters could help companies mitigate the risks of supply chain disruptions, in addition to improving companies’ time-to-market at a lower cost. To further increase Penang’s attractiveness for high quality investments, the State is focusing on three key strategies: Extending its competitive edge in advanced manufacturing, further strengthening Penang’s industry clusters, which include expediting SMEs’ Industry 4.0 transformation journey, and nurturing more homegrown companies to penetrate the global supply chain Embarking on a continuous drive to develop and recruit talent to the State, as well as cultivate the younger generation’s interest in STEM Enhancing Penang’s liveability with a strong focus on making Penang a smart and green city The State government is committed to continue developing Penang in a holistic manner, with the aim of creating a vibrant business and investment destination with a robust and sustainable economy and high standard of living, creating a conducive environment to “work, live, learn, play and invest.” About InvestPenang InvestPenang is the Penang State Government’s principal agency for promotion of investment. Its objectives are to develop and sustain Penang’s economy by enhancing and continuously supporting business activities in the State through foreign and local investments, including spawning viable new growth centres. To realize its objectives, InvestPenang also runs initiatives like the SMART Penang Centre (providing assistance to SMEs), Penang CAT Centre (for talent attraction and retention) and i4.0 seed fund (a catalyst for the start-up ecosystem). For more information, contact [email protected]. InvestPenang also works closely with various industry associations, including SEMI, to promote Penang’s supply chain and E E ecosystem. InvestPenang is delighted to have collaborated with SEMI on numerous occasions since 2015 and endeavours to sustain the partnership in the years to come, including for the SEMICON SEA 2022 exposition to be held in Penang. [1] No longer present in Penang following a corporate M A exercise.

Understanding the significance of a B Corp™ comes down to measuring the success of a company in more than profits and ROI. Can global impact, sustainability, and social justice deliver value to stakeholders too? At Brewer Science, we boldly answered, “yes!” and launched our journey to becoming a Certified B Corporation™. A B Corp is a for-profit, corporate entity that seeks to positively impact society, the community, and the environment, in addition to generating profit. The concept is catching on. Today, there’s a worldwide network of almost 4,000 Certified B Corporations across 150 different industries and 74 countries. In May 2021, Brewer Science announced that we are the first company in the semiconductor industry to become a Certified B Corporation. As a chip industry trailblazer for this certification, Brewer Science wanted to share a little about its journey and answer questions often posed by its suppliers, customers, and competitors: Why would a company go through the exhaustive auditing process, how does it work, who does it involve, and what comes next? Why did Brewer Science seek to become a Certified B Corporation? Certified B Corporations are the forefront of a growing global movement of people using business as a force for good™. Certification demonstrates a spirited commitment to high standards of social and environmental performance, transparency, and accountability. “Certified B Corporation standards align with our mission of being a company of the people, by the technology, for the customer, to achieve fulfillment,” said Dr. Terry Brewer, Founder and CEO of Brewer Science. “Becoming a Certified B Corporation exemplifies our commitment to our mission to continuously evolve our global footprint to the benefit of our employees, community, and customers, adding unexpected value throughout the world.” Certified B Corporations are held accountable for environmentally friendly business practices, being inclusive, and promoting local businesses. Besides providing a social benefit to our suppliers, customers, and employees, the certification also gives Brewer Science extensive opportunities to grow the business in collaboration with other mission-driven companies and people. For example, as Certified B Corporations, companies can attend the B Climate Collective and work synergistically with other B Corp companies to advocate for social change. How did we become a B Corp? Brewer Science completed a meticulous assessment process conducted by B Lab™, which examined over 170 factors in reviewing Brewer Science’s customers and vendors, record of inclusion, community involvement, corporate governance, and environmental impact. B Lab also analyzed average employee tenure, charitable giving, energy savings plan, recycling policies, employee volunteer service, and employee upward mobility. The process of becoming a B Corp begins with a self-assessment that the company’s Board of Directors must certify and ends with a 90-minute review call during which B Lab reviews the company’s responses and the company presents supporting evidence. The entire process is rigorous, with the company winning and losing points based on various criteria. These points are factored into weighing its strength as a candidate, and also in identifying opportunities where the company can improve. B Corp status is granted when the company earns at least 80 out of 200 points. But, this is just the starting point of an ongoing process of growth and improvement to uphold the values of the B Corp into the future. The assessment is more than a scorecard. It’s a thorough inspection of every facet of the company and helps guide it in making changes, since every question in the B Impact Assessment must be supported by an explanation and real-life example. A key part of the certification requires choosing a Business Impact Area, which requires the company to prevent evidence of processes it has implemented to influence that area. This component counts for 29 of the 80 points required to achieve Certified B Corporation status. Brewer Science pursued the impact area of environmentally innovative manufacturing, requiring us to provide detailed evidence of how we manage waste in manufacturing and minimize our carbon footprint. We earned an Overall B Impact Score of 88.7. Brewer Science also addressed other areas in the B Impact Assessment such as our human resource initiatives, community involvement, commitment to helping underserved communities, and seeking minority-owned businesses–just to name a few. The assessment incudes the five B Impact areas where Brewer Science scored the highest. Who was involved in the B Corp process? Brewer Science assembled an internal B Corp task force team of directors from departments across the company to provide a cohesive and complete view of the company – a step that was necessary for us to meet the requirements of B Lab’s extensive auditing of the company. B Lab encourages the use of an outside consultant that serves as a liaison between the company and B Lab. Brewer Science’s internal B Corp task force team held bi-monthly meetings with its consultant for nearly a year to answer the hundreds of questions in the questionnaire and gather evidence to corroborate each claim. “It’s a very extensive, but very rewarding process,” said Karen Brown, Project Manager at Brewer Science, also known as the B Keeper by B Lab since she led the certification process within the company. "B Lab is very thorough with the process. It is detailed with what it means and what the questions stand for. It is firm with its requests to ensure that the certification is taken seriously.” What’s next on Brewer Science’s B Corp Journey? Brewer Science’s B Corp certification is valid for three years, at which we point we will apply for renewal – a process that will require us to score even higher than on the previous certification. B Lab stresses continuous improvement, and B Corps must create an improvement plan that spells out areas they will enhance in the coming years. Brewer Science has already identified improvement areas for the recertification. Several of our new human resources initiatives – such as flexible and expanded work options – have not yet been committed to policy. Additionally, we have expanded our use of a cloud-based learning platform to increase training options for employees and hold performance conversations quarterly instead of annually. As part of the assessment, Brewer Science won points for community involvement and charitable giving. However, we are expanding our community engagement by providing employees with a monthly charity or cause to support. Brewer Science became a Certified Employee-Owned company last year. Since 2020 marked the launch of our employee stock ownership plan (ESOP) and shares had not yet been dispersed, B Lab didn’t fully recognize the program. These are just a few examples of how we plan to earn more points during the recertification. At Brewer Science, we hope we can inspire other industry leaders to apply for certification. For more information about Certified B Corporations, and to get started on your company's application, visit the Certified B Corporation website. Jessica Albright is a content marketer at Brewer Science, Inc.

U.S. consumers are flush with cash, the American economy is hurtling back from the depths of the COVID-19 pandemic, and the semiconductor industry is flying high on skyrocketing chip demand, with chip equities soaring since the initial outbreak in early 2020 as virus outbreaks worldwide supercharged demand for the digitization of everything from factories to home offices. “Wow, what a difference a year makes,” said Jennie Raubacher, Global Head of Semiconductor Electronics Investment Banking at Wells Fargo, speaking at a recent SEMI webinar. The two rounds of government stimulus payments in 2020 and 2021 gave many U.S. households the safety net to withstand the heaviest blows dealt by the COVID-19 pandemic and stoked consumer spending that has helped lift a hobbled economy. Durable goods spending in the U.S. has also seen a sharp rebound, surging more than 60% from its April 2020 trough, Raubacher said. The twin forces have driven a blistering U.S. economic recovery after GDP shrunk about 10% by the second quarter of 2020 only to bounce back in the first quarter of this year to roughly $19 trillion, regaining the lost ground to match the GDP charted at the end of 2019. With the U.S. economy continuing to gain steam, inflation has, as expected, edged higher, with price increases particularly acute in used vehicle and lumber markets. Despite surging prices, Wells Fargo sees inflation moderating as durable goods demand slows, easing pressure on interest rates, Raubacher said. Equity Valuations at Record Highs Heady semiconductor stock prices are not new. Over the past 15 years, equity prices of chip companies in the S P 500 have grown more than 460%, outpacing the 230% jump in value of the S P 500 index overall, Raubacher said. And chip stocks continue to shine. Since early 2020, when the spread of COVID-19 hit its rapid clip, the recognition of the growing importance of chips to economies around the world has exploded. That dynamic joined secular technology trends including autonomous driving development, industrial and factory automation, 5G infrastructure buildouts, data center expansions, and smart city and smart home innovation fueled by the Internet of Things (IoT) as key drivers of semiconductor stock valuations. With its price/earnings (PE) ratio now at more than 21x, the S P 500 is well above its historical average of 15x PE. “The S P 500 valuation is at record high any way you look at it, and valuation multiples across the board, currently at 3x Next Twelve Months revenue, have increased dramatically from historical averages,” Raubacher said. Semiconductor stock valuations are on similar trajectory, with the SOXX index now at 15x Next Twelve Months EBITDA (earnings before interest, taxes, depreciation and amortization). “While semiconductor stocks may seem highly valued compared to historical levels, the chip industry has grown faster and expanded profitability by a wider margin than S P 500 companies,” Raubacher said. With that differential, “semiconductor equities are not as expensive as they may seem at first glance.” Earnings expansion and valuation multiple increases for the chip industry over the past 15 years have translated into a more than 500% jump in market capitalization, compared to a 300% increase for the S P 500 excluding chip companies, she said. Chip company revenue growth in the first quarter of 2021 was predictably low due to seasonality, dipping 2.4%, though dropped less than the historical average, Raubacher said. Second-quarter revenue growth for the industry is expected to hew to the historical average of 6%. Semiconductor growth forecasts by market analysts for 2021 range widely from 6% to 17% year-over-year, she added. Chip Companies Raise Capital at Record Pace In 2020 and 2021, semiconductor companies have raised an unprecedented $82 billion in capital to finance maturing debt and acquisitions, a wave that will “likely catalyze further consolidation in the sector,” Raubacher said. None of the financing has stemmed from liquidity crunches. Since Raubacher joined Wells Fargo 10 years ago to lead its semiconductor practice, the group has executed more than 175 transactions including $40 billion in mergers and acquisitions and $360 billion of financing for its semiconductor industry clients. “With a strong macroeconomic backdrop and demand environment, relatively low interest rates, semiconductor companies showing strong business fundamentals and robust valuations, we expect a pickup in M A activity,” she said. Growth Forecast Across Most Semiconductor Applications The next four years will see the chip industry grow across most applications including wireless communications, consumer electronics, transportation and medical. Automotive and industrial/aerospace will lead the way, expanding at an expected compounded annual growth rate of 14% and 10%, respectively, from 2020 to 2025 to “drive a significant portion of the TAM expansion during that period,” Raubacher said. Across all applications, the semiconductor industry is expected to grow at a 6.8% CAGR from 2020 through 2025, adding $183 billion in revenue by the end of the forecast period, she said. ESG Rises in Importance For their part, investors now focus on more than pure business performance when valuing individual companies. The ability of businesses to reduce their carbon footprint, promote workplace diversity and take other steps to serve the greater good as part of Environmental, Social and Governance (ESG) programs are carrying more weight in valuation models. “Investors are paying more and more attention to ESG initiatives and targets,” Raubacher said. “On the debt side, we’re seeing things like green bonds and interest rate reductions tied to ESG targets. Only a few semiconductor companies have incorporated ESG measures into their financing, so it’s still early days. It really comes down to the metrics you can track in your companies and the goals and targets you can commit to. It will be a very company-specific approach rather than an industry standard.” In the chip industry, Raubacher noted that ESG targets are geared not only to manufacturing equipment and processes in fabs and other semiconductor facilities throughout the supply chain, but increasingly also to chips themselves. As technology innovation continues to spur the development of chips to power more electronics for consumers and businesses, their proliferation comes at a cost: greater energy consumption. The upshot is that semiconductor makers are becoming more focused than ever on power-efficient designs to bolster their ESG initiatives, Raubacher said. Many semiconductor players across the supply chain are reducing their carbon footprint by switching to energy-saving equipment and reducing water waste, Raubacher said. At the same time, more semiconductor executives are recognizing the rising importance of highlighting corporate achievements across all aspects of ESG. More Governments See Vital Importance of Semiconductors As shelter-in-place orders took hold in countries worldwide after the initial COVID-19 outbreak, work-from-home offices, online shopping, virtual classes and remote doctor’s visits became the norm. The electronics at the heart of this connectivity – born of both necessity and convenience – and the chips that power them took on outsized importance around the world. Geopolitical skirmishes intensified and supply chains across the semiconductor industry were reimagined and redrawn. Governments jockeyed for advantage in the race to build new semiconductor manufacturing facilities and upped their chip investments. An acute chip shortage that started in the automotive industry and quickly spread to other sectors magnified just how pervasive and vital semiconductors had become in making the world go round. “There’s no question that the semiconductor industry is vitally important to global and national economies as governments around the world now recognize its strategic importance,” Raubacher said. That puts the industry in an even stronger position to help lay the regulatory groundwork for its own future. “There’s a unique opportunity for semiconductor industry executives to shape the public policies that could impact the direction of the industry for the next 30 years,” she said. More than 750 people attended the June 2nd webinar, Surging Chip Demand, Digital Transformation, and the Pandemic – What’s Next?, sponsored by SEMI members Brooks Automation, Hitachi, JECT, KLA and TEL. Sven Smit of McKinsey Company also delivered his talk Leading in COVID-19 Exit at the event.

When COVID-19 hit the semiconductor industry, SEMI members were confronted with new hurdles to keeping their employees safe and their operations running uninterrupted. We quickly assisted our global membership around the globe by providing a forum for collecting member insights on best practices for operating and safety procedures, supply chain issues and sentiments on business impact and recovery. That forum took the form of surveys we launched in March 2020. We shared the results with the larger SEMI member community to help them cope with the evolving impacts of the pandemic on their businesses. Following is a summary of our 4th survey, issued last month. Regional and Sector Representation Nearly 40% of our respondents represented companies headquartered in North America. Of the respondents, 10% each were from companies headquartered in Taiwan and China; 5% from Korea, 13% from Japan and 20% from European and Middle Eastern members. The largest share of respondents – 40% – develop equipment for semiconductor fabrication, assembly, and test; 21% supply materials to the microelectronics industry; 14% are device makers; 6% supply software and design services; and 3% are OSATs, EMS suppliers or ODMs. Measures Member Are Taking to Continue Operations The May survey found that almost no companies ceased production for any significant length of time. In order to continue operations, companies instituted social distancing and masking requirements, temperature checks, schedule changes, and some contact tracing, all to varying degrees, as shown in Figure 1. In addition, several companies implemented some combination of mandatory testing, bump sensors, air purification and site capacity limits and sequestered foreign workers in separate housing for required quarantines after travelling. Figure 1 All of these measures are routinely discussed during the regular SEMI EHSS COVID-19 Working Group calls. That group consists of facilities, HR managers and others tasked with ensuring safety monitoring and compliance at member companies. Company Vaccination Policies With the pace of vaccine rollouts varying widely around the world, only 5% of respondents are requiring all workers to be vaccinated before returning to the office, and 12% have not yet considered a vaccine policy. The majority of companies are encouraging but not requiring employee vaccinations, and 26% leave the decision to the individual employees. Figure 2 North American companies constituted the majority of the required and encouraged vaccination categories. In Europe, companies fall into the employee decision or encouraged categories but none require vaccinations. Japanese companies primarily leave the vaccination decision to employees, while Chinese companies are split among the required, encouraged and employee decision categories. Clearly, these guidelines are not required by law in each region, but instead fall to employers and local policymakers. Member Readiness for Digital Transformation A solid majority of members reported they have invested in the adoption of digital transformation technologies and practices, though only about 14% expect to continue their digital investments in the coming year. Many respondents have deployed virtual meeting software and have implemented or plan to put in place virtual reality tools for remote diagnostics and predictive modeling for semiconductor manufacturing. Figure 3 Location by Functional Group in Returning Employees to Sites Not surprisingly, manufacturing and distribution staff that could work from home during the pandemic are back on site, and respondents signaled that R D and engineering groups will soon end their remote work, following by finance and procurement. Sales and marketing show the highest percentage of staff working remotely, with sales having the highest number remaining remote for some time to come. Figure 4 Resilience to Further Economic Uncertainty Of the 274 companies responding, 229, or 84%, feel more resilient in the face of further economic uncertainty after their response to COVID-19, though continuing supply chain issues and raw materials shortages ranked among their top concerns, as did rising customer demands, their ability to increase capacity utilization rates, and the increasing demands on employees and facilities overall. Figure 5 Many thanks to all survey respondents over the past year! We’ll keep you up to date on results of future surveys. For more details on the SEMI EHSS COVID-19 Working Group calls, visit the SEMI COVID Response Site. To watch the recording of our most recent CEO Webinar – Surging Chip Demand, Digital Transformation, and the Pandemic – What’s Next? – click here. More than 750 people attended the June 2nd webinar sponsored by SEMI members Brooks Automation, Hitachi, JCET, KLA and TEL. Heidi Hoffman is senior director of Technology Communities marketing at SEMI.

Traditionally, defect classification is done manually by operators or using Automated Optical Inspection (AOI) machines, often leading to classification inconsistencies. Also, rules-based AOIs may at times be unable to fully satisfy project requirements due to the rigidity of inspection recipes. SixSense – Breaking the Status Quo with Artificial Intelligence Enter SixSense, an AI-powered defect classification software platform that has been making breakthroughs in defect detection and classification for semiconductors to make manufacturing smarter and more efficient. Founded in 2018, SixSense has already amassed a wealth of experience and chalked up a number of successes such as automating the manual image classification process, reducing manufacturing false rejects, and capturing escapees. Infineon Technologies and GlobalFoundries were amongst the early adopters of SixSense’s platform: classifAI. With Infineon, classifAI has allowed over-rejection rates to be precisely quantified. classifAI – Simple UI, Easy Usage, Powerful Models As a UI-based assistive software platform, classifAI, SixSense’s automated defect classification platform is built with the defect and yield engineer in mind. SixSense takes care of all the back-end complexities – such as coding, algorithm modelling and deployment – to enable end users to get started and use the platform with a simple GUI. The simplified end-to-end AI pipeline offered on the platform includes data labelling to make data AI-ready, model training, and model testing. Ultimately, models are deployed on the production floor for 24/7 inferencing of hundreds of millions of images every year, at scale, across processes, tools and sites. Machine learning models built by the SixSense team have seen strong results, with model accuracy of up to 98% in certain use cases. Track Record of delighting IDMs, Foundries and OSAT Customers SixSense has consistently solved visual inspection problems and enabled the success of IDMs, foundries and OSATs since its inception. The AI technology has helped a range of customers across 100mm-300mm wafer standards, both pure silicon and compound wafers, and caters to specific end-use market requirements such as RF and automotive. Partnerships between startups and established manufacturers are key to actualizing the value of AI in manufacturing. “Our collaboration with AI startup SixSense has enabled us to explore opportunities in yield gain, improving cycle time, and real-time monitoring of process shifts,” said Dato’ Tan Soo Hee, Executive Vice President, Global Backend Operations at Infineon Technologies Asia Pacific. “SixSense has been very attentive to the needs of our engineering team, addressing project requirements using a customer-first approach evident in the design of the intuitive software platform,” said Melvyn Peh, Principal Engineer, Automation-Scan-Pack, Infineon Technologies Asia Pacific. The intelligent annotation module is one of many offered by SixSense, which uses AI to train AI and accelerate the data annotation process by focusing on the semiconductor-specific requirements. Another valuable module in classifAI is advanced analytics that capture the heatmap for defect distribution on the images. Images are stacked on top of each other, with the location of defects aggregated to provide the defect heatmap. Through this, systematic failure patterns were identified that allowed defect engineers to zero in on key sources of failure and assist in root-cause analysis. Infrastructure – Scale Fast, Adapt Quickly, Accelerate Value Creation In the dynamic world of technology, machine learning and AI projects must meet changing infrastructure demands. A cloud-first approach is often favored for the plethora of benefits it offers. “We’re looking forward to a great partnership with SixSense, treading together hand in hand exploring fresh ideas and possibilities,” said Manju Jalali, Vice President of digital manufacturing at GlobalFoundries, who oversees the company-wide roll out of classifAI. For use cases where on-premise deployments are preferred, SixSense offers such options for infrastructure integration, satisfying all possible infrastructure requirements in the market. Contributing to a vibrant innovation ecosystem SixSense was mentioned by Singapore’s Deputy Prime Minister Heng Swee Keat during an event that marked Infineon’s 50th anniversary in Singapore: “I am heartened that Infineon will be investing more than $27 million over three years on an AI initiative in Singapore. Under this initiative, Infineon Singapore will be partnering academia, industry, and local startup SixSense AI to develop new AI solutions and courses.” Explosive Growth of AI in Chip Manufacturing According to a McKinsey Company report, AI contribution to semiconductor company earnings is projected to rise to between $85 billion and $95 billion per year in the coming years. SixSense has been taking great strides in creating value for their semiconductor customers. “SixSense offers tremendous value in a high-growth vertical in the semiconductor industry, marrying the latest deep learning algorithm with the compute power of the cloud,” said Rajan Rajgopal, CEO of DenseLight Semiconductor. “This leads to faster root-cause analysis that helps reduce the cost of non-conformance and improve quality.” Dominic Teo is Enterprise Business Development Representative at SixSense. He can be reached at [email protected].

What does it mean to identify as LGBTQIA+ in the semiconductor industry? It’s an interesting question to ask, but a difficult one to answer. Because we live in a world in which cisgender heteronormity is assumed, it’s possible to self-identify as LGBTQIA+ without sharing that information publicly. Coworkers and managers might not even realize that their colleague or employee is gay, lesbian, transgender, non-binary or other. Unlike other minorities, notably people of color, LGBTQIA+ people may choose to keep their identities invisible.As I began outreach for this article, I recognized that some people might not want to expose a potential vulnerability to both their co-workers and a broader global audience of SEMI members, so I tried to make them feel more comfortable. I told them I’m a lesbian. I said that I’d send content for their review before publishing. But I quickly discovered that wasn’t enough, despite sweeping cultural and legal advances around LGBTQIA+ attitudes and identity. According to a 2020 Gallup Poll, 5.6% of U.S. adults now identify as LGBTQIA+, up from 4.5% just three years ago. In 2004, Massachusetts became the first U.S. state to legalize same-sex marriage, and in 2015, the U.S. Supreme Court made same-sex marriage legal in all 50 states. The semiconductor industry has been historically conservative. The times, however, are changing. Large chip companies such as AMD, Intel and Lam Research actively support diversity and inclusion efforts across minority groups, including LGBTQIA+, and that’s a good thing, but is it enough? And if not, what actions can SEMI members take to help LGBTQIA+ people in semiconductors feel safe enough to choose visibility?According to Antoinette Hamilton, global head of Inclusion and Diversity at Lam Research, more than 46% of LGBTQIA+ employees in the industry aren’t out in the workplace. That tells us there’s still work to be done, a challenge that Lam is embracing. With its Pride employee resource group (ERG) leading the way, partnerships with organizations such as PFLAG and Out Equal, and recruitment efforts made through organizations such as Out in Science, Technology, Engineering, and Mathematics (oSTEM), Lam has earned a score of 100 on the Human Rights Campaign Foundation’s Corporate Equality Index and was named one of the Best Places to Work for LGBTQ Equality.“At Lam, we understand the importance of empowering employees to bring their authentic self to work,” says Hamilton. “We believe when employees feel valued and included, each person can reach their full potential.”Back in 1992 when Intel paid to relocate Judi Goldstein, her partner and their son from New Jersey to Oregon, mainstream cultural attitudes toward gays and lesbians were very different. According to a June 1992 Gallup poll, only 48% of Americans thought that “gay or lesbian relations between consenting adults should be legal,” with 44% saying they should be illegal. A May 2020 Gallup poll recorded a dramatic shift in attitudes, with 72% affirming the legality of same-sex relations and only 24% opposed.By the late 1990s, Intel had extended domestic partner benefits to same-sex couples. “I registered my partner – now my wife – and our son, and realized that from then on, my whole family would have health insurance through Intel,” says Goldstein, who identifies as a gay woman and uses she/her pronouns. “Both relocating my family and providing family health coverage solidified my attachment to Intel, which was way ahead of other companies at the time.”By 1995, Goldstein became one of the first members of IGLOBE, Intel’s ERG for LGBTQ+ employees. Since that time, she’s observed further progress at Intel, first with the addition of gender identity and expression to Intel’s anti-harassment policy, and later with the inclusion of gender-neutral bathrooms at all major US sites. And advancement didn’t stop there.“We now have international IGLOBE chapters, a celebration of Pride Month in June, company support for the Equality Act and other legislation, a provision for transgender health benefits, and the launch of Self-ID efforts in 2017,” she says.From her start as software engineer more than 32 years ago to her current positions as director of the Open Source Audio and Security Engineering teams, Goldstein has played an instrumental role pioneering new technologies and mentoring other engineers at Intel – in addition to serving as a role model for LGBTQIA+ employees coming through the ranks. Now a grandmother with a five-year-old granddaughter, Goldstein lives in Oregon with her wife of more than 30 and two dogs. Location, Location, LocationAs social animals, we tend to value safe and welcoming places to live. When you’re LGBTQIA+, this may mean moving to an urban area that is more likely to embrace diverse orientations and cultures.After getting his master’s in astrophysics, Chuck Chung had a decision to make. Remain in the same field, which would limit his options on where to live, or get a doctorate in engineering, which would expand them.“In the ‘90s when I was making this choice, things were very different, and I knew that where I worked and lived would have a huge impact on how open I could be,” said Chung. “While I would have loved a career in astrophysics, I realized that engineering would be a more practical choice because I was more likely to find work in a city.”Both personally and professionally, engineering has proved a good choice for Chung. He’s lived in San Francisco and Silicon Valley for the past 18 years, where being out in the workplace is rarely an issue. “I compartmentalize my personal and professional lives when necessary, such as when business colleagues who are overseas talk about their families in casual conversation. Most of the time, though, my identity as a gay man is a non-issue, and I work for a company that really cares.”From his pioneering work in MEMS and genetic sequencing to his current focus on the next generation of microarchitectures at IBM, Chung has long thrived. Now, with a new book on MEMS Product Development – co-authored with two other Ph.D.’s, Alissa Fitzgerald and Carolyn White of A.M. Fitzgerald Associates – the best days of Chung’s career may still be ahead of him. He lives in the Bay area with his husband and their two children.Kunal Garg’s identity didn’t influence his career choices because when he started in semiconductors, he wasn’t out to himself or others. A few years into his engineering career at his former company, Garg realized his identity as a gay man at a time when the national discussion about same-sex marriage was at its apex – leading to some uncomfortable situations at work. “As some of my colleagues and managers openly debated same-sex marriage, they seemed oblivious to the fact that there were LGBTQIA+ people at work,” says Garg. “I knew then that I wanted to steer such conversations in a way that would feel safe and inviting for people like me, who work in this industry while being true to their identities.”Once he’d come out to his family and friends, particularly after he married his husband, Garg wasn’t willing to stay silent at work. “Although it took courage and internal struggle to come out to colleagues, my identity as a gay man wasn’t something I wanted to hide or deny anymore,” he says. “Some people laughed when I mentioned my ‘husband.’ The idea that their colleague, an engineer, an Indian immigrant, a man, could be gay and married to another guy was so foreign, it was almost laughable. Luckily, this didn’t stop me from being myself at work, and over time, these types of conversations became very rare.”Nonetheless, Garg looked around for ways to be part of the LGBTQIA+ engineering community. When he moved to AMD in Austin, he wanted to start with a clean slate. “When my manager called to invite me to join his team at AMD, I casually brought up the fact that my husband was going to need to start looking for a new job in Austin. And, very casually, he asked me what my husband did for a living, and we went on to discuss how Austin would be a great city for us to live in,” says Garg. “The fact that this was such a normal conversation was a big factor in my decision to join AMD.”Soon after starting as a design engineer at AMD, Garg found that LGBTQIA+ engineering community for which he’d been searching. He joined AMD’s Pride ERG, a group that he now chairs. “Being a part of this ERG has been transformational for me on a personal level and has allowed me to connect with my fellow engineers and people in my industry, beyond our mutual love for science and technology.”Become a change agentWhile some chip companies actively promote inclusion and diversity of LGBTQIA+ employees, others still have a long way to go. SEMI and the SEMI Foundation are uniquely positioned to help advance LGBTQIA+ equity issues in the microelectronics industry. "The SEMI Foundation is committed to promoting Diversity, Equity, and Inclusion (DEI) in our industry for the benefit of our workers and our member companies,” says Shari Liss, executive director of the SEMI Foundation. “We are designing programs for human resources departments, company leaders, and DEI allies to make the case for stronger DEI practices that will attract, retain, and promote LGBTQIA+ individuals and other underrepresented groups in our industry. We will soon publish SEMI's Roadmap to Diversity, Equity, and Inclusion and DEI Toolkit, which will contain tools to help companies strengthen their workplace cultures so everyone – including those that identify as LGBTQIA+ – will feel welcome, and will be able to do their best work."“If we want to truly see the semiconductor industry flourish on a global level, we need to push for equitable treatment of LGBTQIA+ and other minority employees,” says Garg. “SEMI can help by educating industry leaders, especially in countries outside North America and Europe, on how diversity and inclusion through policy are vital to their sustained productivity. These workshops and trainings should be data-driven to encourage companies to hire more LGBTQIA+ employees and to create policies that promote the well-being of all employees.”It’s not just at the company level or the industry association level that matters. Just as individuals are necessary change agents in proliferating greater equity among women and people of color, they’re also needed as allies of LGBTQIA+ people.“Like so many of us, I’d love to wave a magic wand to end discrimination based on gender identity or sexual orientation, but like any cultural shift, most change comes in small steps, not in giant leaps,” said Karen Lightman, executive director, Metro21: Smart Cities Institute – Carnegie Mellon University. “Fortunately, it’s easy to help make those small steps by becoming an ally to LGBTQIA+-identified people. When you see an injustice, don’t stay silent. Use your voice. There’s transformative power in that act alone. As one step, I’ve started using my pronouns when I introduce myself and now include them in my digital signature. It’s an easy way for me to express that I am an ally to LGBTQIA+-identified people.”Help us make the change. Use your voice. Get involved. Encourage your company to advocate for LGBTQIA+ inclusion and diversity.Maria Vetrano, principal of Vetrano Communications, is a PR consultant at SEMI Foundation.

As we move through Q2 of 2021, it seems that the world is finally approaching normalcy. But I don’t believe our lives and businesses will ever be the same. Travel is unlikely to return to the same level as pre-COVID-19 for many years. I’m sure many companies will establish tighter travel policies and budgets as virtual conferencing has proven to be beneficial and cost-effective. Patients and doctors who were skeptical of telemedicine are embracing it, and although it’s not perfect, it has filled a needed gap. Online learning essentially happened over a weekend and will now be part of many curriculums and programs. All of these elements have spurred our semiconductor industry into a super cycle. Demand for chips is leading to an increased demand for semiconductor equipment. Semiconductor capital equipment expenditures in 2020 surpassed $63 billion and are forecast to top $70 billion in 2021. The secondary equipment market typically makes up about 5% to 10% of that. Our inquiries have definitely increased this year. With this in mind, I’d like to share some thoughts for the remainder of the year. Storage of Chipmaking Equipment Not New The semiconductor industry has been experiencing an equipment shortage for some time. It is difficult for original equipment manufacturers (OEMs) to support such a large variety of products and technologies. Some companies use equipment for manufacturing 150mm, 200mm and 300mm wafers. Fabs still run 30-year-old technology on 150mm wafers while the latest technology is manufactured on 300mm wafers. We’ve also seen new technologies like silicon carbide (SiC) being developed on these smaller wafer sizes. Unfortunately, some OEMs stopped making 150mm and 200mm some time ago and have only recently jumped back into the market. These OEMs have had to balance technological advances, pricing, and manufacturing capacity to meet this demand since their primary focus is on 300mm equipment. Third-party refurbished equipment suppliers have also experienced an increase in demand over the last several years. We see it increasing at all technology levels over the next three to five years. This translates to increased equipment pricing for both new and used equipment, as well as increased lead times. Growing Demand for Legacy Tools Many electronic products we use and are familiar with don't require state-of-the-art technology. For instance, cellphones, electric vehicles, wearables, monitors and industrial products still contain many chips manufactured on 200mm wafers using 200mm equipment. There are still approximately 200 200mm fabs worldwide and this makes up about 25% of all wafer capacity regardless of wafer size. These fabs manufacture analog devices, MEMS products, power management ICs, RF devices, discrete devices and sensors. We have also seen an increase in lead times for 200mm equipment. Typical lead times of three to six months have increased in some cases to one year or more. This situation has created a dramatic increase in chip making equipment prices and we do not expect much relief there. Many OEMs transitioned to 300mm equipment prior to 2010. Revenue and profit margins are much higher for them on 300mm equipment. 200mm manufacturing was supported by many third parties for a while. However, in 2016 we saw a resurgence in 200mm equipment, and at that time many OEMs began jump-starting their supply chains. It took some time for them to develop new supply chains, upgrade technology and in some cases hire newly trained engineers to support these new tool sets. All this costs money, which is why we will continue to see an increase in new legacy equipment pricing. Because manufacturers and products may not be able to support these prices, we expect the robust third-party ecosystem to continue. SurplusGLOBAL's Response to this Demand One of the advantages we bring to the secondary equipment market is our ability to recycle technology. We continuously search for opportunities to purchase large packages of tools from companies that are transitioning technology nodes, moving from 200mm to 300mm wafer size or changing product lines. We spend approximately $65 million to $100 million each year on purchasing equipment and in some cases storing it for the right customer. For instance, a memory company may be changing technology nodes and no longer needs its equipment. This use to happen on a predictable schedule. Instead of scrapping that equipment, SurplusGLOBAL purchases and stores it. Sometimes we only need to store it for one month before relocating it. However, in many cases, we store it for one year or more. We may power it on at a later date if it is in good condition. In some cases, we work with an OEM or third party to have it refurbished and ready for a new customer. In response to the need for more secondary market equipment, we have opened up additional offices in Japan and Singapore to stay close to and better support our customers in those regions. Finally, our biggest and most recent endeavor is building our Semiconductor Equipment Cluster, which opens in July 2021. Learn more about the SurplusGLOBAL Semiconductor Equipment Cluster. Emerald Greig is executive vice president Americas at SurplusGLOBAL.