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Despite market saturation and stagnation saddling many business sectors, MEMS remains a shining star in the semiconductor industry. Opportunities in automotive, consumer electronics, mobile, medical are rising. What is supporting this industry growth? Who are the big players on the horizon?SEMI spoke with Dimitrios Damianos, Technology Market Analyst, Photonics, Sensing and Display division at Yole Développement, about MEMS market dynamics and future trends. Damianos shared his views ahead of his presentation at SEMI MEMS Imaging Sensors Summit, 25-27 September, 2019, at the WTC in Grenoble, France. Join us at the event to meet experts from Yole and many other key industry influencers. Registration is open.SEMI: MEMS and sensors is one of the healthiest industries not only in Europe but globally. Despite a global economic slowdown, the MEMS and sensors is still growing. What is fueling this growth?Damianos: The value of the global MEMS and sensor market will almost double from $48 billion in 2018 to $93 billion in 2024. In 2018 the MEMS and sensor market represented more than 10% of the total IC market, as more and more MEMS devices and sensors, such as MEMS, image sensors, and RF filters, are integrated in end products in consumer and automotive. In particular, the value of the MEMS-only market reached $11.6 billion in 2018, with consumer applications accounting for more than 60% of the total market. From 2019 to 2024 the MEMS market will grow 8.3% annually in value driven by pressure (for TPMS), RF (for V2X 5G communications), inertial (for ADAS) and future MEMS (such as pMUT for ultrasonic fingerprint) (Source: Status of the MEMS Industry report, Yole Développement, 2019). SEMI: How are MEMS shaping the semiconductor industry today? Damianos: MEMS have a make-smarter enabling capability. They are providing context for new applications and services in transportation, mobility, health, and security. Large companies such as Alibaba and Google are considering MEMS as a critical element in their business solution domains covering the upcoming smart home, smart campus, smart city and smart industry applications. MEMS have key features that correspond to these companies’ criteria for accuracy, small size (without performance degradation), low power and always on (e.g. microphones). Furthermore, with the advent of sensor fusion and edge computing, more sensor data can be processed, maximizing the qualitative and useful information about us and our surroundings. This has a huge impact in all markets, especially consumer.SEMI: MEMS foundries performed well thanks to the boom in industrial and medical applications. Who are the big players right now?Damianos: During 2018, all foundries saw their revenue increase. STMicroelectronics, Teledyne Dalsa, Silex, IMT, Micralyne and Philips Innovation Service are important MEMS foundry players that offer services for various MEMS devices used in medical and industrial markets, among others. On one hand, medical applications were driven mostly by microfluidics, flowmeters, pressure and inertial MEMS. On the other hand, industrial applications were driven by inkjet heads, microbolometers and pressure MEMS. The market prospect, however, is huge for RF MEMS and oscillators that will be used in next-generation 5G infrastructure. SEMI: What is the current status of MEMS for automotive applications? What are the related market drivers? Damianos: In automotive applications, accelerometers and pressure sensors still account for the lion’s share in units. Pressure sensors will grow at more than 8% with Tire Pressure Monitoring System (TPMS) implemented in Chinese vehicles in the near future. After 2019 and 2020, with the new Chinese standard, GB 2614, TPMS will become compulsory: 100% of all new vehicles will have TPMS. Also, automotive MEMS could grow quicker than the corresponding car market (currently at approximately 3%). The reason is a higher number of many different MEMS devices that are being integrated in cars, such as MEMS inertial measurement units (IMUs), TPMS, environmental MEMS for gas and particle monitoring in-cabin and microphones for hands-free voice commands.SEMI: After years of decline, the inkjet heads industry is growing again. What other segments are benefiting from MEMS technology applications? Can you name two examples?Damianos: RF MEMS (BAW filters) is also benefiting from applications in smartphones and will continue to benefit with the arrival of 5G. 5G means additional high frequency sub-6 GHz bands that can only be addressed by BAW filters. Moreover, new infrastructure approach using active antennas will create an expanding market for BAW.Another segment is inertial sensors. Inertial MEMS already have a high potential in wellness and fitness wearables and are gaining support for medical wearable applications to monitor patient activity, with the aim to prevent seizure in cases of epilepsy and other mental disorders. Compared to other types of sensors, MEMS is the golden technology for inertial sensors integrated into medical wearables. They are used for rehabilitation systems, activity trackers and assistance living/fall detection. Specifically, the IMU market will continue to grow for consumer and automotive applications as their price and form factor continue to shrink and they replace traditional standalone MEMS accelerometers and gyroscopes. However, the inertial sensor market will mostly grow for smartphone applications (mostly 6DOF, with 9DOF volumes being comparatively low).SEMI: Give us one prediction about the opportunities offered by the MEMS technology. Damianos: Sensor fusion is becoming more and more relevant since billions of MEMS sensors are made every year. The upcoming 5G revolution will make connectivity easier than ever, creating exponentially more data. To make these data meaningful, data processing is mandatory. Big data is an industry born of recent advancements in AI and machine learning, built upon and fueled by a wealth of new data from ever-expanding sensor applications. An upcoming trend is edge computing, with sensors and MEMS driving a new age of technology. Sensors are digitizing the human experience, and as the real and virtual worlds move closer together, it will be sensors that bind them, enabling new experiences for users everywhere. Running AI at the edge, coupled with sensor fusion, will open new applications for MEMS in audio, motion, olfactometry, and imaging. We also expect that new MEMS devices (microspeakers, ultrasonic fingerprint, pMUT) and piezoelectric MEMS technology could rejuvenate the MEMS market. SEMI: What are your expectations for SEMI MEMS Imaging Sensors Summit and why would you invite your peers to attend? Damianos: SEMI is organizing another very successful event, gathering experts from the Imaging and MEMS industries. We are at a turning point of innovation, with many technological advancements in AI, IoT, AR/VR, biometrics, and other areas where Imaging and MEMS technologies are paramount. Yole is excited to hear the thoughts of many high-profile experts on existing activities and future prospects within their organizations. If you are too, then it is an event that you shouldn’t miss!Dimitrios Damianos, Ph.D. is a Technology and Market Analyst in the Photonics, Sensing and Display division at Yole Développement (Yole). Damianos is a member of a Yole team that produces technology and market reports on the imaging industry including photonics and sensors. Damianos holds a MSc degree in Photonics from the University of Patras (Greece). After his research on theoretical and experimental quantum optics and laser light generation, Dimitrios pursued a Ph.D. in optical and electrical characterization of dielectric materials on silicon with applications in photovoltaics and image sensors, as well as SOI for microelectronics at Grenoble’s university (France). He has also authored and co-authored several scientific papers in international peer-reviewed journals. Learn more! Join the webinar on 5th September 2019. Registration is open! Serena Brischetto is a marketing and communications manager at SEMI Europe.

Flexible hybrid electronics (FHE) is innovation and modern technology at their best, giving rise to lighter, more malleable sensors that better conform to the human body while breeding new applications across a number of markets. For the semiconductor industry, FHE technology is enabling the development of a new generation of chips with the high performance, light weight, scalability, softness and flexibility usually seen in printed electronics. The technology is a boon to chipmakers, giving them novel ways to innovate for the Internet of Things (IoT) market.“The global printed electronics market is expected to garner 14.9% GAGR from 2018 to 2023,” said Stanley Wong, Director of Asia Business Development, Brewer Science, said in his presentation at FLEX Taiwan 2019 in late May. Representatives from industry, government, academia and research institutions gathered at the event in Taipei to explore flexible electronics innovation and growth opportunities.One shining star of FHE innovation is the foldable smartphone. So bright is the future of the bendable devices that not even recent trade tensions between the United States and China have dimmed prospects for the fledgling industry.“While the US-China trade war might slow down shipments of Huawei’s phones, the industry remains bullish on foldable phones,” said Stacy Wu, Principal Analyst at IHS Markit. “When the first generation of flexible AMOLED displays was launched in 2016, the rolling radius was 3mm and it could be folded 200,000 times.”For foldable phones, the 200,000 mark was a major milestone – the industry’s consensus standard for foldable phone display reliability. The industry reasoned that phones capable of being folded and unfolded 200,000 times without distorting color or images or the display itself cracking was a safe bet for consumer adoption. Earlier this year, both Samsung and Huawei announced foldable phones using the thin-film-display technology, ushering in the era of mass-market availability of the devices. Steve Chiu, Division Director for Electronics, IC package, Industrial Technology Research Institute (ITRI), believes that breakthroughs in the next generation of flexible AMOLED technology will allow thin films to be folded 100,000 times with a rolling radius up to 30mm and electric resistivity of less than 10 percent. The rolling radius of 30mm, 10 times higher than today’s phones, will give foldables a higher bending radius, while the lower electric resistivity will help maintain the brightness of the AMOLED panel after tens of thousands usages and extend the service life of foldable smartphones.The biggest challenge facing the foldable phone industry remains developing new materials that are flexible yet durable, stressed Francesco Lemmi, Business Development Director, Flexible Display, at DuPont. Today, the prevailing practice is to layer polyimide (PI) and hard coating on the display module. These stacked protective films replace traditional glass panels but present technical challenges related to impact resistance and the durability of the display as it is folded and unfolded over time.Smart clothing market is another hot market, with 33 percent global growth annually and revenue expected to reach US$ 3.26 billion in 2026. Yet for all the promise of smart clothing, reliability and accuracy remain a big challenge chiefly due to a lack of industry standards. Another gap is the unanswered question of whether consumers will embrace light and energy-efficient products.FLEX Taiwan 2019 speaker Satoshi Maeda of Toyobo is confident they will, pointing out that in the future consumers will enjoy a wide selection of comfortable smart clothing products and applications. The industry is still working to better understand how to develop human-machine interfaces, the essential seam between the human body (the outer layer of skin) and electronics, said Dr. Reinhold H. Dauskardt of Stanford University. Still, he sees great promise in an innovative somatosensory communications platform involving human skin. Human-computer interactions have historically been defined by human touch and vision (for example, typing at a computer keyboard and checking our monitor for the accuracy of our inputs). Dauskardt believes that, in the future, electrical impulses from the skin (conductance) will interact with signals from electronic devices to establish a more intimate human-machine interface that could be adapted one day to extend the visual and auditory abilities of humans.David M. Yeung, co-founder and CEO of Lionrock Batteries, pointed to another challenge in wearables: battery size. Today, large and heavy batteries account for 50 percent to 70 percent of the space in wearable devices, making many of the products too cumbersome to wear. Nanofiber lithium-ion batteries now under development can be as small as ultra-thin 2mm with a rolling radius of up to 20mm in radius and support for high electrical currents, significantly lightening their weight and improving comfort.Nardev Ramanathan, Lead Analyst, Digital Health and Wellness at Lux Research, predicts that, of all flexible electronics products, smart watches will win the largest market share and with the fastest rate of adoption. The devices will get a boost when they shrink as flexible batteries are integrated with the bands. The next wave of smart wearables will feature devices for exercise or medical monitoring. Already, FHE materials have led to advances in medical devices. One example is that smaller hearing aids are now possible thanks to flexible electronics and dressings used to promote skin regeneration, reduce wrinkles and remove scars.Gillian Ewers, VP Marketing at PragmatIC, sees fertile ground for FHE applications in IoT solutions. As FHE manufacturing costs drop, she believes IoT technologies will significantly deepen their penetration into a broad range of industries. For example, the number of electronic tags used in convenience stores worldwide will exceed 100 billion in 2025. Thinner than human hair and more durable than traditional wafers, these tags are expected to spawn a host of new business opportunities. FLEX Taiwan attracted more than 270 attendees from more than 30 fields including smart healthcare, e-paper, displays, system integration, automotive electronics, textiles, wearables, and avionics. On the first day of the event, industry, academia and research center representatives from the United States, Japan, China, Singapore and Taiwan gathered to discuss common goals on a range of FHE-related issues and deepen cross-regional cooperation. Like the FHE industry itself, SEMI-FlexTech remains focused on the future by strengthening cross-border cooperation to help manufacturers find killer applications and test profit-making models. For Taiwanese companies, the event will continue to provide insights on market trends, equipment, materials, advanced manufacturing technologies, product applications and new business opportunities, helping the organizations hone their competitive edge in the global market.Emmy Yi is a marketing specialist at SEMI Taiwan.

Shenyang is on an unwavering path to maturing its integrated circuit (IC) equipment manufacturing industry over the next few decades in response to the Made in China 2025 Strategy. Since the strategy’s introduction in 2015, the city, long a transportation and commercial hub of China's northeast, has built out a complete integrated circuit industrial chain integrating technical research and innovation, components and parts processing, and equipment manufacturing. Its ambition is to compete on the world stage.Shenyang has implemented policies and provided funding to support the development of its IC equipment and related industries to buttress the development of emerging industries. Speaking at the SEMI China Members Day 2019 in Shenyang, Zheng Guangwen, secretary-general of ICMTIA and Shenyang IC Equipment Industry Technology Innovation Strategic Alliance, said that the city, as a key IC equipment industry base in the upstream of China’s industrial chain, hopes to enter the international community in part by leveraging SEMI’s global platform. Zheng Guangwen, Secretary General, ICMTIA and Shenyang IC Equipment Industry Technology Innovation Strategic Alliance More than 150 representatives from member companies gathered at SEMI China Members Day 2019 to discuss China’s semiconductor industry investment and capital dynamics and semiconductor market trends. The event sought to promote stronger communication and interaction between the upstream and downstream of the semiconductor industry chain. The forum was co-sponsored by SEMI China and Shenyang Science and Technology Bureau and co-hosted by ICMTIA and Shenyang IC Equipment Industry Technology Innovation Strategic Alliance. Lung Chu, President of SEMI China Opening the event, Lung Chu, president of SEMI China, set stage for the discussion by noting that global semiconductor industry has been booming since 1957, reaching another record high of $470 billion in sales last year as it faced a critical juncture, with industry growth slowing in the first half of 2019. The slowdown was predictable and is temporary, a natural stage in the industry’s cyclicality. From a macro point of view, the development of advanced technology requires huge investment. There was an obvious gap in investment between enterprises, which often leads to the stronger become much stronger. Under these circumstances, it is very important for China to master key technologies and products during the process of catching up and surpassing. Each region should focus on its strengths.Enterprises should do their own business in a low-key way and keep a prudent and optimistic attitude. The number of SEMI China members has reached a new high. SEMI China is committed to becoming the best partner to realize China's semiconductor dreams. In promoting the development of global semiconductor industry and China's semiconductor industry, SEMI has continuously gathered strength and actively organized rich activities to promote the sustainable growth of Chinese semiconductor enterprises through international cooperation. Zhao Rigang, Director of SCTB, Shenyang Science and Technology Bureau Zhao Rigang, director of SCTB at Shenyang Science and Technology Bureau, pointed to the importance of SEMI’s pivotal role and global influence in cultivating cooperation between international and domestic industries including Shenyang’s IC sector. Speaking at the SEMI China Members Day 2019 in early June, Rigang said the growing importance of chips in China is a key catalyst for Shenyang’s rise as semiconductor sectors domestically and abroad invest heavily in a new generation of information technologies such as mobile Internet, cloud computing, big data, Internet of Things. Kang Jin, General Manager, SMIC Beijing For China’s semiconductor industry to flourish, the region must improve its IC supply capacity just as it has brought its PV industry to full maturation, said Kang Jin, general manager of SMIC Beijing. The key to developing China's integrated circuit industry, he said, lies in building a robust semiconductor supply chain. Zong Runfu, Chairman and General Manager, KINGSEMI Semiconductor Equipment Supply Chain DevelopmentLocalization has enabled KINGSEMI to optimize its technology design capabilities to produce high cost-performance equipment for greater competitive advantage, saidZong Runfu, chairman and general manager of KINGSEMI. While the localization rate of supply chain construction was over 50 percent, the localization rate for front-end equipment is still low. Zong Runfu said localization is imperative not only to lowering costs, but also to ameliorating the supply-guarantee rate, maintaining quality and shortening the delivery cycle. Russell Li, VP of Marketing and Business Development, WLCSP Packaging Solutions for 3D Active Sensing DevicesInternet of Things (IoT), artificial intelligence (AI), 5G and other technologies are starting to become a part of daily life as more sensors find their way into new retail stores and smartphones, a trend that will continue as autonomous transportation begins to take hold, said Russell Liu, VP of marketing and business development at WLCSP. The move to bring more human-like capabilities to technology is driving the implementation of perception function in devices, with passive sensors giving way to active sensors and machines translating the physical world into a 3D view through the eyes of a 3D camera. What’s more, the next generation of IoT devices will feature more integrated processors including signal processors, caches, sensors, photons, RF and MEMS, bringing the challenges of miniaturization to system integration. Liu said miniaturization will only be possible by developing advanced packaging technologies that enable highly integrated processors for mobile devices and intelligent automobiles. Wang Ronghua, VP of Technology, Dalian Xinguan Technology Getting Ready for GaN Power Electronics EraGaN offers excellent performance in optoelectronics, RF and power electronics and will coexist with and complement silicon devices for years to come, said Wang Ronghua, VP of Technology at Dalian Xinguan Technology. However, the industrialization of GaN power devices still faces technical challenges in application, reliability, packaging, epitaxy, device and process – all barriers to market adoption. To overcome these hurdles, GaN power devices must meet the reliability and cost-performance requirements of applications to which they are best suited.Ronghau said that GaN power devices, such as cascade and p-GaN enhanced devices, now support end products, proof that the era of gallium nitride has arrived. “Gallium nitride is quite different from silicon in epitaxy, device design and key technology, which requires close integration of upstream and downstream industry chains for effective promotion,” he said. Billy Feng, Executive Director, J.P. Morgan Is the Semiconductor Industry Still Cyclical? Since 2008, the semiconductor cycle has waned, disrupting the traditional thinking of investors, equipment suppliers and logistics channel providers as investors’ appetite for the chip industry investments has grown, said Billy Feng, executive director at J.P. Morgan. The long-term prospects for the semiconductor industry remain bright. But after reaching historic revenue highs in 2017 and 2018, the industry – and investor expectations – will enter a period of adjustment. Dr. Adam He, Executive Director, CGP Tech Fund The unique gene of the semiconductor industry consists of the blend of its lofty requirements for quality, reliability and consistency; cooperation between upstream and downstream sectors; internationalization; and a powerful ambition to innovate, said Dr. Adam He, Executive Director of CGP Tech Fund. He described Chinese chip enterprises he often encounters as falling into one of two entrepreneurial categories – IC experts and cross-border business people. Both want the answer to "how to make money and how to establish a solid competitive position?” He said. Adam believes that accessing the genes of the semiconductor industry is the answer to both questions and crucial to the maturation of China’s chip industry. The genes must be used to strengthen the Chinese manufacturing and materials sectors. Du Shanshan, Senior Analyst, SEMI China SEMI Market Outlook: Fab Investment, Equipment and Materials Market ForecastsEmerging technologies have sparked explosive semiconductor industry growth, said Du Shanshan, a senior analyst at SEMI China. While the industry will see a slight recession in 2019 due to memory market softness, trade wars and other factors, it is on stable footing for the long run. At the same time, China continues to optimize its IC industry chain, and semiconductor design and manufacturing companies have gradually grown in number. Over the next decade, the average growth rate of China's production capacity is expected to exceed 10 percent. Richard Feldman, VP of Global Expositions and Events, SEMI Richard Feldman, vice president of Global Expositions and Events of SEMI headquarters, presented the new SEMI Asia semiconductor business development plan to members and called on companies in mainland China, Taiwan and Malaysia to participate in SEMICON Europe to strengthen the influence of globalization.After the meeting, participants visited KINGSEMI Co., Ltd., Shenyang Piotech Co., Ltd, Shenyang SIASUN Robot and Automation Co., Ltd., Shenyang Fortune Precision Equipment Co., Ltd. and SKY Technology Development Co., Ltd. The event facilitated communications between upstream and downstream companies. SEMI China Member Day 2019 Group Photo Cherry Sun is a marketing manager at SEMI China.

Kyushu, the third largest island in Japan, is home to the semiconductor production bases of integrated device manufacturers (IDMs) with world-class cutting-edge technology. SONY, Toshiba, Hitachi, Mitsubishi, Fujitsu and Nissan are among the sector’s shining stars, though a host of other IDMs tied to the supply chains of other major enterprises have also set root in Kyushu. Collectively, the companies earned Kyushu the name Silicon Island of Japan.Kyushu’s flourishing IDM industry sprouted from favorable tax and other government policies that reduced semiconductor production costs to levels lower than elsewhere in Japan. Once the IC producers had established bases, equipment and materials companies naturally followed, leading to the influx of many parts manufacturers. Together, they came to Kyushu, one after another, to make the island a magnet for manufacturing. And so it was to Kyushu that a SEMI China delegation travelled for a meeting at TEL’s factory in Kumamoto to learn more about the secrets to the rapid growth of the island’s semiconductor industry and promote cooperation between Chinese and Japanese enterprises. Underscoring the rise of the Silicon Island of Japan, China will soon become TEL’s largest market, said Masami Akimoto, Chairman of Tokyo Electron Kyushu Limited, speaking at the event. Masami Akimoto hopes for support from SEMI China.The island of 12 million people contributes to the growth of the global semiconductor industry, expected to reach USD 500 billion in size in 2019 as China’s semiconductor sector, fueled in part by government-backed investment funds, continues its rapid expansion. Despite the gains, China still lags other regions in advanced manufacturing, said Lung Chu, president of SEMI China, which is doing its part to draw more advanced manufacturing to the region through its SIIP platform. The initiative encourages pan-regional cooperation with China’s semiconductor industry to promote free trade, open markets, technology innovation and IP protection – all to help China better integrate with the global semiconductor industry. SEMI China President Lung Chu(L) issues visit memorial to Masami Akimoto(R), Chairman of Tokyo Electron Kyushu Limited. Chicken shall be led by the HenUnlike other regions with comprehensive semiconductor industries, Kyushu’s is primarily focused on production and assembly, with more than 200 manufacturers of semiconductor equipment and parts.SEMI China Delegation at Tokyo Electron Kyushu LimitedTEL built its first factory in Kumamoto, a city covered by volcanic ash in the center of Kyushu, 34 years ago. Today, TEL every month produces 80 to 90 sets of equipment, each consisting of, on average, over 400 thousand parts that must be certified and authorized by TEL before delivery to its module manufacturers and assembly into complete machines. Having blossomed over the past few decades, the island’s supply chain now supplies TEL with all its equipment parts. SEMI China Delegation at Fajita WorksTEL supplier Fajita Works, a high-precision plate metal manufacturer founded in 1945, is emblematic of other companies in the Kyushu supply chain. It keeps a low public profile as it serves several longtime customers and earns ardent loyalty from its workers, an ethos reflected in the change next January of its slog from “Only One” to “Great company, Great life.”Quality is the life of the enterpriseLong before the rise of its legendary automobile and consumer electronics companies, Japan was known for inferior, counterfeited products, labeled “Made In USA” and shipped to the United States by more than 100 factories. The net effect was to shrink and commoditize American markets. The tide in Japan’s product quality and stained reputation began to turn in the 1980s, when Japan’s semiconductor industry began to produce memory with an error rate 27 times lower than its U.S. competitors, giving Japan an upper hand in quality that it would never relinquish. SEMI China Delegation at HORIBAKyushu-based flowmeter supplier HORIBA, among the many Japanese companies famous for their product quality, ships 38 percent of its products into the automotive market and 27 percent into the semiconductor sector. Cleanliness is as vital a part of the company’s culture as quality. Each depends on the other, with fine detail held to the highest importance. On its visit to HORIBA, the SEMI China delegation, passing by an office area before entering the factory, sighed at the sight of the spotless, neatly kept furniture and workspace: They had never seen an office so sparkling clean. HORIBA’s success is rooted in immaculate offices, factories and the company’s motto “Enjoy innovation and pay close attention to product quality.”After Kumamoto sustained heavy damage during a 2016 earthquake, HORIBA workers returned rocks scattered by temblor to their original position, knowing that order is critical to lean, efficient manufacturing and that, indeed, “the devil is in the details.” SEMI China Delegation in Kumamoto City Full confidence in the exploration of Chinese marketConsumer electronics stalwarts Sony and Panasonic feature semiconductor factories in Kagoshima, the southernmost city in Kyushu and Japan, though rumor had it two years ago that Panasonic planned to pull out. The Panasonic plant, which provides batteries for Tesla, remains. The Sony facility produces image sensors for the iPhone.Semiconductor equipment maker ULVAC, SEMI China’s most important strategic partner, is also based in Kagoshima. During the delegation’s visit to the company, Lung Chu noted that while China is the world’s largest semiconductor market, the region meets just 13 percent of domestic chip demand. Stressing that ULVAC can play a crucial role in helping China become a bigger player, he expressed admiration for ULVAC’s professionalism along with hope that it will maintain its rapid growth and leverage SEMI resources to catalyze rapid development of Internet of Things (IoT), artificial intelligence (AI), and 5G technologies in China and rise into the top 10 of global equipment manufacturers. SEMI China President Lung Chu (L) issues visit memorial to ULVAC Kyushu President and CEO Kenji Yamaguchi ULVAC Kyushu president and CEO Kenji Yamaguchi made clear the company’s interest in Lung Chu’s insights into Chinese semiconductor industry while underscoring its core competency of producing semiconductors for flat panel displays. The Kyushu Factory of ULVAC is full of vitality and market competitiveness. SEMI China Delegation at ULVAC EBARA, a precision machinery company located in Kumamoto, has manufactured chemical-mechanical planarization (CMP) equipment for over 20 years and delivered nearly 2,400 mechanical polishing machines worldwide. While the company expects to ship 50 sets per year to China starting next year, it has the capacity to deliver 20 sets per month, enough to meet demand of Chinese semiconductor makers. SEMI China Delegation at EBARAThe most telling takeaway from the SEMI China delegation’s visit to the Kyushu: Japan ranks number one worldwide in research and development (R D) investment as a proportion of GDP and is also at the top in the percentage of R D funds controlled by private enterprises. The outsize investment strategy has enabled Japan to maintain its hold as one of the world’s top technology innovators.Like Sakurajima, the famed Kyushu volcano, the SEMI China delegation will continue to harness its forces to build relationships with the island’s semiconductor supply chain as it works to develop win-win pan-regional relationships and foster the growth of China’s semiconductor industry. Best view of Sakurai volcano Gang Yao is a marketing director at SEMI China.

Korea is on track to top all other regions in fab investment, spending $63 billion between 2017 and 2020, with powerhouses Samsung Electronics Co. and SK Hynix leading the way, according to latest World Fab Forecast Report by SEMI. Samsung Electronics increased fab investments $770 million to $12 billion this year, and SK Hynix upped its spending a significant $2.8 billion to $7.25 billion in 2018.Korea's investment companies anticipate continued growth for both companies in the second half of 2018.Under this halo of extraordinary investment, nearly 380 SEMI Korea members and industry analysts gathered for 2018 SEMI Korea Members Day on September 13 to share insights on semiconductor market trends and new technologies that could help members bolster their competitiveness. Following are key takeaways from the event. Korea semiconductor market to grow 16% in 2018That’s according to IDC Korea VP Kim Soo-kyung, who noted that data center, memory and Internet of Things (IoT) are becoming key growth drivers for the semiconductor industry. He encouraged semiconductor companies to closely track development of automotive technology and the industry semiconductor market, both key growth areas. SEMI Korea president H.D. Cho opens SEMI Korea Members Day 2018 Continuing fab investment will lead to oversupply, but display will shineMarket entry by Chinese companies will also spur the oversupply, said Jeong Won-Seok, an analyst at HI Investment Corp. He noted that the oversupply will force Korea into stiffer competition with other regions. However, with OLED used for a wide variety of devices and the display industry seeing rapid growth, the sector will remain ripe for growth among Korean companies.Interconnecting various applications is a big semiconductor industry trendThe need for these interconnections will stand out in the mobility and high-performance computing (HPC) markets, said Park Sung-Soon, principal research fellow at Amkor Technology Korea, who addressed trends in packaging technology. He also emphasized interconnection cost efficiency as key to maximizing competitiveness.Smart Manufacturing is driving mass customizationAs semiconductor industry growth continues, production methods are shifting from ‘mass production’ to ‘mass customization,’ increasing the importance of Smart Manufacturing in driving greater production efficiency, noted BISTel VP Jeon Kyeong-Sik. Building a Smart Manufacturing platform to support large-scale production of specialized database and artificial intelligence (AI) chips will boost production efficiency, reduce costs and improve risk management. Virtual simulation will be a key enabling technology. SEMI analyst Clark Tseng presenting at SEMI Korea Members Day 2018 Surge in data volume and technology advances to drive long-term semiconductor industry growthThese key industry drivers will continue to power fab investment growth, with spending focused on 3D NAND, DRAM, and foundry, said Clark Tseng, director of Industry Research and Statistics at SEMI. China alone will see eye-watering growth with the region’s investments in domestic companies surging 46% from 2018 to 2019 and fab investment by Chinese domestic companies outpacing spending by foreign companies in China, Tseng predicted. SEMI membership rises with industry growthCulminating the event, SEMI Korea president H.D. Cho said, "With the growth of the semiconductor market, the number of SEMI members is gradually increasing, and we will help member companies grow with various activities such as Korea Members Day.”Jaegwan Shim is a marketing specialist at SEMI Korea.

The proliferation of chips driven by artificial intelligence and automotive will spur a record $68 billion in sales of semiconductor equipment in 2019.Building the workforce of the future is at once a challenge and opportunity for the semiconductor industry, the key to continuing the rapid pace of innovation and growth. And tariffs levied against billions of dollars of Chinese imports by the Trump administration has profound implications for SEMI members and the chip industry as a whole.Jonathan Davis, Global Vice President of Industry Advocacy at SEMI, offers insights on these key semiconductor industry issues in this interview at SEMICON West 2018. Ariana Raftopoulos is a marketing manager at SEMI.

IntroductionStarting July 4, 2022, PFOA (Perfluorooctanoic acid) levels in semiconductor manufacturing and related equipment (SMRE), including replacement parts, entering the European Union (EU) will be restricted to 25 ppb per component (or any part thereof). Semiconductor equipment components (and the parts thereof) of particular concern include fluid tubing and fittings, pipe/seal tape, wire and cable insulation, filters, valves, tanks, panels, reaction vessels and o-rings; if they are made from fluoropolymers or fluoroelastomers.When PFOA is used as an aid to the manufacture fluoropolymers such as PTFE, PFA, PVDF or fluoroelastomers such as FKM and FFKM (collectively referred to as fluoromaterials), an unintended PFOA residue can be trapped within the fluoromaterial. Buyers of components used in SMRE are usually unaware of the processing method used for any fluoromaterials they may contain, and, as a consequence, the potential for PFOA residue. This lack of information about potential PFOA residues could result in regulatory enforcement actions and restricted market access, particularly in the EU.The impact of restrictions on fluoromaterials used in SMRE has been introduced in previous SEMI articles ‘Fluorinated Compound Restrictions May Trigger Costly Equipment Changes’ and ‘Fluorinated Substance Restrictions Triggers Costly Equipment Changes.’PFOA and its related compounds, such as the ammonium salt APFO (collectively called PFOA in this article), are recognized internationally as hazardous chemicals and are now targeted for regulatory restriction in the U.S., Taiwan, Canada and the EU. The UN Stockholm Convention on Persistent Organic Pollutants (POPs) is also considering listing PFOA, which could lead to additional international restrictions.The SEMI EHS Division PFOA Compliance Working Group has been working to understand: The likelihood of PFOA residue entering the supply chain of new components The residual level of PFOA in fluoromaterials produced prior to the phase out of PFOA by some manufacturers The impact of PFOA residue on the secondary equipment market This SEMI resource page, ‘Elimination of PFOA from the Equipment Supply Chain,’ and the supporting FAQ contain the Working Group’s key findings and conclusions.PFOA in the Fluoromaterial Supply ChainSignatories to the U.S. EPA Stewardship Program, which include FluoroCouncil members, eliminated PFOA from their manufacturing processes by 2013. However, other fluoromaterial manufactures – particularly in China, Russia and India – might still use PFOA and pose a significant risk to the worldwide supply chain.China, the world’s largest fluoromaterial producer, accounts for 53 percent of global production of PTFE and 38 percent of worldwide production of PVDF, FEP and FKM. An estimated 75 percent to 85 percent of fluoromaterials are manufactured using PFOA in China. Fully 25 percent of these fluoromaterials are exported, primarily to the U.S, Japan, EU and India. What’s more, finished goods made from or containing fluoromaterials that might be used as components in SMRE are exported from China.Documentation that traces fluoromaterials through the supply chain back to the original fluoromaterial manufacturer is key to meeting the PFOA regulatory requirements. This traceability can be straightforward in cases when an SMRE manufacturer directly specifies the use of a fluoromaterial in a custom-fabricated fluoromaterial component. However, for off-the-shelf components (e.g., cable ties, wiring insulation, tubing) or the components assembled from these components (e.g., controllers), the complexity and dynamics of the supply chain makes traceability back to the original fluoromaterial producer almost impossible.Residual PFOA Levels If, or how much, PFOA/APFO residue is contained in a fluoromaterial depends on the manufacturing process. Details of the manufacturing processes are proprietary and vary widely. Post manufacturing thermal treatments, such as sintering, extrusion, and molding, can result in the rapid thermal decomposition of APFO above 250C, but PFOA is significantly more stable. The temperature and time of thermal treatments is also proprietary and varies depending on the type of fluoromaterial and what is being made.This variability makes it impossible to estimate the likely level of trapped PFOA or APFO in a finished component or a part thereof. It is unwise to use data on the level of residue made known for one case to extrapolate the level of residue across the fluoromaterial industry. However, an industry-wide range on the order of 1ppm-10ppm (nearly 1000 times the EU limit) is suspected. Testing for the presence of PFOA/APFO at 25ppb in components is also problematic as there is no standard test method, and results among the custom methods developed in each test lab may vary.Given this uncertainty in test methods, a system of supplier declarations warrants consideration.Impact on Secondary (Used) EquipmentThe EU REACH restrictions apply to SMRE and replacement parts placed on the market at any time (not just initial placement – known as “first placing on the market”). For fluoromaterial components manufactured prior to 2013, there is a higher likelihood of residual PFOA/APFO levels exceeding the 25ppb limit of EU REACH. In principle all the SMRE components containing fluoromaterials should be investigated, and those containing PFOA above 25ppb must be replaced before the SMRE can be legally placed again on the EU market. Companies (e.g., semiconductor manufacturers) in the EU who wish to sell used equipment within the EU will be required to demonstrate the used equipment is in compliance. Selling older used equipment would likely be unprofitable after necessary investigations and component replacements are completed.Next StepsWhile the EU semiconductor manufacturing industry heavily depends on the secondary (used) equipment market, EU regulators may be unaware of the PFOA restriction’s damaging impact to this market. The EHS Division PFOA Working Group, in conjunction with SEMI Europe, is now considering how to bring this concern to the attention of regulators and to collaborate and lobby for effective changes including possible modifications to the EU Persistent Organic Pollutants (POPs) regulation.

Emboldened by advances in self-driving and Internet of Vehicles (IoV) technologies, Taiwan’s microelectronics sector is investing heavily in manufacturing processes and equipment as engines of innovation and growth for autonomous driving, the world’s next market goldmine. But breaking into the self-driving vehicle industry can be a steep uphill climb. Semiconductor players hungry to secure their piece of the potentially massive market must know how to navigate the automotive industry’s unique ecosystem of suppliers, not to mention its lofty standards for safety and reliability.To explore opportunities and challenges in the automotive semiconductor market, SEMI recently organized Mobility Tech Talk – a gathering of experts from Strategy Analysis, Yole Développement, Renesas, X-FAB and IHS Markit who examined the evolution of sensors for autonomous cars, advanced driver-assisted system (ADAS) applications, and new energy vehicles (NEVs) in China. Nearly 200 participants exchanged in-depth, forward-looking insights and perspectives as the event helped forge stronger relations among various market segments. Here are four key takeaways from the conference. Lidar: The Hottest Sensing Technology for Smart AutomotiveLidar, mmWave radar, cameras and inertial measurement units (IMUs) are critical sensing devices for autonomous cars. With sensor and high-speed computing technologies maturing at their current pace, some 350,000 self-driving vehicles are expected to hit the road by 2027. But before a single autonomous vehicle takes to the roadways, self-driving technology must become expert at monitoring a vehicle’s environment.That’s where Lidar, the hottest of all sensing technologies and the key to the holy grail of safe self-driving, comes into the picture. Lidar’s versatility supports multiple essential functions such as mapping, object detection and object movement. The problem is that mass production is still impossible due to the technology's high costs. What’s more, technical issues must still be sorted out with solid-state lidar, mechanical lidar and MEMS. Both startups and traditional tier-1 semiconductor manufacturers are aggressively investing in related research and development in hopes of fulfilling lidar's promise and seizing the market opportunity. Smart Automotive Sets New Quality and Safety StandardsAs cars become smarter, so too must silicon. Chips must support vastly more data generated by in-vehicle connectivity, ADAS, electrification, autonomous driving and an array of other functions that rely on advanced automotive electronics components. With demand for smarter silicon surging, Taiwan semiconductor companies are turning to the automotive chip industry for expertise and serving as OEMs for major automakers.Quality and safety for automotive applications is paramount. In-vehicle semiconductors must meet strict requirements for vehicle control, robustness, liability, cost and quality management to meet the automotive specifications necessary to securing certifications. Smart silicon must also pass all AEC-Q liability standards promoted by North America automakers and score “zero defect” for the ISO/TS 16949 Automotive Quality Management System.China’s New Energy Vehicles To Fuel Semiconductor GrowthTo promote NEVs and reduce fuel consumption of cars with internal combustion engines (ICEs), late last year the Chinese government introduced the Measures for the Parallel Administration of the Average Fuel Consumption and New Energy Vehicle Credits of Passenger Vehicle Enterprises. With China the world’s largest market for NEVs, the policy is forcing automakers in Japan, the U.S. and Europe to accelerate moves towards NEVs that, in turn, will fuel growth in the semiconductor and automotive battery industries. NEVs in China are expected to number 2 million by 2020 before more than doubling to 4.9 million by 2025. Today, most cars still run on ICEs as environmentally friendly motor drives are still under development. In unit shipments, motor drives are expected to surpass ICEs by 2025.Cross-field Collaboration is KeyThe rise of smarter, fully autonomous vehicles – a disruptive Car 2.0 – is unlikely to happen overnight. Rapid growth of the global automotive semiconductor market will continue, with safety and powertrain applications driving the strongest chip demand. Meanwhile, automakers are focusing more on innovations from startups and non-traditional suppliers, and some have even started to develop their own IP and solutions. These paradigm industry shifts are diversifying the automotive supply chain into a cross-domain collaborative network of suppliers, pushing the closed, one-way automotive supply chain into lesser relevance. In the near future, rivals and partners may become indistinguishable as traditional turf wars begin to wane. As ADAS and autonomous cars evolve, and the era of electric cars nears, automotive semiconductors are emerging as the engine of growth for the global semiconductor industry. The automotive semiconductor market is expected to grow at a CAGR of 5.8 percent, reaching US$48.78 billion by 2022.For its part, the SEMI Smart Automotive special interest group connects professionals from the microelectronics and automotive industries. The group promotes the semiconductor industry's development of automotive technologies and cross-domain collaboration to help drive autonomous vehicle innovation.